CN113966447A - 灯带基板及其制作方法及成品灯带 - Google Patents
灯带基板及其制作方法及成品灯带 Download PDFInfo
- Publication number
- CN113966447A CN113966447A CN202080000779.0A CN202080000779A CN113966447A CN 113966447 A CN113966447 A CN 113966447A CN 202080000779 A CN202080000779 A CN 202080000779A CN 113966447 A CN113966447 A CN 113966447A
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- circuit
- substrate
- layer
- light
- light emitting
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- 239000010410 layer Substances 0.000 claims description 196
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- 229910052802 copper Inorganic materials 0.000 claims description 18
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
- F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
- F21S4/24—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of ribbon or tape form, e.g. LED tapes
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
本申请提供一种灯带基板及其制作方法及成品灯带，涉及电路板的技术领域，通过将灯带基板分为两个部分，利用灯带基板包括：线路基板和承载基板；通过线路基板和承载基板分别制作，线路基板包括第一线路层，利用第一线路层配置成安装小尺寸发光晶片，进而能够满足小尺寸发光晶片的安装需求，同时利用造价成本较低的承载基板作为灯带基板的基础，利用承载基板对线路基板进行电性导通，在降低成本的同时，还能单独控制线路基板的精度进而保证具有第一线路层的线路基板的电性功能，从而至少能够解决现有技术中灯带基板整体制造成本高，以及电性功能差的技术问题中一个。
Description
PCT国内申请，说明书已公开。
Claims (20)
- PCT国内申请，权利要求书已公开。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2020/091351 WO2021232302A1 (zh) | 2020-05-20 | 2020-05-20 | 灯带基板及其制作方法及成品灯带 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113966447A true CN113966447A (zh) | 2022-01-21 |
Family
ID=78709046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080000779.0A Pending CN113966447A (zh) | 2020-05-20 | 2020-05-20 | 灯带基板及其制作方法及成品灯带 |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN113966447A (zh) |
| WO (1) | WO2021232302A1 (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117082725A (zh) * | 2023-10-16 | 2023-11-17 | 荣耀终端有限公司 | 柔性电路板及电子设备 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102510662A (zh) * | 2011-12-31 | 2012-06-20 | 珠海市耀宏电子科技有限公司 | 新型led无沉镀铜灯带线路板及其制备方法 |
| CN103237410A (zh) * | 2013-05-06 | 2013-08-07 | 田茂福 | 无蚀刻铝基板及制造方法 |
| CN103946995A (zh) * | 2011-11-15 | 2014-07-23 | 赤多尼科两合股份有限公司 | Led模块 |
| CN105782789A (zh) * | 2016-04-29 | 2016-07-20 | 郭垣成 | 一种fpc/cob灯带及其制作方法 |
| CN209495171U (zh) * | 2019-04-24 | 2019-10-15 | 深圳市欣上科技有限公司 | 一种具有双层线路的led软灯带 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6052848B2 (ja) * | 2011-12-20 | 2016-12-27 | 住友化学株式会社 | 液晶ポリエステル樹脂組成物および成形体 |
| CN209926075U (zh) * | 2019-07-18 | 2020-01-10 | 深圳市欣上科技有限公司 | 柔性灯带基板与柔性灯带 |
| CN110966528B (zh) * | 2019-12-09 | 2022-07-26 | 深圳市两岸光电科技有限公司 | 一种led柔性无光斑灯带 |
-
2020
- 2020-05-20 WO PCT/CN2020/091351 patent/WO2021232302A1/zh active Application Filing
- 2020-05-20 CN CN202080000779.0A patent/CN113966447A/zh active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103946995A (zh) * | 2011-11-15 | 2014-07-23 | 赤多尼科两合股份有限公司 | Led模块 |
| CN102510662A (zh) * | 2011-12-31 | 2012-06-20 | 珠海市耀宏电子科技有限公司 | 新型led无沉镀铜灯带线路板及其制备方法 |
| CN103237410A (zh) * | 2013-05-06 | 2013-08-07 | 田茂福 | 无蚀刻铝基板及制造方法 |
| CN105782789A (zh) * | 2016-04-29 | 2016-07-20 | 郭垣成 | 一种fpc/cob灯带及其制作方法 |
| CN209495171U (zh) * | 2019-04-24 | 2019-10-15 | 深圳市欣上科技有限公司 | 一种具有双层线路的led软灯带 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117082725A (zh) * | 2023-10-16 | 2023-11-17 | 荣耀终端有限公司 | 柔性电路板及电子设备 |
| CN117082725B (zh) * | 2023-10-16 | 2024-03-29 | 荣耀终端有限公司 | 柔性电路板及电子设备 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021232302A1 (zh) | 2021-11-25 |
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