CN114222913B - 晶片外观检查装置和方法 - Google Patents
晶片外观检查装置和方法 Download PDFInfo
- Publication number
- CN114222913B CN114222913B CN202080057392.9A CN202080057392A CN114222913B CN 114222913 B CN114222913 B CN 114222913B CN 202080057392 A CN202080057392 A CN 202080057392A CN 114222913 B CN114222913 B CN 114222913B
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- Prior art keywords
- inspection
- image
- wafer
- chip
- unit
- Prior art date
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Links
- 238000007689 inspection Methods 0.000 title claims abstract description 221
- 238000000034 method Methods 0.000 title claims abstract description 36
- 230000008569 process Effects 0.000 claims abstract description 18
- 230000003252 repetitive effect Effects 0.000 claims abstract description 13
- 238000003384 imaging method Methods 0.000 claims description 33
- 238000012545 processing Methods 0.000 claims description 32
- 238000006073 displacement reaction Methods 0.000 claims description 3
- 230000007246 mechanism Effects 0.000 description 19
- 238000005286 illumination Methods 0.000 description 15
- 230000007547 defect Effects 0.000 description 12
- 238000010586 diagram Methods 0.000 description 8
- 238000001514 detection method Methods 0.000 description 6
- 239000013256 coordination polymer Substances 0.000 description 5
- 230000006870 function Effects 0.000 description 5
- 239000011295 pitch Substances 0.000 description 5
- 239000000523 sample Substances 0.000 description 5
- 230000002159 abnormal effect Effects 0.000 description 4
- 238000011179 visual inspection Methods 0.000 description 4
- 230000005484 gravity Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 238000012935 Averaging Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/94—Investigating contamination, e.g. dust
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8854—Grading and classifying of flaws
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
- G01N2021/95615—Inspecting patterns on the surface of objects using a comparative method with stored comparision signal
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/10—Scanning
- G01N2201/104—Mechano-optical scan, i.e. object and beam moving
Landscapes
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Signal Processing (AREA)
- Quality & Reliability (AREA)
- Theoretical Computer Science (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019152538A JP7293046B2 (ja) | 2019-08-23 | 2019-08-23 | ウエーハ外観検査装置および方法 |
| JP2019-152538 | 2019-08-23 | ||
| PCT/JP2020/022717 WO2021039019A1 (fr) | 2019-08-23 | 2020-06-09 | Dispositif et procédé d'inspection d'aspect de tranche |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114222913A CN114222913A (zh) | 2022-03-22 |
| CN114222913B true CN114222913B (zh) | 2024-05-24 |
Family
ID=74678135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080057392.9A Active CN114222913B (zh) | 2019-08-23 | 2020-06-09 | 晶片外观检查装置和方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7293046B2 (fr) |
| KR (1) | KR20220044742A (fr) |
| CN (1) | CN114222913B (fr) |
| WO (1) | WO2021039019A1 (fr) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000346627A (ja) * | 1999-06-07 | 2000-12-15 | Toray Eng Co Ltd | 検査装置 |
| CN1982880A (zh) * | 2005-12-13 | 2007-06-20 | 大日本网目版制造株式会社 | 差分比较检查方法及差分比较检查装置 |
| JP2008244197A (ja) * | 2007-03-28 | 2008-10-09 | Hitachi High-Technologies Corp | 検査装置及び検査方法 |
| JP2009097958A (ja) * | 2007-10-16 | 2009-05-07 | Tokyo Seimitsu Co Ltd | 欠陥検出装置及び欠陥検出方法 |
| JP2009283977A (ja) * | 2009-08-21 | 2009-12-03 | Hitachi High-Technologies Corp | 検査装置及び検査方法 |
| CN102811863A (zh) * | 2010-01-21 | 2012-12-05 | 惠普印迪戈股份公司 | 打印图像的自动检查 |
| CN108280828A (zh) * | 2018-01-25 | 2018-07-13 | 上海闻泰电子科技有限公司 | 相机装配位置检测方法与装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02290036A (ja) | 1989-02-13 | 1990-11-29 | Tokyo Electron Ltd | 半導体ウエハの検査方法 |
| JP2939665B2 (ja) | 1991-03-04 | 1999-08-25 | 東京エレクトロン株式会社 | 半導体ウエハの測定方法 |
| JP2007155610A (ja) | 2005-12-07 | 2007-06-21 | Seiko Epson Corp | 外観検査装置および外観検査方法 |
| JP5275017B2 (ja) | 2008-12-25 | 2013-08-28 | 株式会社日立ハイテクノロジーズ | 欠陥検査方法及びその装置 |
-
2019
- 2019-08-23 JP JP2019152538A patent/JP7293046B2/ja active Active
-
2020
- 2020-06-09 KR KR1020227004449A patent/KR20220044742A/ko unknown
- 2020-06-09 CN CN202080057392.9A patent/CN114222913B/zh active Active
- 2020-06-09 WO PCT/JP2020/022717 patent/WO2021039019A1/fr active Application Filing
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000346627A (ja) * | 1999-06-07 | 2000-12-15 | Toray Eng Co Ltd | 検査装置 |
| CN1982880A (zh) * | 2005-12-13 | 2007-06-20 | 大日本网目版制造株式会社 | 差分比较检查方法及差分比较检查装置 |
| JP2008244197A (ja) * | 2007-03-28 | 2008-10-09 | Hitachi High-Technologies Corp | 検査装置及び検査方法 |
| JP2009097958A (ja) * | 2007-10-16 | 2009-05-07 | Tokyo Seimitsu Co Ltd | 欠陥検出装置及び欠陥検出方法 |
| JP2009283977A (ja) * | 2009-08-21 | 2009-12-03 | Hitachi High-Technologies Corp | 検査装置及び検査方法 |
| CN102811863A (zh) * | 2010-01-21 | 2012-12-05 | 惠普印迪戈股份公司 | 打印图像的自动检查 |
| CN108280828A (zh) * | 2018-01-25 | 2018-07-13 | 上海闻泰电子科技有限公司 | 相机装配位置检测方法与装置 |
Non-Patent Citations (2)
| Title |
|---|
| 基于机器视觉的裸片表面缺陷在线检测研究;林佳 等;电子工业专用设备;第47卷(第2期);第13-16、45页 * |
| 边缘检测法在晶圆缺陷检测中的应用;方宝英 等;计算机与数字工程(第06期);第132-134页 * |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20220044742A (ko) | 2022-04-11 |
| TW202109022A (zh) | 2021-03-01 |
| JP7293046B2 (ja) | 2023-06-19 |
| WO2021039019A1 (fr) | 2021-03-04 |
| CN114222913A (zh) | 2022-03-22 |
| JP2021032672A (ja) | 2021-03-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |