CN113793823B - 一种双模式的固晶机自动上料机构 - Google Patents
一种双模式的固晶机自动上料机构 Download PDFInfo
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- CN113793823B CN113793823B CN202111038605.6A CN202111038605A CN113793823B CN 113793823 B CN113793823 B CN 113793823B CN 202111038605 A CN202111038605 A CN 202111038605A CN 113793823 B CN113793823 B CN 113793823B
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- 230000007246 mechanism Effects 0.000 title claims abstract description 254
- 239000000463 material Substances 0.000 claims abstract description 338
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 230000001360 synchronised effect Effects 0.000 claims description 45
- 210000000078 claw Anatomy 0.000 claims description 35
- 238000001514 detection method Methods 0.000 claims description 19
- 238000003475 lamination Methods 0.000 claims description 12
- 238000010030 laminating Methods 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 10
- 238000000926 separation method Methods 0.000 claims description 9
- 230000003028 elevating effect Effects 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 2
- 230000009977 dual effect Effects 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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CN202111038605.6A CN113793823B (zh) | 2021-09-06 | 2021-09-06 | 一种双模式的固晶机自动上料机构 |
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CN202111038605.6A CN113793823B (zh) | 2021-09-06 | 2021-09-06 | 一种双模式的固晶机自动上料机构 |
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CN113793823A CN113793823A (zh) | 2021-12-14 |
CN113793823B true CN113793823B (zh) | 2022-11-29 |
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CN202111038605.6A Active CN113793823B (zh) | 2021-09-06 | 2021-09-06 | 一种双模式的固晶机自动上料机构 |
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Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115458457B (zh) * | 2022-10-18 | 2023-08-01 | 上海赢朔电子科技股份有限公司 | 一种高速高精共晶贴片机 |
CN115621180B (zh) * | 2022-12-20 | 2023-03-17 | 常州铭赛机器人科技股份有限公司 | 引线框架上料装置及其上料方法 |
CN116417390B (zh) * | 2023-06-09 | 2023-08-15 | 沈阳和研科技股份有限公司 | 一种适用于全自动晶圆上料机的上料方法 |
CN117509168B (zh) * | 2023-12-18 | 2024-04-23 | 江苏富乐华半导体科技股份有限公司 | 一种dcb陶瓷基板自动上料设备 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102820248A (zh) * | 2012-08-15 | 2012-12-12 | 先进光电器材(深圳)有限公司 | 固晶机进料系统 |
CN203345703U (zh) * | 2013-06-30 | 2013-12-18 | 东莞市凯格精密机械有限公司 | 贴片式led固晶机的二合一上料装置 |
CN108899298A (zh) * | 2018-07-05 | 2018-11-27 | 上海世禹精密机械有限公司 | 半导体基板加载载具的上料机 |
CN110815684A (zh) * | 2019-10-08 | 2020-02-21 | 佛山市基米智能科技有限公司 | 自动热压成型设备 |
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2021
- 2021-09-06 CN CN202111038605.6A patent/CN113793823B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102820248A (zh) * | 2012-08-15 | 2012-12-12 | 先进光电器材(深圳)有限公司 | 固晶机进料系统 |
CN203345703U (zh) * | 2013-06-30 | 2013-12-18 | 东莞市凯格精密机械有限公司 | 贴片式led固晶机的二合一上料装置 |
CN108899298A (zh) * | 2018-07-05 | 2018-11-27 | 上海世禹精密机械有限公司 | 半导体基板加载载具的上料机 |
CN110815684A (zh) * | 2019-10-08 | 2020-02-21 | 佛山市基米智能科技有限公司 | 自动热压成型设备 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A dual-mode automatic feeding mechanism of solid crystal machine Effective date of registration: 20230220 Granted publication date: 20221129 Pledgee: Industrial Bank Co.,Ltd. Shanghai Changning sub branch Pledgor: SHANGHAI YINGSHUO ELECTRONIC TECHNOLOGY CO.,LTD. Registration number: Y2023310000035 |
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Granted publication date: 20221129 Pledgee: Industrial Bank Co.,Ltd. Shanghai Changning sub branch Pledgor: SHANGHAI YINGSHUO ELECTRONIC TECHNOLOGY CO.,LTD. Registration number: Y2023310000035 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A dual mode automatic feeding mechanism for solid crystal machines Granted publication date: 20221129 Pledgee: Industrial Bank Co.,Ltd. Shanghai Changning sub branch Pledgor: SHANGHAI YINGSHUO ELECTRONIC TECHNOLOGY CO.,LTD. Registration number: Y2024310000137 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |