CN114340834A - 焊膏和焊料接合体 - Google Patents

焊膏和焊料接合体 Download PDF

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Publication number
CN114340834A
CN114340834A CN202080061477.4A CN202080061477A CN114340834A CN 114340834 A CN114340834 A CN 114340834A CN 202080061477 A CN202080061477 A CN 202080061477A CN 114340834 A CN114340834 A CN 114340834A
Authority
CN
China
Prior art keywords
solder
alloy
metal particles
solder joint
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080061477.4A
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English (en)
Chinese (zh)
Inventor
西村哲郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Superior Sha Co Ltd
Original Assignee
Nihon Superior Sha Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Superior Sha Co Ltd filed Critical Nihon Superior Sha Co Ltd
Publication of CN114340834A publication Critical patent/CN114340834A/zh
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
    • B23K35/302—Cu as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
    • B23K35/3033—Ni as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
    • B23K35/3046—Co as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CN202080061477.4A 2019-09-02 2020-09-02 焊膏和焊料接合体 Pending CN114340834A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019-159862 2019-09-02
JP2019159862 2019-09-02
PCT/JP2020/033346 WO2021045131A1 (ja) 2019-09-02 2020-09-02 はんだペースト及びはんだ接合体

Publications (1)

Publication Number Publication Date
CN114340834A true CN114340834A (zh) 2022-04-12

Family

ID=74853212

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080061477.4A Pending CN114340834A (zh) 2019-09-02 2020-09-02 焊膏和焊料接合体

Country Status (5)

Country Link
US (1) US12521822B2 (https=)
JP (1) JP7637882B2 (https=)
CN (1) CN114340834A (https=)
DE (1) DE112020004146T5 (https=)
WO (1) WO2021045131A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117300434A (zh) * 2023-09-28 2023-12-29 汕尾市栢林电子封装材料有限公司 一种封装焊片及其制备方法
CN120551636A (zh) * 2025-07-30 2025-08-29 东莞市星马焊锡有限公司 一种低温熔点高温服役的焊锡条及其制备工艺

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230058949A (ko) * 2021-10-25 2023-05-03 삼성전자주식회사 반도체 패키지 및 반도체 패키지의 제조 방법

Citations (9)

* Cited by examiner, † Cited by third party
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CN101362261A (zh) * 2007-08-10 2009-02-11 北京康普锡威焊料有限公司 用于电子元器件的低温无铅焊接材料
JP2014028380A (ja) * 2012-07-31 2014-02-13 Koki:Kk 金属フィラー、はんだペースト、及び接続構造体
WO2015079844A1 (ja) * 2013-11-29 2015-06-04 株式会社村田製作所 金属間化合物の生成方法および金属間化合物を用いた接続対象物の接続方法
US20150239069A1 (en) * 2009-09-03 2015-08-27 Murata Manufacturing Co., Ltd. Solder paste, joining method using the same and joined structure
CN104985350A (zh) * 2015-07-03 2015-10-21 北京康普锡威科技有限公司 一种Sn-Bi/Cu无铅复合焊接材料
US20170095891A1 (en) * 2015-10-01 2017-04-06 Iowa State University Research Foundation, Inc. Lead-free composite solder
WO2017154329A1 (ja) * 2016-03-07 2017-09-14 株式会社村田製作所 接合体の製造方法及び接合材料
WO2017154330A1 (ja) * 2016-03-07 2017-09-14 株式会社村田製作所 接合材料及び接合体の製造方法
JP2017170527A (ja) * 2017-04-03 2017-09-28 株式会社タムラ製作所 はんだ接合体の形成方法、並びに当該形成方法により形成されたはんだ接合体を有する電子回路基板および電子制御装置

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US20050029666A1 (en) 2001-08-31 2005-02-10 Yasutoshi Kurihara Semiconductor device structural body and electronic device
JP2005161338A (ja) 2003-12-01 2005-06-23 Hitachi Metals Ltd はんだシート
US7800230B2 (en) 2006-04-28 2010-09-21 Denso Corporation Solder preform and electronic component
EP2641689B1 (en) * 2010-11-19 2016-06-29 Murata Manufacturing Co., Ltd. Electroconductive material, method of connection with same, and connected structure
TWI461252B (zh) * 2010-12-24 2014-11-21 村田製作所股份有限公司 A bonding method, a bonding structure, an electronic device, an electronic device manufacturing method, and an electronic component
TWI436710B (zh) * 2011-02-09 2014-05-01 村田製作所股份有限公司 Connection structure
CA2842762A1 (en) * 2011-08-02 2013-02-07 Alpha Metals, Inc. Solder compositions
WO2013191022A1 (ja) * 2012-06-19 2013-12-27 株式会社村田製作所 接合用部材
CN103805795B (zh) * 2014-01-21 2015-09-02 苏州优诺电子材料科技有限公司 一种用于锡银铜焊料或锡铜焊料熔炼的变质剂及使用方法
US10818405B2 (en) * 2015-07-09 2020-10-27 Furukawa Electric Co., Ltd. Metal fine particle-containing composition
WO2017119205A1 (ja) 2016-01-07 2017-07-13 株式会社村田製作所 金属組成物、金属間化合物部材、接合体
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Publication number Priority date Publication date Assignee Title
CN101362261A (zh) * 2007-08-10 2009-02-11 北京康普锡威焊料有限公司 用于电子元器件的低温无铅焊接材料
US20150239069A1 (en) * 2009-09-03 2015-08-27 Murata Manufacturing Co., Ltd. Solder paste, joining method using the same and joined structure
JP2014028380A (ja) * 2012-07-31 2014-02-13 Koki:Kk 金属フィラー、はんだペースト、及び接続構造体
WO2015079844A1 (ja) * 2013-11-29 2015-06-04 株式会社村田製作所 金属間化合物の生成方法および金属間化合物を用いた接続対象物の接続方法
CN104985350A (zh) * 2015-07-03 2015-10-21 北京康普锡威科技有限公司 一种Sn-Bi/Cu无铅复合焊接材料
US20170095891A1 (en) * 2015-10-01 2017-04-06 Iowa State University Research Foundation, Inc. Lead-free composite solder
WO2017154329A1 (ja) * 2016-03-07 2017-09-14 株式会社村田製作所 接合体の製造方法及び接合材料
WO2017154330A1 (ja) * 2016-03-07 2017-09-14 株式会社村田製作所 接合材料及び接合体の製造方法
JP2017170527A (ja) * 2017-04-03 2017-09-28 株式会社タムラ製作所 はんだ接合体の形成方法、並びに当該形成方法により形成されたはんだ接合体を有する電子回路基板および電子制御装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117300434A (zh) * 2023-09-28 2023-12-29 汕尾市栢林电子封装材料有限公司 一种封装焊片及其制备方法
CN117300434B (zh) * 2023-09-28 2024-11-08 汕尾市栢林电子封装材料有限公司 一种封装焊片及其制备方法
CN120551636A (zh) * 2025-07-30 2025-08-29 东莞市星马焊锡有限公司 一种低温熔点高温服役的焊锡条及其制备工艺
CN120551636B (zh) * 2025-07-30 2025-09-26 东莞市星马焊锡有限公司 一种低温熔点高温服役的焊锡条及其制备工艺

Also Published As

Publication number Publication date
WO2021045131A1 (ja) 2021-03-11
JP7637882B2 (ja) 2025-03-03
US12521822B2 (en) 2026-01-13
DE112020004146T5 (de) 2022-05-25
JPWO2021045131A1 (https=) 2021-03-11
US20220297243A1 (en) 2022-09-22

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Application publication date: 20220412

RJ01 Rejection of invention patent application after publication