CN113767149B - 低介电树脂组合物、成形品、薄膜、层叠薄膜、以及挠性印刷电路板 - Google Patents

低介电树脂组合物、成形品、薄膜、层叠薄膜、以及挠性印刷电路板 Download PDF

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CN113767149B
CN113767149B CN202080030452.8A CN202080030452A CN113767149B CN 113767149 B CN113767149 B CN 113767149B CN 202080030452 A CN202080030452 A CN 202080030452A CN 113767149 B CN113767149 B CN 113767149B
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resin composition
low dielectric
liquid crystal
dielectric resin
crystal polymer
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CN113767149A (zh
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今村雄一
大熊敬介
木户雅善
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Kaneka Corp
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Kaneka Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F255/00—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00
    • C08F255/08—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00 on to polymers of olefins having four or more carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00—Liquid crystal materials
    • C09K19/02—Liquid crystal materials characterised by optical, electrical or physical properties of the components, in general
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00—Liquid crystal materials
    • C09K19/04—Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
    • C09K19/38—Polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00—Liquid crystal materials
    • C09K19/52—Liquid crystal materials characterised by components which are not liquid crystals, e.g. additives with special physical aspect: solvents, solid particles
    • C09K19/54—Additives having no specific mesophase characterised by their chemical composition
    • C09K19/542—Macromolecular compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F255/00—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00
    • C08F255/02—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00 on to polymers of olefins having two or three carbon atoms
    • C08F255/023—On to modified polymers, e.g. chlorinated polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/003—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2219/00—Aspects relating to the form of the liquid crystal [LC] material, or by the technical area in which LC material are used
    • C09K2219/03—Aspects relating to the form of the liquid crystal [LC] material, or by the technical area in which LC material are used in the form of films, e.g. films after polymerisation of LC precursor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Graft Or Block Polymers (AREA)
CN202080030452.8A 2019-04-26 2020-04-23 低介电树脂组合物、成形品、薄膜、层叠薄膜、以及挠性印刷电路板 Active CN113767149B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019086110 2019-04-26
JP2019-086110 2019-04-26
PCT/JP2020/017463 WO2020218405A1 (ja) 2019-04-26 2020-04-23 低誘電樹脂組成物、成形品、フィルム、積層フィルム、及びフレキシブルプリント配線板

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CN113767149A CN113767149A (zh) 2021-12-07
CN113767149B true CN113767149B (zh) 2025-02-11

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US (1) US11993740B2 (https=)
JP (1) JP7436467B2 (https=)
CN (1) CN113767149B (https=)
TW (1) TWI862585B (https=)
WO (1) WO2020218405A1 (https=)

Families Citing this family (13)

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Publication number Priority date Publication date Assignee Title
CN113767149B (zh) * 2019-04-26 2025-02-11 株式会社钟化 低介电树脂组合物、成形品、薄膜、层叠薄膜、以及挠性印刷电路板
JP7839105B2 (ja) * 2020-11-24 2026-04-01 富士フイルム株式会社 液晶ポリマーフィルム、ポリマーフィルム、及び、積層体
WO2022113963A1 (ja) * 2020-11-24 2022-06-02 富士フイルム株式会社 ポリマーフィルム、及び、積層体
CN116568753A (zh) * 2020-11-24 2023-08-08 富士胶片株式会社 液晶聚合物膜、聚合物膜及层叠体
JPWO2022202790A1 (https=) * 2021-03-22 2022-09-29
WO2022202789A1 (ja) * 2021-03-22 2022-09-29 富士フイルム株式会社 ポリマーフィルム及び積層体
JP7682671B2 (ja) * 2021-03-30 2025-05-26 住友化学株式会社 非水電解液二次電池用セパレータ、非水電解液二次電池用部材および非水電解液二次電池
JP2022184736A (ja) * 2021-05-31 2022-12-13 富士フイルム株式会社 配線基板及び配線基板の製造方法
TW202249544A (zh) * 2021-05-31 2022-12-16 日商富士軟片股份有限公司 配線基板及配線基板之製造方法
JP7797143B2 (ja) * 2021-08-31 2026-01-13 富士フイルム株式会社 フィルム及びその製造方法、積層フィルム、並びに、積層体
JP7839672B2 (ja) * 2022-03-25 2026-04-02 株式会社カネカ 液状ポリオレフィン組成物
WO2023233877A1 (ja) * 2022-05-30 2023-12-07 富士フイルム株式会社 フィルム、積層体、配線基板、積層配線基板、及び積層配線基板の製造方法
JPWO2024202632A1 (https=) * 2023-03-28 2024-10-03

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0673239A (ja) * 1992-08-27 1994-03-15 Toray Ind Inc 液晶ポリエステル樹脂組成物
JP3269202B2 (ja) * 1993-08-25 2002-03-25 住友化学工業株式会社 熱可塑性樹脂組成物
JP3949215B2 (ja) * 1997-03-19 2007-07-25 住友化学株式会社 積層体、積層体の製造方法および多層基板
JP3949216B2 (ja) * 1997-03-21 2007-07-25 住友化学株式会社 積層体の製造方法
JPH10330602A (ja) * 1997-05-29 1998-12-15 Sumitomo Chem Co Ltd 液晶ポリエステル樹脂組成物、それよりなる射出成形品およびフィルム
JP2002064030A (ja) * 2000-08-18 2002-02-28 Sumitomo Chem Co Ltd フィルムコンデンサー
JP2004352817A (ja) * 2003-05-28 2004-12-16 Hitachi Chem Co Ltd 接着剤付き液晶ポリマーフィルム
JP4608342B2 (ja) * 2004-03-10 2011-01-12 パナソニック電工株式会社 低誘電正接を有する樹脂成形品およびその製造方法
WO2011093079A1 (ja) * 2010-01-28 2011-08-04 三井化学株式会社 金属樹脂複合体
JP5674405B2 (ja) 2010-09-30 2015-02-25 株式会社クラレ 熱可塑性液晶ポリマーフィルムおよびそれを用いた伝送線路
JP6899636B2 (ja) * 2016-08-31 2021-07-07 三井化学株式会社 低誘電性樹脂組成物、硬化物、ドライフィルム、フィルム、プリプレグ、金属張積層板、プリント配線基板および電子機器
CN113767149B (zh) * 2019-04-26 2025-02-11 株式会社钟化 低介电树脂组合物、成形品、薄膜、层叠薄膜、以及挠性印刷电路板

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CN113767149A (zh) 2021-12-07
US20220041932A1 (en) 2022-02-10
TW202106801A (zh) 2021-02-16
JP7436467B2 (ja) 2024-02-21
US11993740B2 (en) 2024-05-28
TWI862585B (zh) 2024-11-21
WO2020218405A1 (ja) 2020-10-29
JPWO2020218405A1 (https=) 2020-10-29

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