CN114405839A - Intelligent defect detection equipment for packaged chip - Google Patents
Intelligent defect detection equipment for packaged chip Download PDFInfo
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- CN114405839A CN114405839A CN202111608086.2A CN202111608086A CN114405839A CN 114405839 A CN114405839 A CN 114405839A CN 202111608086 A CN202111608086 A CN 202111608086A CN 114405839 A CN114405839 A CN 114405839A
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- 238000001514 detection method Methods 0.000 title claims abstract description 54
- 230000007547 defect Effects 0.000 title claims abstract description 18
- 230000007246 mechanism Effects 0.000 claims abstract description 21
- 230000002950 deficient Effects 0.000 claims abstract description 18
- 238000009434 installation Methods 0.000 claims description 11
- 238000012546 transfer Methods 0.000 claims description 6
- 239000004698 Polyethylene Substances 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 3
- -1 polyethylene Polymers 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims description 2
- 230000011218 segmentation Effects 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 238000013461 design Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000001802 infusion Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 206010063385 Intellectualisation Diseases 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
Abstract
The invention discloses a chip packaging defect intelligent detection device which comprises a chip pin defect detection device, wherein the chip pin defect detection device mainly comprises an operation table, a conveyor, a pin shape detector, a pin electrifying detector, an appearance image detector and a defective product eliminating mechanism, the conveyor is arranged on the operation table, the pin shape detector is arranged on the operation table and is positioned right above the conveyor, the pin shape detector consists of a machine body shell I, pin corner detectors and sprayers, the pin corner detectors are divided into two groups and are symmetrically arranged in the machine body shell I, and the sprayers are positioned on the back of the machine body shell I. The detection equipment designed by the invention is specially used for detecting the defects of the pins of the packaged chip, and can acquire the physical forms, the electrifying conditions and the image information of the pins by adopting an automatic conveying and three-stage detection mode.
Description
Technical Field
The invention relates to the technical field of chip detection, in particular to intelligent defect detection equipment for a packaged chip.
Background
The shell for installing semiconductor integrated circuit chip has the functions of placing, fixing, sealing, protecting chip and enhancing electrothermal performance, and is also the bridge for communicating the internal world of chip with external circuit, and the contacts on the chip are connected to the pins of the package shell by wires, and these pins are connected with other devices by wires on the printed board. Therefore, the package plays an important role in CPU and other LSI integrated circuits, and the packaged chip generally needs to be inspected to ensure the quality of the finished product in order to ensure the product quality.
However, the conventional packaged chip has the following problems in the detection process: (1) the existing detection equipment detects a plurality of chip bodies, and pins of a packaged chip are easy to deform in the processes of production, processing and transportation due to an external design mode, so that the subsequent installation and treatment are not facilitated, and the existing detection equipment lacks a mode for detecting the pins of the chip; (2) the existing packaged chip detection equipment usually needs manual removal for unqualified products, and the degree of automation and intellectualization is insufficient. For this reason, a corresponding technical scheme needs to be designed to solve the existing technical problems.
Disclosure of Invention
The invention aims to provide intelligent detection equipment for defects of a packaged chip, which solves the technical problems that the conventional detection equipment detects a plurality of chip bodies, pins of the packaged chip are easy to deform in the processes of production, processing and transferring due to an external design mode, subsequent installation and treatment are not facilitated, and the conventional detection equipment is lack of a mode for detecting the pins of the chip.
In order to achieve the purpose, the invention provides the following technical scheme: the chip pin defect detection equipment mainly comprises an operation table, a conveyor, a pin shape detector, a pin electrifying detector, an appearance image detector and a defective product eliminating mechanism, wherein the conveyor is arranged on the operation table, the pin shape detector is arranged on the operation table and is positioned right above the conveyor, the pin shape detector comprises a first machine body shell, two groups of pin corner detectors and a sprayer, the two groups of pin corner detectors are symmetrically arranged in the first machine body shell, the sprayer is positioned on the back of the first machine body shell, the pin electrifying detector is arranged on the right side of the pin shape detector and comprises a second machine body shell and two groups of circuit detection clamping plates which are arranged on the inner wall of the second machine body shell in a sliding mode, the appearance image detector is arranged on the right side of the pin electrifying detector and comprises a third machine body shell and two groups of circuit detection clamping plates which are arranged on the inner wall of the second machine body shell, and the appearance image detector is arranged on the right side of the pin electrifying detector and comprises a third machine body shell and is arranged on the inner wall of the first machine body shell The device comprises two groups of 3D laser cameras on three inner walls of a shell, illuminating lamps are mounted on two sides of each 3D laser camera and connected with a console through lines, and the defective product removing mechanisms are divided into three groups and mounted on the right sides of a pin form detector, a pin energizing detector and an appearance image detector respectively.
As a preferred embodiment of the present invention, the pin corner detector comprises a slider, a telescopic rod, a corner detection wheel, a pressure sensor, an indicator light and an electric push rod, wherein the slider is slidably disposed on an inner wall of the first machine body shell, the lower end of the slider is fixedly connected to the telescopic rod, the telescopic rod is of a two-segment structure, the corner detection wheel is mounted at the lower end of the telescopic rod, the pressure sensor is mounted between the corner detection wheel and the telescopic rod and is connected to the indicator light through a circuit, the indicator light is mounted on the front side of the first machine body shell, and the electric push rod is mounted on a side wall of the first machine body shell, and the power output end of the electric push rod is connected to the telescopic rod.
As a preferred embodiment of the present invention, the corner detection wheel has a wheel-shaped structure and an edge has a cambered surface structure, and an upper end of the corner detection wheel contacts with a detection end of the pressure sensor.
As a preferred embodiment of the invention, the sprayer comprises a containing box arranged on a first machine body shell and two groups of infusion tubes connected with the containing box through pipelines, pumps are arranged at the lower ends of the two groups of infusion tubes, the pumps are connected with spray heads through the infusion tubes, vertical rods are arranged at the upper ends of the spray heads, the vertical rods are arranged on the inner wall of the first machine body shell in a sliding mode, and one side of the vertical rods is connected with a second electric push rod.
As a preferred embodiment of the present invention, the circuit detection splint comprises a driving motor, a driving gear, a driven gear, two sets of screws, a triangular plate and an energization interface, wherein a power output end of the driving motor is connected with the driving gear, a lower portion of the driving gear is engaged with the driven gear, the two sets of screws are symmetrically installed on two sides of the driven gear, outer ends of the two sets of screws are respectively inserted with a lantern ring in a threaded manner, the two sets of triangular plates are respectively fixed below the lantern rings, and the energization interface is installed at the bottom of the triangular plate and is connected with an alarm lamp through a line.
In a preferred embodiment of the present invention, the external threads of the two sets of screws are the same, and the internal threads of the two sets of collars are opposite.
In a preferred embodiment of the present invention, the triangular plate has an inverted triangular structure and is made of a polyethylene insulating material.
As a preferred embodiment of the present invention, the inferior goods rejecting mechanism comprises a shovel plate, an installation block, a micro motor, and a inferior goods storage box, wherein the inner end of the shovel plate is located on the conveyor, a rotating rod is arranged in the installation block, the outer end of the rotating rod is connected to the power output end of the micro motor, the outer end of the shovel plate is connected to the rotating rod, and the inferior goods storage box is installed on the outer side of the installation block.
Compared with the prior art, the invention has the following beneficial effects:
1. the invention designs a device special for detecting pin defects of a packaged chip, which mainly comprises an operation table, a conveyor, a pin shape detector, a pin electrifying detector, an appearance image detector and a defective product eliminating mechanism, wherein the packaged chip to be detected is sequentially conveyed and processed by the conveyor, firstly enters the pin shape detector, the corner shape of the pin is detected by the pin shape detector, when the corner shape is unqualified, the corner position of the corresponding pin is sprayed and marked by a spraying mechanism at the back, and is conveyed to the defective product eliminating mechanism for overturning and eliminating, if the corner shape is qualified, the packaged chip is continuously conveyed to the pin electrifying detector, the outer end of the pin of the chip is clamped by a triangular clamping plate of the pin electrifying detector, and a trace current detecting circuit is introduced for smoothness or not, when the circuit is not smooth, the defective product removing mechanism is used for overturning and removing, if the circuit is detected to be qualified, the circuit is continuously conveyed to the appearance image detector, the 3D laser cameras arranged on the two sides of the outer tube image detector are used for acquiring image information of the pins and comparing the image information with database information, if the circuit does not reach the standard, the defective product removing mechanism is used for overturning and removing, and if the circuit reaches the standard, the circuit is conveyed out through the conveyor.
2. The detection equipment designed by the invention is specially used for detecting the defects of the pins of the packaged chip, and can acquire the physical forms, the electrifying conditions and the image information of the pins by adopting an automatic conveying and three-stage detection mode.
Drawings
FIG. 1 is an overall block diagram of the present invention;
FIG. 2 is a front end block diagram of the pin shape detector of the present invention;
FIG. 3 is a rear end structural view of the pin shape detector of the present invention;
FIG. 4 is a block diagram of the pin power-on detector of the present invention;
FIG. 5 is a block diagram of an appearance image detector according to the present invention;
fig. 6 is a structural view of a defective product removing mechanism according to the present invention.
In the figure, 1, an operation table; 2. a conveyor; 3. a first machine body shell; 4. a pin corner detector; 5. a sprayer; 6. a second machine body shell; 7. a circuit detection clamp plate; 8. a third machine body shell; 9. a 3D laser camera; 10. an illuminating lamp; 11. a console; 12. a slider; 13. a telescopic rod; 14. a corner detection wheel; 15. a pressure sensor; 16. an indicator light; 17. an electric push rod I; 18. an accommodating box; 19. a transfusion tube; 20. a pump; 21. a spray head; 22. erecting a rod; 23. a second electric push rod; 24. a drive motor; 25. a drive gear; 26. a driven gear; 27. a screw; 28. a set square; 29. a power-on interface; 30. a collar; 31. an alarm lamp; 32. a shovel plate; 33. mounting blocks; 34. a micro motor; 35. storing defective products in a storage box; 36. rotating the rod.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1: referring to fig. 1-6, the present invention provides a technical solution: the utility model provides a defect intellectual detection system equipment of encapsulation chip, including chip pin defect check out test set, chip pin defect check out test set mainly includes operation panel 1, conveyer 2, pin form detector, pin circular telegram detector, outward appearance image detector and substandard product rejection mechanism, conveyer 2 installs on operation panel 1, pin form detector installs on operation panel 1 and is located conveyer 2 directly over, pin form detector is by organism shell one 3, pin turning detector 4 and sprayer 5 are constituteed, pin turning detector 4 divide be equipped with two sets of and symmetry install in the inside of organism shell one 3, sprayer 5 is located the back of organism shell one 3, pin circular telegram detector installs in the right side of pin form detector and includes organism shell two 6 and slide and set up two sets of circuit detection splint 7 on organism shell two 6 inner walls, outward appearance image detector installs in the right side of pin circular telegram detector and includes organism shell three 8 and install in organism shell three 6 on the right side of organism shell Two sets of 3D laser camera 9 on three 8 inner walls of body shell, lighting lamp 10 and have control cabinet 11 through the line connection are installed to the both sides of 3D laser camera 9, and the substandard product is rejected the mechanism and is divided into three groups and install respectively in the right side of pin form detector, pin circular telegram detector, outward appearance image detector.
Example 2: as shown in fig. 2: the pin corner detector 4 comprises a sliding block 12, an expansion link 13, a corner detection wheel 14, a pressure sensor 15, an indicator light 16 and an electric push rod 17, wherein the sliding block 12 is arranged on the inner wall of a machine body shell 3 in a sliding manner, the lower end of the sliding block is fixedly connected with the expansion link 13, the expansion link 13 is of a two-section structure, the lower end of the expansion link is provided with the corner detection wheel 14, the pressure sensor 15 is arranged between the corner detection wheel 14 and the expansion link 13 and is connected with the indicator light 16 through a circuit, the indicator light 16 is arranged on the front side of the machine body shell 3, the electric push rod 17 is arranged on the side wall of the machine body shell 3, the power output end of the electric push rod 13 is connected with the expansion link 13, the electric push rod 17 pushes the expansion link 13 to move, the corner detection wheel 14 corresponds to and contacts with the corner position of a pin, the pressure sensor 15 detects the pressure of the corner detection wheel 14, when the pressure value is abnormal, and (4) explaining that the amplitude or the thickness at the corner of the pin has a problem, and correspondingly rejecting the pin.
The corner detection wheel 14 is of a wheel-shaped structure, the edge of the corner detection wheel is of a cambered surface structure, the upper end of the corner detection wheel 14 is in contact with the detection end of the pressure sensor 15, the specification of the corner detection wheel 14 is various, and the corner detection wheel can be replaced according to the amplitude of the corner of the pin.
Example 3: as shown in fig. 3: sprayer 5 is including installing the two sets of transfer lines 19 that hold case 18 and be connected with holding case 18 through the pipeline on engine body shell 3, pump 20 is all installed to the lower extreme of two sets of transfer lines 19, pump 20 is connected with shower nozzle 21 through transfer line 19, pole setting 22 is installed to the upper end of shower nozzle 21, pole setting 22 slides and sets up on the inner wall of engine body shell 3 and one side is connected with electric putter two 23, the mark solution that will hold in the case 18 through pump 20 takes out to shower nozzle 21 department, and on spraying in the pin that corresponds through shower nozzle 21, be convenient for follow-up needle corresponds the processing.
Example 4: as shown in fig. 4: the circuit detection splint 7 comprises a driving motor 24, a driving gear 25, a driven gear 26, screws 27, a triangular plate 28 and an electrifying interface 29, wherein the power output end of the driving motor 24 is connected with the driving gear 25, the lower part of the driving gear 25 is meshed with the driven gear 26, the screws 27 are respectively provided with two groups which are symmetrically arranged at two sides of the driven gear 26, lantern rings 30 are respectively inserted at the outer ends of the two groups of screws 27 in a threaded manner, the triangular plate 28 is respectively provided with two groups which are respectively fixed at the lower parts of the lantern rings 30, the electrifying interface 29 is arranged at the bottom of the triangular plate 28 and is connected with an alarm lamp 31 through a line, the driving gear 25 is driven to rotate by the driving motor 24, the driving gear 25 drives the driven gear 26 to rotate in the rotating process, the driven gear 26 drives the two groups of lantern rings 30 to synchronously move inwards or outwards, so as to facilitate the clamping detection of the chip, and the electrifying interface 29 is contacted with the pins of the chip, an energization state is detected.
The external threads of the two groups of screws 27 are the same, and the internal threads of the two groups of lantern rings 30 are opposite, so that the two groups of triangular plates 28 can synchronously move inwards or outwards along the screws 27, and the chip can be conveniently clamped and detected.
The triangle 28 is an inverted triangle structure and is made of polyethylene insulating material, so that the electric leakage is avoided.
Specifically, the inferior product rejecting mechanism comprises a shovel plate 32, an installation block 33, a micro motor 34 and a inferior product storage box 35, wherein the inner end of the shovel plate 32 is positioned on the conveyor 2, a rotating rod 36 is arranged in the installation block, the outer end of the rotating rod 36 is connected with the power output end of the micro motor 34, the outer end of the shovel plate 32 is connected with the rotating rod 36, the inferior product storage box 35 is installed on the outer side of the installation block 33, the inferior product is conveyed to the shovel plate 32 through a conveyor, the rotating rod 36 is driven to rotate through the micro motor 34, the shovel plate 32 is driven to overturn by the rotating rod 36, the inferior product is overturned and placed into the inferior product storage box 35, and the purpose of automatically rejecting the inferior product is achieved.
When in use: the invention designs a device for detecting pin defects of a packaged chip, which mainly comprises an operation table 1, a conveyor 2, a pin shape detector, a pin electrifying detector, an appearance image detector and a defective product eliminating mechanism, wherein the packaged chip to be detected is sequentially conveyed and processed by the conveyor 2, firstly enters the pin shape detector, the corner shape of the pin is detected by the pin shape detector, when the corner shape is unqualified, the corner position of the corresponding pin is sprayed and marked by a spraying mechanism at the back, and is conveyed to the defective product eliminating mechanism for overturning and eliminating, if the corner shape is qualified, the packaged chip is continuously conveyed to the pin electrifying detector, the outer end of the pin of the chip is clamped by a triangular clamping plate of the pin electrifying detector, and a trace current detecting circuit is introduced for smoothness or not, when the circuit is not smooth, the defective product eliminating mechanism is used for overturning and eliminating, if the circuit is detected to be qualified, the circuit is continuously conveyed to the appearance image detector, the 3D laser cameras 9 arranged on the two sides of the outer tube image detector are used for acquiring image information of the pins and comparing the image information with database information, if the circuit does not reach the standard, the defective product eliminating mechanism is used for overturning and eliminating, and if the circuit reaches the standard, the circuit is conveyed out through the conveyor 2.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. The utility model provides a defect intellectual detection system equipment of encapsulation chip, includes chip pin defect detecting equipment, its characterized in that: the chip pin defect detection equipment mainly comprises an operation table (1), a conveyor (2), a pin shape detector, a pin electrifying detector, an appearance image detector and a defective product removing mechanism, wherein the conveyor (2) is arranged on the operation table (1), the pin shape detector is arranged on the operation table (1) and is positioned right above the conveyor (2), the pin shape detector consists of a machine body shell I (3), pin corner detectors (4) and a sprayer (5), the pin corner detectors (4) are respectively provided with two groups and are symmetrically arranged in the machine body shell I (3), the sprayer (5) is positioned at the back of the machine body shell I (3), the pin electrifying detector is arranged at the right side of the pin shape detector and comprises a machine body shell II (6) and two groups of circuit detection clamping plates (7) which are arranged on the inner wall of the machine body shell II (6) in a sliding manner, the appearance image detector is arranged on the right side of the pin electrifying detector and comprises a third machine body shell (8) and two groups of 3D laser cameras (9) arranged on the inner wall of the third machine body shell (8), illuminating lamps (10) are arranged on two sides of each 3D laser camera (9) and are connected with a control console (11) through lines, and the defective product rejecting mechanism is provided with three groups which are respectively arranged on the right sides of the pin shape detector, the pin electrifying detector and the appearance image detector.
2. The apparatus of claim 1, wherein: pin turning detector (4) comprise slider (12), telescopic link (13), turning detection wheel (14), pressure sensor (15), pilot lamp (16) and electric putter (17), slider (12) slide to set up on the inner wall of engine body shell (3) and lower extreme and telescopic link (13) fixed connection, telescopic link (13) are two segmentation structures and the lower extreme installs turning detection wheel (14), pressure sensor (15) are located to install and detect between wheel (14) and telescopic link (13) and are connected with pilot lamp (16) through the circuit in the turning, pilot lamp (16) are installed in the front side of engine body shell (3), electric putter (17) are installed on the lateral wall of engine body shell (3) and power take off end is connected with telescopic link (13).
