CN112452781A - Semiconductor chip roughness detection device - Google Patents

Semiconductor chip roughness detection device Download PDF

Info

Publication number
CN112452781A
CN112452781A CN202011213400.2A CN202011213400A CN112452781A CN 112452781 A CN112452781 A CN 112452781A CN 202011213400 A CN202011213400 A CN 202011213400A CN 112452781 A CN112452781 A CN 112452781A
Authority
CN
China
Prior art keywords
plate
sliding
cylinder
spring
block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202011213400.2A
Other languages
Chinese (zh)
Other versions
CN112452781B (en
Inventor
程新钟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huayan Core Measurement Semiconductor Suzhou Co ltd
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN202011213400.2A priority Critical patent/CN112452781B/en
Publication of CN112452781A publication Critical patent/CN112452781A/en
Application granted granted Critical
Publication of CN112452781B publication Critical patent/CN112452781B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B07SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07CPOSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B07SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07CPOSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/02Measures preceding sorting, e.g. arranging articles in a stream orientating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B07SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07CPOSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/04Sorting according to size
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B07SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07CPOSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/36Sorting apparatus characterised by the means used for distribution
    • B07C5/361Processing or control devices therefor, e.g. escort memory
    • B07C5/362Separating or distributor mechanisms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B07SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07CPOSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/36Sorting apparatus characterised by the means used for distribution
    • B07C5/38Collecting or arranging articles in groups

Abstract

The present disclosure relates to semiconductor chip inspection devices, and particularly to a semiconductor chip flatness inspection device. The technical problem of the invention is that: the flatness detecting device for semiconductor chips is convenient to detect and capable of preventing damage to the semiconductor chips. The technical implementation scheme of the invention is as follows: a semiconductor chip flatness detection device comprises a workbench, a collection frame, a vertical plate, a top plate, a first mounting plate and the like; the collecting frame is embedded on the workbench, vertical plates are arranged on the workbench on two sides of the collecting frame, a top plate is arranged between the two vertical plates, and one side, far away from the collecting frame, of the workbench is connected with a first mounting plate. The invention can conveniently detect the thickness and the pins of the medical chip by matching the movable limiting mechanism, the flatness testing mechanism and the pin testing mechanism, and does not need a user to measure and evaluate the thickness and the pins of the semiconductor by a card holding ruler, thereby being convenient to detect the medical chip and preventing the medical chip from being damaged.

Description

Semiconductor chip roughness detection device
Technical Field
The present disclosure relates to semiconductor chip inspection devices, and particularly to a semiconductor chip flatness inspection device.
Background
The semiconductor chip is a semiconductor device which is manufactured by etching and wiring on a semiconductor wafer and can realize a certain function; not only silicon chips, but also semiconductor materials such as gallium arsenide and germanium are common; semiconductors are also trending like automobiles; in the seventies of the twentieth century, intel and other american enterprises have been in the wind of the dynamic random access memory market.
Semiconductor chip is after production, need the workman to carry out the roughness test to semiconductor chip thickness after the production and pin, make things convenient for semiconductor chip's follow-up use for this reason, at present when testing specific semiconductor chip, need the workman to measure and assess through slide caliper rule, so inconvenient workman detects a large amount of semiconductor chip, when measuring through laser, certain error can appear in the difficult chance, prior art examines time measuring semiconductor chip simultaneously, there is certain probability can damage semiconductor chip, because semiconductor chip cost is very high, so can cause the wasting of resources.
Therefore, there is a need to provide a flatness detecting apparatus for semiconductor chips, which can easily detect the flatness and prevent the semiconductor chips from being damaged.
Disclosure of Invention
In order to overcome the defects that a large number of semiconductor chips are inconvenient to detect because a worker detects the semiconductor chips through a caliper and the semiconductor chips are damaged in the detection of the prior art, the invention has the technical problems that: the flatness detecting device for semiconductor chips is convenient to detect and capable of preventing damage to the semiconductor chips.
The technical scheme of the invention is as follows: the utility model provides a semiconductor chip roughness detection device, which comprises a workbench, collect the frame, the riser, the roof, first mounting panel, telescopic cylinder, remove stop gear, roughness accredited testing organization, ejecting mechanism and pin accredited testing organization, it has the collection frame to inlay on the workstation, all be provided with the riser on the workstation of collection frame both sides, be provided with the roof between two risers, one side of keeping away from on the workstation and collecting the frame is connected with first mounting panel, be provided with telescopic cylinder on the first mounting panel, install between two risers of first mounting panel upside and remove stop gear, it is connected with telescopic cylinder to remove stop gear, roughness accredited testing organization is installed to the bottom of roof, ejecting mechanism is installed to one side that the roof bottom is close to flatness accredited testing organization, one side that the roof bottom is close to ejecting mechanism is provided with pin accredited testing organization.
Optionally, the movement limiting mechanism comprises a slide rail, a first slide block, a connecting plate, support rods, a first fixing plate, a second mounting plate, a gear motor, a gear, a fixed sliding sleeve, a rack, a first moving plate, a second moving plate, a clamping plate, a second slide block, a first air cylinder, a fixing block and a push plate, wherein two slide rails are arranged and are respectively arranged between the two vertical plates, the slide rail is provided with the slide block in a sliding manner, the connecting plate is fixedly connected between the two first slide blocks, the connecting plate is provided with four support rods, the first fixing plate is fixed between the four support rods, the side wall of the first fixing plate is fixedly connected with the telescopic rod of the telescopic air cylinder, the first fixing plate is provided with the second mounting plate, the second mounting plate is positioned between the four support rods, the gear motor is arranged on the second mounting plate, the gear is fixed on, the sliding type is equipped with two racks on the fixed sliding sleeve, two racks mesh with the gear respectively, install first movable plate on the lateral wall of downside rack, the top rigid coupling of upside rack has the second movable plate, it has a word groove to open on the connecting plate, first movable plate all passes a word groove with the second movable plate, splint are all installed with the top of second movable plate to first movable plate, first spout has all been opened on the connecting plate of a word groove both sides, the equal slidingtype in both sides of first spout is equipped with the second slider, two adjacent second sliders all with splint rigid coupling, all install first cylinder on the first fixed plate of downside rack both sides, the rigid coupling has the fixed block on the telescopic link of first cylinder, be connected with the push pedal on the lateral wall of fixed block, the push pedal passes the connecting plate.
Optionally, the flatness testing mechanism comprises a second fixing plate, first springs, a sliding frame, sliding plates, rollers, second springs and first inductors, wherein the second fixing plate is installed at the bottom of the top plate, the second fixing plate is connected with the four first springs, the sliding frame is installed between the four first springs, the sliding frame is provided with the two sliding plates in a sliding mode, the rollers are arranged between the two sliding plates, the sliding plates are fixedly connected with the second springs, the first inductors are installed on two sides of the bottom of the second fixing plate, and the two second springs are respectively connected with the corresponding first inductors.
Optionally, the ejecting mechanism comprises a mounting frame, a second cylinder and a limiting plate, the mounting frame is arranged at the top of the top plate, the second cylinder is arranged on the mounting frame, the limiting plate is arranged on a telescopic rod of the second cylinder, and the limiting plate penetrates through the mounting frame and the top plate.
Optionally, the pin testing mechanism comprises a fixed frame, a third cylinder, a connecting rod, a sliding plate, a connecting frame, a third spring, a contact block, a contact rod, a sliding block, a second inductor, a fourth spring and a moving block, wherein a second sliding chute is formed in one side of the top plate far away from the mounting frame, the fixed frame is arranged in the second sliding chute in a sliding manner, the fixed frame is also fixedly connected to one side of the bottom of the top plate close to the second sliding chute, the third cylinder is arranged on the side wall of a vertical plate on one side, the connecting rod is fixedly connected to a telescopic rod of the third cylinder and is connected with the fixed frame on one side, the sliding plate is arranged on the side wall of the fixed frame on the other side, the connecting frame is arranged on the side wall of the fixed frame on the lower side of the sliding plate, the connecting frame passes through the fixed frame on one side, the third spring, a plurality of second inductors are embedded on the sliding block, a fourth spring is arranged on the second inductors, and a moving block is connected to the fourth spring.
Optionally, the moving block is made of a rubber material.
Optionally, the fixture comprises two fixture blocks, two screw rods and two nuts, the two screw rods are fixedly connected to the side walls of the fixture blocks, the screw rods penetrate through the corresponding sliding plates, and the nuts are arranged on the screw rods.
Optionally, the alarm is further included, and the alarm is mounted on one side, close to the second fixing plate, of the top plate.
Has the advantages that:
1. the invention can conveniently detect the thickness and the pins of the medical chip by matching the movable limiting mechanism, the flatness testing mechanism and the pin testing mechanism, and does not need a user to measure and evaluate the thickness and the pins of the semiconductor by a card holding ruler, so that the medical chip can be conveniently detected and the medical chip can be prevented from being damaged;
2. through the matching of the movable limiting mechanism and the pushing mechanism, unqualified medical chips can be collected;
3. by replacing the roller, the medical chips of other models can be conveniently tested;
4. the fire alarm can remind a user in time, and huge loss caused by fire disasters due to short circuit is prevented.
Drawings
Fig. 1 is a schematic perspective view of the present invention.
Fig. 2 is a partial perspective view of the present invention.
Fig. 3 is a schematic perspective view of the movement limiting mechanism of the present invention.
Fig. 4 is a schematic perspective view of the gear motor of the present invention.
Fig. 5 is a schematic perspective view of the flatness testing mechanism according to the present invention.
Fig. 6 is a schematic perspective view of the present invention a.
Fig. 7 is a schematic perspective view of a pin testing mechanism according to the present invention.
FIG. 8 is a schematic perspective view of the slider of the present invention.
Fig. 9 is a schematic perspective view of a second inductor according to the present invention.
Fig. 10 is a schematic perspective view of a fixture block according to the present invention.
The meaning of the reference symbols in the figures: 1: workbench, 2: collection frame, 3: a vertical plate, 4: top plate, 5: first mounting plate, 6: telescopic cylinder, 7: remove stop gear, 71: slide rail, 72: first slider, 73: connection plate, 74: strut, 75: first fixing plate, 76: second mounting plate, 77: gear motor, 78: gear, 79: fixed sliding sleeve, 710: rack, 711: first moving plate, 712: second moving plate, 713: straight slot, 714: a splint, 715: first runner, 716: second slider, 717: second cylinder, 718: fixed block, 719: push plate, 8: flatness testing mechanism, 81: second fixing plate, 82: first spring, 83: carriage, 84: sliding plate, 85: roller, 86: second spring, 87: first inductor, 9: ejection mechanism, 91: mounting frame, 92: first cylinder, 93: limiting plate, 10: pin test mechanism, 101: second chute, 102: mount, 103: third cylinder, 104: connecting rod, 105: slide plate, 1051: connecting frame, 106: third spring, 107: contact block, 108: contact stem, 109: slider, 1010: second inductor, 1011: fourth spring, 1012: moving block, 11: a cartridge, 12: screw, 13: nut, 14: an alarm.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings in conjunction with the following detailed description. It should be understood that the description is intended to be exemplary only, and is not intended to limit the scope of the present invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.
Example 1
A semiconductor chip flatness detection device is shown in figure 1 and comprises a workbench 1, a collection frame 2, vertical plates 3, a top plate 4, a first mounting plate 5, a telescopic cylinder 6, a movable limiting mechanism 7, a flatness testing mechanism 8, a pushing mechanism 9 and a pin testing mechanism 10, wherein the collection frame 2 is embedded in the middle of the top of the workbench 1, the vertical plates 3 are respectively mounted on the left side and the right side of the top of the workbench 1, the collection frame 2 is positioned between the left vertical plate 3 and the right vertical plate 3, the top plate 4 is arranged between the tops of the two vertical plates 3, the workbench 1 is connected with the first mounting plate 5, the first mounting plate 5 is fixedly connected with the left side wall of the right vertical plate 3, the telescopic cylinder 6 is arranged on the first mounting plate 5 through bolts, the movable limiting mechanism 7 is mounted between the left vertical plate 3 and the right vertical plate 3, the movable limiting mechanism 7 is positioned on the upper side of the, flatness testing mechanism 8 is installed to the bottom of roof 4, installs ejecting mechanism 9 on roof 4, and ejecting mechanism 9 is located flatness testing mechanism 8's left side, is provided with pin testing mechanism 10 between roof 4 bottom and the 3 upper portions of left side riser, and pin testing mechanism 10 is located ejecting mechanism 9's left side.
When the medical chip needs to be detected, a user places the medical chip on the movable limiting mechanism 7, then the user limits the medical chip through the movable limiting mechanism 7, then the user starts the telescopic air cylinder 6 to move the medical chip leftwards through the movable limiting mechanism 7, when the medical chip moves leftwards and is in contact with the flatness testing mechanism 8, the medical chip continues to move leftwards, so that the thickness of the medical chip can be tested through the flatness testing mechanism 8, when the medical chip moves leftwards and is in contact with the push-out mechanism 9, the thicker medical chip can be pushed down from the movable limiting mechanism 7 through the push-out mechanism 9 and falls into the collecting frame 2, so that the unqualified medical chip can be collected, when the medical chip moves leftwards and is positioned right below the pin testing mechanism 10, the user moves the medical chip upwards to a proper position through the movable limiting mechanism 7, the user passes through pin accredited testing organization 10 afterwards to test medical chip's pin can, after medical chip pin test accomplished, the user puts into collection frame 2 to unqualified medical chip, deposit qualified medical chip and collect can, the user resets through removing stop gear 7 afterwards, and start telescopic cylinder 6 and make and remove stop gear 7 and remove right the removal and reset and close, so need not measure and assess medical chip through slide caliper rule, thereby can conveniently test a large amount of medical chip, and can prevent that medical chip from damaging.
Example 2
On the basis of embodiment 1, as shown in fig. 1, 2, 3 and 4, the movement limiting mechanism 7 includes a sliding rail 71, a first sliding block 72, a connecting plate 73, two supporting rods 74, a first fixing plate 75, a second mounting plate 76, a reduction motor 77, a gear 78, a fixed sliding sleeve 79, a rack 710, a first moving plate 711, a second moving plate 712, a clamping plate 714, a second sliding block 716, a first cylinder 92, a fixing block 718 and a pushing plate 719, the sliding rail 71 is provided with two sliding blocks which are installed between two vertical plates 3, the sliding rail 71 is provided with sliding blocks in a sliding manner, the connecting plate 73 is fixedly connected between the tops of the front and rear first sliding blocks 72, the bottom of the connecting plate 73 is provided with four supporting rods 74, the first fixing plate 75 is fixed between the bottom ends of the four supporting rods 74, the side wall of the first fixing plate 75 is fixedly connected with the left end of the telescopic rod of the telescopic cylinder 6, the, the second mounting plate 76 is positioned between the four supporting rods 74, the top of the second mounting plate 76 is provided with a speed reducing motor 77 through bolts, a gear 78 is fixed on an output shaft of the speed reducing motor 77, the top of the first fixing plate 75 is provided with a fixing sliding sleeve 79, the fixing sliding sleeve 79 is positioned at the rear side of the gear 78, racks 710 are arranged at the upper side and the lower side of the fixing sliding sleeve 79 in a sliding manner, the upper rack 710 and the lower rack 710 are both meshed with the gear 78, a first moving plate 711 is arranged on the front side wall of the lower rack 710, a second moving plate 712 is fixedly connected to the top of the upper rack 710, a straight groove 713 is formed in the middle of the connecting plate 73, the first moving plate 711 and the second moving plate 712 both pass through the straight groove 713, clamping plates 714 are arranged at the tops of the first moving plate 711 and the second moving plate 712, first sliding grooves 715 are formed in the connecting plates 73 at the left side and the right, the tops of the left and right adjacent second sliding blocks 716 are fixedly connected with the bottoms of the clamping plates 714, first cylinders 92 are mounted on the first fixing plates 75 on the two sides of the lower rack 710, fixing blocks 718 are fixedly connected to telescopic rods of the first cylinders 92, push plates 719 are connected to side walls of the fixing blocks 718, and the push plates 719 penetrate through the connecting plates 73.
When in use, a user places a medical chip on the connecting plate 73 between the two clamping plates 714, then the user starts the reducing motor 77 to enable the gear 78 to rotate anticlockwise, the gear 78 rotates anticlockwise to enable the lower side rack 710 to move backwards, the lower side rack 710 moves backwards to enable the first moving plate 711 to move backwards, the first moving plate 711 moves backwards to enable the front side clamping plate 714 to move backwards, the gear 78 rotates anticlockwise to enable the upper side rack 710 to move forwards, the upper side rack 710 moves forwards to enable the second moving plate 712 to move forwards, the second moving plate 712 moves forwards to enable the rear side clamping plate 714 to move forwards, the front clamping plate 714 and the rear clamping plate 714 are closed, so that the medical chip can be clamped, when the medical chip is clamped, the user turns off the reducing motor 77, when a test is needed, the user repeats the above operation to enable the first fixing plate 75 to move leftwards, the first fixing plate 75 moves leftwards to enable a part on the first fixing plate 75 to move leftwards, therefore, the front clamping plate 714 and the rear clamping plate 714 can move leftwards, and the medical chip moves leftwards along with the movement, so that the test on the thickness and the pin flatness of the medical chip can be conveniently carried out.
As shown in fig. 1, 5 and 6, the flatness testing mechanism 8 includes a second fixing plate 81, first springs 82, a sliding frame 83, sliding plates 84, rollers 85, second springs 86 and first sensors 87, the second fixing plate 81 is installed at the bottom of the top plate 4, the second fixing plate 81 is connected with four first springs 82, the sliding frame 83 is installed between the bottom ends of the four first springs 82, the sliding plates 84 are slidably installed on the front and rear sides of the sliding frame 83, the rollers 85 are installed between the lower portions of the two sliding plates 84, the second springs 86 are fixedly connected to the top of the sliding plates 84, the first sensors 87 are installed on the front and rear sides of the bottom of the second fixing plate 81, and the top ends of the second springs 86 are respectively connected with the corresponding first sensors 87.
When the medical chip moves leftwards to contact with the roller 85, the medical chip continues to move leftwards, the medical chip with qualified flatness moves leftwards and cannot extrude the roller 85 to move upwards, when the medical chip moves leftwards to enable the roller 85 to move upwards, the roller 85 moves upwards to enable the sliding plate 84 to move upwards, the second spring 86 moves upwards to extrude the first sensor 87 along with the sliding plate, the first sensor 87 gives an alarm, and therefore a user can know that the medical chip is unqualified through testing.
Example 3
On the basis of embodiment 2, as shown in fig. 1 and fig. 2, the pushing-out mechanism 9 includes a mounting bracket 91, a second cylinder 717 and a limiting plate 93, the mounting bracket 91 is disposed on the top of the top plate 4, the second cylinder 717 is disposed on the mounting bracket 91 through a bolt, the limiting plate 93 is fixed on an expansion link of the second cylinder 717, and the limiting plate 93 passes through the mounting bracket 91 and the top plate 4.
Before using, the user starts second cylinder 717 and makes limiting plate 93 upwards or move to suitable position downwards, and the user closes second cylinder 717 afterwards, moves left and contacts with limiting plate 93 when the medical chip, and the medical chip continues to move left, when the medical chip is thick, can block the medical chip through limiting plate 93, and connecting plate 73 continues to move left thereupon, so can make unqualified medical chip fall into downwards in collecting frame 2 to can conveniently collect and deposit unqualified medical chip.
As shown in fig. 1, 7, 8 and 9, the pin testing mechanism 10 includes a fixed frame 102, a third cylinder 103, a connecting rod 104, a sliding plate 105, a connecting frame 1051, a third spring 106, a contact block 107, a contact rod 108, a sliding block 109, a second inductor 1010, a fourth spring 1011 and a moving block 1012, a second sliding slot 101 is opened on the left side of the bottom of the top plate 4, the fixed frame 102 is arranged in the second sliding slot 101 in a sliding manner, the fixed frame 102 is also fixedly connected to the bottom of the top plate 4 on the right side of the second sliding slot 101, the third cylinder 103 is installed on the upper portion of the right side wall of the left side vertical plate 3, the connecting rod 104 is fixed to the right end of the telescopic rod of the third cylinder 103, the connecting rod 104 is connected to the fixed frame 102 on the left side, the sliding plate 105 is installed on the upper portion of the left side wall of the fixed frame 102 on the right side, the sliding, the connecting frame 1051 penetrates through the fixed frame 102 on the left side, the bottom of the sliding plate 105 is provided with a third spring 106, the bottom end of the third spring 106 is provided with a contact block 107, the bottom of the contact block 107 is provided with a contact rod 108, the contact rod 108 penetrates through the connecting frame 1051, the lower parts of the left sliding block 109 and the right sliding block 109 are respectively embedded with at least two second inductors 1010, the second inductors 1010 are provided with fourth springs 1011, and the fourth springs 1011 are connected with moving blocks 1012.
When the medical chip moves leftwards and is positioned right below the contact rod 108, a user starts the first air cylinders 92 at the left side and the right side to enable the fixed block 718 to move upwards, the fixed block 718 moves upwards to enable the push plate 719 to move upwards, the medical chip can move upwards through the upward movement of the push plates 719 at the left side and the right side, after the medical chip moves upwards to a proper position, the user closes the first air cylinders 92 and enables pins of the medical chip and the moving block 1012 to be positioned on the same horizontal line, the medical chip can be limited through the matching of the third spring 106, the contact block 107 and the contact rod 108, when the pins of the medical chip need to be detected, the user starts the third air cylinder 103 to enable the fixed frame 102 at the left side to move rightwards through the connecting rod 104, the fixed frame 102 at the left side can move rightwards to enable the sliding block 109 at the left side, when the left moving block 1012 moves rightwards to be contacted with pins of a medical chip, the left moving block 1012 continues to move rightwards, so that the medical chip moves rightwards, the pins on the right side of the medical chip are contacted with the right moving block 1012, the connecting rod 104 continues to move the fixed frame 102 on the left side rightwards, the pins on the two sides of the medical chip push the moving blocks 1012 on the two sides to move towards the two sides, when one pin of the medical chip is long, the moving block 1012 is pushed to enable the fourth spring 1011 to extrude the second inductor 1010, so that the second inductor 1010 can give an alarm, the length of the pins of the medical chip is different, the pins need to be processed again, after the pin test of the medical chip is finished, a user starts the third air cylinder 103 to reset and close the fixed frame 102 on the left side through the connecting rod 104, and, then the user starts the first cylinder 92 to move the fixing block 718 downwards to reset and close, so that the medical chip can move downwards to reset, the user collects qualified medical chips, and then the user moves the movement limiting mechanism 7 to the right through the telescopic cylinder 6 to reset and close.
Example 4
On the basis of embodiment 3, as shown in fig. 1 and 10, the sliding door further includes two latch blocks 11, two screw rods 12 and two nuts 13, the two screw rods 12 are fixedly connected to the side walls of the latch blocks 11, the screw rods 12 pass through the corresponding sliding plates 84, and the nuts 13 are disposed on the screw rods 12.
When chips of other models need to be tested, a user takes the nut 13 off the screw 12, then moves the fixture block 11 leftwards to enable the screw 12 to move out of the sliding plate 84, the user replaces the roller 85, then the user resets the screw 12 through the fixture block 11, and resets the nut 13, so that the roller 85 can be limited, and the chips of other models can be conveniently tested.
As shown in fig. 1, the fire alarm 14 is further included, the fire alarm 14 is mounted at the bottom of the top plate 4, and the fire alarm 14 is located on the right side of the second fixing plate 81.
The fire alarm 14 can remind the user in time to prevent fire from causing great loss due to short circuit.
While the disclosure has been described with respect to a limited number of embodiments, those skilled in the art, having benefit of this disclosure, will appreciate that various other embodiments can be devised which do not depart from the scope of the invention as disclosed herein. Accordingly, the scope of the invention should be limited only by the attached claims.

