CN114405839B - Intelligent defect detection equipment for packaged chip - Google Patents
Intelligent defect detection equipment for packaged chip Download PDFInfo
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- CN114405839B CN114405839B CN202111608086.2A CN202111608086A CN114405839B CN 114405839 B CN114405839 B CN 114405839B CN 202111608086 A CN202111608086 A CN 202111608086A CN 114405839 B CN114405839 B CN 114405839B
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- 238000001514 detection method Methods 0.000 title claims abstract description 62
- 230000007547 defect Effects 0.000 title claims abstract description 22
- 230000002950 deficient Effects 0.000 claims abstract description 31
- 230000007246 mechanism Effects 0.000 claims abstract description 20
- 238000001802 infusion Methods 0.000 claims description 9
- 238000005507 spraying Methods 0.000 claims description 5
- 239000004698 Polyethylene Substances 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 3
- -1 polyethylene Polymers 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 claims 3
- 238000013461 design Methods 0.000 abstract description 7
- 239000007921 spray Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 238000012545 processing Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000009434 installation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
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- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The invention discloses intelligent defect detection equipment for a packaged chip, which comprises chip pin defect detection equipment, wherein the chip pin defect detection equipment mainly comprises an operation table, a conveyor, pin shape detectors, pin electrifying detectors, an appearance image detector and a defective product removing mechanism, wherein the conveyor is arranged on the operation table, the pin shape detectors are arranged on the operation table and are positioned right above the conveyor, each pin shape detector consists of a first machine body shell, pin corner detectors and a sprayer, the pin corner detectors are respectively provided with two groups and are symmetrically arranged in the first machine body shell, and the sprayer is positioned on the back surface of the first machine body shell. The invention designs equipment for detecting the defects of pins of a packaged chip, and the detection equipment adopts an automatic conveying and three-level detection mode and can acquire physical form, power-on condition and image information of the pins.
Description
Technical Field
The invention relates to the technical field of chip detection, in particular to intelligent defect detection equipment for a packaged chip.
Background
The shell for mounting semiconductor integrated circuit chip plays roles of placing, fixing, sealing, protecting chip and enhancing electrothermal performance, and is also a bridge for communicating the world inside the chip with external circuits, namely, the joints on the chip are connected to pins of the packaging shell by leads, and the pins are connected with other devices by leads on the printed board. Therefore, packaging plays an important role in both CPU and other LSI integrated circuits, and in order to ensure the quality of the packaged chip, it is generally necessary to perform inspection processing on the chip to ensure the quality of the finished product.
However, the existing packaging chip has the following problems in the detection process: (1) The existing detection equipment detects the chip body in many ways, and the pins of the packaged chip are easy to deform in the production, processing and transferring processes due to an external design mode, so that the subsequent installation treatment is not facilitated, and the existing detection equipment lacks a mode for detecting the chip pins; (2) The existing packaging chip detection equipment generally needs to be manually removed for unqualified products, and has insufficient automation and intelligent degree. For this purpose, a corresponding technical solution is required to be designed to solve the existing technical problems.
Disclosure of Invention
The invention aims to provide intelligent defect detection equipment for a packaged chip, which solves the technical problems that the existing detection equipment is used for detecting a chip body, pins of the packaged chip are easy to deform in the production, processing and transferring processes due to an external design mode, subsequent installation and treatment are not facilitated, and the existing detection equipment is lack of a mode for detecting the pins of the chip.
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides a defect intelligent detection equipment of encapsulation chip, includes chip pin defect detection equipment, chip pin defect detection equipment mainly includes operation panel, conveyer, pin form detector, pin circular telegram detector, outward appearance image detector and defective goods rejection mechanism, the conveyer is installed on the operation panel, pin form detector installs on the operation panel and is located directly over the conveyer, pin form detector comprises engine body shell one, pin corner detector and sprayer, pin corner detector divides and is equipped with two sets of and symmetry installs in engine body shell one's inside, the sprayer is located engine body shell one's back, pin circular telegram detector installs on the right side of pin form detector and includes engine body shell two sets of circuit detection splint on engine body shell two inner walls, outward appearance image detector installs on the right side of pin circular telegram detector and includes engine body shell three and installs two sets of 3D laser cameras on engine body shell three inner walls, the both sides of 3D laser camera are installed the light and are connected with the control panel through the circuit, the sprayer is located engine body shell one's back, pin circular telegram detector is equipped with three sets of defective goods respectively and is installed in engine body shell three sets of detector, the appearance image detector.
As a preferred embodiment of the invention, the pin corner detector consists of a sliding block, a telescopic rod, a corner detection wheel, a pressure sensor, an indicator light and an electric push rod I, wherein the sliding block is arranged on the inner wall of the machine body shell I in a sliding manner, the lower end of the sliding block is fixedly connected with the telescopic rod, the telescopic rod is of a two-section structure, the lower end of the telescopic rod is provided with the corner detection wheel, the pressure sensor is arranged between the corner detection wheel and the telescopic rod and is connected with the indicator light through a circuit, the indicator light is arranged on the front side of the machine body shell I, and the electric push rod I is arranged on the side wall of the machine body shell I, and the power output end of the electric push rod I is connected with the telescopic rod.
As a preferred embodiment of the present invention, the corner detection wheel has a wheel-like structure and an edge has a cambered surface structure, and an upper end of the corner detection wheel is in contact with a detection end of the pressure sensor.
As a preferred implementation mode of the invention, the sprayer comprises a containing box arranged on a first machine body shell and two groups of infusion tubes connected with the containing box through pipelines, pumps are arranged at the lower ends of the two groups of infusion tubes, the pumps are connected with a spray head through the infusion tubes, a vertical rod is arranged at the upper end of the spray head, the vertical rod is arranged on the inner wall of the first machine body shell in a sliding mode, and one side of the vertical rod is connected with a second electric push rod.
As a preferred implementation mode of the circuit detection clamp plate, the circuit detection clamp plate comprises a driving motor, a driving gear, a driven gear, a screw rod, a triangular plate and an electrifying interface, wherein the power output end of the driving motor is connected with the driving gear, the lower part of the driving gear is connected with the driven gear in a meshed manner, the screw rod is provided with two groups which are symmetrically arranged on two sides of the driven gear, the outer ends of the two groups of screw rods are respectively threaded and inserted with a lantern ring, the triangular plate is provided with two groups which are respectively fixed below the lantern ring, and the electrifying interface is arranged at the bottom of the triangular plate and is connected with an alarm lamp through a circuit.
As a preferred embodiment of the present invention, the external threads of the two sets of screws are identical, and the internal threads of the two sets of collars are opposite.
As a preferred embodiment of the present invention, the triangular plate has an inverted triangle structure and is made of polyethylene insulating material.
As a preferred embodiment of the present invention, the defective product removing mechanism comprises a shovel plate, a mounting block, a micro motor and a defective product storage box, wherein the inner end of the shovel plate is positioned on the conveyor, a rotating rod is arranged in the mounting plate, the outer end of the rotating rod is connected with the power output end of the micro motor, the outer end of the shovel plate is connected with the rotating rod, and the defective product Chu Nahe is mounted on the outer side of the mounting block.
Compared with the prior art, the invention has the following beneficial effects:
1. the invention designs a device for detecting pin defects of a packaged chip, which mainly comprises an operation table, a conveyor, a pin shape detector, a pin electrifying detector, an appearance image detector and a defective product removing mechanism, wherein the packaged chip to be detected is conveyed and processed in sequence through the conveyor, firstly, the packaged chip enters the pin shape detector, the corner shape of the pin is detected through the pin shape detector, when the corner shape is unqualified, the spraying and marking processing is carried out on the corner position of the corresponding pin through a spraying mechanism on the back, the pin is conveyed to the defective product removing mechanism for overturning and removing, if the detection is qualified, the pin is continuously conveyed into the pin electrifying detector, the outer end of the pin of the chip is clamped through a triangular clamping plate of the pin electrifying detector, and a micro current detecting circuit is fed or not smoothly, if the circuit is not smooth, the defective product removing mechanism is used for overturning, if the circuit is not smooth, the circuit is continuously conveyed to the appearance image detector, the image information of the pin is obtained through a 3D laser camera arranged on two sides of an outer pipe image detector, and is compared with database information, if the image information of the pin is not qualified, the image information is not standard, and the defective product is removed through the overturning mechanism, and the defective product removing mechanism is carried out through the conveyor when the circuit is not smooth.
2. The invention designs equipment for detecting the defects of pins of a packaged chip, and the detection equipment adopts an automatic conveying and three-level detection mode and can acquire physical form, power-on condition and image information of the pins.
Drawings
FIG. 1 is an overall block diagram of the present invention;
FIG. 2 is a front end block diagram of a pin configuration detector according to the present invention;
FIG. 3 is a rear end block diagram of a pin configuration detector according to the present invention;
FIG. 4 is a block diagram of a pin energized detector according to the present invention;
FIG. 5 is a block diagram of an appearance image detector according to the present invention;
fig. 6 is a structural diagram of the defective product removing mechanism according to the present invention.
In the figure, 1, an operation table; 2. a conveyor; 3. a first machine body shell; 4. a pin corner detector; 5. a spray applicator; 6. a second machine body shell; 7. a circuit detection clamping plate; 8. a third body shell; 9. a 3D laser camera; 10. a lighting lamp; 11. a console; 12. a slide block; 13. a telescopic rod; 14. a corner detection wheel; 15. a pressure sensor; 16. an indicator light; 17. an electric push rod I; 18. a housing box; 19. an infusion tube; 20. a pump; 21. a spray head; 22. a vertical rod; 23. an electric push rod II; 24. a driving motor; 25. a drive gear; 26. a driven gear; 27. a screw; 28. a triangle; 29. a power-on interface; 30. a collar; 31. an alarm lamp; 32. a shovel plate; 33. a mounting block; 34. a micro motor; 35. a defective storage box; 36. and rotating the rod.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1: referring to fig. 1-6, the present invention provides a technical solution: the utility model provides a defect intelligent detection equipment of encapsulation chip, chip pin defect detection equipment includes mainly that operation panel 1, conveyer 2, pin form detector, pin circular telegram detector, outward appearance image detector and defective products reject the mechanism, conveyer 2 installs on operation panel 1, pin form detector installs on operation panel 1 and is located directly over conveyer 2, pin form detector comprises engine body shell one 3, pin corner detector 4 and sprayer 5, pin corner detector 4 divides and is equipped with two sets of and symmetry installs in engine body shell one's 3 inside, sprayer 5 is located engine body shell one's 3 back, pin circular telegram detector installs on the right side of pin form detector and includes engine body shell two 6 and slides and set up two sets of circuit detection splint 7 on engine body shell two 6 inner walls, outward appearance image detector installs on the right side of pin circular telegram detector and includes engine body shell three 8 and installs two sets of 3D laser cameras 9 on engine body shell three 8 inner walls, the both sides of 3D laser camera 9 install light 10 and have control panel 11 through the circuit connection, the sprayer 5 is located engine body shell one's 3's back, pin circular telegram detector installs three sets of defective products, the detector is equipped with in the pin form detector respectively, the right side image detector is installed to the defective products.
Example 2: as shown in fig. 2: the pin corner detector 4 comprises a sliding block 12, a telescopic rod 13, a corner detection wheel 14, a pressure sensor 15, an indicator light 16 and an electric push rod 17, wherein the sliding block 12 is arranged on the inner wall of the first machine body shell 3 in a sliding mode, the lower end of the sliding block is fixedly connected with the telescopic rod 13, the telescopic rod 13 is of a two-section structure, the lower end of the telescopic rod is provided with the corner detection wheel 14, the pressure sensor 15 is arranged between the corner detection wheel 14 and the telescopic rod 13 and is connected with the indicator light 16 through a circuit, the indicator light 16 is arranged on the front side of the first machine body shell 3, the electric push rod 17 is arranged on the side wall of the first machine body shell 3, the power output end of the electric push rod 17 is connected with the telescopic rod 13, the electric push rod 17 pushes the telescopic rod 13 to move and enable the corner detection wheel 14 to correspond to the corner position of a pin and be in contact with the corner position of the pin, the pressure sensor 15 detects the pressure of the corner detection wheel 14, and when the pressure value is abnormal, the amplitude or thickness of the corner position of the pin is indicated, and the corresponding rejection can be achieved.
The corner detection wheel 14 is in a wheel-shaped structure, the edge of the corner detection wheel is in an arc-shaped structure, the upper end of the corner detection wheel 14 is in contact with the detection end of the pressure sensor 15, the specifications of the corner detection wheel 14 are various, and the corner detection wheel can be replaced according to the amplitude of the corner of the pin.
Example 3: as shown in fig. 3: the sprayer 5 comprises a containing box 18 arranged on the first machine body shell 3 and two groups of infusion tubes 19 connected with the containing box 18 through pipelines, pumps 20 are arranged at the lower ends of the two groups of infusion tubes 19, the pumps 20 are connected with spray heads 21 through the infusion tubes 19, upright rods 22 are arranged at the upper ends of the spray heads 21, the upright rods 22 are arranged on the inner wall of the first machine body shell 3 in a sliding mode, one sides of the upright rods 22 are connected with electric push rods II 23, marking solution in the containing box 18 is pumped to the spray heads 21 through the pumps 20, and the corresponding pins are sprayed through the spray heads 21, so that subsequent corresponding treatment is facilitated.
Example 4: as shown in fig. 4: the circuit detection clamp plate 7 comprises a driving motor 24, a driving gear 25, a driven gear 26, a screw 27, a triangle 28 and an electrifying interface 29, wherein the power output end of the driving motor 24 is connected with the driving gear 25, the lower part of the driving gear 25 is meshed with the driven gear 26, the screw 27 is divided into two groups and symmetrically installed on two sides of the driven gear 26, the outer ends of the two groups of screws 27 are threaded through lantern rings 30, the triangle 28 is divided into two groups and respectively fixed on the lower part of the lantern rings 30, the electrifying interface 29 is installed on the bottom of the triangle 28 and connected with an alarm lamp 31 through a circuit, the driving gear 25 is driven to rotate through the driving motor 24, the driven gear 26 drives the driven gear 26 to rotate in the rotating process, the two groups of lantern rings 30 are driven to synchronously move inwards or synchronously outwards, the chip is convenient to clamp and detect, the electrifying interface 29 is contacted with pins of the chip, and the electrifying condition is detected.
The external threads of the two sets of screws 27 are the same, and the internal threads of the two sets of collars 30 are opposite, so that the two sets of triangular plates 28 can synchronously move inwards or outwards along the screws 27 in a design manner, and the chip can be conveniently clamped and detected.
The triangular plate 28 has an inverted triangular structure and is made of polyethylene insulating material, so that the situation of electric leakage is avoided.
Specifically, the defective goods removing mechanism comprises a shovel plate 32, a mounting block 33, a micro motor 34 and a defective goods storage box 35, wherein the inner end of the shovel plate 32 is positioned on the conveyor 2, a rotating rod 36 is arranged in the mounting plate, the outer end of the rotating rod 36 is connected with the power output end of the micro motor 34, the outer end of the shovel plate 32 is connected with the rotating rod 36, the defective goods storage box 35 is arranged on the outer side of the mounting block 33, defective goods are conveyed onto the shovel plate 32 through the conveyor, the rotating rod 36 is driven to rotate through the micro motor 34, and the rotating rod 36 drives the shovel plate 32 to turn over and place the defective goods into the defective goods storage box 35, so that the purpose of automatically removing the defective goods is achieved.
When in use: the invention designs a device for detecting pin defects of a packaged chip, which mainly comprises an operation table 1, a conveyor 2, a pin shape detector, a pin electrifying detector, an appearance image detector and a defective product removing mechanism, wherein the packaged chip to be detected is conveyed and processed in sequence through the conveyor 2, firstly enters the pin shape detector, the corner shape of the pin is detected through the pin shape detector, when the corner shape is unqualified, the spraying and marking processing is carried out on the corner position of the corresponding pin through a spraying mechanism on the back, the pin is conveyed to the defective product removing mechanism for overturning and removing, if the detection is qualified, the pin is continuously conveyed to the pin electrifying detector, the outer end of the pin of the chip is clamped and is fed with a micro current detecting circuit to be smooth, if the circuit is not smooth, the defective product removing mechanism is used for overturning, if the circuit is not smooth, the defective product removing mechanism is used for continuously conveying the chip to the appearance image detector, the image information of the pin is acquired through a 3D laser camera 9 arranged on two sides of an outer tube image detector and is compared with database information, if the defective product is not qualified, and the defective product is removed through the defective product removing mechanism is carried out through the conveyor 2.
Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present invention, and the present invention is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present invention has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (4)
1. The utility model provides a defect intelligent detection equipment of encapsulation chip, includes chip pin defect detection equipment, its characterized in that: the chip pin defect detection equipment mainly comprises an operation table (1), a transmission machine (2), a pin shape detector, a pin electrifying detector, an appearance image detector and a defective product removing mechanism, wherein the transmission machine (2) is installed on the operation table (1), the pin shape detector is installed on the operation table (1) and is positioned right above the transmission machine (2), the pin shape detector consists of a first machine shell (3), a pin corner detector (4) and a sprayer (5), the pin corner detector (4) is provided with two groups symmetrically installed inside the first machine shell (3), the sprayer (5) is positioned on the back surface of the first machine shell (3), the pin electrifying detector is installed on the right side of the second machine shell (6) and comprises two groups of circuit detection clamping plates (7) which are arranged on the inner wall of the second machine shell (6) in a sliding manner, the appearance image detector is installed on the right side of the third machine shell (8) and comprises two groups of cameras (3D) which are installed on the inner wall of the third machine shell (8), the two groups of cameras (9) are installed on the right side of the third machine shell (8) and the laser image detector is installed on the right side of the third machine shell (3) through the laser detector, the second machine shell (3) and the laser detector is installed on the right side of the second machine shell (3) and the laser detector is installed on the side of the second machine shell (6) respectively, the pin corner detector (4) consists of a sliding block (12), a telescopic rod (13), a corner detection wheel (14), a pressure sensor (15), an indicator lamp (16) and an electric push rod I (17), wherein the sliding block (12) is arranged on the inner wall of the engine body shell I (3) in a sliding manner, the lower end of the sliding block is fixedly connected with the telescopic rod (13), the telescopic rod (13) is of a two-section structure, the lower end of the telescopic rod is provided with the corner detection wheel (14), the pressure sensor (15) is arranged between the corner detection wheel (14) and the telescopic rod (13) and is connected with the indicator lamp (16) through a circuit, the indicator lamp (16) is arranged on the front side of the engine body shell I (3), the electric push rod I (17) is arranged on the side wall of the engine body shell I (3) and is connected with the telescopic rod (13), the corner detection wheel (14) is of a wheel-shaped structure, the upper end of the telescopic rod (14) is in contact with the detection end of the pressure sensor (15), the spray coating device (5) is arranged on the upper end of the pressure sensor (14) and comprises an upper pipe (19) and a lower pipe (18) which is connected with an infusion tube (18) of the two groups, and a transfusion tube (19) is arranged on the two groups of infusion tube groups (18), the utility model provides a shower nozzle, including pump (20), shower nozzle (21), pole setting (22) are installed to the upper end of shower nozzle (21), pole setting (22) slip sets up on the inner wall of organism shell one (3) and one side is connected with electric putter two (23), circuit detection splint (7) are by driving motor (24), drive gear (25), driven gear (26), screw rod (27), set square (28) and circular telegram interface (29) are constituteed, the power take off end of driving motor (24) is connected with drive gear (25), the below and the driven gear (26) meshing of drive gear (25) are connected, screw rod (27) divide to be equipped with two sets of and symmetrical mounting in the both sides of driven gear (26), two sets of the equal screw thread of outer end of screw rod (27) is interluded there is lantern ring (30), set square (28) divide and be equipped with two sets and be fixed in the below of lantern ring (30) respectively, circular telegram interface (29) are installed in the bottom of set square (28) and are warning lamp (31) through the circuit connection.
2. The intelligent defect detection device for a packaged chip according to claim 1, wherein: the external threads of the two groups of screw rods (27) are the same, and the internal threads of the two groups of lantern rings (30) are opposite.
3. The intelligent defect detection device for a packaged chip according to claim 1, wherein: the triangular plate (28) is in an inverted triangular structure and is made of polyethylene insulating materials.
4. The intelligent defect detection device for a packaged chip according to claim 1, wherein: the inferior product removing mechanism is composed of a shovel plate (32), a mounting block (33), a micro motor (34) and an inferior product storage box (35), wherein the inner end of the shovel plate (32) is positioned on a conveyor (2), a rotating rod (36) is arranged in the mounting block, the outer end of the rotating rod (36) is connected with the power output end of the micro motor (34), the outer end of the shovel plate (32) is connected with the rotating rod (36), and the inferior product storage box (35) is arranged on the outer side of the mounting block (33).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111608086.2A CN114405839B (en) | 2021-12-22 | 2021-12-22 | Intelligent defect detection equipment for packaged chip |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111608086.2A CN114405839B (en) | 2021-12-22 | 2021-12-22 | Intelligent defect detection equipment for packaged chip |
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| CN114405839A CN114405839A (en) | 2022-04-29 |
| CN114405839B true CN114405839B (en) | 2023-12-19 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114646647B (en) * | 2022-05-23 | 2022-08-02 | 深圳市禾川兴科技有限公司 | Chip pin welding defect detector based on reduction performance |
| CN115301565A (en) * | 2022-08-11 | 2022-11-08 | 徐州市沂芯微电子有限公司 | Full-automatic intelligent optical inspection equipment for integrated circuit board |
| CN116068057B (en) * | 2023-04-02 | 2023-06-20 | 广东仁懋电子有限公司 | SOT packaging chip defect detection method and system |
| CN117038494B (en) * | 2023-10-10 | 2023-12-15 | 天津芯成半导体有限公司 | Auxiliary intelligent detection system for chip processing industry |
| CN117129840B (en) * | 2023-10-26 | 2024-01-23 | 华迅信息技术研究(深圳)有限公司 | Integrated circuit chip detection equipment |
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