CN114097309A - 柔性印刷配线板、电池配线模块及柔性印刷配线板的制造方法 - Google Patents

柔性印刷配线板、电池配线模块及柔性印刷配线板的制造方法 Download PDF

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Publication number
CN114097309A
CN114097309A CN202080048048.3A CN202080048048A CN114097309A CN 114097309 A CN114097309 A CN 114097309A CN 202080048048 A CN202080048048 A CN 202080048048A CN 114097309 A CN114097309 A CN 114097309A
Authority
CN
China
Prior art keywords
connection terminal
flexible printed
wiring board
printed wiring
conductive pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080048048.3A
Other languages
English (en)
Chinese (zh)
Inventor
内田淑文
高濑慎一
高桥秀夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
Sumitomo Electric Printed Circuits Inc
Original Assignee
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
Sumitomo Electric Printed Circuits Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Wiring Systems Ltd, AutoNetworks Technologies Ltd, Sumitomo Electric Industries Ltd, Sumitomo Electric Printed Circuits Inc filed Critical Sumitomo Wiring Systems Ltd
Publication of CN114097309A publication Critical patent/CN114097309A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/502—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing
    • H01M50/519—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing comprising printed circuit boards [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M2220/00—Batteries for particular applications
    • H01M2220/20—Batteries in motive systems, e.g. vehicle, ship, plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0311—Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10037—Printed or non-printed battery
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10916—Terminals having auxiliary metallic piece, e.g. for soldering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Structure Of Printed Boards (AREA)
CN202080048048.3A 2019-07-10 2020-07-09 柔性印刷配线板、电池配线模块及柔性印刷配线板的制造方法 Pending CN114097309A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019-128681 2019-07-10
JP2019128681 2019-07-10
PCT/JP2020/026938 WO2021006325A1 (ja) 2019-07-10 2020-07-09 フレキシブルプリント配線板、電池配線モジュール及びフレキシブルプリント配線板の製造方法

Publications (1)

Publication Number Publication Date
CN114097309A true CN114097309A (zh) 2022-02-25

Family

ID=74113773

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080048048.3A Pending CN114097309A (zh) 2019-07-10 2020-07-09 柔性印刷配线板、电池配线模块及柔性印刷配线板的制造方法

Country Status (4)

Country Link
US (1) US20220272839A1 (https=)
JP (1) JPWO2021006325A1 (https=)
CN (1) CN114097309A (https=)
WO (1) WO2021006325A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024116720A (ja) * 2023-02-16 2024-08-28 株式会社デンソー バスバーモジュール、および、電池パック

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09232499A (ja) * 1996-02-26 1997-09-05 Canon Inc 半導体装置
JP2004127715A (ja) * 2002-10-02 2004-04-22 Rohm Co Ltd フラットフレキシブルケーブルの耐熱性回路基板に対する半田接続構造及び接続方法
JP2008166021A (ja) * 2006-12-27 2008-07-17 Nec Saitama Ltd 電池の接続端子構造
US20160336671A1 (en) * 2014-02-03 2016-11-17 Molex, Llc Metal terminals
JP2018018612A (ja) * 2016-07-26 2018-02-01 株式会社オートネットワーク技術研究所 電池用配線モジュール
US20180248167A1 (en) * 2017-02-28 2018-08-30 Yazaki Corporation Conductive module and battery pack
JP2019021443A (ja) * 2017-07-13 2019-02-07 株式会社オートネットワーク技術研究所 端子及び端子付き基板
WO2019035278A1 (ja) * 2017-08-14 2019-02-21 住友電気工業株式会社 フレキシブルプリント配線板

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4900279A (en) * 1989-04-24 1990-02-13 Die Tech, Inc. Solder terminal
US5411420A (en) * 1993-05-27 1995-05-02 Die Tech, Inc. Solder terminal strip
JP3734138B2 (ja) * 2000-02-18 2006-01-11 矢崎総業株式会社 フラットケーブル用ターミナル
TWM357746U (en) * 2008-12-09 2009-05-21 Htc Corp Electronic device and connector assembly
KR101786512B1 (ko) * 2010-07-26 2017-10-18 엘지전자 주식회사 다층 연성회로기판의 제조방법
EP2799595A1 (de) * 2013-05-03 2014-11-05 Delphi Technologies, Inc. Elektrisches Kontaktelement
JP6033164B2 (ja) * 2013-05-23 2016-11-30 オムロンオートモーティブエレクトロニクス株式会社 端子、電子制御装置
CN105379022B (zh) * 2013-07-11 2017-09-12 日本压着端子制造株式会社 端子及采用端子的连接结构

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09232499A (ja) * 1996-02-26 1997-09-05 Canon Inc 半導体装置
JP2004127715A (ja) * 2002-10-02 2004-04-22 Rohm Co Ltd フラットフレキシブルケーブルの耐熱性回路基板に対する半田接続構造及び接続方法
JP2008166021A (ja) * 2006-12-27 2008-07-17 Nec Saitama Ltd 電池の接続端子構造
US20160336671A1 (en) * 2014-02-03 2016-11-17 Molex, Llc Metal terminals
JP2018018612A (ja) * 2016-07-26 2018-02-01 株式会社オートネットワーク技術研究所 電池用配線モジュール
US20180248167A1 (en) * 2017-02-28 2018-08-30 Yazaki Corporation Conductive module and battery pack
JP2019021443A (ja) * 2017-07-13 2019-02-07 株式会社オートネットワーク技術研究所 端子及び端子付き基板
WO2019035278A1 (ja) * 2017-08-14 2019-02-21 住友電気工業株式会社 フレキシブルプリント配線板

Also Published As

Publication number Publication date
JPWO2021006325A1 (https=) 2021-01-14
WO2021006325A1 (ja) 2021-01-14
US20220272839A1 (en) 2022-08-25

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Application publication date: 20220225