Claims (8)

1. The utility model provides a semiconductor chip roughness detection device which characterized in that: comprises a workbench (1), a collecting frame (2), vertical plates (3), a top plate (4), a first mounting plate (5), a telescopic cylinder (6), a movable limiting mechanism (7), a flatness testing mechanism (8), a pushing mechanism (9) and a pin testing mechanism (10), wherein the collecting frame (2) is embedded on the workbench (1), the vertical plates (3) are arranged on the workbench (1) at two sides of the collecting frame (2), the top plate (4) is arranged between the two vertical plates (3), one side of the workbench (1) far away from the collecting frame (2) is connected with the first mounting plate (5), the telescopic cylinder (6) is arranged on the first mounting plate (5), the movable limiting mechanism (7) is arranged between the two vertical plates (3) at the upper side of the first mounting plate (5), the movable limiting mechanism (7) is connected with the telescopic cylinder (6), the flatness testing mechanism (8) is arranged at the bottom of the top plate (4), a pushing-out mechanism (9) is installed on one side, close to the flatness testing mechanism (8), of the bottom of the top plate (4), and a pin testing mechanism (10) is arranged on one side, close to the pushing-out mechanism (9), of the bottom of the top plate (4).
2. A semiconductor chip flatness detecting apparatus according to claim 1, wherein: the movable limiting mechanism (7) comprises a sliding rail (71), a first sliding block (72), a connecting plate (73), supporting rods (74), a first fixing plate (75), a second mounting plate (76), a speed reducing motor (77), a gear (78), a fixed sliding sleeve (79), a rack (710), a first moving plate (711), a second moving plate (712), a clamping plate (714), a second sliding block (716), a first cylinder (92), a fixing block (718) and a pushing plate (719), wherein two sliding rails (71) are arranged and are respectively mounted between two vertical plates (3), sliding blocks are arranged on the sliding rail (71) in a sliding manner, the connecting plate (73) is fixedly connected between the two first sliding blocks (72), four supporting rods (74) are arranged on the connecting plate (73), the first fixing plate (75) is fixed between the four supporting rods (74), the side wall of the first fixing plate (75) is fixedly connected with a telescopic rod of a telescopic cylinder (6, a second mounting plate (76) is arranged on the first fixing plate (75), the second mounting plate (76) is positioned among the four supporting rods (74), a speed reducing motor (77) is mounted on the second mounting plate (76), a gear (78) is fixed on an output shaft of the speed reducing motor (77), a fixed sliding sleeve (79) is connected to one side, close to the gear (78), of the first fixing plate (75), two racks (710) are slidably arranged on the fixed sliding sleeve (79), the two racks (710) are respectively meshed with the gear (78), a first moving plate (711) is mounted on the side wall of the lower rack (710), a second moving plate (712) is fixedly connected to the top of the upper rack (710), a straight groove (713) is formed in the connecting plate (73), the first moving plate (711) and the second moving plate (712) both penetrate through the straight groove (713), and clamping plates (714) are mounted on the tops of the first moving plate (711) and the second moving plate (712), all opened first spout (715) on connecting plate (73) of word groove (713) both sides, the both sides of first spout (715) all slidingtype are equipped with second slider (716), two adjacent second slider (716) all with splint (714) rigid coupling, all install first cylinder (92) on first fixed plate (75) of downside rack (710) both sides, the rigid coupling has fixed block (718) on the telescopic link of first cylinder (92), be connected with push pedal (719) on the lateral wall of fixed block (718), push pedal (719) pass connecting plate (73).
3. A semiconductor chip flatness detecting apparatus according to claim 2, wherein: flatness accredited testing organization (8) is including second fixed plate (81), first spring (82), carriage (83), sliding plate (84), running roller (85), second spring (86) and first inductor (87), the bottom at roof (4) is installed in second fixed plate (81), be connected with four first spring (82) on second fixed plate (81), install carriage (83) between four first spring (82), sliding type is equipped with two sliding plate (84) on carriage (83), be equipped with running roller (85) between two sliding plate (84), the rigid coupling has second spring (86) on sliding plate (84), first inductor (87) are all installed to the both sides of second fixed plate (81) bottom, two second spring (86) are connected with corresponding first inductor (87) respectively.
4. A semiconductor chip flatness detecting apparatus according to claim 3, wherein: push-out mechanism (9) is including mounting bracket (91), second cylinder (717) and limiting plate (93), and mounting bracket (91) set up at the top of roof (4), is provided with second cylinder (717) on mounting bracket (91), installs limiting plate (93) on the telescopic link of second cylinder (717), and mounting bracket (91) and roof (4) are passed to limiting plate (93).
5. A semiconductor chip flatness detecting apparatus according to claim 4, wherein: the pin testing mechanism (10) comprises a fixing frame (102), a third cylinder (103), a connecting rod (104), a sliding plate (105), a connecting frame (1051), a third spring (106), a contact block (107), a contact rod (108), a sliding block (109), a second inductor (1010), a fourth spring (1011) and a moving block (1012), wherein a second sliding groove (101) is formed in one side, far away from the mounting frame (91), of the top plate (4), the fixing frame (102) is arranged in the second sliding groove (101) in a sliding mode, the fixing frame (102) is also fixedly connected to one side, close to the second sliding groove (101), of the bottom of the top plate (4), the third cylinder (103) is installed on the side wall of a vertical plate (3) on one side, the connecting rod (104) is fixedly connected to the telescopic rod of the third cylinder (103), the connecting rod (104) is connected with the fixing frame (102) on one side, the sliding plate, slide (105) pass mount (102) of one side, install link (1051) on mount (102) the lateral wall of slide (105) downside, link (1051) pass mount (102) of one side, third spring (106) are installed to the bottom of slide (105), be provided with on third spring (106) and contact piece (107), install contact rod (108) on contact piece (107), contact rod (108) pass link (1051), it is equipped with a plurality of second inductor (1010) to inlay on sliding block (109), be provided with fourth spring (1011) on second inductor (1010), be connected with movable block (1012) on fourth spring (1011).
6. A semiconductor chip flatness detecting apparatus according to claim 5, wherein: the moving block (1012) is made of rubber materials.
7. A semiconductor chip flatness detecting apparatus according to claim 5, wherein: the fixture comprises two fixture blocks (11), two screw rods (12) and two nuts (13), wherein the two screw rods (12) are fixedly connected to the side wall of each fixture block (11), the screw rods (12) penetrate through the corresponding sliding plates (84), and the nuts (13) are arranged on the screw rods (12).
8. A semiconductor chip flatness detecting apparatus according to claim 7, wherein: the alarm device is characterized by further comprising an alarm device (14), wherein the alarm device (14) is installed on one side, close to the second fixing plate (81), of the top plate (4).
CN202011213400.2A 2020-11-04 2020-11-04 Semiconductor chip roughness detection device Active CN112452781B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011213400.2A CN112452781B (en) 2020-11-04 2020-11-04 Semiconductor chip roughness detection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011213400.2A CN112452781B (en) 2020-11-04 2020-11-04 Semiconductor chip roughness detection device

Publications (2)

Publication Number Publication Date
CN112452781A true CN112452781A (en) 2021-03-09
CN112452781B CN112452781B (en) 2022-04-12

Family

ID=74835919

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202011213400.2A Active CN112452781B (en) 2020-11-04 2020-11-04 Semiconductor chip roughness detection device

Country Status (1)

Country Link
CN (1) CN112452781B (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113219324A (en) * 2021-04-28 2021-08-06 深圳市利拓光电有限公司 Semiconductor chip detection device
CN113458010A (en) * 2021-07-09 2021-10-01 邹佳文 Metal sheet roughness check out test set after punching press
CN113996555A (en) * 2021-10-29 2022-02-01 中铁上海工程局集团有限公司 Roller contact type concrete plate flatness detection system and detection method thereof
CN114377988A (en) * 2022-01-20 2022-04-22 广州大成电子有限公司 Flatness detection machine with intelligent sorting function
CN114405839A (en) * 2021-12-22 2022-04-29 徐州盛科半导体科技有限公司 Intelligent defect detection equipment for packaged chip
CN114798485A (en) * 2022-04-12 2022-07-29 派珂纳米科技(苏州)有限公司 Silicon steel sheet insulating coating tectorial membrane levels detection device
CN114963951A (en) * 2022-07-30 2022-08-30 武汉山那边科技有限公司 Plate flatness measuring device for manufacturing furniture

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11217116A (en) * 1998-01-30 1999-08-10 Tokyo Seiko Co Ltd Inspection device for throw-away chip
JP2004045097A (en) * 2002-07-09 2004-02-12 Ikegami Tsushinki Co Ltd Visual inspection apparatus
CN103041995A (en) * 2012-11-28 2013-04-17 东莞市凯昶德电子科技股份有限公司 Automatic deformation screening machine for pins of connector housings
CN103357592A (en) * 2013-06-28 2013-10-23 东莞市凯昶德电子科技股份有限公司 Automatic detection device of electrical connectors
FR3006048A1 (en) * 2013-05-24 2014-11-28 Commissariat Energie Atomique METHOD OF CHARACTERIZING THE TOPOGRAPHY OF A SURFACE
CN104457502A (en) * 2014-12-15 2015-03-25 苏州工业职业技术学院 Semi-automatic workpiece thickness rapid detection jig
CN108317928A (en) * 2018-05-11 2018-07-24 苏州宏泉高压电容器有限公司 A kind of high voltage ceramic capacitor ceramic dielectric chip thickness detection device
CN108592770A (en) * 2018-04-20 2018-09-28 钟维栋 A kind of square-wood plate flatness detection device
CN208567742U (en) * 2018-08-13 2019-03-01 拓闻(天津)电子科技有限公司 Semiconductor chip pin detection device
CN109550702A (en) * 2019-01-07 2019-04-02 昆山宇辰光通自动化科技有限公司 Automatic IC testing, sorting equipment
CN111089531A (en) * 2019-11-27 2020-05-01 南通长青沙船舶工程有限公司 Flatness measuring equipment of propulsion device for shipbuilding factory and using method
CN111322933A (en) * 2020-03-18 2020-06-23 唐山学院 Automatic change plane degree detection device
CN211803539U (en) * 2020-01-08 2020-10-30 武汉艾特艾迪汽车科技有限公司 Chip pin bending device and chip pin bending machine

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11217116A (en) * 1998-01-30 1999-08-10 Tokyo Seiko Co Ltd Inspection device for throw-away chip
JP2004045097A (en) * 2002-07-09 2004-02-12 Ikegami Tsushinki Co Ltd Visual inspection apparatus
CN103041995A (en) * 2012-11-28 2013-04-17 东莞市凯昶德电子科技股份有限公司 Automatic deformation screening machine for pins of connector housings
FR3006048A1 (en) * 2013-05-24 2014-11-28 Commissariat Energie Atomique METHOD OF CHARACTERIZING THE TOPOGRAPHY OF A SURFACE
CN103357592A (en) * 2013-06-28 2013-10-23 东莞市凯昶德电子科技股份有限公司 Automatic detection device of electrical connectors
CN104457502A (en) * 2014-12-15 2015-03-25 苏州工业职业技术学院 Semi-automatic workpiece thickness rapid detection jig
CN108592770A (en) * 2018-04-20 2018-09-28 钟维栋 A kind of square-wood plate flatness detection device
CN108317928A (en) * 2018-05-11 2018-07-24 苏州宏泉高压电容器有限公司 A kind of high voltage ceramic capacitor ceramic dielectric chip thickness detection device
CN208567742U (en) * 2018-08-13 2019-03-01 拓闻(天津)电子科技有限公司 Semiconductor chip pin detection device
CN109550702A (en) * 2019-01-07 2019-04-02 昆山宇辰光通自动化科技有限公司 Automatic IC testing, sorting equipment
CN111089531A (en) * 2019-11-27 2020-05-01 南通长青沙船舶工程有限公司 Flatness measuring equipment of propulsion device for shipbuilding factory and using method
CN211803539U (en) * 2020-01-08 2020-10-30 武汉艾特艾迪汽车科技有限公司 Chip pin bending device and chip pin bending machine
CN111322933A (en) * 2020-03-18 2020-06-23 唐山学院 Automatic change plane degree detection device

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113219324A (en) * 2021-04-28 2021-08-06 深圳市利拓光电有限公司 Semiconductor chip detection device
CN113219324B (en) * 2021-04-28 2022-09-20 深圳市利拓光电有限公司 Semiconductor chip detection device
CN113458010A (en) * 2021-07-09 2021-10-01 邹佳文 Metal sheet roughness check out test set after punching press
CN113458010B (en) * 2021-07-09 2023-08-08 东莞市博飞特模具有限公司 Metal sheet roughness check out test set after punching press
CN113996555A (en) * 2021-10-29 2022-02-01 中铁上海工程局集团有限公司 Roller contact type concrete plate flatness detection system and detection method thereof
CN114405839A (en) * 2021-12-22 2022-04-29 徐州盛科半导体科技有限公司 Intelligent defect detection equipment for packaged chip
CN114405839B (en) * 2021-12-22 2023-12-19 徐州盛科半导体科技有限公司 Intelligent defect detection equipment for packaged chip
CN114377988A (en) * 2022-01-20 2022-04-22 广州大成电子有限公司 Flatness detection machine with intelligent sorting function
CN114798485A (en) * 2022-04-12 2022-07-29 派珂纳米科技(苏州)有限公司 Silicon steel sheet insulating coating tectorial membrane levels detection device
CN114963951A (en) * 2022-07-30 2022-08-30 武汉山那边科技有限公司 Plate flatness measuring device for manufacturing furniture

Also Published As

Publication number Publication date
CN112452781B (en) 2022-04-12

Similar Documents

Publication Publication Date Title
CN112452781B (en) Semiconductor chip roughness detection device
CN107966124B (en) Automobile battery tray checking fixture
WO2021082378A1 (en) Test device for electrical automation apparatus
CN209193023U (en) A kind of multi-functional detection screening installation of notebook computer shell
CN211979119U (en) Automatic chip connection testing equipment
CN211205578U (en) Temperature testing device for signal processing board
CN219552596U (en) Electronic product mainboard multiunit detection device
CN219161253U (en) Positioning device for copper thickness measuring instrument of rigid circuit board
CN208075720U (en) A kind of automobile glass checking tool
CN116203389A (en) Multi-station testing equipment for integrated circuit manufacturing
CN201607201U (en) Check tool for cross connection supports of automobile instrument board framework cross beams
CN204902719U (en) Spring length detection device
CN112137240A (en) Sole antiskid nature detection device
CN201844787U (en) Check fixture for checking automobile left bracket cover plate
CN207556387U (en) A kind of automobile absorber detecting tool
CN218381106U (en) Temperature and humidity vibration detection box with anti-interference function
CN218916137U (en) Detector with adapt to multiple type gauge block function
CN109368240A (en) A kind of multi-functional detection screening installation of notebook computer shell
CN215261519U (en) Complex die part checking fixture
CN110514153A (en) A kind of heavy parts planar detecting device
CN213750192U (en) Electronic component carrier tray placing device
CN113624091B (en) Detection device capable of testing quality of graduated scale
CN217533881U (en) Clean storage device of light shield intellectual detection system
CN216234630U (en) Material moving device for SMD electronic component testing
CN220922133U (en) Detection positioning jig

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right
TA01 Transfer of patent application right

Effective date of registration: 20220323

Address after: 215300 room 1, Xueyuan Road 999, Bacheng Town, Kunshan, Suzhou, Jiangsu.

Applicant after: Huayan core measurement semiconductor (Suzhou) Co.,Ltd.

Address before: 641000 youjiatuo village, Longmen Town, Shizhong District, Neijiang City, Sichuan Province

Applicant before: Cheng Xinzhong

GR01 Patent grant
GR01 Patent grant