3. The apparatus of claim 2, wherein: the corner detection wheel (14) is of a wheel-shaped structure, the edge of the corner detection wheel is of a cambered surface structure, and the upper end of the corner detection wheel (14) is in contact with the detection end of the pressure sensor (15).
4. The apparatus of claim 2, wherein: sprayer (5) are including installing holding case (18) on engine body shell (3) and two sets of transfer lines (19) that are connected with holding case (18) through the pipeline, and are two sets of pump (20) are all installed to the lower extreme of transfer line (19), pump (20) are connected with shower nozzle (21) through transfer line (19), pole setting (22) are installed to the upper end of shower nozzle (21), pole setting (22) slide to set up on the inner wall of engine body shell (3) and one side is connected with electric putter two (23).
5. The apparatus of claim 1, wherein: circuit detects splint (7) and comprises driving motor (24), drive gear (25), driven gear (26), screw rod (27), set-square (28) and circular telegram interface (29), the power take off end of driving motor (24) is connected with drive gear (25), the below and the driven gear (26) meshing of drive gear (25) are connected, screw rod (27) branch is equipped with two sets ofly and the symmetry is installed in the both sides of driven gear (26), and is two sets of the equal screw thread interlude in outer end of screw rod (27) has lantern ring (30), set-square (28) branch is equipped with two sets ofly and is fixed in the below of lantern ring (30) respectively, circular telegram interface (29) are installed in the bottom of set-square (28) and have alarm lamp (31) through line connection.
6. The apparatus of claim 5, wherein: the external threads of the two groups of screws (27) are the same, and the internal threads of the two groups of lantern rings (30) are opposite.
7. The apparatus of claim 5, wherein: the triangular plate (28) is of an inverted triangular structure and is made of polyethylene insulating materials.
8. The apparatus of claim 1, wherein: the defective product removing mechanism comprises a shovel plate (32), an installation block (33), a micro motor (34) and a defective product storage box (35), the inner end of the shovel plate (32) is located on the conveyor (2), a rotating rod (36) is arranged in the installation plate, the outer end of the rotating rod (36) is connected with the power output end of the micro motor (34), the outer end of the shovel plate (32) is connected with the rotating rod (36), and the defective product storage box (35) is installed on the outer side of the installation block (33).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111608086.2A CN114405839B (en) | 2021-12-22 | 2021-12-22 | Intelligent defect detection equipment for packaged chip |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111608086.2A CN114405839B (en) | 2021-12-22 | 2021-12-22 | Intelligent defect detection equipment for packaged chip |
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| CN114405839A true CN114405839A (en) | 2022-04-29 |
| CN114405839B CN114405839B (en) | 2023-12-19 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114646647A (en) * | 2022-05-23 | 2022-06-21 | 深圳市禾川兴科技有限公司 | Chip pin welding defect detector based on reduction performance |
| CN115301565A (en) * | 2022-08-11 | 2022-11-08 | 徐州市沂芯微电子有限公司 | Full-automatic intelligent optical inspection equipment for integrated circuit board |
| CN116068057A (en) * | 2023-04-02 | 2023-05-05 | 广东仁懋电子有限公司 | SOT packaging chip defect detection method and system |
| CN117038494A (en) * | 2023-10-10 | 2023-11-10 | 天津芯成半导体有限公司 | Auxiliary intelligent detection system for chip processing industry |
| CN117129840A (en) * | 2023-10-26 | 2023-11-28 | 华迅信息技术研究(深圳)有限公司 | Integrated circuit chip detection equipment |
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| CN117038494A (en) * | 2023-10-10 | 2023-11-10 | 天津芯成半导体有限公司 | Auxiliary intelligent detection system for chip processing industry |
| CN117038494B (en) * | 2023-10-10 | 2023-12-15 | 天津芯成半导体有限公司 | Auxiliary intelligent detection system for chip processing industry |
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| CN117129840B (en) * | 2023-10-26 | 2024-01-23 | 华迅信息技术研究(深圳)有限公司 | Integrated circuit chip detection equipment |
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