CN1137797C - 用于减少焊料中金属间化合物形成的镍合金薄膜 - Google Patents

用于减少焊料中金属间化合物形成的镍合金薄膜 Download PDF

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CN1137797C
CN1137797C CNB001217879A CN00121787A CN1137797C CN 1137797 C CN1137797 C CN 1137797C CN B001217879 A CNB001217879 A CN B001217879A CN 00121787 A CN00121787 A CN 00121787A CN 1137797 C CN1137797 C CN 1137797C
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layer
alloy
nickel
scolder
pad
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CN1282645A (zh
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皮德罗・阿门高・查尔科
皮德罗·阿门高·查尔科
・大卫・布莱克薛尔
埃德蒙·大卫·布莱克薛尔
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Tessera Inc
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Abstract

一种形成焊盘上的焊点的方法，可大大降低因镍和焊料接触而形成的金属间化合物层的厚度，提高焊点的可靠性。其包括下列步骤：在焊盘上提供镍的第一层；提供覆盖第一层的贵金属的第二(优选为金)层；对第一层和第二层退火，由此在第一层和第二层之间形成包含镍和贵金属的合金层；并使第二层与包含锡的熔融焊料接触，使贵金属溶入焊料，然后使焊料浸润合金层，以在合金层和焊料之间形成包含镍、贵金属和锡的金属间化合物层。

Description

用于减少焊料中金属间化合物形成的镍合金薄膜
本发明涉及用来减少在半导体器件电子封装的电连接中采用的焊点中的金属间化合物形成的方法。
在电子封装中普遍存在着因焊点与通常用来覆盖与焊料粘接的焊盘的镍合金形成金属间化合物而导致的问题。金属间化合物是脆性材料，是微裂纹萌生源，并成为裂纹扩展以导致焊料互连早期破坏的扩展路径。这一点严重阻碍了新生的BGA(球栅阵列)和CSP(芯片级封装)技术的发展，这两项技术对于半导体工业的持续发展是极其关键的。因此，减少焊点中的金属间化合物的形成成为大量研究开发的目标。现有的抑制金属间化合物生长的方法是限制焊点的热暴露程度。由于主动的热暴露如焊料重流工艺是不可避免的，所以上述限制常常是很不够的。
在通常的焊点中，焊料将两个焊盘浸润以形成互连。焊盘通常是芯片或印刷电路板的电路构图中的I/O位置。芯片中的线路是铝，而对于印刷电路板是铜。现在的新的芯片金属化工艺是用铜置换铝。焊料浸润层必须覆盖焊盘表面。在熔化时，焊料与该层结合形成强的键合，这对于获得高可靠性是必需的。由于焊料与铝不结合，而铜易于氧化，焊盘需要确保可靠焊料键合的焊料浸润层。只有有限的金属具有可靠和持久的焊料浸润性。在电子工业中最常用的金属，是覆盖有一薄层金的镍。不能采用覆盖金的铜，因为铜易于扩散穿过金而形成氧化层。因此，常规的铜焊盘，如图1A所示，在衬底1上具有覆盖铜焊盘10的镍层11，且具有覆盖镍的金层12。
镍易于与锡形成金属间化合物。电子工业中常用的焊料都包含锡。在重流工艺中焊料熔化以形成连接或焊点(如图1B所示)时，用于保护的金会几乎瞬时溶入熔化的焊料中，有时把金称作“牺牲贵金属”。钯和铂也可用作该保护膜。金溶解后，焊料15与镍层11直接接触，在一短时间的成核和长大后，开始形成镍/锡金属间化合物层14。已经发现，形成薄的金属间化合物层(优选厚度小于1微米)对获得强的焊料键合是必需的。但是，厚度继续增加会导致焊点可靠性下降，尤其是采用的焊料体积相当小时，如在倒装片和BGA应用中。
金属间化合物的生长需要镍原子的通过金属间化合物层与锡原子相遇并反应以生成金属间化合物的活动能力强。随着金属间化合物层厚度增加，由于原子必须扩散通过的路径变长，其生长速度与时间呈抛物线下降。但是，这种生长速度的下降在金属间化合物相当厚时(几个微米)才发生。
限制金属间化合物层增加的常规方法是限制焊点热暴露的程度。这一点在许多应用中是不实际的，因为焊料必须经过多次重流工艺和芯片散热导致的热循环。
而且，本发明人已发现，用纯金属与焊料接触不能提供减少金属间化合物形成的有效环境。已知金属间化合物的形成和生长是被形成金属间化合物的镍原子的扩散制约的。众所周知，纯镍是良好的焊料浸润材料，在与焊料接触时可形成相当厚的金属间化合物层。如上所述，形成的金属间化合物层的厚度最好小于1微米。因此，为了仅形成薄的金属间化合物层，最好形成有效的镍原子扩散阻挡层以减慢金属间化合物的生长。
本发明的提出正是为了满足上述在焊盘上形成焊点时对减薄的金属间化合物层的需要。
根据本发明，提供一种形成焊盘上的焊点的方法。其可大大减小因镍与焊料接触而形成的金属间化合物层的厚度。该方法包括下列步骤：在焊盘上提供镍的第一层；提供覆盖第一层的贵金属的第二(优选为金)层；以及对第一层和第二层退火，由此在第一层和第二层之间形成包含镍和贵金属的合金层。然后使第二层与熔融焊料(包含锡)接触，使贵金属溶入焊料，然后使焊料浸润合金层，以在合金层和焊料之间形成包含镍、贵金属和锡的金属间化合物层。
该方法具有许多重要的优点。最主要的是，它显著降低形成金属间化合物的速度，由此提高焊点的机械可靠性。该方法还消除了现有的对焊料重流工艺中的热暴露施加的限制。
根据本发明的另一方面，提供一种形成焊盘上的焊点的方法，其中包括下列步骤：在焊盘上淀积合金层，该合金包含镍和从包括金、钯和铂的组中选择的合金元素；在合金层上淀积金层以在焊盘上形成镍合金/金结构；以及使镍合金/金结构与熔融焊料(包含锡)接触，使金溶入焊料，然后焊料浸润合金层，以在合金层和焊料之间形成包含镍、金和锡的金属间化合物层。该镍合金层和金层可通过电镀法形成。
根据本发明的又一方面，提供一种焊点结构，其中焊料含有锡。该焊点结构包括：在焊盘上淀积的镍层；以及覆盖镍层的合金层。该合金层包含从镍和从包括金、钯和铂的组中选择的合金元素。该焊点结构还包括在焊料和合金层之间的金属间化合物层，该金属间化合物层包含镍、合金元素和锡，且是通过焊料浸润合金而形成。该合金层可通过对镍层和合金元素层退火而获得。
根据本发明的再一方面，提供一种焊点结构，其中包括：在焊盘上淀积的合金层；以及在焊料和合金层之间的金属间化合物层。该合金层可通过电镀形成在焊盘上。该合金包含镍和从包括金、钯和铂的组中选择的合金元素，该金属间化合物层包含镍、合金元素和锡，且是通过焊料浸润合金层而形成。
图1A是具有常规Cu-Ni-Au结构的焊盘的示意图；
图1B示出图1A的焊盘在焊料重流工艺后形成了焊点，并示意表示了厚的金属间化合物层的形成；
图2A示出根据本发明优选实施方案的焊盘结构，具有镍层、退火形成的镍合金层以及覆盖铜的金；
图2B示意示出采用图2A的结构时的焊料重流工艺中，导致形成金属间化合物薄层的反应阻挡层效果；
图3A示出根据本发明的另一方案的焊盘结构，具有镍合金层和用电镀在铜盘上形成的金层；
图3B示出采用图3A的结构时在焊料重流工艺中金属间化合物薄层的形成。
本发明人的研究表明，焊接之前对Cu-Ni-Au合金体进行退火(或时效，或热处理)可显著减小金属间化合物的形成速度，以致于在焊料滴浸10秒钟后在放大1000倍的情况下几乎观察不到。这表明在时效过程中镍-金合金的形成速度取决于温度与时间。
图2A示出本发明的优选实施方案。在退火以前，其焊盘结构与图1A的相同，即在铜焊盘10的上面，金层12覆盖镍层11。退火工艺造成金和镍的互扩散，导致在金层22和镍层23之间形成有梯度的Ni-Au合金层23。合金层的厚度小于Ni层和Au层的原始厚度和。应当指出，退火后薄的金层22仍保留在结构的最上方，该层用来保护合金层。
发现在125℃下退火3周可形成图2A所示的合金层。而且，基于已知的扩散特性，可以认为下列退火条件的组合是等效的：
125℃                     3周
225℃                     2天
275℃                     16小时
325℃                     5小时
375℃                     2小时
因此，用375℃×2小时的退火工艺也可得到图2A所示的结构。
在焊料重流工艺中，金层22溶入焊料25，从而使焊料浸润镍合金层23。之后的瞬间，镍合金与焊料反应生成薄的金属间化合物层24，其成分包括镍、锡和金(见图2B)。金属间化合物层的继续生长需要镍扩散穿过金属间化合物层。由于金属间化合物层中合金元素(如金)的存在，这是很困难的。由此该金属间化合物层成为反应阻挡层，结果使金属间化合物生长速度下降。金属间化合物层24的厚度小于1微米，如上所述，这对于获得强的焊料键合是优选的。
作为替代方案，镍合金/金结构可通过在铜焊盘上电镀而获得(见图3A)。用常规方法在铜盘10上电镀镍合金层31。在电镀之前，准备焊盘，用清洗液清洗以确保与电镀层的良好结合。接着，用常规电镀液电镀镍合金层31，然后电镀金层32以保护镍合金层31的表面。层31中采用的合金优选为镍-金合金。由于金的原子大小与镍的接近，其混合物形成具有均匀面心立方晶体结构的固溶体。其它的可用的合金包括镍-钯合金和镍-铂合金。优选的合金成分包含1～50原子％的合金元素。也可采用由镍和另两种元素的二元合金，上述的两种元素可以是金、钯或铂。作为焊料重流工艺的结果，该结构形成薄的金属间化合物层，如图3B所示。薄的金层32溶在焊料35中，然后焊料浸润合金层31，结果导致在焊料和合金层之间形成金属间化合物层34。
虽然上面结合特定实施方案对本发明作了描述，很显然基于上述描述，本领域技术人员可做出种种替换、改进和变更。因此，本发明意在涵盖所有不超出本发明范围和精神和后述权利要求书的替换、改进和变更。

