CN113800263A

CN113800263A - Intelligent transferring and placing equipment for integrated chips

Info

Publication number: CN113800263A
Application number: CN202111194267.5A
Authority: CN
Inventors: 鄢美兰
Original assignee: Shenzhen Chengda Yonghe Electronics Co ltd
Current assignee: Shenzhen Dashengtang Technology Co ltd
Priority date: 2021-10-13
Filing date: 2021-10-13
Publication date: 2021-12-17
Anticipated expiration: 2041-10-13
Also published as: CN113800263B

Abstract

The invention discloses an integrated chip intelligent transfer and placement device which comprises a rack and a carrier loading mechanical arm component, wherein the carrier loading mechanical arm component is arranged on the front right side of the rack, a chip carrier mechanism, a chip carrier photographing component, a four-axis robot, a CCD camera component and an intelligent placement mechanism are sequentially arranged on the rack, the chip carrier mechanism is fixed on the right side of the rack, the chip carrier photographing component is fixed on the right side of the chip carrier mechanism, the four-axis robot is fixed on the left side of the chip carrier mechanism, the CCD camera component is fixed behind the four-axis robot, the intelligent placement mechanism is fixed on the left side of the four-axis robot, and the intelligent placement mechanism comprises a balance conveying component, a balance separating component, a top balance positioning component and a balance stacking component; the invention has high intelligent degree and high placing efficiency, is suitable for large-scale production and processing and has good market application value.

Description

Intelligent transferring and placing equipment for integrated chips

Technical Field

The invention relates to the field of chip processing machinery, in particular to an intelligent integrated chip transferring and placing device.

Background

At present, after overcoming the bottleneck technology, the research of an integrated computer needs to go through an integrated road, a superconducting system, a semiconductor integrated point system, a micro-nano photonics system, even an atom system and an ion system, and a chip road to realize commercialization and industrial upgrading; the "integrated chip" is the "brain" of future integrated computers. Along with the development of the semiconductor industry and artificial intelligence, the application of the integrated chips is also particularly important, the transferring and placing are an important part of the storage and use of the integrated chips, the intelligent degree of the existing placing machine is low, the structure is complex, and the placing efficiency is low.

Accordingly, the prior art is deficient and needs improvement.

Disclosure of Invention

In order to overcome the defects in the prior art, the invention provides intelligent integrated chip transferring and placing equipment.

The technical scheme provided by the invention comprises a rack and a carrier feeding mechanical arm assembly, wherein the carrier feeding mechanical arm assembly is arranged on the right side of the front end of the rack, a chip carrier mechanism, a chip carrier photographing assembly, a four-axis robot, a CCD camera assembly and an intelligent placing mechanism are sequentially arranged on the rack, the chip carrier mechanism is fixed on the right side of the rack, the chip carrier photographing assembly is fixed on the right side of the chip carrier mechanism, the four-axis robot is fixed on the left side of the chip carrier mechanism, the CCD camera assembly is fixed behind the four-axis robot, the intelligent placing mechanism is fixed on the left side of the four-axis robot, and the intelligent placing mechanism comprises a placing plate conveying assembly, a placing plate separating assembly, a top placing plate positioning assembly and a placing plate stacking assembly.

The chip carrier is moved to the chip carrier mechanism by the carrier loading mechanical arm component, the memory chips are clamped from the chip carrier mechanism through the chip carrier photographing component and the CCD camera component matched with the four-axis robot, and the memory chips are orderly placed in a placing disc on the intelligent placing mechanism, so that the intelligent loading and placing operation of the computer memory chips is realized.

Preferably, the carrier loading arm assembly includes a loading arm underframe, a loading arm support, a rodless cylinder sliding unit and a carrier moving unit, the loading arm support is fixed on the loading arm underframe, the rodless cylinder sliding unit is fixed on the upper front portion of the loading arm support, and the carrier moving unit is fixed in front of the rodless cylinder sliding unit.

The feeding mechanical arm underframe and the feeding mechanical arm support are used as supporting parts, chip carriers can be placed on the feeding mechanical arm underframe, the rodless cylinder sliding unit can drive the carrier moving unit to move left and right conveniently, the carrier moving unit slides up and down to clamp the moving chip carriers, and therefore intelligent feeding of the chip carriers is achieved.

Preferably, the chip carrier mechanism comprises a chip carrier conveying assembly, a carrier supporting assembly, a carrier blocking cylinder assembly, a carrier positioning assembly, a cylinder upper swinging plate assembly and a carrier stacking assembly, the chip carrier conveying assembly is fixed on the upper surface of the frame, the carrier supporting assembly is arranged on the right side of the chip carrier conveying assembly, the carrier supporting assembly is fixed on the upper surface of the frame, the carrier blocking cylinder is arranged on the left side of the carrier supporting assembly, the carrier blocking cylinder is fixed on the chip carrier conveying assembly, the carrier positioning assembly is fixed on the upper surface of the frame, the carrier positioning assembly is arranged on the left side of the carrier blocking cylinder, the cylinder upper swinging plate assembly is fixed on the bottom of the left side of the chip carrier conveying assembly, the carrier stacking assembly is arranged on the upper portion of the cylinder upper swinging plate assembly, the carrier stacking assembly is fixed on the left two sides of the chip carrier conveying assembly.

The chip carrier conveying assembly is driven by a motor to drive a synchronous belt to transmit the chip carriers from the carrier supporting assembly to the carrier positioning assembly in sequence, chip clamping is carried out by a four-axis robot, when the chip clamping operation is carried out, the carrier blocking cylinder assembly blocks the chip carriers transmitted by the chip carrier conveying assembly, the chip clamping operation is finished before the chip clamping operation is finished, the carrier blocking cylinder assembly releases the blocking operation to carry out the next chip clamping operation, the chip carriers which are clamped by the chips are transmitted to the upper swinging plate assembly and the carrier stacking assembly of the cylinder by the chip carrier conveying assembly, the carrier stacking assembly is lifted up, when the chip carriers which are clamped by the chips are transmitted to the upper swinging plate assembly of the cylinder, the upper swinging plate assembly of the cylinder is used for jacking operation, when the jacked chip carriers contact the carrier stacking assembly, the carrier stacking assembly is folded and dragged after being moved to two sides, the position of the upper swing plate assembly of the cylinder is restored after descending, the stacking operation of the chip carriers is completed, the chip carrier mechanism starts from feeding the chip carriers to stacking operation of the chip carriers which are clamped by the chip clamps, and intelligent operation is achieved.

Preferably, the chip carrier subassembly of shooing includes that the carrier shoots the support, shoots no pole cylinder, shoots sliding unit and CCD camera unit, the carrier is shot the support and is fixed in the higher authority right side of frame, it is fixed in to shoot no pole cylinder the carrier is shot the preceding upper portion of support, it set up in to shoot sliding unit below no pole cylinder, it is fixed in to shoot sliding unit the carrier is shot the preceding upper portion of support, CCD camera unit is fixed in shoot no pole cylinder with shoot sliding unit's preceding.

The photographing rodless cylinder on the photographing support is matched with the photographing sliding unit to move the CCD camera unit left and right, the CCD camera unit photographs the chip on the carrier positioning assembly and transmits the image to the image processing system, and therefore the chip can be accurately grabbed better by the four-axis robot.

Preferably, the CCD camera assembly includes a camera base plate, a camera upright plate, a negative pressure switch, a camera connecting plate, a camera clamping block, an industrial camera, a vacuum generator and a camera light source unit, the camera base plate is fixed on the upper surface of the frame, the camera upright plate is fixed on the side surface of the camera base plate, the negative pressure switch is fixed on the side surface of the camera upright plate, the camera connecting plate is fixed on the front side surface of the camera upright plate, the camera clamping block is fixed on the front side surface of the camera connecting plate, the industrial camera is connected with the camera clamping block, the vacuum generator is arranged on the side surface of the camera connecting plate, the vacuum generator is fixed on the front side surface of the camera upright plate, and the camera light source unit is fixed on the front side surface of the camera upright plate.

The CCD camera component is arranged on the frame and matched with the four-axis robot, the measurement and judgment are carried out on the machine production line instead of human eyes, a digital image shooting target is converted into an image signal and transmitted to a special image processing system, the image system carries out various operations on the signal to extract the characteristics of the target, and then the on-site equipment action is controlled according to the judgment result.

Preferably, balance staff conveying unit includes conveying support, driven wheel subassembly, first drive synchronous belt, drive wheel subassembly, second drive synchronous belt and drive motor subassembly, the conveying support is fixed in the higher authority of frame, driven wheel subassembly is connected the right side of conveying support, the right side of first drive synchronous belt is connected driven wheel subassembly, the left side of first drive synchronous belt is connected drive wheel subassembly, drive wheel subassembly is connected the left side of conveying support, drive motor subassembly is fixed in below the conveying support, connect above the second drive synchronous belt drive wheel subassembly, connect below the second drive synchronous belt drive motor subassembly.

The swing disc conveying assembly takes the conveying support as a carrier, the driven wheel assembly, the first transmission synchronous belt, the driving wheel assembly, the second transmission synchronous belt and the transmission motor assembly are arranged on the conveying support, the transmission motor assembly transmits power to the driving wheel assembly through the second transmission synchronous belt, and the driving wheel assembly drives the first transmission synchronous belt and the driven wheel assembly to move, so that the swing disc is conveyed on the swing disc conveying assembly.

Preferably, the wobble plate separating assembly comprises a separating thin cylinder, a separating cylinder supporting plate, a separating bottom plate, wobble plate tongue units, a separating baffle support and a separating rear baffle, the separating thin cylinder is fixed below the wobble plate conveying assembly, the separating cylinder supporting plate is arranged above the separating thin cylinder, the separating bottom plate is arranged above the separating cylinder supporting plate and fixed on two sides of the conveying support, the wobble plate tongue units are arranged on two sides of the conveying support respectively, the wobble plate tongue units are fixed on the separating bottom plate, the two sides of the separating bottom plate are fixed on the separating baffle support respectively, the rear ends of the separating bottom plates are provided with the separating rear baffle, and the separating rear baffle is connected with the separating baffle support.

The method comprises the following steps that an empty swinging plate is placed on a swinging plate separating assembly, a separating thin cylinder moves upwards to jack up a separating cylinder supporting plate, a swinging plate tongue unit on a separating bottom plate moves upwards along with the swinging plate, when the swinging plate tongue unit crosses a bottommost empty swinging plate, the separating thin cylinder drives the separating cylinder supporting plate to fall back downwards, the swinging plate tongue unit blocks a penultimate empty swinging plate along with falling, the bottommost empty swinging plate is placed on the separating cylinder supporting plate, and the swinging plate tongue unit is transmitted into a top swinging plate positioning assembly through a swinging plate transmission assembly; the swinging plate separating assembly repeatedly acts as above to realize intelligent emptying swinging plate operation one by one.

Preferably, the top wobble plate positioning assembly comprises a top wobble plate positioning bottom plate, a wobble plate positioning unit, a top cylinder connecting plate, a top wobble plate double-rod cylinder, a top wobble plate guide shaft, a top wobble plate shaft sleeve, a top wobble plate supporting frame, a top wobble plate supporting plate and a top wobble plate buffer, the top swing plate positioning bottom plate is fixed on the rack, the swing plate positioning unit is fixed on the right side of the top swing plate positioning bottom plate, the top cylinder connecting plate is fixed on the top of the top wobble plate positioning bottom plate, the top wobble plate double-rod cylinder is connected with the top cylinder connecting plate, the four corners of the upper surface of the top swinging plate positioning bottom plate are respectively provided with one top swinging plate guide shaft, the top swinging plate shaft sleeve penetrates through the top swinging plate guide shafts, the top swing plate shaft sleeve penetrates through and is connected with the top swing plate supporting frame, the top of the top swing plate guide shaft is connected with the top swing plate supporting plate, and a plurality of top plate buffers are arranged on the periphery of the top swing plate supporting plate.

When the empty wobble plate is conveyed to the top wobble plate positioning assembly through the wobble plate conveying assembly, the top wobble plate double-rod cylinder jacks a top wobble plate supporting plate, the empty wobble plate is jacked up to be separated from the first transmission synchronous belt, the empty wobble plate is fixed, a four-axis robot is enabled to perform placing operation, a top wobble plate guide shaft, a top wobble plate shaft sleeve and a top wobble plate supporting frame are matched with each other, the top wobble plate positioning assembly is convenient to freely lift, after the placing operation is completed, the top wobble plate double-rod cylinder drives the top wobble plate supporting plate to fall back, the wobble plate conveying assembly is replaced again, the wobble plate is conveyed continuously through the first transmission synchronous belt, and in order to protect the top wobble plate positioning assembly in the falling process, a top plate buffer is arranged below the top wobble plate supporting plate.

The swinging plate positioning bottom plate is used as a support, when the empty swinging plate is conveyed to the top swinging plate positioning assembly through the swinging plate conveying assembly, the air cylinder of the swinging plate positioning unit raises the stop block to stop the empty swinging plate conveyed from the back so as to avoid influencing the ongoing placing operation.

