JP7436467B2 - 低誘電樹脂組成物、成形品、フィルム、積層フィルム、及びフレキシブルプリント配線板 - Google Patents
低誘電樹脂組成物、成形品、フィルム、積層フィルム、及びフレキシブルプリント配線板 Download PDFInfo
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- JP7436467B2 JP7436467B2 JP2021516198A JP2021516198A JP7436467B2 JP 7436467 B2 JP7436467 B2 JP 7436467B2 JP 2021516198 A JP2021516198 A JP 2021516198A JP 2021516198 A JP2021516198 A JP 2021516198A JP 7436467 B2 JP7436467 B2 JP 7436467B2
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- low dielectric
- graft
- resin composition
- liquid crystal
- crystal polymer
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- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
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- PFBLRDXPNUJYJM-UHFFFAOYSA-N tert-butyl 2-methylpropaneperoxoate Chemical compound CC(C)C(=O)OOC(C)(C)C PFBLRDXPNUJYJM-UHFFFAOYSA-N 0.000 description 1
- JIYXDFNAPHIAFH-UHFFFAOYSA-N tert-butyl 3-tert-butylperoxycarbonylbenzoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC(C(=O)OC(C)(C)C)=C1 JIYXDFNAPHIAFH-UHFFFAOYSA-N 0.000 description 1
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K19/00—Liquid crystal materials
- C09K19/04—Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
- C09K19/38—Polymers
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- C—CHEMISTRY; METALLURGY
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- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K19/00—Liquid crystal materials
- C09K19/52—Liquid crystal materials characterised by components which are not liquid crystals, e.g. additives with special physical aspect: solvents, solid particles
- C09K19/54—Additives having no specific mesophase characterised by their chemical composition
- C09K19/542—Macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F255/00—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00
- C08F255/08—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00 on to polymers of olefins having four or more carbon atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K19/00—Liquid crystal materials
- C09K19/02—Liquid crystal materials characterised by optical, electrical or physical properties of the components, in general
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F255/00—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00
- C08F255/02—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00 on to polymers of olefins having two or three carbon atoms
- C08F255/023—On to modified polymers, e.g. chlorinated polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/003—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2219/00—Aspects relating to the form of the liquid crystal [LC] material, or by the technical area in which LC material are used
- C09K2219/03—Aspects relating to the form of the liquid crystal [LC] material, or by the technical area in which LC material are used in the form of films, e.g. films after polymerisation of LC precursor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0141—Liquid crystal polymer [LCP]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Graft Or Block Polymers (AREA)
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| PCT/JP2020/017463 WO2020218405A1 (ja) | 2019-04-26 | 2020-04-23 | 低誘電樹脂組成物、成形品、フィルム、積層フィルム、及びフレキシブルプリント配線板 |
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| JPWO2020218405A1 JPWO2020218405A1 (https=) | 2020-10-29 |
| JPWO2020218405A5 JPWO2020218405A5 (https=) | 2022-02-16 |
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| CN113767149B (zh) * | 2019-04-26 | 2025-02-11 | 株式会社钟化 | 低介电树脂组合物、成形品、薄膜、层叠薄膜、以及挠性印刷电路板 |
| JP7839105B2 (ja) * | 2020-11-24 | 2026-04-01 | 富士フイルム株式会社 | 液晶ポリマーフィルム、ポリマーフィルム、及び、積層体 |
| WO2022113963A1 (ja) * | 2020-11-24 | 2022-06-02 | 富士フイルム株式会社 | ポリマーフィルム、及び、積層体 |
| CN116568753A (zh) * | 2020-11-24 | 2023-08-08 | 富士胶片株式会社 | 液晶聚合物膜、聚合物膜及层叠体 |
| JPWO2022202790A1 (https=) * | 2021-03-22 | 2022-09-29 | ||
| WO2022202789A1 (ja) * | 2021-03-22 | 2022-09-29 | 富士フイルム株式会社 | ポリマーフィルム及び積層体 |
| JP7682671B2 (ja) * | 2021-03-30 | 2025-05-26 | 住友化学株式会社 | 非水電解液二次電池用セパレータ、非水電解液二次電池用部材および非水電解液二次電池 |
| JP2022184736A (ja) * | 2021-05-31 | 2022-12-13 | 富士フイルム株式会社 | 配線基板及び配線基板の製造方法 |
| TW202249544A (zh) * | 2021-05-31 | 2022-12-16 | 日商富士軟片股份有限公司 | 配線基板及配線基板之製造方法 |
| JP7797143B2 (ja) * | 2021-08-31 | 2026-01-13 | 富士フイルム株式会社 | フィルム及びその製造方法、積層フィルム、並びに、積層体 |
| WO2023233877A1 (ja) * | 2022-05-30 | 2023-12-07 | 富士フイルム株式会社 | フィルム、積層体、配線基板、積層配線基板、及び積層配線基板の製造方法 |
| JPWO2024202632A1 (https=) * | 2023-03-28 | 2024-10-03 |
Citations (1)
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| JP2002064030A (ja) | 2000-08-18 | 2002-02-28 | Sumitomo Chem Co Ltd | フィルムコンデンサー |
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| JPH0673239A (ja) * | 1992-08-27 | 1994-03-15 | Toray Ind Inc | 液晶ポリエステル樹脂組成物 |
| JP3269202B2 (ja) * | 1993-08-25 | 2002-03-25 | 住友化学工業株式会社 | 熱可塑性樹脂組成物 |
| JP3949215B2 (ja) * | 1997-03-19 | 2007-07-25 | 住友化学株式会社 | 積層体、積層体の製造方法および多層基板 |
| JP3949216B2 (ja) * | 1997-03-21 | 2007-07-25 | 住友化学株式会社 | 積層体の製造方法 |
| JPH10330602A (ja) * | 1997-05-29 | 1998-12-15 | Sumitomo Chem Co Ltd | 液晶ポリエステル樹脂組成物、それよりなる射出成形品およびフィルム |
| JP2004352817A (ja) * | 2003-05-28 | 2004-12-16 | Hitachi Chem Co Ltd | 接着剤付き液晶ポリマーフィルム |
| JP4608342B2 (ja) * | 2004-03-10 | 2011-01-12 | パナソニック電工株式会社 | 低誘電正接を有する樹脂成形品およびその製造方法 |
| WO2011093079A1 (ja) * | 2010-01-28 | 2011-08-04 | 三井化学株式会社 | 金属樹脂複合体 |
| JP5674405B2 (ja) | 2010-09-30 | 2015-02-25 | 株式会社クラレ | 熱可塑性液晶ポリマーフィルムおよびそれを用いた伝送線路 |
| JP6899636B2 (ja) * | 2016-08-31 | 2021-07-07 | 三井化学株式会社 | 低誘電性樹脂組成物、硬化物、ドライフィルム、フィルム、プリプレグ、金属張積層板、プリント配線基板および電子機器 |
| CN113767149B (zh) * | 2019-04-26 | 2025-02-11 | 株式会社钟化 | 低介电树脂组合物、成形品、薄膜、层叠薄膜、以及挠性印刷电路板 |
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| JP2002064030A (ja) | 2000-08-18 | 2002-02-28 | Sumitomo Chem Co Ltd | フィルムコンデンサー |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023142439A (ja) * | 2022-03-25 | 2023-10-05 | 株式会社カネカ | 液状ポリオレフィン組成物 |
| JP7839672B2 (ja) | 2022-03-25 | 2026-04-02 | 株式会社カネカ | 液状ポリオレフィン組成物 |
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| CN113767149A (zh) | 2021-12-07 |
| US20220041932A1 (en) | 2022-02-10 |
| TW202106801A (zh) | 2021-02-16 |
| US11993740B2 (en) | 2024-05-28 |
| TWI862585B (zh) | 2024-11-21 |
| CN113767149B (zh) | 2025-02-11 |
| WO2020218405A1 (ja) | 2020-10-29 |
| JPWO2020218405A1 (https=) | 2020-10-29 |
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