KR20220020346A - 기판 처리 장치, 기판 검사 방법 및 기억 매체 - Google Patents

기판 처리 장치, 기판 검사 방법 및 기억 매체 Download PDF

Info

Publication number
KR20220020346A
KR20220020346A KR1020227000733A KR20227000733A KR20220020346A KR 20220020346 A KR20220020346 A KR 20220020346A KR 1020227000733 A KR1020227000733 A KR 1020227000733A KR 20227000733 A KR20227000733 A KR 20227000733A KR 20220020346 A KR20220020346 A KR 20220020346A
Authority
KR
South Korea
Prior art keywords
unit
substrate
film
wafer
film thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020227000733A
Other languages
English (en)
Korean (ko)
Inventor
야스아키 노다
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20220020346A publication Critical patent/KR20220020346A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • G01N21/27—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands using photo-electric detection ; circuits for computing concentration
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/8422—Investigating thin films, e.g. matrix isolation method
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • H01L22/12—
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/10—Scanning
    • G01N2201/104—Mechano-optical scan, i.e. object and beam moving
    • G01N2201/1042—X, Y scan, i.e. object moving in X, beam in Y
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Quality & Reliability (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
KR1020227000733A 2019-06-10 2020-06-09 기판 처리 장치, 기판 검사 방법 및 기억 매체 Ceased KR20220020346A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2019-108148 2019-06-10
JP2019108148 2019-06-10
JPJP-P-2020-093162 2020-05-28
JP2020093162 2020-05-28
PCT/JP2020/022612 WO2020250868A1 (ja) 2019-06-10 2020-06-09 基板処理装置、基板検査方法、及び記憶媒体

Publications (1)

Publication Number Publication Date
KR20220020346A true KR20220020346A (ko) 2022-02-18

Family

ID=73781163

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227000733A Ceased KR20220020346A (ko) 2019-06-10 2020-06-09 기판 처리 장치, 기판 검사 방법 및 기억 매체

Country Status (6)

Country Link
US (1) US20220252507A1 (https=)
JP (1) JP7282171B2 (https=)
KR (1) KR20220020346A (https=)
CN (1) CN113994199B (https=)
TW (1) TWI848121B (https=)
WO (1) WO2020250868A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7431694B2 (ja) * 2020-07-28 2024-02-15 キヤノン株式会社 情報処理装置、膜形成装置、物品の製造方法、およびプログラム
JP7482018B2 (ja) * 2020-12-24 2024-05-13 東京エレクトロン株式会社 推定モデル作成装置、推定モデル作成方法、及び記憶媒体
DE102021111707B3 (de) * 2021-05-05 2022-06-02 Sioptica Gmbh Verfahren und Anordnung zum zerstörungsfreien Überprüfen einer Oberflächenstruktur
JP7171092B1 (ja) * 2021-11-08 2022-11-15 株式会社シンクロン 成膜制御装置、成膜装置及び成膜方法
JP7822791B2 (ja) * 2022-01-12 2026-03-03 東京エレクトロン株式会社 基板検査装置、基板検査方法、及び、基板検査プログラム
JP7793427B2 (ja) * 2022-03-01 2026-01-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置及び基板処理システム並びに基板処理方法
DE102023106815B3 (de) * 2023-03-17 2024-05-23 Confovis Gmbh Verfahren zum Erstellen eines Schichtdickenvariationsprofils einer Oberflächenschicht eines Substrates
CN117147441B (zh) * 2023-07-18 2024-04-12 镭友芯科技(苏州)有限公司 一种气体探测器及制备方法
CN121773325A (zh) * 2023-08-23 2026-03-31 东京毅力科创株式会社 基片检查装置、基片检查方法和存储介质
CN119555020A (zh) * 2025-02-05 2025-03-04 四川省开璞环保包装制品有限公司 一种环保无纺布表面涂层检测方法及系统

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015215193A (ja) 2014-05-08 2015-12-03 東京エレクトロン株式会社 膜厚測定装置、膜厚測定方法、プログラム及びコンピュータ記憶媒体

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0346501A (ja) * 1989-07-13 1991-02-27 Dainippon Screen Mfg Co Ltd 膜厚測定方法
JPH03256321A (ja) * 1990-03-06 1991-11-15 Nec Corp レジスト膜形成装置
JP3450651B2 (ja) * 1997-06-10 2003-09-29 キヤノン株式会社 研磨方法及びそれを用いた研磨装置
US7217573B1 (en) * 1999-10-05 2007-05-15 Hitachi, Ltd. Method of inspecting a DNA chip
JP3589406B2 (ja) * 1999-10-25 2004-11-17 東京エレクトロン株式会社 基板処理システム
JP3723392B2 (ja) * 1999-11-29 2005-12-07 大日本スクリーン製造株式会社 膜厚測定装置および膜厚測定方法
US7095511B2 (en) * 2000-07-06 2006-08-22 Filmetrics, Inc. Method and apparatus for high-speed thickness mapping of patterned thin films
US6633831B2 (en) * 2000-09-20 2003-10-14 Kla Tencor Technologies Methods and systems for determining a critical dimension and a thin film characteristic of a specimen
JP3616003B2 (ja) * 2000-09-29 2005-02-02 東京エレクトロン株式会社 塗布膜形成方法及びその装置
JP3625761B2 (ja) * 2000-11-06 2005-03-02 東京エレクトロン株式会社 膜厚測定装置及びその方法
JP2003100598A (ja) * 2001-09-25 2003-04-04 Dainippon Screen Mfg Co Ltd 基板処理装置制御システムおよび基板処理装置
JP3857217B2 (ja) * 2002-11-06 2006-12-13 大日本スクリーン製造株式会社 膜厚測定装置
JP4963064B2 (ja) * 2004-03-04 2012-06-27 シャープ株式会社 半導体装置の製造方法および半導体検査装置
JP2006030070A (ja) * 2004-07-20 2006-02-02 Opto One Kk 膜厚検査装置
DE102004049518B3 (de) * 2004-10-11 2006-02-02 Infineon Technologies Ag Verfahren zum tiefenaufgelösten Charakterisieren einer Schicht eines Trägers
WO2008128372A1 (en) * 2007-04-20 2008-10-30 Eth Zurich Transmission interferometric adsorption sensor
JP2010117161A (ja) * 2008-11-11 2010-05-27 Nikon Corp 検査装置
US8751033B2 (en) * 2008-11-14 2014-06-10 Applied Materials, Inc. Adaptive tracking spectrum features for endpoint detection
JP2012063321A (ja) * 2010-09-17 2012-03-29 Hamamatsu Photonics Kk 反射率測定装置、反射率測定方法、膜厚測定装置及び膜厚測定方法
JP5769572B2 (ja) * 2011-03-30 2015-08-26 株式会社Ｓｃｒｅｅｎホールディングス 基板検査装置および基板検査方法
KR101376450B1 (ko) 2011-06-01 2014-03-19 다이닛뽕스크린 세이조오 가부시키가이샤 화상취득장치, 패턴검사장치 및 화상취득방법
JP6308958B2 (ja) * 2015-02-25 2018-04-11 東京エレクトロン株式会社 基板処理装置、基板処理方法、プログラム及びコンピュータ記憶媒体
JP6329923B2 (ja) * 2015-06-08 2018-05-23 東京エレクトロン株式会社 基板の検査方法、コンピュータ記憶媒体及び基板検査装置
JP6405290B2 (ja) * 2015-07-22 2018-10-17 東京エレクトロン株式会社 基板処理装置、基板処理方法及びコンピュータ読み取り可能な記録媒体
US10573545B2 (en) * 2016-06-28 2020-02-25 Murata Machinery, Ltd. Substrate carrier and substrate carrier stack

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015215193A (ja) 2014-05-08 2015-12-03 東京エレクトロン株式会社 膜厚測定装置、膜厚測定方法、プログラム及びコンピュータ記憶媒体

Also Published As

Publication number Publication date
TW202113331A (zh) 2021-04-01
JPWO2020250868A1 (https=) 2020-12-17
WO2020250868A1 (ja) 2020-12-17
CN113994199B (zh) 2024-10-18
US20220252507A1 (en) 2022-08-11
JP7282171B2 (ja) 2023-05-26
TWI848121B (zh) 2024-07-11
CN113994199A (zh) 2022-01-28

Similar Documents

Publication Publication Date Title
JP7282171B2 (ja) 基板処理装置、基板検査方法、及び記憶媒体
KR102866009B1 (ko) 기판 검사 시스템, 기판 검사 방법 및 기억 매체
US11599027B2 (en) Lithographic process and apparatus and inspection process and apparatus
JP7579948B2 (ja) 基板検査装置、基板処理装置、基板検査方法、及びコンピュータ読み取り可能な記録媒体
JP2013500597A (ja) リソグラフィ用の検査方法
JP7763106B2 (ja) 基板検査装置、基板検査方法、及び、基板検査プログラム
JP7153521B2 (ja) 基板処理装置及び検査方法
KR20210036266A (ko) 기판 처리 제어 방법, 기판 처리 장치, 및 기억 매체
JP7425700B2 (ja) 形状特性値推定装置、形状特性値推定方法、及び記憶媒体
TWI899392B (zh) 推定模型作成裝置、推定模型作成方法及記憶媒體
JP7822791B2 (ja) 基板検査装置、基板検査方法、及び、基板検査プログラム
JP2024045432A (ja) 反り量推定装置及び反り量推定方法
KR20240172687A (ko) 형상 특성값 추정 장치, 형상 특성값 추정 방법 및 기억 매체
TW202501598A (zh) 基板處理方法及基板處理裝置
JP2026069901A (ja) 基板処理方法、及び、基板処理装置
KR20260054623A (ko) 기판 처리 방법 및 기판 처리 장치
TW202532974A (zh) 判定取樣方案之方法及相關度量衡方法

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

D21 Rejection of application intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D21-EXM-PE0902 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11 Administrative time limit extension requested

Free format text: ST27 STATUS EVENT CODE: U-3-3-T10-T11-OTH-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

B15 Application refused following examination

Free format text: ST27 STATUS EVENT CODE: N-2-6-B10-B15-EXM-PE0601 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601