Preferably, the swinging plate stacking assembly comprises swinging plate stacking side plates, a swinging plate stacking bottom plate, a swinging plate stacking shaft sleeve, a swinging plate stacking guide shaft, a swinging plate stacking double-shaft cylinder, a swinging plate stacking support plate, a stacking support plate buffer, a swinging plate lifting assembly and a swinging plate stacking support frame, the swinging plate stacking side plates are fixed on two sides of the conveying support frame, the bottom plates of the swinging plate stacking side plates on two sides are connected with the swinging plate stacking bottom plate, four swinging plate stacking shaft sleeves are arranged on the swinging plate stacking bottom plate, the swinging plate stacking guide shaft penetrates through the swinging plate stacking shaft sleeves, the swinging plate stacking double-shaft cylinder is fixed on the swinging plate stacking bottom plate, the swinging plate stacking support plate is connected with the top of the swinging plate stacking guide shaft, four-corner buffers are respectively arranged on the swinging plate stacking support plate, one swinging plate lifting assembly is respectively arranged on two sides of the swinging plate stacking support plate, the lifting and swinging plate assembly is connected with the swinging plate stacking side plate, the swinging plate stacking support is arranged on two sides of the lifting and swinging plate assembly, and the swinging plate stacking support is fixed on the conveying support.

With the balance, pile up the curb plate and balance and pile up the bottom plate and be the supporter to the balance piles up the axle sleeve and balance and pile up the guide shaft and slide as the cooperation, the balance piles up biax cylinder jack-up balance and piles up the layer board, will fall into the balance and pile up the balance jack-up of layer board, and lift the balance by lifting balance subassembly, the balance piles up biax cylinder and drives balance and pile up the layer board and fall back, waits for the next balance that has carried out the chip and put the operation and conveys.

When the next balance is conveyed, the balance stacking double-shaft cylinder jacks up the balance stacking support plate to jack up the balance falling into the balance stacking support plate, when the jacking height butts against the balance lifting assembly, the balance lifting assembly is folded towards two sides, all balance plates are supported by the balance stacking support plate, the balance stacking double-shaft cylinder continues to jack up the balance stacking support plate, the balance lifting assembly supports all balance plates again, and the balance stacking double-shaft cylinder drives the balance stacking support plate to fall back to wait for the next balance to be conveyed; the swinging plate stacking assembly repeats the actions to realize intelligent stacking operation of the swinging plate.

Preferably, two sides of the swing plate stacking assembly are respectively provided with a swing plate lifting assembly, the swing plate lifting assembly comprises a swing plate lifting support, a swing plate lifting support plate, a swing plate lifting sliding unit, a swing plate lifting front and rear cylinder, a swing plate lifting insertion plate, a swing plate lifting cylinder connecting plate and a swing plate lifting double-rod cylinder, the swing plate lifting support is fixed on two sides of the swing plate stacking side plate, the swing plate lifting support plate is fixed on the swing plate lifting support, the swing plate lifting sliding unit is fixed on two sides of the swing plate lifting support plate, the swing plate lifting front and rear cylinder is fixed on the middle rear side of the swing plate lifting support plate, the swing plate lifting insertion plate is arranged on the upper portion of the swing plate lifting sliding unit, a bottom plate of the swing plate lifting insertion plate is connected with the upper portion of the swing plate lifting sliding unit, the middle rear portion of the swing plate lifting insertion plate is connected with the front of the swing plate lifting front and rear cylinder, the swing plate lifting cylinder connecting plate is fixed on the swing plate lifting insertion plate, the lifting swing plate double-rod cylinder is fixed in front of the connecting plate of the lifting swing plate cylinder, and the bottom of the lifting swing plate double-rod cylinder is connected with the lifting swing plate inserting plate.

The lifting and swinging plate assembly is supported by a lifting and swinging plate support and a lifting and swinging plate support plate, a front cylinder and a rear cylinder of the lifting and swinging plate are matched with the lifting and swinging plate sliding unit to move the lifting and swinging plate plugboard back and forth to control the lifting and swinging plate plugboard to be lifted and retracted, and a lifting and swinging plate cylinder connecting plate is matched with a lifting and swinging plate double-rod cylinder to support the lifting and swinging plate plugboard. The wobble plate stacking operation is made more efficient.

Compared with the prior art, the intelligent feeding device has the advantages that intelligent feeding is achieved through the carrier feeding mechanical arm assembly and the chip carrier mechanism, intelligent placement operation is achieved through the chip carrier photographing assembly and the CCD camera assembly which are matched with the four-axis robot, intelligent placement operation is achieved through the intelligent placement mechanism, intelligent emptying of the placing plate, fixing and positioning of the emptying placing plate and intelligent stacking operation of the placing plate with chips placed are achieved, the intelligent degree is high, placement efficiency is high, the intelligent feeding device is suitable for assembly lines and large-scale production and processing, and the market application value is good.

Drawings

Fig. 1 is a schematic view of an overall structure of an intelligent integrated chip transferring and placing device according to the present invention;

FIG. 2 is a schematic view of a carrier loading robot assembly according to the present invention;

FIG. 3 is a schematic structural diagram of a chip carrier mechanism according to the present invention;

FIG. 4 is a schematic view of a chip carrier camera assembly according to the present invention;

FIG. 5 is a schematic view of a CCD camera module according to the present invention;

FIG. 6 is a schematic structural diagram of an intelligent placement mechanism according to the present invention;

FIG. 7 is a schematic structural view of a wobble plate carrier assembly of the present invention;

FIG. 8 is a schematic structural view of a wobble plate release assembly of the present invention;

FIG. 9 is a schematic structural view of a top wobble plate positioning assembly of the present invention;

FIG. 10 is a schematic view of the wobble plate stack assembly of the present invention;

FIG. 11 is a schematic structural view of a wobble plate assembly of the present invention;

reference numerals: 1, a frame; 2. a carrier is used for loading a mechanical arm assembly; 21. a feeding mechanical arm underframe; 22. a mechanical arm support is loaded; 23. a rodless cylinder slide unit; 24. a carrier moving unit; 3. a chip carrier mechanism; 31. a chip carrier transport assembly; 32. a carrier lifting assembly; 33. a carrier block cylinder assembly; 34. a carrier positioning assembly; 35. a wobble plate assembly on the cylinder; 36. a carrier stacking assembly; 4. a chip carrier photographing component; 41. a carrier photographing bracket; 42. a rodless cylinder is used for photographing; 43. a photographing sliding unit; 44. a CCD camera unit; 5. a four-axis robot; 6. a CCD camera assembly; 61. a camera chassis; 62. a camera vertical plate; 63. a negative pressure switch; 64. a camera connection board; 65. a camera clamp block; 66. an industrial camera; 67. a vacuum generator; 68. a camera light source unit; 7. an intelligent placement mechanism; 71. a wobble plate transfer assembly; 711. a delivery carriage; 712. a driven wheel assembly; 713. a first transmission synchronous belt; 714. a drive wheel assembly; 715. a second transmission synchronous belt; 716. a drive motor assembly; 72. a wobble plate separation assembly; 721. separating the thin cylinder; 722. separating the cylinder supporting plate; 723. separating the bottom plate; 724. a wobble plate tongue unit; 725. separating the baffle bracket; 726. separating a rear baffle; 73. a top wobble plate positioning assembly; 731. a top swing plate positioning bottom plate; 732. a wobble plate positioning unit; 733. a top cylinder connecting plate; 734. a top swing plate double-rod cylinder; 735. a top swing plate guide shaft; 736. a top swing plate shaft sleeve; 737. a top swing plate support frame; 738. a top swing plate supporting plate; 739. a top tray buffer; 74. a wobble plate stack assembly; 741. side plates are stacked on the swinging plate; 742. a wobble plate stacking base plate; 743. a wobble plate stacking sleeve; 744. a balance stack guide shaft; 745. a balance stack double-shaft cylinder; 746. a balance stack pallet; 747. a stacked pallet buffer; 748. a tilt plate assembly; 7481. lifting the swing plate bracket; 7482. lifting a swing plate supporting plate; 7483. a tilt plate sliding unit; 7484. a front cylinder and a rear cylinder of the lifting and swinging plate; 7485. lifting and placing plate inserting plates; 7486. a connecting plate of a lifting and swinging plate cylinder; 7487. a double-rod cylinder of the lifting and swinging plate; 749. balance stack support.

Detailed Description

The technical features mentioned above are combined with each other to form various embodiments which are not listed above, and all of them are regarded as the scope of the present invention described in the specification; also, modifications and variations may be suggested to those skilled in the art in light of the above teachings, and it is intended to cover all such modifications and variations as fall within the true spirit and scope of the invention as defined by the appended claims.

In order to facilitate an understanding of the invention, the invention is described in more detail below with reference to the accompanying drawings and specific examples. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for descriptive purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

The present invention will be described in detail with reference to the accompanying drawings.

Example 1: as shown in fig. 1 and 6, an integrated chip intelligent transfer placing device comprises a frame 1 and a carrier feeding mechanical arm assembly 2, wherein the carrier feeding mechanical arm assembly 2 is arranged on the right side of the front end of the frame 1, a chip carrier is convenient to clamp, a chip carrier mechanism 3, a chip carrier photographing assembly 4, a four-axis robot 5, a CCD camera assembly 6 and an intelligent placing mechanism 7 are sequentially arranged on the frame 1, the chip carrier mechanism 3 is fixed on the right side of the frame 1, the chip carrier photographing assembly 4 is fixed on the right side of the chip carrier mechanism 3, the four-axis robot 5 is fixed on the left side of the chip carrier mechanism 3, the CCD camera assembly 6 is fixed on the back of the four-axis robot 5, the intelligent placing mechanism 7 is fixed on the left side of the four-axis robot 5, and the intelligent placing mechanism 7 comprises a placing plate conveying assembly 71, A wobble plate separation assembly 72, a top wobble plate positioning assembly 73, and a wobble plate stack assembly 74.

Further, a chip carrier is moved to the chip carrier mechanism 3 through the carrier loading mechanical arm component 2, the chip carrier photographing component 4 and the CCD camera component 6 are matched with the four-axis robot 5, the memory chips are clamped from the chip carrier mechanism 3 and are orderly placed in a placing disc on the intelligent placing mechanism 7, and therefore intelligent loading and placing operation of the computer memory chips is achieved.

Example 2: as shown in fig. 2, in order to realize intelligent loading of a chip carrier, a carrier loading arm assembly 2 is arranged at the front right of a frame 1, the carrier loading arm assembly 2 includes a loading arm underframe 21, a loading arm support 22, a rodless cylinder sliding unit 23 and a carrier moving unit 24, the loading arm support 22 is fixed on the loading arm underframe 21, the rodless cylinder sliding unit 23 is fixed on the upper front portion of the loading arm support 22, and the carrier moving unit 24 is fixed in front of the rodless cylinder sliding unit 23.

Further, the feeding arm underframe 21 and the feeding arm support 22 are used as supporting parts, a chip carrier can be placed on the feeding arm underframe 21, the rodless cylinder sliding unit 23 can drive the carrier moving unit 24 to move left and right conveniently, and the carrier moving unit 24 slides up and down to clamp the mobile chip carrier.

Example 3: as shown in fig. 3, in order to facilitate loading, chip positioning and clamping, and stacking of chip carriers, a chip carrier mechanism 3 is disposed on a frame 1, the chip carrier mechanism 3 includes a chip carrier conveying assembly 31, a carrier lifting assembly 32, a carrier blocking cylinder assembly 33, a carrier positioning assembly 34, a cylinder tilt-up plate assembly 35, and a carrier stacking assembly 36, the chip carrier conveying assembly 31 is fixed on the frame 1, the carrier lifting assembly 32 is disposed on the right side of the chip carrier conveying assembly 31, the carrier lifting assembly 32 is fixed on the frame 1, the carrier blocking cylinder 33 is disposed on the left side of the carrier lifting assembly 32, the carrier blocking cylinder 33 is fixed on the chip carrier conveying assembly 31, the carrier positioning assembly 34 is fixed on the frame 1, and the carrier positioning assembly 34 is disposed on the left side of the carrier blocking cylinder 33, the cylinder upper balance weight assembly 35 is fixed at the bottom of the left side of the chip carrier conveying assembly 31, the carrier stacking assembly 36 is arranged at the upper part of the cylinder upper balance weight assembly 35, and the carrier stacking assembly 36 is fixed at the two sides of the left side of the chip carrier conveying assembly 31.

Further, the chip carrier conveying assembly 31 drives the synchronous belt transmission through the motor to sequentially convey the chip carriers from the carrier supporting assembly 32 to the carrier positioning assembly 34, and then the chip is clamped by the four-axis robot 5, when the chip clamping operation is performed, the carrier blocking cylinder assembly 33 blocks the chip carriers conveyed by the chip carrier conveying assembly 31, when the previous chip clamping operation is completed, the carrier blocking cylinder assembly 33 releases the blocking, and the next chip clamping operation is performed, the chip carriers which have completed the chip clamping operation are conveyed to the cylinder upper swinging plate assembly 35 and the carrier stacking assembly 36 by the chip carrier conveying assembly 31, the carrier stacking assembly 36 is lifted firstly, when the chip clamped by the chip clamping is conveyed to the cylinder upper swinging plate assembly 35, the cylinder upper swinging plate assembly 35 performs the jacking operation, when the jacked chip carriers contact the carrier stacking assembly 36, the carrier stacking assembly 36 is folded and dragged after moving away to two sides, the position of the upper swinging plate assembly 35 on the air cylinder is restored after descending, stacking operation of the chip carriers is completed, and the chip carrier mechanism 3 performs stacking operation on the chip carriers which are clamped by the chips from feeding of the chip carriers to the completion of the chip clamping operation, so that intelligent operation is realized.

Example 4: as shown in fig. 4, in order to replace manual intervention and realize intelligent operation, a chip carrier photographing assembly 4 needs to be arranged on the rack 1, the chip carrier photographing assembly 4 includes a carrier photographing bracket 41, a photographing rodless cylinder 42, a photographing sliding unit 43 and a CCD camera unit 44, the carrier photographing bracket 41 is fixed on the right side of the upper surface of the rack 1, the photographing rodless cylinder 42 is fixed on the upper front portion of the carrier photographing bracket 41, the photographing sliding unit 43 is arranged below the photographing rodless cylinder 42, the photographing sliding unit 43 is fixed on the upper front portion of the carrier photographing bracket 41, and the CCD camera unit 44 is fixed in front of the photographing rodless cylinder 42 and the photographing sliding unit 43.

Further, the photographing rodless cylinder 42 on the photographing bracket 41 is matched with the photographing sliding unit 43 to move the CCD camera unit 44 left and right, the CCD camera unit 44 photographs the chip on the carrier positioning assembly 34 and transmits the image to the image processing system, so that the four-axis robot 5 can better and accurately grasp the chip;

example 5: as shown in fig. 5, in order to implement an intelligent operation in cooperation with a four-axis robot 5, a CCD camera assembly 6 is disposed on a frame, the CCD camera assembly 6 includes a camera base plate 61, a camera riser 62, a negative pressure switch 63, a camera connecting plate 64, a camera clamping block 65, an industrial camera 66, a vacuum generator 67 and a camera light source unit 68, the camera base plate 61 is fixed on the frame 1, the camera riser 62 is fixed on a side surface of the camera base plate 61, the negative pressure switch 63 is fixed on a side surface of the camera riser 62, the camera connecting plate 64 is fixed on a front side surface of the camera riser 62, the camera clamping block 65 is fixed on a front side surface of the camera connecting plate 64, the industrial camera 66 is connected to the camera clamping block 65, the vacuum generator 67 is disposed on a side surface of the camera connecting plate 64, and the vacuum generator 67 is fixed on a front side surface of the camera riser 62, the camera light source unit 68 is fixed on the upper front side of the camera riser 62.

Furthermore, a CCD camera assembly 6 is arranged on the machine frame 1, a four-axis robot 5 is matched, measurement and judgment are carried out on a machine production line instead of human eyes, a digital image shooting target is converted into an image signal and transmitted to a special image processing system, the image system carries out various operations on the signal to extract the characteristics of the target, and then the on-site equipment action is controlled according to the judgment result.

Example 6: as shown in fig. 7, in order to make the placing and conveying intelligent, a placing plate conveying assembly 71 is arranged on the intelligent placing mechanism 1, the wobble plate transmission assembly 71 comprises a transmission bracket 711, a driven wheel assembly 712, a first transmission synchronous belt 713, a driving wheel assembly 714, a second transmission synchronous belt 715 and a transmission motor assembly 716, the transmission bracket 711 is fixed on the upper surface of the frame 1, the driven wheel assembly 712 is connected to the right side of the transmission bracket 711, the right side of the first timing belt 713 is connected to the driven wheel assembly 712, the left side of the first timing belt 713 is connected to the drive wheel assembly 714, the driving wheel assembly 714 is coupled to the left side of the transferring bracket 711, the driving motor assembly 716 is fixed to the lower surface of the transferring bracket 711, the driving wheel assembly 714 is connected to the upper surface of the second synchronous transmission belt 715, and the driving motor assembly 716 is connected to the lower surface of the second synchronous transmission belt 715.

Further, the wobble plate transmission assembly 71 uses a transmission bracket 711 as a carrier, the driven wheel assembly 712, the first transmission synchronous belt 713, the driving wheel assembly 714, the second transmission synchronous belt 715 and the transmission motor assembly 716 are arranged on the transmission bracket 711, the transmission motor assembly 716 transmits power to the driving wheel assembly 714 through the second transmission synchronous belt 715, and the driving wheel assembly 714 drives the first transmission synchronous belt 713 and the driven wheel assembly 712 to move, so that the wobble plate is transmitted on the wobble plate transmission assembly 71.

Example 7: as shown in fig. 8, in order to make the separated wobble plate intelligent, a wobble plate separating assembly 72 is disposed on the intelligent wobble mechanism 1, the wobble plate separating assembly 72 includes a separated thin cylinder 721, a separated cylinder supporting plate 722, a separated bottom plate 723, wobble plate tongue units 724, a separated baffle bracket 725 and a separated back baffle 726, the separated thin cylinder 721 is fixed below the wobble plate conveying assembly 71, the separated cylinder supporting plate 722 is disposed on the separated thin cylinder 721, the separated bottom plate 723 is disposed on the separated cylinder supporting plate 722, the separated bottom plate 723 is fixed on both sides of the upper surface of the conveying bracket 711, two wobble plate tongue units 724 are disposed on both sides of the conveying bracket 711, the wobble plate tongue units 724 are fixed on the separated bottom plate 723, and the separated baffle brackets 725 are respectively fixed on both sides of the two separated bottom plates 723, the rear ends of the two separation bottom plates 723 are provided with the separation back plate 726, and the separation back plate 726 is connected with the two separation back plate brackets 725.

Further, an empty wobble plate is placed on the wobble plate separation assembly 72, the separation thin cylinder 721 moves upwards to jack up the separation cylinder supporting plate 722, the wobble plate tongue unit 724 on the separation bottom plate 723 moves upwards along with the wobble plate, when the wobble plate tongue unit 724 crosses the bottommost empty wobble plate, the separation thin cylinder 721 drives the separation cylinder supporting plate 722 to fall back downwards, the wobble plate tongue unit 724 blocks the penultimate empty wobble plate along with falling, the bottommost empty wobble plate is placed on the separation cylinder supporting plate 722, and the bottom empty wobble plate is transmitted to the top wobble plate positioning assembly 73 through the wobble plate transmission assembly 71; the wobble plate separation assembly 72 repeats the actions as described above to achieve intelligent emptying wobble plate operation one by one.

Example 8: as shown in fig. 9, in order to facilitate positioning and placement, a top swing plate positioning assembly 73 is disposed on the intelligent placement mechanism 1, the top swing plate positioning assembly 73 includes a top swing plate positioning bottom plate 731, a swing plate positioning unit 732, a top cylinder connecting plate 733, a top swing plate dual-rod cylinder 734, a top swing plate guide shaft 735, a top swing plate shaft sleeve 736, a top swing plate support frame 737, a top swing plate support plate 738, and a top plate buffer 739, the top swing plate positioning bottom plate 731 is fixed on the rack 1, the swing plate positioning unit 732 is fixed on the right side of the top swing plate positioning bottom plate 731, the top cylinder connecting plate 733 is fixed on the top swing plate positioning bottom plate 731, the top swing plate dual-rod cylinder 734 is connected to the top cylinder connecting plate 733, one top swing plate guide shaft 735 is disposed at each of four corners of the top swing plate positioning bottom plate 731, and the top swing plate shaft sleeve 736 passes through the top swing plate guide shaft 735, the top swing plate shaft sleeve 736 penetrates through and is connected with the top swing plate supporting frame 7337, the top of the top swing plate guide shaft 735 is connected with the top swing plate supporting plate 738, and a plurality of top plate buffers 739 are arranged around the top swing plate supporting plate 738.

Further, when the empty wobble plate is conveyed to the top wobble plate positioning assembly 73 through the wobble plate conveying assembly 71, the top wobble plate double-rod air cylinder 734 jacks up the top wobble plate supporting plate 738, the empty wobble plate is jacked up to leave the first transmission synchronous belt 713, the empty wobble plate is fixed, the four-axis robot 5 of the empty wobble plate is enabled to carry out placing operation, the top wobble plate guide shaft 735, the top wobble plate shaft sleeve 736 and the top wobble plate supporting frame 737 are matched with each other, free lifting of the top wobble plate positioning assembly 73 is facilitated, after the placing operation is completed, the top wobble plate double-rod air cylinder 734 drives the top wobble plate supporting plate 738 to fall back, the wobble plate is placed back to the wobble plate conveying assembly 71 again and is conveyed continuously through the first transmission synchronous belt 713, and in order to protect the top wobble plate positioning assembly 73 in the falling process, a top plate buffer 739 is arranged below the top wobble plate supporting plate.

Further, with the swing plate positioning bottom plate 731 as a support, when the free swing plate is transferred to the top swing plate positioning assembly 73 through the swing plate transfer assembly 71, the cylinder of the swing plate positioning unit 732 raises the stopper to block the free swing plate transferred later, so as to avoid affecting the placing operation in progress.

Example 9: as shown in fig. 10, in order to facilitate the intelligent stacking of the wobble plate on which chips are placed, a wobble plate stacking assembly 74 is disposed on the intelligent placement mechanism 1, the wobble plate stacking assembly 74 includes wobble plate stacking side plates 741, a wobble plate stacking bottom plate 742, wobble plate stacking shaft sleeves 743, a wobble plate stacking guide shaft 744, a wobble plate stacking double-shaft cylinder 745, a wobble plate stacking support plate 746, a stacking support plate buffer 747, a wobble plate lifting assembly 748 and a wobble plate stacking bracket 749, the wobble plate stacking side plates 741 are fixed on both sides of the conveying bracket 711, bottom plates of the wobble plate stacking side plates 741 on both sides are connected to the wobble plate stacking bottom plate 742, the wobble plate stacking bottom plate 742 is provided with four wobble plate stacking shaft sleeves 743 thereon, the wobble plate stacking guide shaft 744 passes through the wobble plate stacking shaft sleeves 743, the wobble plate stacking double-shaft cylinder 745 is fixed on the wobble plate stacking bottom plate 742, the wobble plate stacking support plate 746 is connected to the top of the wobble plate stacking guide shaft 744, the four corners of the wobble plate stacking support plate 746 are respectively provided with one stacking support plate buffer 747, two sides of the wobble plate stacking support plate 746 are respectively provided with one wobble plate lifting assembly 748, the wobble plate lifting assembly 748 is connected with the wobble plate stacking side plate 741, the wobble plate stacking supports 749 are arranged on two sides of the wobble plate lifting assembly 748, and the wobble plate stacking supports 749 are fixed on the conveying support 711.

Further, the wobble plate stacking side plates 741 and the wobble plate stacking bottom plate 742 are used as supporting bodies, the wobble plate stacking shaft sleeve 743 and the wobble plate stacking guide shaft 744 are used for matching to slide, the wobble plate stacking double-shaft cylinder 745 jacks up the wobble plate stacking support plate 746, a wobble plate falling into the wobble plate stacking support plate 746 is jacked up, the wobble plate is lifted up by the wobble plate lifting assembly 748, and the wobble plate stacking double-shaft cylinder 745 drives the wobble plate stacking support plate 746 to fall back to wait for the next wobble plate which is subjected to chip placement operation to be conveyed.

Further, when the next wobble plate is conveyed, the wobble plate stacking double-shaft cylinder 745 jacks up the wobble plate stacking supporting plate 746, the wobble plate falling into the wobble plate stacking supporting plate 746 is jacked up, when the jacking height butts against the wobble plate lifting assembly 748, the wobble plate lifting assembly 748 is retracted towards two sides, all the wobble plates are supported by the wobble plate stacking supporting plate 746, the wobble plate stacking double-shaft cylinder 745 continues to jack up the wobble plate stacking supporting plate 746, the wobble plate lifting assembly 748 again supports all the wobble plates, the wobble plate stacking double-shaft cylinder 745 drives the wobble plate stacking supporting plate 746 to fall back, and the next wobble plate is conveyed; the wobble plate stacking assembly 74 repeats the above actions to realize the wobble plate intelligent stacking operation.

Furthermore, as shown in fig. 11, two sides of the wobble plate stacking assembly 74 are respectively provided with a lifting wobble plate assembly 748, each lifting wobble plate assembly 748 includes a lifting wobble plate support 7481, a lifting wobble plate support plate 7482, a lifting wobble plate sliding unit 7483, a lifting wobble plate front and rear air cylinder 7484, a lifting wobble plate insertion plate 7485, a lifting wobble plate air cylinder connection plate 7486 and a lifting wobble plate double-rod air cylinder 7487, the lifting wobble plate support 7481 is fixed on two sides of the wobble plate stacking side plate 741, the lifting wobble plate support plate 7482 is fixed on the lifting wobble plate support 7481, the lifting wobble plate sliding units 7483 are fixed on two sides of the lifting wobble plate support plate 7482, the lifting wobble plate front and rear air cylinder 7484 is fixed on the middle rear side of the lifting wobble plate support plate 7482, the lifting wobble plate insertion plate 7485 is arranged on the upper portion of the lifting wobble plate sliding unit 7483, the bottom plate of the lifting wobble plate insertion plate 7485 is connected to the upper portion of the lifting wobble plate sliding unit 7483, the middle rear part of the lifting and swinging plate inserting plate 7485 is connected with the front part of a lifting and swinging plate front and rear air cylinder 7484, the lifting and swinging plate air cylinder connecting plate 7486 is fixed on the lifting and swinging plate inserting plate 7485, the lifting and swinging plate double-rod air cylinder 7487 is fixed on the front part of the lifting and swinging plate air cylinder connecting plate 7486, and the bottom part of the lifting and swinging plate double-rod air cylinder 7487 is connected with the lifting and swinging plate inserting plate 7485.

Further, the lifting and swinging plate assembly 748 takes a lifting and swinging plate support 7481 and a lifting and swinging plate support plate 7482 as supports, a lifting and swinging plate front and rear air cylinder 7484 is matched with the lifting and swinging plate sliding unit 7483 to carry out front and rear movement operation on the lifting and swinging plate plug plate 7485 so as to control the lifting and swinging plate plug plate 7485 to be lifted and retracted, and a lifting and swinging plate air cylinder connecting plate 7486 is matched with the lifting and swinging plate double-rod air cylinder 7487 to support the lifting and swinging plate plug plate 7485. The wobble plate stacking operation is made more efficient.

Example 10: as shown in fig. 1, different from the above embodiment, in order to improve the placing efficiency, a second four-axis mechanical arm is arranged on the left side of the rack, and is fixed on the left side of the CCD camera component, so as to realize the double-station placing operation, and the chip carrier photographing component 4 and the CCD camera component cooperate with the second four-axis mechanical arm to clamp the chip on the chip carrier mechanism, and place the chip on the empty placing plate of the intelligent placing mechanism for orderly placing.

Further, four-axis arm and the operation of second four-axis arm simultaneously, when chip carrier subassembly and the CCD camera subassembly operating pressure of shooing was too big, can set up second CCD camera subassembly in the left side of frame, be fixed in the left side that intelligence put the mechanism, make it provide more accurate clamp for the four-axis arm and get the cooperation.

The working principle of the invention is as follows: the rodless cylinder sliding unit 23 is matched with the carrier moving unit 24 to move the chip carrier to the chip carrier mechanism 3, the chip carrier is supported by the carrier supporting assembly 32, the chip carrier is conveyed by the chip carrier conveying assembly 31, after the chip carrier reaches the carrier positioning assembly 34, the stop block of the carrier blocking cylinder assembly 33 is lifted, the chip carrier photographing assembly 4 and the CCD camera assembly 6 are matched with the four-axis robot 5 to carry out clamping operation, after the clamping operation is finished, the empty chip carrier is stacked by the carrier stacking assembly 36, the four-axis robot 5 orderly places the clamped chips in an empty wobble plate on the top wobble plate positioning assembly 73 of the intelligent swinging mechanism 7, the empty wobble plate is matched and separated by the separating thin cylinder 721 of the wobble plate separating assembly 72 and the wobble plate tongue unit 724, then the wobble plate conveying assembly 71 conveys the empty wobble plate to the top wobble plate positioning assembly 72, the four-axis robot 5 orderly places the chips, after the placing operation is finished, the placing plate conveying assembly 71 continuously conveys the placing plate stacking assembly 74, the placing plate stacking double-shaft air cylinder 745 jacks the placing plate stacking supporting plate 746, a placing plate falling into the placing plate stacking supporting plate 746 is jacked, when the jacking height butts against the placing plate lifting assembly 748, the placing plate lifting assembly 748 is retracted towards two sides, all placing plates are supported by the placing plate stacking supporting plate 746, the placing plate stacking double-shaft air cylinder 745 continuously jacks the placing plate stacking supporting plate 746, the placing plate lifting assembly 748 again supports all placing plates, the placing plate stacking double-shaft air cylinder 745 drives the placing plate stacking supporting plate 746 to fall back, and the next placing plate is waited to be conveyed; the swinging plate stacking assembly 74 repeats the actions to realize intelligent stacking operation of the swinging plate, and intelligent equipment finishing from intelligent feeding to intelligent placing and intelligent stacking operation.

Claims

1. An intelligent integrated chip transferring and placing device is characterized by comprising a frame and a carrier feeding mechanical arm component, the carrier loading mechanical arm assembly is arranged on the front right side of the frame, a chip carrier mechanism, a chip carrier photographing assembly, a four-axis robot, a CCD camera assembly and an intelligent placing mechanism are sequentially arranged on the frame, the chip carrier mechanism is fixed on the right side of the frame, the chip carrier photographing component is fixed on the right side of the chip carrier mechanism, the four-axis robot is fixed on the left side of the chip carrier mechanism, the CCD camera component is fixed on the back of the four-axis robot, the intelligent placing mechanism is fixed on the left side of the four-axis robot and comprises a placing plate conveying assembly, a placing plate separating assembly, a top placing plate positioning assembly and a placing plate stacking assembly.

2. The intelligent transferring and placing equipment for integrated chips as claimed in claim 1, wherein the carrier loading arm assembly comprises a loading arm underframe, a loading arm support, a rodless cylinder sliding unit and a carrier moving unit, the loading arm support is fixed on the loading arm underframe, the rodless cylinder sliding unit is fixed on the upper front part of the loading arm support, and the carrier moving unit is fixed in front of the rodless cylinder sliding unit.

3. The intelligent integrated chip transferring and placing device of claim 1, wherein the chip carrier mechanism comprises a chip carrier conveying assembly, a carrier holding assembly, a carrier blocking cylinder assembly, a carrier positioning assembly, a swinging plate assembly on a cylinder and a carrier stacking assembly, the chip carrier conveying assembly is fixed on the upper surface of the frame, the carrier holding assembly is arranged on the right side of the chip carrier conveying assembly, the carrier holding assembly is fixed on the upper surface of the frame, the carrier blocking cylinder is arranged on the left side of the carrier holding assembly, the carrier blocking cylinder is fixed on the chip carrier conveying assembly, the carrier positioning assembly is fixed on the upper surface of the frame, the carrier positioning assembly is arranged on the left side of the carrier blocking cylinder, the swinging plate assembly on the cylinder is fixed on the bottom of the left side of the chip carrier conveying assembly, the carrier stacking assembly is arranged on the upper portion of the swinging plate assembly on the air cylinder, and the carrier stacking assembly is fixed on the left two sides of the chip carrier conveying assembly.

4. The integrated chip intelligent transferring and placing device of claim 1, wherein the chip carrier photographing assembly comprises a carrier photographing bracket, a photographing rodless cylinder, a photographing sliding unit and a CCD camera unit, the carrier photographing bracket is fixed on the right side of the upper surface of the frame, the photographing rodless cylinder is fixed on the upper front portion of the carrier photographing bracket, the photographing sliding unit is arranged below the photographing rodless cylinder, the photographing sliding unit is fixed on the upper front portion of the carrier photographing bracket, and the CCD camera unit is fixed on the front of the photographing rodless cylinder and the photographing sliding unit.

5. The intelligent transferring and placing equipment for integrated chips as claimed in claim 1, the CCD camera component comprises a camera bottom plate, a camera vertical plate, a negative pressure switch, a camera connecting plate, a camera clamping block, an industrial camera, a vacuum generator and a camera light source unit, the camera bottom plate is fixed on the machine frame, the camera vertical plate is fixed on the side surface of the camera bottom plate, the negative pressure switch is fixed on the side surface of the camera vertical plate, the camera connecting plate is fixed on the front side surface of the camera vertical plate, the camera clamping block is fixed on the front side surface of the camera connecting plate, the industrial camera is connected with the camera clamping block, the vacuum generator is arranged on the side face of the camera connecting plate, the vacuum generator is fixed on the front side face of the camera vertical plate, and the camera light source unit is fixed on the upper face of the front side of the camera vertical plate.

6. The intelligent integrated chip transferring and placing device as claimed in claim 1, wherein the swinging tray conveying assembly comprises a conveying bracket, a driven wheel assembly, a first synchronous transmission belt, a driving wheel assembly, a second synchronous transmission belt and a driving motor assembly, the conveying bracket is fixed on the upper surface of the frame, the driven wheel assembly is connected to the right side of the conveying bracket, the right side of the first synchronous transmission belt is connected to the driven wheel assembly, the left side of the first synchronous transmission belt is connected to the driving wheel assembly, the driving wheel assembly is connected to the left side of the conveying bracket, the driving motor assembly is fixed on the lower surface of the conveying bracket, the upper surface of the second synchronous transmission belt is connected to the driving wheel assembly, and the lower surface of the second synchronous transmission belt is connected to the driving motor assembly.

7. The intelligent integrated chip transferring and placing equipment of claim 6, wherein the swinging plate separating assembly comprises a separating thin cylinder, a separating cylinder supporting plate, a separating bottom plate, swinging plate tongue units, a separating baffle bracket and a separating rear baffle, the separating thin cylinder is fixed below the swinging plate conveying assembly, the separating cylinder supporting plate is arranged above the separating thin cylinder, the separating bottom plate is arranged above the separating cylinder supporting plate and fixed on two sides of the conveying bracket, two swinging plate tongue units are respectively arranged on two sides of the conveying bracket, the swinging plate tongue units are fixed on the separating bottom plate, the separating baffle bracket is respectively fixed on two sides of the two separating bottom plates, the separating rear baffle is arranged at the rear end of the two separating bottom plates, the separation back baffle is connected with the two separation baffle brackets.

8. The intelligent integrated chip transferring and placing equipment according to claim 1, wherein the top wobble plate positioning assembly comprises a top wobble plate positioning bottom plate, a wobble plate positioning unit, a top cylinder connecting plate, a top wobble plate double-rod cylinder, a top wobble plate guide shaft, a top wobble plate shaft sleeve, a top wobble plate support frame, a top wobble plate support plate and a top wobble plate buffer, the top wobble plate positioning bottom plate is fixed on the upper surface of the frame, the wobble plate positioning unit is fixed on the right side of the top wobble plate positioning bottom plate, the top cylinder connecting plate is fixed on the upper surface of the top wobble plate positioning bottom plate, the top wobble plate double-rod cylinder is connected with the top cylinder connecting plate, four corners of the upper surface of the top wobble plate positioning bottom plate are respectively provided with one top wobble plate guide shaft, the top wobble plate shaft sleeve penetrates through the top wobble plate guide shaft, the top wobble plate shaft sleeve penetrates through and is connected with the top wobble plate support frame, the top of the top swing plate guide shaft is connected with the top swing plate supporting plate, and a plurality of top plate buffers are arranged around the top swing plate supporting plate.

9. The intelligent transferring and placing equipment for the integrated chips according to claim 6, wherein the swinging plate stacking assembly comprises swinging plate stacking side plates, a swinging plate stacking bottom plate, a swinging plate stacking shaft sleeve, a swinging plate stacking guide shaft, a swinging plate stacking double-shaft cylinder, a swinging plate stacking support plate, a stacking support plate buffer, a swinging plate lifting assembly and a swinging plate stacking support frame, the swinging plate stacking side plates are fixed on two sides of the conveying support frame, the bottom plates of the swinging plate stacking side plates on two sides are connected with the swinging plate stacking bottom plate, four swinging plate stacking shaft sleeves are arranged on the swinging plate stacking bottom plate, the swinging plate stacking guide shaft passes through the swinging plate stacking shaft sleeve, the swinging plate stacking double-shaft cylinder is fixed on the swinging plate stacking bottom plate, the swinging plate stacking support plate is connected with the top of the swinging plate stacking guide shaft, and one stacking support plate buffer is respectively arranged at each of four corners of the swinging plate stacking support plate, the two sides of the swinging plate stacking supporting plate are respectively provided with one swinging plate lifting assembly, the swinging plate lifting assembly is connected with the swinging plate stacking side plate, the swinging plate stacking supports are arranged on the two sides of the swinging plate lifting assembly, and the swinging plate stacking supports are fixed on the conveying support.

10. The intelligent integrated chip transferring and placing equipment according to claim 9, wherein the lifting and swinging plate assembly comprises a lifting and swinging plate bracket, a lifting and swinging plate support plate, a lifting and swinging plate sliding unit, a lifting and swinging plate front and rear cylinder, a lifting and swinging plate insertion plate, a lifting and swinging plate cylinder connection plate and a lifting and swinging plate double-rod cylinder, the lifting and swinging plate bracket is fixed on two sides of the swinging plate stacking side plate, the lifting and swinging plate support plate is fixed on the lifting and swinging plate bracket, the lifting and swinging plate sliding unit is fixed on two sides of the lifting and swinging plate support plate, the lifting and swinging plate front and rear cylinder is fixed on the middle rear side of the lifting and swinging plate support plate, the lifting and swinging plate insertion plate is arranged on the upper portion of the lifting and swinging plate sliding unit, the bottom plate of the lifting and swinging plate insertion plate is connected with the upper portion of the lifting and swinging plate sliding unit, and the middle rear portion of the lifting and swinging plate insertion plate is connected with the front of the lifting and swinging plate front cylinder, the lifting swing plate cylinder connecting plate is fixed on the lifting swing plate inserting plate, the lifting swing plate double-rod cylinder is fixed in the front of the lifting swing plate cylinder connecting plate, and the bottom of the lifting swing plate double-rod cylinder is connected with the lifting swing plate inserting plate.