Claims (16)

1.一种形成焊盘上的焊点的方法，包括下列步骤：
在焊盘上提供镍的第一层；
提供覆盖第一层的贵金属的第二层；
对第一层和第二层退火，由此在第一层和第二层之间形成包含镍和贵金属的合金层；以及
使第二层与包含锡的熔融焊料接触，使贵金属溶入焊料，然后使焊料浸润合金层，以在合金层和焊料之间形成包含镍、贵金属和锡的金属间化合物层。
2.如权利要求1所述的方法，其中：所述贵金属从包括金、钯和铂的组中选择。
3.如权利要求1所述的方法，其中在不高于375℃的温度下执行所述退火步骤。
4.如权利要求1所述的方法，其中所述接触步骤包括焊料重流工艺。
5.一种形成焊盘上的焊点的方法，包括下列步骤：
在焊盘上淀积合金层，该合金包含镍和从包括金、钯和铂的组中选择的合金元素；
在合金层上淀积金层以在焊盘上形成镍合金/金结构；以及
使镍合金/金结构与包含锡的熔融焊料接触，使金溶入焊料，然后焊料浸润合金层，以在合金层和焊料之间形成包含镍、金和锡的金属间化合物层。
6.如权利要求5所述的方法，其中用电镀工艺淀积所述合金层。
7.如权利要求5所述的方法，其中所述合金是包含镍和从包括金、钯和铂的组中选出的两种元素的三元合金。
8.如权利要求5所述的方法，其中所述合金元素占所述合金的1～50原子％。
9.一种把含锡的焊料与焊盘连接起来的焊点结构，包括：
在焊盘上淀积的镍层；
覆盖镍层的合金层，该合金层包含从镍和从包括金、钯和铂的组中选择的合金元素；以及
焊料和合金层之间的金属间化合物层，该金属间化合物层包含镍、合金元素和锡，且是通过焊料浸润合金而形成。
10.如权利要求9所述的焊点结构，其中所述合金层通过对与合金元素层接触的镍层退火而形成。
11.如权利要求10所述的焊点结构，其中所述退火在不高于375℃的温度下进行。
12.如权利要求9所述的焊点结构，其中在焊料重流工艺中所述合金层被焊料浸润。
13.一种把含锡的焊料与焊盘连接起来的焊点结构，包括：
在焊盘上淀积的合金层，该合金包含镍和从包括金、钯和铂的组中选择的合金元素；以及
焊料和合金层之间的金属间化合物层，该金属间化合物层包含镍、合金元素和锡，且是通过焊料浸润合金层而形成。
14.如权利要求13所述的焊点结构，其中通过电镀在所述焊盘上淀积所述合金层。
15.如权利要求13所述的焊点结构，其中所述合金是包含镍和从包括金、钯和铂的组中选出的两种合金元素的三元合金。
16.如权利要求13所述的焊点结构，其中所述合金元素占所述合金的1～50原子％。
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SG91877A1 (en) 2002-10-15
TW461067B (en) 2001-10-21

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