CN113728423A - Bonding apparatus, bonding method, and method for manufacturing display apparatus - Google Patents
Bonding apparatus, bonding method, and method for manufacturing display apparatus Download PDFInfo
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- CN113728423A CN113728423A CN202080031258.1A CN202080031258A CN113728423A CN 113728423 A CN113728423 A CN 113728423A CN 202080031258 A CN202080031258 A CN 202080031258A CN 113728423 A CN113728423 A CN 113728423A
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
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- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
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- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
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- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
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- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
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Abstract
The entire surface can be pressed substantially uniformly in a state where the alignment is performed with high accuracy. The substantially plate-shaped 1 st suction part sucks the substantially plate-shaped 1 st member, and the substantially plate-shaped 2 nd suction part provided on the upper side of the 1 st suction part in the vertical direction sucks the substantially plate-shaped transparent 2 nd member, and these members are bonded. The 2 nd suction part is a substantially cylindrical member having both ends covered, and the lower surface of the 2 nd suction part is a transparent suction pad having a hole penetrating in the thickness direction, and the 2 nd member is sucked to the suction pad by sucking air from the suction port. At least a part of the upper surface of the 2 nd suction part includes a transparent member, and an imaging part provided on the upper side of the 2 nd suction part in the vertical direction images the 1 st member and/or the 2 nd member through the transparent member and the suction pad.
Description
Technical Field
The invention relates to a bonding apparatus, a bonding method, and a method for manufacturing a display apparatus.
Background
Prior art documents
Patent document
Patent document 1: japanese laid-open patent publication No. 2009-295853
Disclosure of Invention
Problems to be solved by the invention
In the invention described in patent document 1, since the temporary holding substrate is pressed in a direction in which the temporary holding substrate is in a curved state protruding toward the transfer substrate side, the transfer substrate is also in a curved state. Therefore, when the invention described in patent document 1 is used in a process of bonding a wafer on which LEDs are formed and a circuit board, the entire surface cannot be pressed substantially uniformly, and there is a possibility that breakage of the LEDs, uneven lighting of the LEDs, and breakage of the wafer occur.
The present invention has been made in view of the above circumstances, and an object thereof is to provide a bonding apparatus, a bonding method, and a method for manufacturing a display device, which can substantially uniformly pressurize the entire surface in a state where alignment is performed with high accuracy.
Means for solving the problems
In order to solve the above problem, a bonding apparatus according to the present invention is a bonding apparatus for bonding a substantially plate-shaped member 1 and a transparent substantially plate-shaped member 2, for example, the bonding apparatus including: a substantially plate-shaped 1 st suction portion for sucking the 1 st member; a substantially plate-shaped 2 nd suction portion provided above the 1 st suction portion in the vertical direction and configured to suck the 2 nd member; a 1 st moving unit that moves the 1 st suction unit or the 2 nd suction unit in a vertical direction; a 2 nd moving unit that moves the 1 st suction unit in a horizontal direction; and an imaging unit provided on an upper side of the 2 nd suction unit in a vertical direction, wherein the 2 nd suction unit is a substantially cylindrical member having both ends covered, and is provided with a suction port for sucking air, at least a part of an upper surface of the 2 nd suction unit includes a transparent member, a lower surface of the 2 nd suction unit is a transparent suction pad having a hole penetrating therethrough in a thickness direction, and the imaging unit images the 1 st member and/or the 2 nd member through the transparent member and the suction pad.
According to the bonding apparatus of the present invention, the substantially plate-shaped 1 st suction portion sucks the substantially plate-shaped 1 st member, and the substantially plate-shaped 2 nd suction portion provided on the upper side in the vertical direction of the 1 st suction portion sucks the substantially plate-shaped transparent 2 nd member, and bonds them. The 2 nd suction part is a substantially cylindrical member having both ends covered, and the lower surface of the 2 nd suction part is a transparent suction pad having a hole penetrating in the thickness direction, and the 2 nd member is sucked to the suction pad by sucking air from the suction port. At least a part of the upper surface of the 2 nd suction part includes a transparent member, and an imaging part provided on the upper side of the 2 nd suction part in the vertical direction images the 1 st member and/or the 2 nd member through the transparent member and the suction pad. The 1 st member and the 2 nd member are directly observed by the imaging unit, and the alignment can be performed with high accuracy. Further, by sandwiching the 1 st member and the 2 nd member between the 1 st suction part and the 2 nd suction part having substantially plate shapes, the entire surface can be pressurized substantially uniformly.
Here, the 1 st member and the 2 nd member may have a plurality of LEDs formed on one side and a connection pattern formed on the other side, and may include a plurality of probes connected to a power supply, and the probes may be movable in the vertical direction between a position in contact with the connection pattern and a position not in contact with the connection pattern. This makes it possible to confirm the lighting of the LED by the bonding device.
Here, the present invention may further include: and a 3 rd moving unit that moves the 2 nd suction unit in the horizontal direction, wherein the 3 rd moving unit is a substantially cylindrical member and is provided on the upper side of the 2 nd suction unit in the vertical direction. Thus, the imaging unit can image the 1 st member and/or the 2 nd member through the 3 rd moving unit, the transparent member, and the suction pad.
Here, the present invention may further include: a substantially columnar mounting portion that holds the imaging portion and the 2 nd suction portion; a light irradiation section provided to the mounting section so as to be positioned at a height between the image pickup section and the 2 nd suction section; and a mirror movable in a horizontal direction between a position overlapping with an optical path of the image pickup section and a position not overlapping with the optical path. This enables the 1 st member and the 2 nd member to be connected by using the photocurable resin.
