CN114188244A - Automatic code printing and inserting machine - Google Patents

Automatic code printing and inserting machine Download PDF

Info

Publication number
CN114188244A
CN114188244A CN202111359023.8A CN202111359023A CN114188244A CN 114188244 A CN114188244 A CN 114188244A CN 202111359023 A CN202111359023 A CN 202111359023A CN 114188244 A CN114188244 A CN 114188244A
Authority
CN
China
Prior art keywords
basket
fixed
wafer
jacking
machine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202111359023.8A
Other languages
Chinese (zh)
Inventor
高波
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Conworth Intelligent Equipment Co ltd
Original Assignee
Suzhou Conworth Intelligent Equipment Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Conworth Intelligent Equipment Co ltd filed Critical Suzhou Conworth Intelligent Equipment Co ltd
Priority to CN202111359023.8A priority Critical patent/CN114188244A/en
Publication of CN114188244A publication Critical patent/CN114188244A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67282Marking devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766Mechanical parts of transfer devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769Storage means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781Batch transfer of wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention discloses an automatic coding and inserting machine, which comprises a rack, wherein a material discharging mechanism, a conveying mechanism, a carrying mechanism, a basket loading assembly and a marking machine are arranged above the rack, the material discharging mechanism is used for storing wafers and is arranged on one side of a transmission starting point of a transmission machine, the marking machine is arranged on the other side of the transmission machine, the carrying mechanism is used for carrying the wafers from the material discharging mechanism to the transmission machine, the wafers are marked through the marking machine, and after marking is finished, the transmission machine conveys the wafers to a transmission end point and puts the wafers into the basket assembly through a material pushing cylinder, a material pushing block and a basket jacking module. According to the invention, the marking and the basket collecting of the wafer are integrated into one device, so that the manual carrying is avoided, the labor cost is saved, the marking and basket collecting efficiency of the wafer is greatly improved, the yield of the wafer basket collecting can reach 800 plus materials 1200Pcs/H, the basket loading operation is time-saving and labor-saving, meanwhile, the lamination rate is less than 1%, the fragment rate is less than 3 per thousand, the basket collecting quality is also ensured, and the device is suitable for popularization and application.

Description

Automatic code printing and inserting machine
Technical Field
The invention relates to the technical field of wafer collection baskets, in particular to an automatic coding and inserting machine.
Background
Marking of wafers is an indispensable step in the semiconductor manufacturing process, and the purpose of marking wafers is mainly to mark wafer IDs or add company logos. The marking machine is widely applied to marking the surface of an integrated circuit in the IC industry. According to different use requirements, the integrated circuit board used in the IC industry has three forms of a material strip, a chip and a wafer.
Among the prior art, need artifically place the wafer and beat the mark on the board of marking machine, wait for to beat and beat the mark and accomplish the back, artifical the taking off again receives the basket to the wafer, beat mark and receive the basket and go on two boards, the wafer is beating the unloading of mark in-process and last receipts basket and all adopt the manual work to go on, not only the recruitment is in large quantity, the cost of labor is high, beat and expect that unloading and basket operation are wasted time and energy, long-time letter sorting operation easily causes the operating personnel fatigue, with low basket efficiency, the time has also been wasted simultaneously. In addition, during manual carrying and basket receiving of the wafers, collision between the wafers and the tool and collision between the wafers are easy to occur, so that the wafers are subjected to corner chipping or fragment breaking, the fragment rate is increased, and the production yield of the semiconductor wafers is influenced.
Disclosure of Invention
The invention aims to provide an automatic coding and inserting machine to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme:
an automatic coding and inserting machine comprises a rack, wherein a feeding mechanism, a conveying mechanism, a carrying mechanism, a basket loading assembly and a marking machine are arranged above the rack, the conveying mechanism comprises a conveyor, a supporting leg, a material receiving box, a material blocking rod, a material blocking cylinder, a first motor, a material pushing cylinder and a material pushing block, the conveyor is fixed on the supporting leg and driven by the first motor, the material receiving box is obliquely arranged on the outer side of the middle section of the conveyor, the material blocking cylinder is connected with two material blocking rods, one material blocking rod is used for separating more than two overlapped wafers, the other material blocking cylinder is used for positioning the wafers, the material blocking cylinder is fixed on the supporting leg and is opposite to the material receiving box, the material pushing cylinder and the material pushing block are arranged above a transmission terminal of the conveyor, and the material pushing block is fixed on a piston rod of the material pushing cylinder;
the basket assembly comprises a circular rotating table, basket assembly components, adjusting grooves and an index plate, the circle center of the lower end of the rotating table is fixed at the output end of the index plate, a plurality of basket assembly components distributed in a circular array are placed at the upper end of the rotating table, the rotating table is also provided with the adjusting grooves with the same number as the basket assembly components, and the adjusting grooves are arranged below the basket assembly components;
a basket jacking module is arranged below the rotating table and used for adjusting the height of the basket assembly;
the discharging mechanism is used for storing wafers, the discharging mechanism is arranged on one side of a transmission starting point of the transmission machine, the marking machine is arranged on the other side of the transmission machine, the carrying mechanism is used for carrying the wafers to the transmission starting point of the transmission machine from the discharging mechanism, when the transmission machine carries the wafers to the middle of the transmission machine, the marking machine marks the wafers, after marking is finished, the transmission machine carries the wafers to a transmission end point and puts the wafers into the basket tool assembly through the material pushing cylinder, the material pushing block and the basket tool jacking module.
Preferably, basket utensil jacking module includes first mounting panel, the second mounting panel, the dead lever, the second motor, the screw rod, the screw thread seat, the jacking pole, jacking piece and electro-magnet, parallel arrangement about second mounting panel and the first mounting panel, be connected through the dead lever between it, the lower extreme fixed mounting of first mounting panel has the second motor, the motor shaft of second motor stretch out first mounting panel and with screw rod fixed connection, install the screw thread seat on the screw rod, install two jacking poles on the screw thread seat, the upper end of two jacking poles stretches out the second mounting panel and installs the lower extreme at the jacking piece, the electro-magnet is installed to the upper end of jacking piece.
Preferably, the discharging mechanism comprises an electric push rod, a fixed plate, positioning rods and a top plate, the electric push rod is installed below the fixed plate, the output end of the electric push rod penetrates through the fixed plate from bottom to top and is fixedly connected with the top plate, the fixed plate is fixed on the rack, the upper end of the fixed plate is fixedly provided with the positioning rods distributed in a circular array, the fixed plate is further symmetrically fixed with two installation rods, and air nozzles are fixed above the installation rods.
Preferably, the first carrying mechanism comprises a mounting box, a guide rail, a first air cylinder, a second air cylinder and a sucker, the mounting box is fixed at the upper end of the support leg, the support leg is fixed on the rack, the guide rail is arranged in the mounting box, the first air cylinder is fixed at the outer side of the mounting box, a piston rod of the first air cylinder extends into the mounting box and is fixedly connected with a sliding block, the sliding block is arranged on the guide rail in a left-right sliding mode, the second air cylinder is fixed at the outer side of the sliding block, a buffer is arranged on a motion path of the sliding block, and the sucker for adsorbing wafers is fixedly mounted on the piston rod of the second air cylinder.
Preferably, the basket tool assembly comprises a basket tool, a basket tool base and an adsorption block, a plurality of placing grooves used for storing wafers are formed in the basket tool, the lower end of the basket tool assembly is detachably fixed on the basket tool base, and the adsorption block capable of attracting the electromagnet is arranged at the lower end of the basket tool base.
Preferably, a protection seat is arranged on the outer side of the rotating platform, and a circular groove with the same outer diameter as the rotating platform is formed in the center of the protection seat.
Preferably, the lower end of the basket tool base is further provided with a positioning hole, and the jacking block is provided with a positioning bulge matched with the positioning hole.
Compared with the prior art, the invention has the beneficial effects that:
1. in the invention, the unmarked wafer is stacked in the discharging mechanism, the unmarked wafer is carried to the conveyer of the conveying mechanism from the discharging mechanism by the carrying mechanism, when the unmarked wafer is conveyed to the middle section of the conveyer, the wafer is positioned by the stop rod, the wafer is paused to be conveyed, the marking machine marks the wafer, after the marking is finished, the conveyer continues to convey, and then the basket collection of the wafer is realized automatically by the arrangement of the material pushing cylinder, the material pushing block, the basket loading assembly and the basket jacking module, the marking and the basket collection of the wafer are integrated into one device, the manual carrying is avoided, the labor amount is reduced, the labor cost is saved, the efficiency of the marking and the basket collection of the wafer is greatly improved, the yield of the wafer collecting basket can reach 800 plus 1200Pcs/H, the basket loading operation is time-saving and labor-saving, meanwhile, the lamination rate is less than 1 percent, the fragment rate is less than 3 per thousand, and the basket collection quality is also ensured, is suitable for popularization and application.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic top view of the overall structure of the present invention;
FIG. 3 is a rear side structural view of the overall structure of the present invention;
FIG. 4 is a schematic structural view of a discharging mechanism of the present invention;
FIG. 5 is a schematic view of the conveying mechanism of the present invention;
FIG. 6 is a rear side view of the conveying mechanism of the present invention;
FIG. 7 is a schematic structural view of a carrying mechanism according to the present invention;
FIG. 8 is a schematic structural view of a basket loading assembly and a basket lifting module according to the present invention;
FIG. 9 is a schematic view of the basket assembly of the present invention;
FIG. 10 is a schematic view of the basket assembly of the present invention;
FIG. 11 is a schematic structural view of a basket jacking module according to the present invention;
fig. 12 is an enlarged view of the region a in fig. 6 according to the present invention.
In the figure: 1 rack, 2 emptying mechanisms, 21 electric push rod, 22 fixing plate, 23 positioning rod, 24 mounting rod, 25 air nozzle, 26 top plate, 3 conveying mechanism, 31 conveyer, 32 supporting leg, 33 material receiving box, 34 material blocking rod, 35 material blocking cylinder, 36 first motor, 37 material pushing cylinder, 38 material pushing block, 4 conveying mechanism, 41 mounting box, 42 guide rail, 43 first cylinder, 44 second cylinder, 45 sucker, 46 supporting leg, 47 buffer, 5 basket components, 51 rotating platform, 52 basket components, 521 basket devices, 522 placing grooves, 523 basket device bases, 524 adsorption blocks, 525 positioning holes, 53 adjusting grooves, 54 dividing discs, 6 protective seats, 7 wafers, 8 basket device jacking modules, 81 first mounting plates, 82 second mounting plates, 83 fixing rods, 84 second motors, 85 screw rods, 86 threaded seats, 87 jacking rods, 88 jacking blocks, 89 electromagnets, 810 positioning protrusions and 9 marking machines.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-12, the present invention provides a technical solution:
the utility model provides an automatic coding insert machine, its includes frame 1, and the top of frame 1 is provided with drop feed mechanism 2, conveying mechanism 3, transport mechanism 4, dress basket subassembly 5 and marking machine 9.
Drop feed mechanism 2 is used for storing wafer 7, it sets up the one side at the transmission starting point of conveyer 31, marking machine 9 sets up the opposite side at conveyer 31, drop feed mechanism 2 includes electric putter 21, fixed plate 22, locating lever 23 and top dish 26, electric putter 21 is installed in the below of fixed plate 22, its output passes fixed plate 22 from the bottom up and links to each other with top dish 26 is fixed, fixed plate 22 is fixed in frame 1, its upper end fixed mounting has a plurality of locating levers 23 that become circular array and distribute, still the symmetry is fixed with two installation poles 24 on fixed plate 22, the top of installation pole 24 is fixed with air cock 25. The wafer 7 is placed on the top plate 26, the position of the wafer 7 is restrained by the four positioning rods 23, air is blown to the uppermost wafer 7 through the air nozzle 25, the sucking disc 45 only sucks one wafer 7 at a time, the top plate 26 is pushed to ascend through the electric push rod 21, the uppermost wafer 7 is always at the same height, and the carrying mechanism 4 is convenient to carry.
The carrying mechanism 4 is used for carrying the wafer 7 from the discharging mechanism 2 to a transmission starting point of the conveyor 31, the first carrying mechanism 4 comprises a mounting box 41, a guide rail 42, a first air cylinder 43, a second air cylinder 44 and a suction cup 45, the mounting box 41 is fixed at the upper end of the supporting leg 46, the supporting leg 46 is fixed on the rack 1, the guide rail 42 is arranged in the mounting box 41, the first air cylinder 43 is fixed at the outer side of the mounting box 41, a piston rod of the first air cylinder extends into the mounting box 41 and is fixedly connected with a sliding block, the sliding block is slidably mounted on the guide rail 42 left and right, the second air cylinder 44 is fixed at the outer side of the sliding block, a buffer 47 is arranged on a moving path of the sliding block, and the suction cup 45 used for adsorbing the wafer 7 is fixedly mounted on the piston rod of the second air cylinder 44.
The conveying mechanism 3 comprises a conveyor 31, a supporting leg 32, a material receiving box 33, material blocking rods 34, a material blocking cylinder 35, a first motor 36, a material pushing cylinder 37 and a material pushing block 38, wherein the conveyor 31 is fixed on the supporting leg 32 and driven by the first motor 36, the material receiving box 33 is obliquely arranged on the outer side of the middle section of the conveyor 31, the material blocking cylinder 35 is connected with the two material blocking rods 34, one material blocking rod 34 is used for separating more than two overlapped wafers 7 and is used for positioning the wafers 7, the material blocking cylinder 35 is fixed on the supporting leg 32 and is opposite to the material receiving box 33, the material pushing cylinder 37 and the material pushing block 38 are arranged above a conveying terminal of the conveyor 31, and the material pushing block 38 is fixed on a piston rod of the material pushing cylinder 37.
The wafer 7 carrying mechanism 4 carries to the starting point of the conveyor 31, when the conveyor 31 carries the wafer 7 to the middle part of the conveyor 31, the material blocking cylinder 35 stretches out to drive one material blocking rod 34 to ascend, the wafer 7 is positioned through one material blocking rod 34, the wafer 7 is paused to be transmitted at the moment, the marking machine 9 marks the wafer 7, after the marking is finished, whether the wafer 7 is a single wafer or a double wafer is detected through a sensor, if the wafer 7 is a double wafer or a plurality of wafers, the material blocking cylinder 35 stretches out to drive the other material blocking rod 34 to ascend to block the wafer 7 below, two or more than two wafers 7 which are overlapped together are separated, the redundant wafers enter the material collecting box 33, and the height of the material blocking rod 34 used for positioning is larger than the height of the material blocking rod 34 used for separating the wafer 7. The material blocking rod 34 for separating the wafer 7 is arranged on the side surface of the conveyor 31, and since the wafer 7 is circular, in the process of conveying the wafer, the wafer 7 on the lower side is pushed towards the material receiving box 33 under the action of the material blocking rod 34, the uppermost wafer 7 is conveyed continuously, so that only one wafer 7 is transferred to the right end of the conveyor 31 at each time, the conveyor 31 conveys the wafer 7 to the conveying end point, and the wafer 7 is placed into the basket assembly 52 through the material pushing cylinder 37, the material pushing block 38 and the basket jacking module 8.
The basket assembly 5 comprises a circular rotating platform 51, basket assembly 52, adjusting grooves 53 and an indexing disc 54, the circle center of the lower end of the rotating platform 51 is fixed at the output end of the indexing disc 54, a plurality of basket assembly 52 distributed in a circular array are placed at the upper end of the rotating platform 51, the rotating platform 51 is also provided with the adjusting grooves 53 with the same number as the basket assembly 52, and the adjusting grooves 53 are arranged below the basket assembly 52, in the embodiment, the basket assembly 52 is provided with 6.
The lower part of the rotating platform 51 is further provided with a basket jacking module 8, and the basket jacking module 8 is used for adjusting the height of the basket assembly 52.
Basket utensil jacking module 8 includes first mounting panel 81, second mounting panel 82, dead lever 83, second motor 84, screw rod 85, screw thread seat 86, jacking rod 87, jacking piece 88 and electro-magnet 89, parallel arrangement about second mounting panel 82 and the first mounting panel 81, be connected through dead lever 83 between it, the lower extreme fixed mounting of first mounting panel 81 has second motor 84, the motor shaft of second motor 84 stretch out first mounting panel 81 and with screw rod 85 fixed connection, install screw thread seat 86 on the screw rod 85, install two jacking rods 87 on the screw thread seat 86, the upper end of two jacking rods 87 stretches out second mounting panel 82 and installs the lower extreme at jacking piece 88, electro-magnet 89 is installed to the upper end of jacking piece 88.
Basket utensil subassembly 52 includes basket utensil 521, basket utensil base 523, adsorbs piece 524, offers a plurality of standing groove 522 that is used for depositing wafer 7 on the basket utensil 521, and its lower extreme can be dismantled and fix on basket utensil base 523, and the lower extreme of basket utensil base 523 is provided with the piece 524 that adsorbs that can inhale mutually with electro-magnet 89, and basket utensil base 523 is greater than adjustment tank 53, in this embodiment: the adsorption block 524 is an iron block.
The conveyor 31 conveys the wafer 7 to a conveying end point, a part of the wafer 7 enters the placing groove 522 of the basket 521, then the second motor 84 is started, the second motor 84 rotates to drive the screw 85 to rotate, so that the jacking block 88 is driven to ascend through the threaded seat 86 and the two jacking rods 87, the jacking block 88 ascends to drive the basket 521 to ascend for a distance, the distance is the distance between the two placing grooves 522, then the material pushing cylinder 37 is started, and the piston rod of the material pushing cylinder 37 stretches out to drive the material pushing block 38 to push the wafer 7 into the basket 521; when a basket 521 is full of wafers 7, the second motor 84 of the basket jacking module 8 rotates reversely to drive the basket 521 to reset, after the basket 521 resets, the electromagnet 89 is closed, the jacking block 88 is separated from the basket base 523, the index plate 54 is started to drive the rotating table 51 to rotate by 60 degrees, so that the next empty basket 521 is opposite to the conveyor 31, and then the basket is collected through the emptying mechanism 2, the conveying mechanism 3, the carrying mechanism 4 and the basket jacking module 8; the basket collecting machine stops until all the baskets 521 are full.
The outer side of the rotating platform 51 is provided with a protection seat 6, a circular groove with the same outer diameter as the rotating platform 51 is formed in the center of the protection seat 6, and the protection seat 6 protects parts below the rotating platform 51 from water, dust and the like and restricts the rotation of the rotating platform 51.
The lower end of the basket tool base 523 is further provided with a positioning hole 525, and the jacking block 88 is provided with a positioning bulge 810 matched with the positioning hole 525, so that positioning is facilitated.
The working principle of the invention is as follows:
the unmarked wafer 7 is stacked in the discharging mechanism 2, the unmarked wafer 7 is conveyed to the transmission machine 31 of the conveying mechanism 3 from the discharging mechanism 2 through the conveying mechanism 4, when the unmarked wafer 7 is transmitted to the middle section of the transmission machine 31, the wafer 7 is positioned through the stop rod 34, the transmission of the wafer 7 is suspended, the marking machine 9 marks the wafer 7, after the marking is finished, the transmission machine 31 continues to transmit the wafer 7, and then the basket receiving of the wafer 7 is automatically realized through the arrangement of the material pushing cylinder 37, the material pushing block 38, the basket loading assembly 5 and the basket jacking module 8, the marking and the basket receiving of the wafer 7 are integrated into one device, the manual conveying is avoided, the labor amount is reduced, the labor cost is saved, the efficiency of the marking and the basket receiving of the wafer 7 is greatly improved, the basket receiving yield of the wafer 7 can reach 1200 plus materials/H, the basket loading operation is time and labor saving, and the lamination rate is less than 1 percent, the fragment rate is less than 3 per mill, the basket collecting quality is also ensured, and the method is suitable for popularization and application.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. The utility model provides an automatic coding insert machine, its includes frame (1), its characterized in that:
the automatic material collecting and conveying device is characterized in that a discharging mechanism (2), a conveying mechanism (3), a carrying mechanism (4), a basket assembly (5) and a marking machine (9) are arranged above the rack (1), the conveying mechanism (3) comprises a conveyor (31), supporting legs (32), a material collecting box (33), material blocking rods (34), material blocking cylinders (35), a first motor (36), a material pushing cylinder (37) and a material pushing block (38), the conveyor (31) is fixed on the supporting legs (32) and driven by the first motor (36), the material collecting box (33) is obliquely arranged on the outer side of the middle section of the conveyor (31), the material blocking cylinders (35) are connected with the two material blocking rods (34), one material blocking rod (34) is used for separating more than two overlapped wafers (7), one material blocking rod is used for positioning the wafers (7), the material blocking cylinder (35) is fixed on the material blocking cylinders (32) and is opposite to the material collecting box (33), the pushing cylinder (37) and the pushing block (38) are arranged above the transmission end point of the conveyor (31), and the pushing block (38) is fixed on a piston rod of the pushing cylinder (37);
the basket containing assembly (5) comprises a circular rotating table (51), basket tool assemblies (52), adjusting grooves (53) and an index plate (54), the circle center of the lower end of the rotating table (51) is fixed at the output end of the index plate (54), a plurality of basket tool assemblies (52) distributed in a circular array are placed at the upper end of the rotating table, the rotating table (51) is further provided with the adjusting grooves (53) with the same number as the basket tool assemblies (52), and the adjusting grooves (53) are arranged below the basket tool assemblies (52);
a basket tool jacking module (8) is further arranged below the rotating table (51), and the basket tool jacking module (8) is used for adjusting the height of the basket tool assembly (52);
drop feed mechanism (2) are used for storing wafer (7), and it sets up in one side of transmitter (31) transmission starting point, and marking machine (9) set up the opposite side in transmitter (31), handling mechanism (4) are used for carrying wafer (7) from drop feed mechanism (2) to the transmission starting point of transmitter (31), when transmitter (31) carried wafer (7) the middle part of transmitter (31), through marking machine (9) beats mark to wafer (7), after the mark, transmitter (31) carry wafer (7) transmission terminal point and put into basket utensil subassembly (52) through pushing away material cylinder (37), pushing away material piece (38) and basket utensil jacking module (8) with wafer (7).
2. The automatic coding insert machine of claim 1, characterized in that: the basket jacking module (8) comprises a first mounting plate (81), a second mounting plate (82), a fixed rod (83), a second motor (84), a screw rod (85), a threaded seat (86), a jacking rod (87), a jacking block (88) and an electromagnet (89), wherein the second mounting plate (82) and the first mounting plate (81) are arranged in parallel up and down, the two are connected through a fixed rod (83), the lower end of the first mounting plate (81) is fixedly provided with a second motor (84), a motor shaft of the second motor (84) extends out of the first mounting plate (81) and is fixedly connected with the screw rod (85), install screw thread seat (86) on screw rod (85), install two jacking rods (87) on screw thread seat (86), two the upper end of jacking rod (87) stretches out second mounting panel (82) and installs the lower extreme at jacking piece (88), electro-magnet (89) are installed to the upper end of jacking piece (88).
3. The automatic coding insert machine of claim 1, characterized in that: drop feed mechanism (2) include electric putter (21), fixed plate (22), locating lever (23) and top dish (26), electric putter (21) are installed in the below of fixed plate (22), and its output from the bottom up passes fixed plate (22) and links to each other with top dish (26) is fixed, fixed plate (22) are fixed in frame (1), and its upper end fixed mounting has locating lever (23) that a plurality of root become circular array and distribute, it is fixed with two installation poles (24) still to the symmetry on fixed plate (22), the top of installation pole (24) is fixed with air cock (25).
4. The automatic coding insert machine of claim 1, characterized in that: first transport mechanism (4) are including mounting box (41), guide rail (42), first cylinder (43), second cylinder (44) and sucking disc (45), the upper end at supporting legs (46) is fixed in mounting box (41), supporting legs (46) are fixed on frame (1), guide rail (42) set up in mounting box (41), first cylinder (43) are fixed in the outside of mounting box (41), and its piston rod stretches into in mounting box (41) and links to each other with the slider is fixed, slider side to side slidable mounting be in on guide rail (42), the outside of slider is fixed with second cylinder (44), be provided with buffer (47) on the motion path of slider, fixed mounting has sucking disc (45) that are used for adsorbing wafer (7) on the piston rod of second cylinder (44).
5. The automatic coding insert machine of claim 2, characterized in that: the basket tool component (52) comprises a basket tool (521), a basket tool base (523) and an adsorption block (524), wherein a plurality of placing grooves (522) used for storing wafers (7) are formed in the basket tool (521), the lower end of the basket tool is detachably fixed on the basket tool base (523), and the adsorption block (524) capable of being adsorbed with the electromagnet (89) is arranged at the lower end of the basket tool base (523).
6. The automatic coding insert machine of claim 1, characterized in that: the outer side of the rotating platform (51) is provided with a protective seat (6), and a circular groove with the same outer diameter as the rotating platform (51) is formed in the center of the protective seat (6).
7. The automatic coding insert machine of claim 5, characterized in that: the lower end of the basket tool base (523) is further provided with a positioning hole (525), and the jacking block (88) is provided with a positioning bulge (810) matched with the positioning hole (525).
CN202111359023.8A 2021-11-17 2021-11-17 Automatic code printing and inserting machine Pending CN114188244A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111359023.8A CN114188244A (en) 2021-11-17 2021-11-17 Automatic code printing and inserting machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111359023.8A CN114188244A (en) 2021-11-17 2021-11-17 Automatic code printing and inserting machine

Publications (1)

Publication Number Publication Date
CN114188244A true CN114188244A (en) 2022-03-15

Family

ID=80602155

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111359023.8A Pending CN114188244A (en) 2021-11-17 2021-11-17 Automatic code printing and inserting machine

Country Status (1)

Country Link
CN (1) CN114188244A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115156369A (en) * 2022-07-11 2022-10-11 红旗仪表(长兴)有限公司 A stamping equipment for production of manometer watchcase

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115156369A (en) * 2022-07-11 2022-10-11 红旗仪表(长兴)有限公司 A stamping equipment for production of manometer watchcase
CN115156369B (en) * 2022-07-11 2024-06-21 红旗仪表(长兴)有限公司 Stamping equipment for production of manometer case

Similar Documents

Publication Publication Date Title
CN113933681B (en) Chip test equipment
CN112466797A (en) Chip assembly feeding and discharging machine
CN110646724A (en) Feeding and conveying device of semiconductor chip sorting and testing device and working method thereof
CN112047083B (en) Full-automatic goods of furniture for display rather than for use machine
CN214058036U (en) Full-automatic feeding and charging equipment for semiconductor packaging process
CN114160991A (en) Novel soldering lug arranging machine and working method thereof
CN112387534A (en) Semiconductor packaging machine
CN114188244A (en) Automatic code printing and inserting machine
CN112389713A (en) Full-automatic feeding and charging equipment for semiconductor packaging process
CN115448029A (en) Stacker, sorting system and sorting method
CN210390436U (en) Silk-screen printing production line
CN113998457B (en) Multi-chip detection system
CN113990786A (en) Single-rail silicon wafer basket collecting machine
CN213691982U (en) Chip assembly feeding and discharging machine
CN216980500U (en) Automatic code printing and inserting machine
CN113003218A (en) Plate washing machine for processing PCB and use method thereof
CN209766454U (en) Biplate making herbs into wool wafer separator
CN216928524U (en) Single-rail silicon wafer basket collecting machine
CN215500336U (en) Automatic LED circuit board chip mounter of material loading
CN201614182U (en) Lifting structure of automatic plane glass stacker
CN214652491U (en) Grabbing device of washing label machine
CN213111534U (en) Glass loading machine and glass loading device
CN111547286B (en) Contact lens PP cup heat-seal packaging machine and heat-seal packaging method thereof
CN210432092U (en) Automatic paster mechanism
CN109979870B (en) Automatic burst feed mechanism of silicon wafer

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination