CN114096589B - 聚酰亚胺树脂、聚酰亚胺清漆及聚酰亚胺薄膜 - Google Patents

聚酰亚胺树脂、聚酰亚胺清漆及聚酰亚胺薄膜 Download PDF

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Publication number
CN114096589B
CN114096589B CN202080049420.2A CN202080049420A CN114096589B CN 114096589 B CN114096589 B CN 114096589B CN 202080049420 A CN202080049420 A CN 202080049420A CN 114096589 B CN114096589 B CN 114096589B
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polyimide
mol
film
acid
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CN114096589A (zh
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星野舜
三田寺淳
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Mitsubishi Gas Chemical Co Inc
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Mitsubishi Gas Chemical Co Inc
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/1064Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075Partially aromatic polyimides
    • C08G73/1078Partially aromatic polyimides wholly aromatic in the diamino moiety
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003Preparatory processes
    • C08G73/1007Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2150/00Compositions for coatings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
CN202080049420.2A 2019-07-10 2020-07-08 聚酰亚胺树脂、聚酰亚胺清漆及聚酰亚胺薄膜 Active CN114096589B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019128572 2019-07-10
JP2019-128572 2019-07-10
PCT/JP2020/026619 WO2021006284A1 (ja) 2019-07-10 2020-07-08 ポリイミド樹脂、ポリイミドワニス及びポリイミドフィルム

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CN114096589A CN114096589A (zh) 2022-02-25
CN114096589B true CN114096589B (zh) 2024-03-08

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JP (1) JP7484913B2 (ja)
KR (1) KR20220034059A (ja)
CN (1) CN114096589B (ja)
TW (1) TWI839543B (ja)
WO (1) WO2021006284A1 (ja)

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01304124A (ja) * 1988-05-31 1989-12-07 Sanken Kako Kk 可溶性ポリイミドの製造法
JP2003155342A (ja) * 2001-11-19 2003-05-27 Nippon Steel Chem Co Ltd 脂環構造を有するポリイミド共重合体
KR20080063906A (ko) * 2007-01-03 2008-07-08 에스케이씨 주식회사 접착력이 개선된 폴리이미드 필름
JP2008297360A (ja) * 2007-05-29 2008-12-11 New Japan Chem Co Ltd 溶剤可溶性ポリイミド樹脂
JP2010116476A (ja) * 2008-11-12 2010-05-27 Jsr Corp ポリイミド系材料、フィルム及びその製造方法
CN102634022A (zh) * 2012-04-10 2012-08-15 中国科学院化学研究所 无色高透明聚酰亚胺薄膜及其制备方法与应用
JP2014210896A (ja) * 2013-04-22 2014-11-13 住友ベークライト株式会社 ポリイミド樹脂およびポリイミドフィルム
JP2016163999A (ja) * 2016-04-05 2016-09-08 東洋紡株式会社 透明ポリイミド系フィルムの製造方法
CN108136755A (zh) * 2015-10-15 2018-06-08 新日铁住金化学株式会社 聚酰亚胺层叠体及其制造方法
JP2018134808A (ja) * 2017-02-22 2018-08-30 三菱瓦斯化学株式会社 ポリイミドフィルム積層体
CN109071813A (zh) * 2016-05-09 2018-12-21 三菱瓦斯化学株式会社 聚酰亚胺树脂和聚酰亚胺树脂组合物
JP2019059834A (ja) * 2017-09-26 2019-04-18 河村産業株式会社 ポリイミド粉体、ポリイミドワニス及びポリイミドフィルム

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101796174B1 (ko) * 2011-05-19 2017-11-10 삼성전자주식회사 폴리아미드 블록 코폴리머, 이의 제조 방법, 이를 포함하는 성형품 및 상기 성형품을 포함하는 디스플레이 장치
EP3279237A4 (en) * 2015-03-31 2018-04-04 Asahi Kasei Kabushiki Kaisha Polyimide film, polyimide varnish, product using polyimide film, and laminate
TWI609897B (zh) * 2017-02-15 2018-01-01 律勝科技股份有限公司 聚醯亞胺樹脂及其製造方法與薄膜

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01304124A (ja) * 1988-05-31 1989-12-07 Sanken Kako Kk 可溶性ポリイミドの製造法
JP2003155342A (ja) * 2001-11-19 2003-05-27 Nippon Steel Chem Co Ltd 脂環構造を有するポリイミド共重合体
KR20080063906A (ko) * 2007-01-03 2008-07-08 에스케이씨 주식회사 접착력이 개선된 폴리이미드 필름
JP2008297360A (ja) * 2007-05-29 2008-12-11 New Japan Chem Co Ltd 溶剤可溶性ポリイミド樹脂
JP2010116476A (ja) * 2008-11-12 2010-05-27 Jsr Corp ポリイミド系材料、フィルム及びその製造方法
CN102634022A (zh) * 2012-04-10 2012-08-15 中国科学院化学研究所 无色高透明聚酰亚胺薄膜及其制备方法与应用
JP2014210896A (ja) * 2013-04-22 2014-11-13 住友ベークライト株式会社 ポリイミド樹脂およびポリイミドフィルム
CN108136755A (zh) * 2015-10-15 2018-06-08 新日铁住金化学株式会社 聚酰亚胺层叠体及其制造方法
JP2016163999A (ja) * 2016-04-05 2016-09-08 東洋紡株式会社 透明ポリイミド系フィルムの製造方法
CN109071813A (zh) * 2016-05-09 2018-12-21 三菱瓦斯化学株式会社 聚酰亚胺树脂和聚酰亚胺树脂组合物
JP2018134808A (ja) * 2017-02-22 2018-08-30 三菱瓦斯化学株式会社 ポリイミドフィルム積層体
JP2019059834A (ja) * 2017-09-26 2019-04-18 河村産業株式会社 ポリイミド粉体、ポリイミドワニス及びポリイミドフィルム

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Publication number Publication date
WO2021006284A1 (ja) 2021-01-14
TWI839543B (zh) 2024-04-21
KR20220034059A (ko) 2022-03-17
CN114096589A (zh) 2022-02-25
TW202106765A (zh) 2021-02-16
JP7484913B2 (ja) 2024-05-16
JPWO2021006284A1 (ja) 2021-01-14

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