CN113994199B - 基板处理装置、基板检查方法和存储介质 - Google Patents

基板处理装置、基板检查方法和存储介质 Download PDF

Info

Publication number
CN113994199B
CN113994199B CN202080041339.XA CN202080041339A CN113994199B CN 113994199 B CN113994199 B CN 113994199B CN 202080041339 A CN202080041339 A CN 202080041339A CN 113994199 B CN113994199 B CN 113994199B
Authority
CN
China
Prior art keywords
substrate
unit
film
wafer
spectroscopic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202080041339.XA
Other languages
English (en)
Chinese (zh)
Other versions
CN113994199A (zh
Inventor
野田康朗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN113994199A publication Critical patent/CN113994199A/zh
Application granted granted Critical
Publication of CN113994199B publication Critical patent/CN113994199B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • G01N21/27—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands using photo-electric detection ; circuits for computing concentration
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/8422—Investigating thin films, e.g. matrix isolation method
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/10—Scanning
    • G01N2201/104—Mechano-optical scan, i.e. object and beam moving
    • G01N2201/1042—X, Y scan, i.e. object moving in X, beam in Y
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
CN202080041339.XA 2019-06-10 2020-06-09 基板处理装置、基板检查方法和存储介质 Active CN113994199B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2019108148 2019-06-10
JP2019-108148 2019-06-10
JP2020093162 2020-05-28
JP2020-093162 2020-05-28
PCT/JP2020/022612 WO2020250868A1 (ja) 2019-06-10 2020-06-09 基板処理装置、基板検査方法、及び記憶媒体

Publications (2)

Publication Number Publication Date
CN113994199A CN113994199A (zh) 2022-01-28
CN113994199B true CN113994199B (zh) 2024-10-18

Family

ID=73781163

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080041339.XA Active CN113994199B (zh) 2019-06-10 2020-06-09 基板处理装置、基板检查方法和存储介质

Country Status (6)

Country Link
US (1) US20220252507A1 (https=)
JP (1) JP7282171B2 (https=)
KR (1) KR20220020346A (https=)
CN (1) CN113994199B (https=)
TW (1) TWI848121B (https=)
WO (1) WO2020250868A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7431694B2 (ja) * 2020-07-28 2024-02-15 キヤノン株式会社 情報処理装置、膜形成装置、物品の製造方法、およびプログラム
JP7482018B2 (ja) * 2020-12-24 2024-05-13 東京エレクトロン株式会社 推定モデル作成装置、推定モデル作成方法、及び記憶媒体
DE102021111707B3 (de) * 2021-05-05 2022-06-02 Sioptica Gmbh Verfahren und Anordnung zum zerstörungsfreien Überprüfen einer Oberflächenstruktur
JP7171092B1 (ja) * 2021-11-08 2022-11-15 株式会社シンクロン 成膜制御装置、成膜装置及び成膜方法
JP7822791B2 (ja) * 2022-01-12 2026-03-03 東京エレクトロン株式会社 基板検査装置、基板検査方法、及び、基板検査プログラム
JP7793427B2 (ja) * 2022-03-01 2026-01-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置及び基板処理システム並びに基板処理方法
DE102023106815B3 (de) * 2023-03-17 2024-05-23 Confovis Gmbh Verfahren zum Erstellen eines Schichtdickenvariationsprofils einer Oberflächenschicht eines Substrates
CN117147441B (zh) * 2023-07-18 2024-04-12 镭友芯科技(苏州)有限公司 一种气体探测器及制备方法
WO2025041661A1 (ja) * 2023-08-23 2025-02-27 東京エレクトロン株式会社 基板検査装置、基板検査方法、及び記憶媒体
CN119555020A (zh) * 2025-02-05 2025-03-04 四川省开璞环保包装制品有限公司 一种环保无纺布表面涂层检测方法及系统

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001153620A (ja) * 1999-11-29 2001-06-08 Dainippon Screen Mfg Co Ltd 膜厚測定装置および膜厚測定方法
JP2002141274A (ja) * 2000-11-06 2002-05-17 Tokyo Electron Ltd 膜厚測定装置及びその方法
JP2003100598A (ja) * 2001-09-25 2003-04-04 Dainippon Screen Mfg Co Ltd 基板処理装置制御システムおよび基板処理装置
JP2010117161A (ja) * 2008-11-11 2010-05-27 Nikon Corp 検査装置

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0346501A (ja) * 1989-07-13 1991-02-27 Dainippon Screen Mfg Co Ltd 膜厚測定方法
JPH03256321A (ja) * 1990-03-06 1991-11-15 Nec Corp レジスト膜形成装置
JP3450651B2 (ja) * 1997-06-10 2003-09-29 キヤノン株式会社 研磨方法及びそれを用いた研磨装置
US7217573B1 (en) * 1999-10-05 2007-05-15 Hitachi, Ltd. Method of inspecting a DNA chip
JP3589406B2 (ja) * 1999-10-25 2004-11-17 東京エレクトロン株式会社 基板処理システム
US7095511B2 (en) * 2000-07-06 2006-08-22 Filmetrics, Inc. Method and apparatus for high-speed thickness mapping of patterned thin films
US6946394B2 (en) * 2000-09-20 2005-09-20 Kla-Tencor Technologies Methods and systems for determining a characteristic of a layer formed on a specimen by a deposition process
JP3616003B2 (ja) * 2000-09-29 2005-02-02 東京エレクトロン株式会社 塗布膜形成方法及びその装置
JP3857217B2 (ja) * 2002-11-06 2006-12-13 大日本スクリーン製造株式会社 膜厚測定装置
CN100466180C (zh) * 2004-03-04 2009-03-04 夏普株式会社 用于制造半导体设备的方法和用于检查半导体的装置
JP2006030070A (ja) * 2004-07-20 2006-02-02 Opto One Kk 膜厚検査装置
DE102004049518B3 (de) * 2004-10-11 2006-02-02 Infineon Technologies Ag Verfahren zum tiefenaufgelösten Charakterisieren einer Schicht eines Trägers
WO2008128372A1 (en) * 2007-04-20 2008-10-30 Eth Zurich Transmission interferometric adsorption sensor
US8751033B2 (en) * 2008-11-14 2014-06-10 Applied Materials, Inc. Adaptive tracking spectrum features for endpoint detection
JP2012063321A (ja) * 2010-09-17 2012-03-29 Hamamatsu Photonics Kk 反射率測定装置、反射率測定方法、膜厚測定装置及び膜厚測定方法
JP5769572B2 (ja) * 2011-03-30 2015-08-26 株式会社Ｓｃｒｅｅｎホールディングス 基板検査装置および基板検査方法
KR101376450B1 (ko) 2011-06-01 2014-03-19 다이닛뽕스크린 세이조오 가부시키가이샤 화상취득장치, 패턴검사장치 및 화상취득방법
JP6035279B2 (ja) * 2014-05-08 2016-11-30 東京エレクトロン株式会社 膜厚測定装置、膜厚測定方法、プログラム及びコンピュータ記憶媒体
JP6308958B2 (ja) * 2015-02-25 2018-04-11 東京エレクトロン株式会社 基板処理装置、基板処理方法、プログラム及びコンピュータ記憶媒体
JP6329923B2 (ja) * 2015-06-08 2018-05-23 東京エレクトロン株式会社 基板の検査方法、コンピュータ記憶媒体及び基板検査装置
JP6405290B2 (ja) * 2015-07-22 2018-10-17 東京エレクトロン株式会社 基板処理装置、基板処理方法及びコンピュータ読み取り可能な記録媒体
US10573545B2 (en) * 2016-06-28 2020-02-25 Murata Machinery, Ltd. Substrate carrier and substrate carrier stack

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001153620A (ja) * 1999-11-29 2001-06-08 Dainippon Screen Mfg Co Ltd 膜厚測定装置および膜厚測定方法
JP2002141274A (ja) * 2000-11-06 2002-05-17 Tokyo Electron Ltd 膜厚測定装置及びその方法
JP2003100598A (ja) * 2001-09-25 2003-04-04 Dainippon Screen Mfg Co Ltd 基板処理装置制御システムおよび基板処理装置
JP2010117161A (ja) * 2008-11-11 2010-05-27 Nikon Corp 検査装置

Also Published As

Publication number Publication date
WO2020250868A1 (ja) 2020-12-17
JPWO2020250868A1 (https=) 2020-12-17
TW202113331A (zh) 2021-04-01
US20220252507A1 (en) 2022-08-11
TWI848121B (zh) 2024-07-11
KR20220020346A (ko) 2022-02-18
JP7282171B2 (ja) 2023-05-26
CN113994199A (zh) 2022-01-28

Similar Documents

Publication Publication Date Title
CN113994199B (zh) 基板处理装置、基板检查方法和存储介质
CN112068399B (zh) 基片检查系统、基片检查方法和存储介质
US9355442B2 (en) Film thickness measurement apparatus, film thickness measurement method, and non-transitory computer storage medium
JP7579948B2 (ja) 基板検査装置、基板処理装置、基板検査方法、及びコンピュータ読み取り可能な記録媒体
KR101396907B1 (ko) 결함 분류 방법, 컴퓨터 기억 매체 및 결함 분류 장치
JP7572436B2 (ja) 機械学習に基づく基板画像処理からの膜厚推定
CN111650813B (zh) 基板处理装置、基板检查装置及方法、以及记录介质
JP7090005B2 (ja) 基板処理装置及び検査方法
JP7763106B2 (ja) 基板検査装置、基板検査方法、及び、基板検査プログラム
JP7153521B2 (ja) 基板処理装置及び検査方法
JP7425700B2 (ja) 形状特性値推定装置、形状特性値推定方法、及び記憶媒体
JP7822791B2 (ja) 基板検査装置、基板検査方法、及び、基板検査プログラム
TWI899392B (zh) 推定模型作成裝置、推定模型作成方法及記憶媒體
KR20240172687A (ko) 형상 특성값 추정 장치, 형상 특성값 추정 방법 및 기억 매체
TW202431460A (zh) 基板檢查方法、基板檢查裝置及基板檢查程式

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant