CN114365045B - 曝光装置和制造物品的方法 - Google Patents

曝光装置和制造物品的方法 Download PDF

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Publication number
CN114365045B
CN114365045B CN202080061309.5A CN202080061309A CN114365045B CN 114365045 B CN114365045 B CN 114365045B CN 202080061309 A CN202080061309 A CN 202080061309A CN 114365045 B CN114365045 B CN 114365045B
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China
Prior art keywords
light shielding
shielding member
plane
light
end portion
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CN202080061309.5A
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English (en)
Chinese (zh)
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CN114365045A (zh
Inventor
小林大辅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
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Canon Inc
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Publication of CN114365045A publication Critical patent/CN114365045A/zh
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Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058Mask illumination systems
    • G03F7/70091Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058Mask illumination systems
    • G03F7/70066Size and form of the illuminated area in the mask plane, e.g. reticle masking blades or blinds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058Mask illumination systems
    • G03F7/7015Details of optical elements
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058Mask illumination systems
    • G03F7/70075Homogenization of illumination intensity in the mask plane by using an integrator, e.g. fly's eye lens, facet mirror or glass rod, by using a diffusing optical element or by beam deflection
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058Mask illumination systems
    • G03F7/70141Illumination system adjustment, e.g. adjustments during exposure or alignment during assembly of illumination system
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058Mask illumination systems
    • G03F7/70191Optical correction elements, filters or phase plates for controlling intensity, wavelength, polarisation, phase or the like
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70358Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • G03F7/70558Dose control, i.e. achievement of a desired dose

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Developing Agents For Electrophotography (AREA)
CN202080061309.5A 2019-09-03 2020-07-21 曝光装置和制造物品的方法 Active CN114365045B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019160664A JP7446069B2 (ja) 2019-09-03 2019-09-03 露光装置及び物品の製造方法
JP2019-160664 2019-09-03
PCT/JP2020/028195 WO2021044755A1 (ja) 2019-09-03 2020-07-21 露光装置及び物品の製造方法

Publications (2)

Publication Number Publication Date
CN114365045A CN114365045A (zh) 2022-04-15
CN114365045B true CN114365045B (zh) 2024-04-26

Family

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CN202080061309.5A Active CN114365045B (zh) 2019-09-03 2020-07-21 曝光装置和制造物品的方法

Country Status (7)

Country Link
US (1) US11762298B2 (https=)
EP (1) EP4027199A4 (https=)
JP (1) JP7446069B2 (https=)
KR (1) KR102746191B1 (https=)
CN (1) CN114365045B (https=)
TW (1) TWI805936B (https=)
WO (1) WO2021044755A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7680878B2 (ja) 2021-05-07 2025-05-21 キヤノン株式会社 照明光学系、露光装置、および物品の製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002110529A (ja) * 2000-10-03 2002-04-12 Nikon Corp 投影露光装置及び該装置を用いたマイクロデバイス製造方法
JP2006253186A (ja) * 2005-03-08 2006-09-21 Nikon Corp 可変スリット装置、照明装置、露光装置、及びデバイスの製造方法
JP2010073835A (ja) * 2008-09-17 2010-04-02 Canon Inc 露光装置及びデバイス製造方法
WO2011010560A1 (ja) * 2009-07-24 2011-01-27 株式会社ニコン 照明光学系、露光装置、およびデバイス製造方法
JP2017053888A (ja) * 2015-09-07 2017-03-16 キヤノン株式会社 露光方法および露光装置、ならびに物品の製造方法
CN107621754A (zh) * 2016-07-13 2018-01-23 佳能株式会社 曝光装置、曝光方法以及物品制造方法
US9880474B2 (en) * 2013-05-16 2018-01-30 Carl Zeiss Smt Gmbh System for producing structures in a substrate

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US6013401A (en) * 1997-03-31 2000-01-11 Svg Lithography Systems, Inc. Method of controlling illumination field to reduce line width variation
JP2002033272A (ja) * 2000-05-11 2002-01-31 Nikon Corp 露光方法及び装置、並びにデバイス製造方法
JP2005109304A (ja) 2003-10-01 2005-04-21 Canon Inc 照明光学系及び露光装置
JP4458329B2 (ja) * 2003-12-26 2010-04-28 キヤノン株式会社 露光装置及びデバイス製造方法
JP5159027B2 (ja) * 2004-06-04 2013-03-06 キヤノン株式会社 照明光学系及び露光装置
JP2008153401A (ja) * 2006-12-15 2008-07-03 Canon Inc 露光装置及びデバイス製造方法
JP2009043933A (ja) * 2007-08-08 2009-02-26 Canon Inc 露光装置、調整方法、露光方法及びデバイス製造方法
JP2009059893A (ja) * 2007-08-31 2009-03-19 Nikon Corp 露光方法及び装置、並びにデバイス製造方法
JP5127875B2 (ja) * 2010-04-28 2013-01-23 キヤノン株式会社 リソグラフィ装置及び物品の製造方法
JP6015930B2 (ja) * 2012-12-07 2016-10-26 株式会社ニコン 露光方法及び露光装置、並びにデバイス製造方法
KR102547257B1 (ko) * 2017-07-25 2023-06-23 도판 인사츠 가부시키가이샤 노광 장치 및 노광 방법
JP6991462B2 (ja) 2018-03-15 2022-01-12 オムロン株式会社 小型光電センサ
US11165978B2 (en) 2019-04-16 2021-11-02 Canon Kabushiki Kaisha Imaging device, control method thereof, and imaging apparatus

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002110529A (ja) * 2000-10-03 2002-04-12 Nikon Corp 投影露光装置及び該装置を用いたマイクロデバイス製造方法
JP2006253186A (ja) * 2005-03-08 2006-09-21 Nikon Corp 可変スリット装置、照明装置、露光装置、及びデバイスの製造方法
JP2010073835A (ja) * 2008-09-17 2010-04-02 Canon Inc 露光装置及びデバイス製造方法
WO2011010560A1 (ja) * 2009-07-24 2011-01-27 株式会社ニコン 照明光学系、露光装置、およびデバイス製造方法
US9880474B2 (en) * 2013-05-16 2018-01-30 Carl Zeiss Smt Gmbh System for producing structures in a substrate
JP2017053888A (ja) * 2015-09-07 2017-03-16 キヤノン株式会社 露光方法および露光装置、ならびに物品の製造方法
CN107621754A (zh) * 2016-07-13 2018-01-23 佳能株式会社 曝光装置、曝光方法以及物品制造方法

Also Published As

Publication number Publication date
TWI805936B (zh) 2023-06-21
JP7446069B2 (ja) 2024-03-08
WO2021044755A1 (ja) 2021-03-11
TW202111441A (zh) 2021-03-16
CN114365045A (zh) 2022-04-15
EP4027199A1 (en) 2022-07-13
KR102746191B1 (ko) 2024-12-24
US20220171291A1 (en) 2022-06-02
KR20220042453A (ko) 2022-04-05
JP2021039244A (ja) 2021-03-11
US11762298B2 (en) 2023-09-19
EP4027199A4 (en) 2023-09-06

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