CN114316872A - 一种临时粘合剂及其应用和应用方法 - Google Patents
一种临时粘合剂及其应用和应用方法 Download PDFInfo
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- CN114316872A CN114316872A CN202011057611.1A CN202011057611A CN114316872A CN 114316872 A CN114316872 A CN 114316872A CN 202011057611 A CN202011057611 A CN 202011057611A CN 114316872 A CN114316872 A CN 114316872A
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- Prior art keywords
- bonding agent
- temporary bonding
- adhesive
- resin
- temporary
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
本发明公开了一种临时粘合剂,所述临时粘合剂至少包括以下组分:极性树脂5~50wt%、主溶剂30~90wt%、助溶剂0~60wt%;所述极性树脂选自苯氧基树脂、聚醚醚酮树脂、聚碳酸酯树脂中的至少一种。本发明的第二方面提供了一种如上所述的临时粘合剂在半导体封装领域的应用。本发明的第三方面提供了一种如上所述的临时粘合剂的应用方法,包括以下步骤:使用所述临时粘合剂将待处理基材与载体基材粘合,对待处理基材进行工艺处理,处理完毕后解开粘合。
Description
技术领域
本发明涉及半导体封装技术领域,尤其涉及一种临时粘合剂及其应用和应用方法。
背景技术
随着现有半导体产业发展,薄片加工有了更高的需求,薄片加工制程中需要将厚硅片打磨至较薄厚度,再在其上进行精细结构制作,但是薄硅片会存在易破裂、难固定加工的问题。为此,现有一种方法是使用粘合剂将硅片与较厚的、表面平整的基材(例如毫米级厚度的玻璃片)暂时粘合在一起组成一个易于加工的“组合件”,在打磨、抛光、涂光刻胶、显影等制程结束后,再将粘合剂的粘合状态解开。解开方法有机械力拆解(简单高效成本低但是容易造成硅片破坏)、加热拆解(条件不温和)、化学溶剂拆解(简单方便成本低但是效率低)、激光拆解(高效快速但成本高)的方法。粘合剂在制程中需要保持粘合状态,不能受环境影响,同时要求粘合剂从粘合状态容易被拆解。然而,现有的粘合剂在应用中存在缺点如下:
缺点1:某些粘合剂具有不耐受高温或者不耐受溶剂问题。一些制程如PVD(物理气相沉积)、锡球回焊,需要在较高温度下进行,温度会高于100℃,甚至有10min时间会达260℃的高温。除此之外,制程中粘合状态下的组合件还要经过诸如显影液、去胶液、蚀刻液等溶剂的腐蚀,如果耐受能力不足,则会使得粘合好的硅片与基材解开粘合,会导致硅片破坏。
缺点2:现有技术中已经公开的粘合剂对于光的阻碍有限,在一些使用激光解粘合的工艺中,激光能量透过率较高,而胶层不具备吸光能力或解键时能量过高将会在基材上留下激光照射的光斑,导致芯片表面材质有激光划痕,引起接触不良等问题。
发明内容
为了解决现有技术中存在的问题:1.粘合剂耐热性不足的问题,达200℃组分会分解使得胶层破坏,不具备粘合能力;2.粘合剂耐化学性不足的问题,芳香类溶剂、烃类等弱极性溶剂、去胶溶液例如NMP等浸泡会溶解胶层使其失去粘合能力;3.粘合剂激光能量透过率过高的问题。
本发明的第一方面提供了一种临时粘合剂,所述临时粘合剂至少包括以下组分:极性树脂5~50wt%、主溶剂30~90wt%、助溶剂0~60wt%;所述极性树脂选自苯氧基树脂、聚醚醚酮树脂、聚碳酸酯树脂中的至少一种。
作为一种优选的技术方案,所述极性树脂的数均分子量为10000~100000,分子量分布为1~3.5。
作为一种优选的技术方案,所述主溶剂选自酯类溶剂、酮类溶剂、砜类溶剂、酰胺类溶剂中的至少一种。
作为一种优选的技术方案,所述主溶剂选自3-乙氧丙酸乙酯、乙酸乙酯、乙酸正丁酯、乳酸乙酯、γ-丁内酯、甲乙酮、甲基异丁基酮、异佛尔酮、丙二醇甲醚醋酸酯、二甲基亚砜中的至少一种。
作为一种优选的技术方案,所述助溶剂选自酯类溶剂、酮类溶剂、砜类溶剂、酰胺类溶剂中的至少一种。
作为一种优选的技术方案,所述助溶剂选自N-甲基吡咯烷酮、N,N-二甲基甲酰胺、环己酮、环戊酮中的至少一种。
作为一种优选的技术方案,所述临时粘合剂还包括阻光材料;所述阻光材料在临时粘合剂中的占比为0.1~20wt%。
作为一种优选的技术方案,所述阻光材料为无机物和/或有机物;所述无机物选自金属粉粒、金属氧化物粉粒、炭粉中的至少一种;所述有机物为对波长290~350nm的紫外光具有吸收作用的有机物。
本发明的第二方面提供了一种如上所述的临时粘合剂在半导体封装领域的应用。
本发明的第三方面提供了一种如上所述的临时粘合剂的应用方法,包括以下步骤:使用所述临时粘合剂将待处理基材与载体基材粘合,对待处理基材进行工艺处理,处理完毕后解开粘合。
有益效果:本发明提供了一种临时粘合剂,通过特定树脂的选择,配合适宜的溶剂,使得所述粘合剂具有易清洗、耐高温、耐酸碱以及有机溶剂浸泡的优点,且易于涂覆施工,采用恰当的阻光材料还可赋予粘合剂耐受激光的性能。本发明的另一方面还提供了所述粘合剂在半导体封装领域的应用,提高了晶圆加工过程中的良品率。
附图说明
为了进一步解释说明本发明中提供的一种临时粘合剂及其应用和应用方法的有益效果,提供了相应的附图,需要指出的是本发明中提供的附图只是所有附图中选出来的个别示例,目的也不是作为对权利要求的限定,所有通过本申请中提供的附图获得的其他相应图谱均应该认为在本申请保护的范围之内。
图1为本发明中的粘合剂与基材组成的组合件的结构示意图。
图2为本发明中由硅片、粘合剂、玻璃组成的组合件的实物图。
图3为本发明中解粘后的硅片与玻璃的实物图。
图4为本发明中解粘后的硅片的实物图。
图5为本发明中清洗后的硅片与玻璃的实物图。
具体实施方式
结合以下本发明的优选实施方法的详述以及包括的实施例可进一步地理解本发明的内容。除非另有说明,本文中使用的所有技术及科学术语均具有与本申请所属领域普通技术人员的通常理解相同的含义。如果现有技术中披露的具体术语的定义与本申请中提供的任何定义不一致,则以本申请中提供的术语定义为准。
在本文中使用的,除非上下文中明确地另有指示,否则没有限定单复数形式的特征也意在包括复数形式的特征。还应理解的是,如本文所用术语“由…制备”与“包含”同义,“包括”、“包括有”、“具有”、“包含”和/或“包含有”,当在本说明书中使用时表示所陈述的组合物、步骤、方法、制品或装置,但不排除存在或添加一个或多个其它组合物、步骤、方法、制品或装置。此外,当描述本申请的实施方式时,使用“优选的”、“优选地”、“更优选的”等是指,在某些情况下可提供某些有益效果的本发明实施方案。然而,在相同的情况下或其他情况下,其他实施方案也可能是优选的。除此之外,对一个或多个优选实施方案的表述并不暗示其他实施方案不可用,也并非旨在将其他实施方案排除在本发明的范围之外。
为了解决上述问题,本发明的第一方面提供了一种临时粘合剂,所述临时粘合剂至少包括以下组分:极性树脂5~50wt%、主溶剂30~90wt%、助溶剂0~60wt%。作为一种示例,所述极性树脂在临时粘合剂中的重量百分比可以为5%、10%、15%、20%、25%、30%、35%、40%、45%、50%等;作为一种示例,所述主溶剂在临时粘合剂中的重量百分比可以为30%、35%、40%、45%、50%、55%、60%、65%、70%、75%、80%、85%、90%等;作为一种示例,所述助溶剂在临时粘合剂中的重量百分比可以为0%、5%、10%、15%、20%、25%、30%、35%、40%、45%、50%、55%、60%等。
在一些优选的实施方式中,所述临时粘合剂至少包括以下组分:极性树脂5~30wt%、主溶剂30~50wt%、助溶剂40~60wt%。
本申请中的极性树脂是指结构中带有极性基团的树脂。
在一些优选的实施方式中,所述极性树脂选自苯氧基树脂、聚醚醚酮树脂(PEEK)、聚碳酸酯树脂中的至少一种;进一步优选的,所述苯氧基树脂选自PKHC、PKHH、PKHJ、PKHB中的至少一种。
本发明中的极性树脂可为市售,例如Inchem、Gabriel、日铁化学生产的产品,产品型号可举例YP-50、YP-50EK35、YP-50S、YP-55、YP-70等。
在一些优选的实施方式中,所述极性树脂的数均分子量为10000~100000,分子量分布为1~3.5,20wt%环己酮溶液在25℃下的溶液粘度为300~900cps。作为一种实例,所述极性树脂的数均分子量可以为10000、15000、20000、21000、25000、26000、30000、32000、35000、40000、45000、50000、52000、55000、60000、65000、70000、75000、80000、85000、90000、95000、100000等,所述极性树脂的分子量分布可以为1、1.2、1.5、2、2.5、3、3.5等,所述极性树脂的20wt%环己酮溶液在25℃下的溶液粘度可以为300cps、350cps、400cps、450cps、500cps、550cps、600cps、650cps、700cps、750cps、800cps、850cps、900cps等。在一些进一步优选的实施方式中,所述极性树脂的数均分子量为20000~40000,分子量分布为1.5~2.5,20wt%环己酮溶液在25℃下的溶液粘度为600~800cps。本发明中的极性树脂由于活性基团之间的相互作用,为材料提供体系粘度、粘合能力、耐热性能、耐化性能。发明人在研究中发现,极性树脂添加过少会引起表面过干,粘合能力不足,添加过高则粘度过大不易施工,分子量过高时,树脂不易溶解,过低则其耐化学能力和耐溶剂能力不足。
本申请中树脂的数均分子量、分子量分布的测定方法可为本领域技术人员熟知的任何一种,例如凝胶色谱法;溶液粘度的测定方法可谓本领域技术人员熟知的任何一种,例如使用粘度计进行测量。在测试过程中,数均分子量的测定结果波动在20%左右,分子量分布、粘度测试偏差在10%左右。
在一些优选的实施方式中,所述主溶剂选自酯类溶剂、酮类溶剂、砜类溶剂、酰胺类溶剂中的至少一种。
作为酯类溶剂,可举例乙酸乙酯、乙酸正丁酯、3-乙氧丙酸乙酯(EEP)、γ-丁内酯(GBL)、丙二醇甲醚醋酸酯(PMA)、乙酸异丙酯、乳酸乙酯等;作为酮类溶剂,可举例甲乙酮、甲基异丁基酮、异佛尔酮、丙酮等;作为砜类溶剂,可举例二甲基亚砜(DMSO)、二甲砜(DMS)等;作为酰胺类溶剂,可举例二甲基乙酰胺(DMAC)、N,N-二甲基甲酰胺(DMF)等。
在一些进一步优选的实施方式中,所述主溶剂选自3-乙氧丙酸乙酯(EEP)、乙酸乙酯、乙酸正丁酯、乳酸乙酯、γ-丁内酯(GBL)、甲乙酮、甲基异丁基酮、异佛尔酮、丙二醇甲醚醋酸酯(PMA)、二甲基亚砜(DMSO)中的至少一种。本发明中的主溶剂用于溶解树脂,若添加量过少则溶解效率较慢,过高则影响其他组分添加量,固含量降低,从而导致涂层变薄影响粘结效果。
在一些优选的实施方式中,所述助溶剂选自酯类溶剂、酮类溶剂、砜类溶剂、酰胺类溶剂中的至少一种;进一步优选的,所述助溶剂选自N-甲基吡咯烷酮(NMP)、N,N-二甲基甲酰胺(DMF)、环己酮、环戊酮中的至少一种。本发明中的助溶剂可改善粘合剂的涂覆流平效果,添加过少则流平效果差,涂覆后表面不平整影响施工,添加过多则影响其他组分添加量,在烘烤过程中引起暴沸,导致成膜效果变差。
为了降低粘合胶层的紫外透过率,在一些优选的实施方式中,所述临时粘合剂还包括阻光材料;所述阻光材料在临时粘合剂中的占比为0.1~20wt%。作为一种示例,所述阻光材料在临时粘合剂中的占比(重量百分比)可以为0.1%、0.5%、1%、1.5%、2%、2.5%、3%、4%、5%、8%、10%、12%、15%、18%、20%等。在一些进一步优选的实施方式中,所述阻光材料在临时粘合剂中的占比为0.1~10wt%。
在一些优选的实施方式中,所述阻光材料为无机物和/或有机物;进一步优选的,所述无机物选自金属粉粒、金属氧化物粉粒、炭粉中的至少一种;所述有机物为对波长290~350nm的紫外光具有吸收作用的有机物。
作为金属粉粒,可举例铝粉、银粉等;作为金属氧化物粉粒,可举例钛白粉、氧化铝粉末、氧化镁、氧化钙等;作为对波长290~350nm的紫外光具有吸收作用的有机物,可举例包含酰胺(-NH-R-)基团、酰亚胺(R-CO-NR’-CO-R”)基团的有机物、UV390、UV571(CAS号:23328-53-2)、UV572、镉试剂(CAS号:5392-67-6)、苯并三氮唑(CAS号:95-14-7)等。
在一些进一步优选的实施方式中,所述阻光材料选自炭粉、铝粉、UV390、UV571、UV572中的至少一种。
本发明中的阻光材料可以使得在膜厚20微米级别时的激光透过率降至20%,且不影响其解键、清洗步骤。阻光材料的添加量过少则涂膜透光率降低效果差,添加量过高则影响粘合性能。
为了平衡体系的遮光效果和施工效果,在一些优选的实施方式中,当阻光材料选自金属粉粒、金属氧化物粉粒、炭粉等颗粒状材料时,所述阻光材料的粒径为0.2~40微米。作为一种示例,所述阻光材料的粒径可以为0.2微米、0.5微米、1微米、2微米、2.5微米、5微米、10微米、15微米、20微米、25微米、30微米、35微米、40微米。在一些进一步优选的实施方式中,所述阻光材料的粒径为0.5~20微米。发明人在研发过程中发现,材料粒径选择过小容易藏入结构导致颗粒残留且遮光效果有限,过大则容易造成涂覆表面不平整。
本发明所述粘合剂可添加挡光和/或吸光填料进行组合使用,且添加后仍可以通过溶剂清洗洁净,本案所述粘合剂耐受能力/粘合能力是由粘合剂核心树脂特性决定,发明人经过大量实验选择出的树脂使得包含所述树脂的粘合剂可耐受300℃的高温,同时所述粘合剂可耐受制程种溶剂所含酸、碱、有机溶剂的浸泡,其粘合能力不受到影响,且由于树脂结构特点的差异,适用的阻光材料也有所差异,需要搭配合适的阻光材料才能实现较好的阻光效果。
本发明的第二方面提供了一种如上所述的临时粘合剂在半导体封装领域的应用。
本发明的第三方面提供了上述临时粘合剂的应用方法,包括以下步骤:使用所述临时粘合剂将待处理基材与载体基材粘合,对待处理基材进行工艺处理,处理完毕后解开粘合。
在一些实施方式中,所述工艺处理包括但不限于半导体封装中的晶圆打薄、应力释放、干法蚀刻、重新布线(RDL)封装、物理气相沉积(PVD)、植球等。本发明中的粘合剂可经受工艺制程中的各类酸、碱以及非极性溶剂(如苯系溶剂、烃类溶剂)的腐蚀而不影响粘合。
以下结合附图,对本发明所述临时粘合剂的应用方法进行清楚、完整的描述,显然,所描述的实施方式仅仅是本发明一部分实施方式,而不是全部的实施方式。基于本发明中的实施方式,本领域技术人员在没有做出创造性劳动前提下所获得的所有其他实施方式,都属于本发明保护的范围。
本发明所述临时粘合剂的应用方法包括粘合步骤:使用上述临时粘合剂将待处理基材与载体基材粘合。如图1所示,a、c为需要将其粘合在一起的基材,材质可以为金属、玻璃、硅片等。在本实施方式中,a为厚度较厚的基材,材质为玻璃,作为载体基材;c为厚度较薄的基材,材质为硅片,作为待处理基材。b层为使用本发明所述临时粘合剂制成的粘合剂层。b层作用是将a层与c层结合在一起,在实际使用中,可以根据实际应用中是否有挡光需求而选择是否添加阻光材料。
通过本发明所述的临时粘合剂将a、c粘合之后,得到组合件(如图2所示)。图2为由a向c方向看,a材质为玻璃,透过a层可以看见粘合胶层均匀透明。
本发明所述临时粘合剂的应用方法还包括解键步骤。当临时粘合剂自身单独使用时可应用于A)使用加热软化将其解开粘合的热解工艺及B)使用化学溶剂将其溶解解开粘合的化学解工艺。如果和具有激光解键能力的粘合剂配套使用,则可以应用于C)使用激光照射使其解开粘合的激光解粘工艺。
在一些优选的实施方式中,所述临时粘合剂使用加热方法解粘时(应用于A)热解工艺),所述临时粘合剂需要在160~200℃持续30~60min以上软化,之后逐渐推动硅片(待处理基材c),则可解开粘合。
在一些优选的实施方式中,所述临时粘合剂使用化学浸泡方法解粘时(应用于B)化学解工艺),将上述组合件整片浸泡在25~60℃的胶层良溶剂(本发明中为上述主溶剂,如γ-丁内酯等)保持30min以上。
在一些优选的实施方式中,所述临时粘合剂使用激光照射方法解粘时(应用于C)激光解粘工艺),在a、b之间增加一层激光解离层d层(此d层即为光敏粘合剂层),d层预先涂于a层上,而后b层进行粘附,组成组合件,解粘时从a向c方向照射d层解离所需能量的激光,则可使d层解离,从而解开粘合状态。
选择上述三种解开粘合的方法中的任何一种使得组合件的粘合状态分开,如图3、4所示,分开的a、c表面均可明显看到基材上有胶的残留。
本发明所述临时粘合剂的应用方法还包括清洗步骤。
在一些优选的实施方式中,所述临时粘合剂使用热解工艺或化学解工艺解粘后,使用溶剂(NMP、DMAC、EEP、异氟尔酮等溶剂中的一种搭配环己酮、环戊酮中的一种)清洗残胶,清洗基材后可以使得表面洁净(如图5所示),至此b层分离开,a层可回收,c层可进入下一步工序。
本发明中清洗基材的方法可为本领域技术人员熟知的任何一种,例如浸泡法、冲洗法、淋洗法等。若使用浸泡法,则是通过25~60℃溶剂浸泡20~40min将残余胶溶解,该方法优点为对薄片冲击小,但耗时较长;若使用冲、淋洗方法洗涤,则是将洗涤溶液以适当流速不断地冲洗表面3~10min,该方法一般洗涤速度较快,但也存在溶剂消耗问题和可能破坏薄片的缺点。
在一些优选的实施方式中,所述临时粘合剂使用激光解粘工艺解粘后,d层解离的残留需要在使用5~30wt%TMAH(四甲基氢氧化氨,CAS号:75-59-2)水溶液对基材进行相应的清洗(30~60℃,浸泡10~30min)。
实施例
以下通过实施例对本发明技术方案进行详细说明,但是本发明的保护范围不局限于所述实施例。如无特殊说明,本发明中的原料均为市售。
以下为各实施例中所用原料:
A.极性树脂
A1.苯氧基树脂PKHH,数均分子量32000,分子量分布1.7,20wt%环己酮溶液在25℃下的溶液粘度为630cps
A2.苯氧基树脂PKHH,数均分子量52000,分子量分布2.3,20wt%环己酮溶液在25℃下的溶液粘度为860cps
A3.苯氧基树脂PKHB,数均分子量52000,分子量分布1.5,20wt%环己酮溶液在25℃下的溶液粘度为900cps
A4.苯氧基树脂PKHB,数均分子量26000,分子量分布1.8,20wt%环己酮溶液在25℃下的溶液粘度为560cps
A5.苯氧基树脂PKHJ,数均分子量26000,分子量分布1.2,20wt%环己酮溶液在25℃下的溶液粘度为550cps
A6.苯氧基树脂PKHC,数均分子量26000,分子量分布2,20wt%环己酮溶液在25℃下的溶液粘度为580cps
A7.聚碳酸酯,数均分子量21000,分子量分布1.2,20wt%环己酮溶液在25℃下的溶液粘度为530cps
A8.聚醚醚酮树脂PEEK,数均分子量26000,分子量分布3,20wt%环己酮溶液在25℃下的溶液粘度为560cps
A9.聚酰亚胺,数均分子量30000,分子量分布2.4±0.1,20wt%环己酮溶液在25℃下的溶液粘度为550cps
A10.苯氧基树脂PKHB,数均分子量26000,分子量分布4,20wt%环己酮溶液在25℃下的溶液粘度为500cps
B.阻光材料
B1.炭粉,0.2μm
B2.铝粉,0.5μm
B3.UV572
B4.UV390
B5.UV571
B6.炭粉,粒径60μm
C.主溶剂
C1.GBL(γ-丁内酯,CAS号:96-48-0)
C2.DMAC(二甲基乙酰胺,CAS号:127-19-5)
C3.EEP(3-乙氧丙酸乙酯,CAS号:763-69-9)
C4.NMP(N-甲基吡咯烷酮,CAS号:872-50-4)
D.助溶剂
D1.环己酮
D2.环戊酮
D3.NMP(N-甲基吡咯烷酮,CAS号:872-50-4)
实施例1~20、对比例1~5均提供了一种临时粘合剂,各例中的成分如表1所示。
表1
通过实施例和对比例1、3的对比可以得知,本发明选择的极性树脂具有优异的粘合能力,且耐热性能良好;由对比例2可以得知,在粘合剂中加入阻光材料可以为粘合剂带来阻光效果,但由对比例4可以得知,阻光材料过量会使粘合剂的解键性能变差;溶剂的用量会对粘合剂的性能产生影响,参考对比例5,当助溶剂用量过多、主溶剂用量过少时,树脂溶解度差,易析出,导致粘合剂难以涂覆。
本发明还提供了上述临时粘合剂的使用方法,包括以下步骤:
a.临时粘合剂配制:添加极性树脂A于溶剂C和D中混合,搅拌至完全溶解,再添加阻光材料B至完全分散,得到临时粘合剂;
b.涂覆:将临时粘合剂涂覆在基材a上,涂覆转速1000~3000rpm,持续时间15~30s,涂覆后150~210℃烘烤,持续120~300s;优选为涂覆转速为2000rpm,持续30s旋涂后,180℃烘烤180s;
c.粘合:粘合剂台抽真空并升温至180~220℃,真空抽至<10mbar,保持>10min,使用>3000N压力压合,持续至少2min,期间保持抽真空;结束压合同时破真空,完成基材a和基材c的粘合,形成如图1所示的组合件,其中临时粘合剂形成粘合剂层b;
d.解键:化学解键方法通过边缘溶剂渗透使得粘合剂层解开键合;如果使用激光解键方法时,则需要与激光解键合材料配合使用;
e.清洗:粘合解开之后,将解开粘合的基材a、基材c浸泡在清洗溶剂(选自NMP、DMAC、EEP、异氟尔酮中的一种搭配环己酮、环戊酮中的一种以体积比1:1配置)中,温度20~60℃,浸泡20~30min,用氮气吹扫表面,再用丙酮清洗表面,再用氮气吹扫洁净,显微镜下观测无大于5微米胶状残留,则完成清洗。
性能测试工艺及测试结果
1.耐化学性能测试:将测试用化学溶剂/溶液加热到对应的温度,将待测样片(即如图1所示的组合件)浸入,在对应温度下浸泡对应时间,观察其粘合状态是否解开,解开则NG,不解开则将样片再进行下一溶剂的测试。组合件可以经受住溶剂连续浸泡而不解开粘合即为通过测试,具体溶剂种类和浸泡条件如表2所示。本发明实施例1~20、对比例1~5的耐化学性能测试结果如表3所示。
表2
表3
2.耐热性能测试:将组合件放在加热板上进行加热,使用测温枪/热电偶温度计的方式测其温度,在100℃、150℃、200℃、250℃、300℃条件下,观察粘合后的硅片(基材c)和玻璃片(基材a)没有发生相对滑动,再取出恢复常温,其粘合能力和耐化学溶剂渗透性能不会受到影响,仍然保持粘合状态,则通过耐热性能测试。这里的耐受OK指的是使用粘合剂制成的组合件到达该温度后其粘合剂核心组分结构不会被破坏,当温度下降回常温时,粘合层依然可以发挥粘合作用,保持组合状态。而NG则指的是在该温度下,其粘合能力已经失去,自行打开粘合状态,再恢复到较低的工作温度时,粘合层失去其粘合作用。实施例1~20、对比例1~5的测试结果见表4。
表4
3.化学浸泡法解键性能测试:将组合件置于加热板上,分别于25±1℃和60±5℃使用初始溶剂(即各例中所用的溶剂)进行浸泡测试,如果浸泡30±1min后有溶剂渗透,逐渐解开粘合状态,则解键性能良好,反之解键性能不通过。实施例1~20、对比例1~5的化学浸泡法解键性能测试结果见表5。
表5
4.键合能力测试:取两片长方形铜片,使用上述实施例或对比例中的临时粘合剂使之一端粘合,粘合部分面积为12×65mm,粘合完毕后使用CMT4103模量仪检测其使用机械力拉开二片铜片粘合所需拉力。测试粘合剂厚度在1-100微米,其拉开所需力量均大于400N,则认为可满足制程中横向剪切力耐受需求,解键效果记为OK,实施例1~20、对比例1~5的键合能力测试结果见表6。
表6
5.挡光性能测试:将待测样品涂覆于标准透明玻璃片上,涂成厚度为1±0.05微米的待测层,然后以空玻璃片作为背景,通过紫外分光光光度计测试波长为355nm的光透过率,实施例1~20、对比例1~5的挡光性能测试结果见表7。
表7
通过实施例1~20可以得知,本发明提供了一种临时粘合剂,通过特定树脂的选择,配合适宜的溶剂,使得所述粘合剂可耐受300℃的高温,同时所述粘合剂可耐受制程种溶剂所含酸、碱、有机溶剂的浸泡,其粘合能力不受到影响,因此同时具备了易清洗、耐高温、耐酸碱以及有机溶剂浸泡等优点,且易于涂覆施工,采用恰当的阻光材料还可赋予粘合剂耐受激光的性能。
前述的实例仅是说明性的,用于解释本发明所述方法的一些特征。所附的权利要求旨在要求可以设想的尽可能广的范围,且本文所呈现的实施例仅是根据所有可能的实施例的组合的选择的实施方式的说明。因此,申请人的用意是所附的权利要求不被说明本发明的特征的示例的选择限制。在权利要求中所用的一些数值范围也包括了在其之内的子范围,这些范围中的变化也应在可能的情况下解释为被所附的权利要求覆盖。
Claims (10)
1.一种临时粘合剂,其特征在于,所述临时粘合剂至少包括以下组分:极性树脂5~50wt%、主溶剂30~90wt%、助溶剂0~60wt%;所述极性树脂选自苯氧基树脂、聚醚醚酮树脂、聚碳酸酯树脂中的至少一种。
2.如权利要求1所述的临时粘合剂,其特征在于,所述极性树脂的数均分子量为10000~100000,分子量分布为1~3.5。
3.如权利要求1所述的临时粘合剂,其特征在于,所述主溶剂选自酯类溶剂、酮类溶剂、砜类溶剂、酰胺类溶剂中的至少一种。
4.如权利要求3所述的临时粘合剂,其特征在于,所述主溶剂选自3-乙氧丙酸乙酯、乙酸乙酯、乙酸正丁酯、乳酸乙酯、γ-丁内酯、甲乙酮、甲基异丁基酮、异佛尔酮、丙二醇甲醚醋酸酯、二甲基亚砜中的至少一种。
5.如权利要求1所述的临时粘合剂,其特征在于,所述助溶剂选自酯类溶剂、酮类溶剂、砜类溶剂、酰胺类溶剂中的至少一种。
6.如权利要求5所述的临时粘合剂,其特征在于,所述助溶剂选自N-甲基吡咯烷酮、N,N-二甲基甲酰胺、环己酮、环戊酮中的至少一种。
7.如权利要求1~6任一项所述的临时粘合剂,其特征在于,所述临时粘合剂还包括阻光材料;所述阻光材料在临时粘合剂中的占比为0.1~20wt%。
8.如权利要求7所述的临时粘合剂,其特征在于,所述阻光材料为无机物和/或有机物;所述无机物选自金属粉粒、金属氧化物粉粒、炭粉中的至少一种;所述有机物为对波长290~350nm的紫外光具有吸收作用的有机物。
9.一种如权利要求1~8任一项所述的临时粘合剂在半导体封装领域的应用。
10.一种如权利要求1~8任一项所述的临时粘合剂的应用方法,其特征在于,包括以下步骤:使用所述临时粘合剂将待处理基材与载体基材粘合,对待处理基材进行工艺处理,处理完毕后解开粘合。
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US20190157128A1 (en) * | 2017-11-17 | 2019-05-23 | Jsr Corporation | Workpiece treating method, semiconductor device, process for manufacturing the same, and temporary fixing composition for shear peeling |
CN111534270A (zh) * | 2020-05-18 | 2020-08-14 | 深圳市化讯半导体材料有限公司 | 一种激光剥离材料及其制备方法和应用 |
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CN114316872B (zh) | 2023-09-05 |
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TW202223051A (zh) | 2022-06-16 |
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