Here, the present invention may further include: and a 1 st control unit that controls the 2 nd moving unit to move the 1 st suction unit while the 1 st member is imaged and observed by the imaging unit through the 2 nd suction unit and the 2 nd member. This enables high-precision positioning.
Here, the present invention may further include: a 4 th moving part which moves the probe in a vertical direction; and a 2 nd control unit for controlling the 1 st moving unit to press the 1 st member and the 2 nd member, and controlling the 4 th moving unit to bring the probe into contact with the connection pattern while maintaining the pressed state. In this way, by checking the lighting of the LED before connecting the 1 st member and the 2 nd member, the 1 st member and the 2 nd member can be separated when the LED is not lit, and the defect can be corrected. Therefore, the yield in manufacturing can be improved.
In order to solve the above problem, a bonding method according to the present invention includes, for example: placing a plate-like 1 st member on a substantially plate-like 1 st suction portion, sucking a transparent plate-like 2 nd member on a transparent substantially plate-like 2 nd suction portion provided on an upper side of the 1 st suction portion in a vertical direction, and disposing the 1 st member and the 2 nd member substantially in parallel; moving the 1 st member in a horizontal direction while observing the 1 st member by an imaging unit provided on an upper side of the 2 nd suction unit in a vertical direction through the 2 nd suction unit and the 2 nd member, thereby aligning the 1 st member and the 2 nd member; and a step of pressurizing the 1 st member and the 2 nd member. This makes it possible to apply pressure to the entire surface substantially uniformly in a state where the alignment is performed with high accuracy.
Here, the 1 st member and the 2 nd member may have a plurality of LEDs formed on one side and a connection pattern formed on the other side, and the 1 st member and/or the 2 nd member may be coated with an adhesive, and may include: moving a probe while keeping the 1 st member and the 2 nd member pressurized, and bringing the probe into contact with the connection pattern to light the LED; a step of photographing the 1 st member and the 2 nd member by the image pickup unit and confirming lighting of the LED by the photographed images; and curing the adhesive when all the LEDs are turned on. In this way, by checking the lighting of the LED before connecting the 1 st member and the 2 nd member, the 1 st member and the 2 nd member can be separated when the LED is not lit, and the defect can be corrected. Therefore, the yield in manufacturing can be improved.
Here, the 1 st member and the 2 nd member may be arranged substantially in parallel by a process including: placing the 2 nd member on the 1 st suction portion; moving the 1 st suction unit in a horizontal direction while imaging and observing the 2 nd member through the 2 nd suction unit by the imaging unit; a step of adsorbing the 2 nd member by the 2 nd adsorption part; and a step of placing the 1 st member on the 1 st suction portion. This enables alignment to be performed while directly observing the 1 st member and the 2 nd member by one imaging unit. As a result, the alignment can be performed with high accuracy.
In order to solve the above problems, a method of manufacturing a display device according to the present invention is a method of manufacturing a display device including a bonding step of bonding a substantially plate-shaped member 1 having a plurality of LEDs formed on one side and a connection pattern formed on the other side and a substantially plate-shaped member 2 having a transparent property, the bonding step including: placing the 1 st member on a substantially plate-shaped 1 st suction portion, sucking the 2 nd member on a transparent substantially plate-shaped 2 nd suction portion provided on an upper side of the 1 st suction portion in a vertical direction, and disposing the 1 st member and the 2 nd member substantially in parallel; moving the 1 st member in a horizontal direction while observing the 1 st member by an imaging unit provided on an upper side of the 2 nd suction unit in a vertical direction through the 2 nd suction unit and the 2 nd member, thereby aligning the 1 st member and the 2 nd member; and a step of pressurizing the 1 st member and the 2 nd member.
Here, the bonding step may include applying an adhesive to the 1 st member and/or the 2 nd member, and includes: moving a probe while keeping the 1 st member and the 2 nd member pressurized, and bringing the probe into contact with the connection pattern to light the LED; a step of photographing the 1 st member and the 2 nd member by the image pickup unit and confirming lighting of the LED by the photographed images; and curing the adhesive when all the LEDs are turned on.
Here, the 1 st member and the 2 nd member may be arranged substantially in parallel by a process including: placing the 2 nd member on the 1 st suction portion; moving the 1 st suction unit in a horizontal direction while imaging and observing the 2 nd member through the 2 nd suction unit by the imaging unit; a step of adsorbing the 2 nd member by the 2 nd adsorption part; and a step of placing the 1 st member on the 1 st suction portion.
Effects of the invention
According to the present invention, the entire surface can be pressed substantially uniformly in a state where the alignment is performed with high accuracy.
Drawings
Fig. 1 is a schematic view showing a display device 1 manufactured by using the manufacturing apparatus and the manufacturing method of the present invention.
Fig. 2 is a partial cross-sectional view schematically showing the display device 1.
Fig. 3 is a diagram schematically illustrating a method of manufacturing the display device 1.
Fig. 4 is a diagram schematically illustrating a method of manufacturing the display device 1.
Fig. 5 is a schematic view showing the bonding apparatus 2.
Fig. 6 is a schematic view showing the suction portion 69, fig. 6 (a) is a side view, and fig. 6 (B) is a bottom view.
Fig. 7 is a diagram schematically showing a state where the wafer 25 is adsorbed to the adsorption pad 62.
Fig. 8 is a schematic view showing the image pickup unit 71 and the mounting unit 72, where fig. 8 (a) is a front view and fig. 8 (B) is a side view.
Fig. 9 is a block diagram showing an electrical configuration of the attaching device 2.
Fig. 10 is a flowchart showing a processing flow of the bonding step.
Fig. 11 is a view schematically showing the bonding step.
Fig. 12 is a diagram schematically showing the position of the probe 81 in the bonding step.
Fig. 13 is a schematic view showing the bonding apparatus 3.
Fig. 14 is a flowchart showing a processing flow of the bonding step.
Fig. 15 is a view schematically showing the bonding step.
Detailed Description
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
< embodiment 1>
Fig. 1 is a schematic view showing a display device 1 manufactured by using the manufacturing apparatus and the manufacturing method of the present invention. The display device 1 is a full-color LED display panel in which a plurality of micro LEDs are arranged in a matrix, and displays an image in color.
Fig. 1 is a schematic plan view showing a display device 1. In the display device 1, a plurality of LEDs 20 are disposed on a circuit board 10 which is a substantially plate-shaped circuit board. The LED20 is an ultra-small LED having a size of approximately 50 μm × approximately 50 μm or less, and emits ultraviolet light (wavelength 385nm), for example. The configuration of the LED20 is already known, and thus a detailed description is omitted.
The LEDs 20 are arranged continuously in the longitudinal direction and the lateral direction. The fluorescent light-emitting layer 30 having the red fluorescent light-emitting layer 30R, the green fluorescent light-emitting layer 30G, and the blue fluorescent light-emitting layer 30B is provided above the LED 20.
Fig. 2 is a partial cross-sectional view schematically showing the display device 1. The circuit substrate 10 is a light-transmitting substrate, and is formed using sapphire glass, for example. The circuit board 10 is provided with a wiring pattern 11 having a connection pattern 12 (see fig. 3) connected to the LED 20. The LED20 is bonded to the wiring pattern 11, and the connection pattern 12 on the wiring pattern 11 is electrically connected to the p-electrode 22 and the n-electrode 23 of the LED 20.
The planarization film 32 is provided so as to cover the LED20, and the fluorescent light-emitting layer 30 and the partition wall 31 that partitions the fluorescent light-emitting layer 30 are provided on the upper side of the planarization film 32. A metal film (not shown) for preventing color mixing is provided on the surface of the partition wall 31.
Each LED20 is a sub-pixel, and sub-pixels of three colors R, G, B constitute one pixel. In the present embodiment, the subpixels are arranged in stripes (see fig. 1), but the arrangement of the subpixels may be a mosaic arrangement, a delta arrangement, or the like.
The wiring pattern 11 is electrically connected to a drive circuit 40. The drive circuit 40 supplies a drive signal to each LED20, and turns on/off the LED20 by driving it on/off.
Fig. 3 and 4 are views schematically showing a method of manufacturing the display device 1.
As shown in fig. 3 a, a circuit board 10 having a wiring pattern 11 and a connection pattern 12 (not shown) formed thereon is produced. The circuit board 10 is a substantially plate-shaped member. The circuit substrate 10 may or may not be transparent.
< step 2> as shown in fig. 3 (B), an adhesive 41 is applied to the connection pattern 12 for connecting the wiring pattern 11 and the LED 20. The adhesive 41 may be applied to the wiring pattern 11 and the connection pattern 12, or may be applied to either the wiring pattern 11 or the connection pattern 12. The adhesive 41 is desirably formed of a resin having conductivity, for example, a resin mixed with carbon or a metal (for example, silver). The step of applying the adhesive includes: a step of applying an adhesive to the wiring pattern 11 using a coater or the like; a pre-baking step of heating the solution at approximately 90 ℃ for approximately 2 minutes to evaporate the solution; a step of placing a mask 101 on the circuit board 10 and performing alignment; an exposure step of performing exposure at normal temperature to cure (precure) the adhesive with light and transferring the pattern of the mask 101 to the adhesive; and a developing step of removing the uncured adhesive.
< step 3> as shown in fig. 3 (C), a transparent substantially plate-shaped wafer 25 on which a plurality of LEDs 20 are formed is bonded to a circuit board 10 coated with an adhesive, and an LED20 is fixed to a connection pattern. The bonding step will be described in detail later.
In the < step 4> when the LED20 is fixed to the circuit board 10, the planarization film 32 is formed so as to cover the LED20, as shown in fig. 3 (D). The planarization film forming step includes: a step of applying a material of the planarization film 32 on the wiring pattern 11 using a coater or the like; a pre-baking step of heating the solution to evaporate the solution; a step of placing a mask 102 on the circuit board 10 and performing alignment; an exposure step of curing the planarizing film 32 by performing exposure at normal temperature; a developing step of removing the uncured material of the planarization film; and a post-baking step for removing moisture and the like.
In the < step 5>, as shown in fig. 3 (E), the partition walls 31 are formed on the upper side of the planarization film 32. The partition forming step includes: a step of coating the material of the partition walls 31 on the wiring pattern 11 using a coating machine or the like; a pre-baking step of heating the solution to evaporate the solution; a step of placing a mask 103 on the circuit board 10 and performing alignment; an exposure step of performing exposure at normal temperature to cure the partition walls 31; a developing step of removing the uncured material of the partition walls; and a post-baking step for removing moisture and the like.
< step 6> as shown in fig. 3 (F), the partition walls 31 formed in step 5 are subjected to plating treatment, and a metal film 33 is formed on the surfaces of the partition walls 31 and the planarization film 32. The plating treatment can be electroless Ni plating treatment, for example.
< step 7> as shown in fig. 3 (G), of the metal films 33 formed in step 6, the metal film 33 formed on the surface of the planarization film 32 is removed. In this embodiment mode, the metal film is removed by laser processing.
< step 8> as shown in fig. 4 (a), a fluorescent light emitting resist containing a fluorescent dye (pigment or dye) of red is filled between the partition walls 31 and cured to form a fluorescent light emitting layer 30R of red. The red fluorescent light-emitting layer 30R formation step includes: a step of filling the fluorescent light emitting resist between the partition walls 31 with a squeegee; a pre-baking step of heating the solution to evaporate the solution; a step of placing a mask 104 on the circuit board 10 and performing alignment; an exposure step of curing the red fluorescent light-emitting layer 30R by exposure at room temperature; a developing step of removing the uncured fluorescent light emitting resist; and a post-baking step for removing moisture and the like.
< step 9> as shown in fig. 4 (B), a green fluorescent light-emitting layer 30G is formed by filling and curing a fluorescent light-emitting resist containing a green fluorescent dye between the partition walls 31. The green fluorescent light-emitting layer 30G forming step is substantially the same as the red fluorescent light-emitting layer 30R forming step except for using the mask 105, and therefore, the description thereof is omitted.
< step 10> as shown in fig. 4 (C), a blue fluorescent dye-containing fluorescent light-emitting resist is filled between the partition walls 31 and cured to form a blue fluorescent light-emitting layer 30B. The process for forming the blue fluorescent light-emitting layer 30B is substantially the same as the process for forming the red fluorescent light-emitting layer 30R, except that the mask 106 is used, and therefore, the description thereof is omitted.
< step 11> as shown in fig. 4 (D), a rigid flexible substrate 43 is mounted on the wiring pattern 11. In addition, a substrate other than the rigid flexible substrate may be mounted on the wiring pattern 11.
< step 12> as shown in fig. 4 (E), the drive circuit 40 is connected to the rigid flexible substrate 43. Thus, the driving signal from the driving circuit 40 is transmitted to the LED20 via the wiring pattern 11, and functions as the display device 1.
Next, a bonding apparatus used in a bonding step (step 3) of bonding the wafer 25 and the circuit board 10 and electrically connecting the LED20 and the wiring pattern 11 will be described. Fig. 5 is a schematic view showing the bonding apparatus 2. In fig. 5, the vertical direction is defined as the Z direction, and the directions substantially orthogonal to the Z direction are defined as the X direction and the Y direction. The X-direction and the Y-direction are substantially orthogonal.
The bonding apparatus 2 mainly includes a stage (stage)50, a suction stage 60, an imaging unit 71, a probe 81, and a support frame 90.
The support frame 90 is a substantially box-shaped casing covering the outside of the bonding apparatus 2. The support frame 90 is provided therein with a table 50, an adsorption table 60, an inspection unit 80, and the like.
The table 50 mainly includes a heating table 51 (corresponding to the 1 st adsorption part), a tilt table 52, a θ table 53, an XY table 54, and a Z moving part 55.
The heating table 51 is a substantially plate-shaped (substantially thick plate-shaped in this case) member, and the circuit board 10 is placed on the upper surface 51 a. The heating table 51 is provided with a hole (not shown) opened in the upper surface 51a, and the circuit board 10 is sucked and fixed to the upper surface 51a by sucking air by an air suction device 91 (see fig. 9) connected to the hole. In addition, a porous material may be used for the heating stage 51.
The heating table 51 has a heating unit (not shown). The heating unit maintains the entire heating table 51 at a constant temperature (for example, approximately 120 degrees or approximately 200 degrees or more).
The tilt table 52, the θ table 53, and the XY table 54 are disposed between the heating table 51 and the Z moving part 55. The tilt table 52 rotates the heating table 51 about the X axis and the Y axis (tilts the heating table 51). The θ table 53 rotates the heating table 51 about the Z axis. The XY table 54 moves the heating table 51 in parallel in the X direction and the Y direction. The Z-moving unit 55 moves the heating stage 51, the tilting stage 52, the θ stage 53, and the XY stage 54 in parallel along the Z-axis. Since the tilt table 52, the θ table 53, the XY table 54, and the Z moving unit 55 can use a known technique, description thereof is omitted.
The suction table 60 is provided on the vertical direction upper side (+ Z side) of the table 50. The adsorption stage 60 mainly has a cylindrical holder (socket) 61, an adsorption pad 62, a cover glass (coverglass)63, a tilt stage 64, and a θ stage 65.
The cylindrical holder 61, the suction pad 62, and the cover glass 63 are suction portions 69 (corresponding to the 2 nd suction portion) for sucking the wafer 25, and are substantially cylindrical members having both ends covered. In the present invention, the substantially cylindrical shape is a hollow rod material, and includes a concept of a substantially cylindrical shape, a substantially square cylindrical shape, and the like. The substantially cylindrical shape also includes a shape having a protrusion and a depression on a side surface. The substantially cylindrical member also includes a member in which the boundary between the side surface and the upper surface or between the side surface and the bottom surface is rounded and the boundary cannot be clearly distinguished. The substantially cylindrical member also includes a member in which a reinforcing material such as a rib or a column is added to the hollow portion.
Fig. 6 is a schematic view showing the suction portion 69, fig. 6 (a) is a side view, and fig. 6 (B) is a bottom view. Fig. 6 (a) shows a part of the cross section.
In order to maintain high strength, the cylindrical bracket 61 contains metal such as aluminum or iron. The cylindrical holder 61 is substantially cylindrical, and the suction pads 62 and the cover glass 63 cover both ends of the cylindrical holder 61.
The suction pad 62 is a transparent substantially plate-shaped member, and covers the lower end of the cylindrical bracket 61. The suction pad 62 is formed with a hole 62a penetrating in the thickness direction (Z direction). The number of the holes 62a for adsorption may be one or plural.
Examples of the material of the suction pad 62 include glass and resin. The adsorption pad 62 is preferably transparent as a whole, but may have a portion that is opaque. For example, the adsorption pad 62 may be formed by combining a plurality of materials such as glass and rubber. The suction pad 62 may not necessarily be entirely transparent, and the image pickup unit 71 may be transparent to the alignment mark or a portion necessary for imaging a part of the circuit board 10 or the wafer 25 necessary for alignment.
The cover glass 63 is a transparent member that covers the upper surface of the cylindrical holder 61. The material of the cover glass 63 may be transparent resin, but is preferably glass. A recess 61a is formed on the upper end side of the cylindrical bracket 61, and a cover glass 63 is attached to the inside of the recess 61a, whereby the cover glass 63 covers the upper end surface of the cylindrical bracket 61. In other words, at least a part of the upper surface of the suction portion 69 includes a transparent member.
A vacuum suction joint 68 connected to an air suction device 92 (see fig. 9) is provided on a side surface of the cylindrical bracket 61. Since both end surfaces of the cylindrical holder 61 are covered with the suction pads 62 and the cover glass 63, the air inside the suction portion 69 is sucked by the air suction device 92 through the vacuum suction joint 68, and the wafer 25 is sucked by the bottom surfaces 62b of the suction pads 62 as shown in fig. 7.
Returning to the description of fig. 5. The tilt table 64 and the θ table 65 are provided above the suction portion 69 in the vertical direction, and move the suction portion 69 in the horizontal direction. Specifically, the tilt table 64 rotates the suction portion 69 about the X axis and the Y axis (tilts the suction portion 69). Further, the θ table 53 rotates the suction portion 69 around the Z axis. Since the tilt table 64 and the θ table 65 can use a known technique, description thereof is omitted. In the present invention, the horizontal movement includes not only the parallel movement but also the tilting operation and the turning operation.
The imaging unit 71 is a camera for capturing an image for aligning the positions of the circuit board 10 and the wafer 25. The imaging unit 71 is provided with a zoom optical system to enable magnification observation and to change magnification. Since a general camera can be used as the imaging unit 71, the description thereof is omitted. The imaging unit 71 is provided on the upper side of the suction unit 69 in the vertical direction via a substantially columnar attachment unit 72.
Fig. 8 is a schematic view showing the image pickup unit 71 and the mounting unit 72, where fig. 8 (a) is a front view and fig. 8 (B) is a side view. Fig. 8 (a) and 8 (B) show a part thereof in cross section.
The mounting portion 72 holds the imaging portion 71 so as to be movable in the X direction, the Y direction, and the Z direction (see the hollow arrow in fig. 8). Thereby, the imaging unit 71 can observe the entire area of the wafer 25 adsorbed on the adsorption pad 62.
The attachment portion 72 holds the suction table 60 on the lower side (on the-Z side) in the vertical direction of the imaging portion 71.
The tilt table 64 and the θ table 65 are substantially cylindrical. The upper and lower surfaces of the suction portion 69 (the suction pad 62 and the cover glass 63) are transparent. Therefore, the imaging unit 71 can image the wafer 25 through the suction pad 62, the cover glass 63, the tilt table 64, and the θ table 65. Further, since the wafer 25 is transparent, the imaging unit 71 can image the circuit board 10 through the wafer 25 (see fig. 5).
The mounting portion 72 is provided with a light irradiation portion 73 for irradiating ultraviolet rays. The light irradiation section 73 is provided in the mounting section 72 so as to be located at a height between the imaging section 71 and the suction table 60. The light irradiation section 73 irradiates light in the horizontal direction (-Y direction).
As shown in fig. 8B, the mirror 74 (not shown in fig. 8 a) is an optical member that reflects the ultraviolet light irradiated from the light irradiation unit 73, and bends the optical path by approximately 90 degrees. The mirror 74 is provided to be movable in the horizontal direction (see arrow (B) in fig. 8) between a position overlapping the optical path of the image pickup unit 71 (see broken line (B) in fig. 8) and a position not overlapping the optical path of the image pickup unit 71 (see solid line (B) in fig. 8). In a state where the mirror 74 is disposed at a position overlapping the optical path of the imaging unit 71, the ultraviolet light irradiated from the light irradiation unit 73 is reflected by the mirror 74 and irradiated to the circuit board 10 and the wafer 25.
Returning to the description of fig. 5. The inspection unit 80 mainly includes a plurality of probes 81 and a moving unit 82. The plurality of probes 81 are connected to a power source 85 (see fig. 9). Further, the probe 81 is provided in the moving portion 82. The moving unit 82 can move the probes 81 in the vertical direction between a position in contact with the wiring pattern 11 provided on the circuit board 10 and a position not in contact with the wiring pattern 11. In the present embodiment, the wiring pattern 11 has a power supply pad (not shown) for lighting inspection, and the probe 81 is brought into contact with the power supply pad.
In the present embodiment, the inspection unit 80 is attached to the support frame 90 at a position near the suction table 60, but the position and arrangement of the inspection unit 80 are not limited to this. The probe 81 may be provided so as to be movable in the vertical direction, and for example, the moving unit 82 may be provided on the XY table 54.
Fig. 9 is a block diagram showing an electrical configuration of the attaching device 2. The bonding apparatus 2 includes a CPU (Central Processing Unit) 151, a RAM (Random Access Memory) 152, a ROM (Read Only Memory) 153, an input/output interface (I/F)154, a communication interface (I/F)155, and a medium interface (I/F)156, and these are connected to the stage 50, the adsorption stage 60, the image pickup Unit 71, the inspection Unit 80, the power supply 85, the air suction devices 91 and 92.
The RAM152 is a volatile memory. The ROM153 is a nonvolatile memory in which various control programs and the like are stored. The CPU151 operates based on programs stored in the RAM152 and the ROM153, and controls each unit.
The CPU151 has a function of a control unit 151a that controls each unit of the bonding apparatus 2. The control unit 151a is constructed by executing a predetermined program read by the CPU 151.
The control unit 151a mainly includes a functional unit for performing alignment, a functional unit for performing pressurization, and a functional unit for performing inspection. Among the functional units for alignment, the tilt table 52, the θ table 53, and the XY table 54 are controlled to move the heating table 51 in the horizontal direction while the circuit board 10 is imaged and observed via the suction table 60 and the wafer 25 by the imaging unit 71. In addition, the Z moving unit 55 is controlled to move the heating table 51 in the vertical direction (+ Z direction) among the functions for pressurizing, thereby pressurizing the circuit board 10 and the wafer 25. At this time, the control unit 151a detects the pressurizing pressure by a load cell (not shown), thereby controlling the pressure to an optimum set pressure. In the functional portion for inspection, the moving portion 82 is controlled to bring the probes 81 into contact with the wiring pattern 11 while keeping the circuit board 10 and the wafer 25 pressurized. The processing performed by the control unit 151a will be described in detail later.
The CPU151 controls an input/output device 161 such as a keyboard and a mouse via the input/output interface 154. The communication interface 155 receives data from other devices and transmits the data to the CPU151 via the network 162, and transmits data generated by the CPU151 to other devices via the network 162.
The media interface 156 reads the program and data stored in the storage medium 163 and stores them in the RAM 152. The storage medium 163 is, for example, an IC card, an SD card, a DVD, or the like. Further, the program for realizing each function is read from the storage medium 163, installed in the bonding apparatus 2 via the RAM152, and executed by the CPU 151.
The configuration of the bonding apparatus 2 shown in fig. 9 is the configuration mainly described in the description of the features of the present embodiment, and does not exclude a configuration provided in a general information processing apparatus, for example. The components of the bonding apparatus 2 may be classified into more components according to the processing content, or one component may execute the processing of a plurality of components.
Next, a process (step 3) of bonding the circuit board 10 and the wafer 25 by using the bonding apparatus 2 will be described. The bonding step is mainly performed by the controller 151 a. In the bonding step, the wafer 25 on which the plurality of LEDs 20 are formed is bonded to the circuit board 10, and the LED20 is fixed to the connection pattern.
Fig. 10 is a flowchart showing a processing flow of the bonding step. Fig. 11 is a view schematically showing the bonding step. Fig. 12 is a diagram schematically showing the position of the probe 81 in the bonding step.
1. Alignment step (Steps S100 to S106)
< step S100>
First, as shown in fig. 11 a, the wafer 25 is placed on the upper surface 51a of the stage 50 (here, the heating stage 51) such that the LED20 (not shown in fig. 11) faces downward. At this time, the controller 151a sucks air by the air suction device 91 to suck and fix the wafer 25 to the upper surface 51 a.
Next, as shown in fig. 11 (B), the controller 151a controls the Z moving unit 55 to move the heating table 51 in the upward direction (+ Z direction) and bring the wafer 25 close to the suction table 60. Then, the controller 151a controls the tilt table 52, the θ table 53, and the XY table 54 to move the heating table 51 (i.e., the wafer 25) in the horizontal direction while imaging and observing the wafer 25 via the suction table 60 by the imaging unit 71. At this time, the control section 151a moves the wafer 25 in the horizontal direction so that the alignment mark formed on the wafer 25 coincides with the center (optical axis) of the imaging section 71.
< step S102>
When the alignment mark formed on the wafer 25 coincides with the optical axis of the imaging unit 71, the control unit 151a cuts off the suction of air by the air suction device 91, and releases the suction of the wafer 25 to the upper surface 51 a. The controller 151a also sucks air inside the suction unit 69 by the air suction device 92 through the vacuum suction joint 68 to suck the wafer 25 to the suction pad 62. Thus, the wafer 25 is fixed to the suction pad 62 so that the LED20 faces downward.
< step S104>
Next, as shown in fig. 11C, the controller 151a controls the Z moving unit 55 to move the heating table 51 downward (in the (-Z direction), places the circuit board 10 on the upper surface 51a of the table 50 (here, the heating table 51) so that the wiring pattern 11 faces upward, and sucks air by the air sucking device 91 to suck and fix the circuit board 10 on the upper surface 51 a.
< step S106>
As shown in fig. 11 (D), the controller 151a controls the Z moving unit 55 to move the heating table 51 in the + Z direction, and brings the circuit board 10 close to the wafer 25. However, the circuit board 10 does not abut on the wafer 25. Then, the controller 151a controls the tilt table 52, the θ table 53, and the XY table 54 to move the heating table 51 (i.e., the circuit board 10) in the horizontal direction while imaging and observing the circuit board 10 via the suction table 60 and the wafer 25 by the imaging unit 71. In addition, since the wafer 25 is transparent, the circuit board 10 can be imaged through the wafer 25.
At this time, the control section 151a moves the circuit board 10 in the horizontal direction so that the alignment mark formed on the circuit board 10 coincides with the center (optical axis) of the image pickup section 71. When the alignment mark formed on the circuit board 10 coincides with the optical axis of the image pickup unit 71, the control unit 151a ends the alignment process. Thus, the circuit board 10 and the wafer 25 are arranged substantially in parallel in a positioned state.
2. Bonding step
< step S108>
As shown in fig. 11 (E), the controller 151a controls the Z moving unit 55 to move the heating table 51 in the + Z direction, and thereby applies pressure from both sides of the circuit board 10 and the wafer 25 while the circuit board 10 and the wafer 25 are held between the heating table 51 and the suction pads 62. Thereby, the circuit board 10 and the wafer 25 are pressed. As shown in fig. 12 a, the probes 81 do not contact the wiring pattern 11 (not shown in fig. 12) during pressing.
In the present embodiment, since the circuit board 10 and the wafer 25 are held between the heating table 51 and the suction pad 62, the circuit board 10 and the wafer 25 are not bent at the time of pressing, the entire surface of the wafer 25 can be pressed substantially uniformly, and the plurality of LEDs 20 formed on the wafer 25 can be fixed to the circuit board 10 at one time. Further, for example, when the circuit board 10 and the wafer 25 are bent, an excessive force may be applied to the LED20 located in a portion close to the circuit board 10 and the wafer 25, which may cause breakage of the LED20 and breakage of the wafer 25. In contrast, in the present embodiment, since the entire surface of the wafer 25 is uniformly pressurized, breakage of the LED20, uneven lighting of the LED20, and cracking of the wafer 25 can be prevented.
3. Inspection step (Steps S110 to S118)
< step S110>
As shown in fig. 11 (F) and 12 (B), the controller 151a moves the probes 81 in the-Z direction to bring the probes 81 into contact with the wiring pattern 11 (not shown) while applying pressure from both sides of the wafer 25 and the circuit board 10.
< step S112>
The controller 151a applies a current from the power source 85 to the wiring pattern 11 via the probes 81. Thereby, the LED20 lights up.
< step S114>
The control unit 151a checks whether or not all of the LEDs 20 are on based on the image captured by the imaging unit 71. When no problem occurs in the bonding step, all the LEDs 20 are turned on as shown in fig. 12 (C).
< step S116>
When all the LEDs 20 are not lit (no in step S114), that is, when even one unlit LED20 is present, the controller 151a controls the Z moving unit 55 to move the heating table 51 in the-Z direction and separate the circuit board 10 from the wafer 25.
< step S118>
The control unit 151a corrects the malfunction by blowing off dust or the like with a blower or the like, not shown. In the present embodiment, since the inspection is performed before the circuit board 10 and the wafer 25 are connected (before the adhesive is cured), the circuit board 10 and the wafer 25 can be separated from each other, and thus the defect can be corrected. Then, the control unit 151a returns the process to step S106.
4. Curing step
< step S200>
When all the LEDs are turned on (yes in step S114), the controller 151a controls the moving unit 82 to separate the probes 81 from the wiring pattern 11 as shown in fig. 12D. Then, the control unit 151a heats the entire heating table 51 by a heating unit, not shown, in a state where pressure is applied from both sides of the circuit board 10 and the wafer 25, thereby heating the circuit board 10 and the wafer 25 and curing the adhesive 41. Thus, the LED20 is fixed to the circuit board 10.
The adhesive is not limited to a thermosetting resin, and an ultraviolet curable resin can be used. When an ultraviolet curable resin is used, the reflector 74 is moved to a position overlapping the optical path of the imaging unit 71, and ultraviolet light is irradiated from the light irradiation unit 73. Thereby, the circuit board 10 and the wafer 25 are irradiated with ultraviolet rays, and the adhesive is cured.
5. Pressure release process
< step S202>
The controller 151a stops the suction of the air by the air suction device 92, returns the air to the inside of the suction portion 69, and separates the wafer 25 from the suction pad 62.
< step S204>
As shown in fig. 11 (G), the controller 151a controls the Z moving unit 55 to move the heating table 51 in the-Z direction, and moves the member to which the wafer 25 is connected to the circuit board 10 together with the heating table 51 in the-Z direction.
< step S206>
Finally, the control unit 151a stops the air suction by the air suction device 91 and separates the circuit board 10 from the upper surface 51 a. Then, the circuit board 10 is taken out from the upper surface 51 a. The above is the processing flow of the bonding step.
According to the present embodiment, the circuit board 10 and the wafer 25 can be directly observed by the imaging unit 71 by using the transparent suction pad 62 and the cover glass 63, and the cylindrical tilt table 64 and the θ table 65. Further, since alignment is performed while directly observing the circuit board 10 and the wafer 25 by the imaging unit 71, alignment can be performed with high accuracy. Further, since the circuit board 10 and the wafer 25 are held and pressed by the substantially plate-shaped heating stage 51 and the suction pad 62, the entire surface can be pressed substantially uniformly.
Further, according to the present embodiment, the probes 81 are movably provided, the probes 81 are brought into contact with the wiring pattern 11 at the time of inspection, and the probes 81 are separated from the wiring pattern 11 at the time of curing the adhesive, whereby the bonding apparatus 2 can check the lighting of the LED. Further, since lighting of the LED20 is confirmed before the adhesive 41 is cured to connect the circuit board 10 and the wafer 25, when there is an unlit LED20, the circuit board 10 and the wafer 25 can be separated to correct the defect. Therefore, the yield in manufacturing the display device 1 can be improved.
In the present embodiment, the stage 50 has the Z moving unit 55, and the Z moving unit 55 moves the heating stage 51 in the + Z direction or the-Z direction, but the heating stage 51 is not limited to the heating stage 51, and the heating stage may be moved in the + Z direction or the-Z direction. For example, the suction table 60 may have a Z movement unit that moves the suction unit 69 in the + Z direction or the-Z direction.
In the present embodiment, the table 50 has the heating table 51, but the heating table 51 is not essential. When the adhesive agent is a photocurable resin, the bonding apparatus 2 may have the light irradiation unit 73 and the reflecting mirror 74. The light irradiation unit 73 and the mirror 74 are not essential, and when thermosetting resin is used as the adhesive, the bonding apparatus 2 may have the heating table 51.
In the present embodiment, alignment is performed by aligning the alignment marks formed on the circuit board 10 and the wafer 25 with the center (optical axis) of the image pickup unit 71, respectively, but the alignment marks are not necessarily required. For example, the imaging unit 71 may take an image of the circuit board 10 and the wafer 25, and move the heating table 51 in the horizontal direction so that the position of the LED20 provided on the wafer 25 matches the position of the wiring pattern 11 of the circuit board 10 to perform alignment. In the present embodiment, since the imaging unit 71 can directly observe the circuit board 10 and the wafer 25, the circuit board 10 and the wafer 25 can be aligned without the alignment mark. In particular, since the image pickup unit 71 has a zoom optical system and the image pickup unit 71 is provided so as to be movable in the X direction and the Y direction, it is possible to perform imaging by enlarging a part of the circuit board 10 and the wafer 25, and to perform accurate alignment.
In the present embodiment, the alignment mark is provided at the center of the wafer 25, but the position at which the alignment mark is provided is not limited to the center. In addition, the number of the alignment marks may be one or plural. By marking a plurality of alignment marks, not only the height but also the tilt offset and the rotational offset can be aligned with high accuracy. It is particularly preferable to mark three or more alignment marks.
< embodiment 2>
Fig. 13 is a schematic view showing the bonding apparatus 3. The bonding apparatus 3 is used in a bonding step (step 3) of bonding the wafer 25 and the circuit board 10 to electrically connect the LED20 and the wiring pattern 11, and mainly includes a table 50, a suction table 60, image pickup units 71, 76, and 77, an inspection unit 80, and a support frame 90.
The imaging unit 77 is a camera that captures an image of the circuit board 10, and is provided on the upper surface of the support frame 90. The imaging unit 76 is a camera for capturing an image of the wafer 25, and is provided on the XY table 54. Since a general camera can be used for the imaging units 76 and 77, the description thereof is omitted.
Fig. 14 is a flowchart showing a processing flow of the bonding step. Fig. 15 is a view schematically showing the bonding step. In addition, embodiment 1 differs from embodiment 2 only in the alignment step and the bonding step, and therefore, detailed description of steps other than the alignment step and the bonding step is omitted.
1. Alignment step (Steps S102 to S107)
< step S102>
First, as shown in fig. 15 a, air inside the suction portion 69 is sucked by the air suction device 92 through the vacuum suction joint 68, and the wafer 25 is sucked to the suction pad 62 such that the LED20 (not shown in fig. 15) faces downward.
< step S103>
Next, the control unit 151a adjusts the tilt offset and the rotational offset of the wafer 25 while imaging and observing the wafer 25 by the imaging unit 76. That is, the control unit 151a controls the tilt table 64 and the θ table 65 to move the wafer 25 in the horizontal direction so that the alignment mark formed on the wafer 25 coincides with the center (optical axis) of the imaging unit 71.
< step S104>
Next, the controller 151a fixes the circuit board 10 on the upper surface 51a of the stage 50 (here, the heating stage 51) so that the wiring pattern 11 faces upward.
< step S105>
Then, the control unit 151a adjusts the tilt offset and the rotational offset of the circuit board 10 while imaging and observing the circuit board 10 by the imaging unit 77. That is, the tilt table 52, the θ table 53, and the XY table 54 are controlled to move the heating table 51 (i.e., the circuit board 10) in the horizontal direction. At this time, the control section 151a moves the circuit board 10 in the horizontal direction so that the alignment mark formed on the circuit board 10 coincides with the center (optical axis) of the image pickup section 77.
< step S107>
As shown in fig. 15 (B), the controller 151a controls the XY table 54 to move the heating table 51 (i.e., the circuit board 10) in the horizontal direction so that the position of the alignment mark formed on the circuit board 10 substantially coincides with the position of the optical axis of the imaging unit 76 in step S103. Thus, the circuit board 10 and the wafer 25 are arranged substantially in parallel in a positioned state.
2. Bonding step
< step S109>
As shown in fig. 15 (C), the controller 151a controls the Z moving unit 55 to move the heating table 51 in the + Z direction. The control unit 151a also images the circuit board 10 and the wafer 25 by the imaging unit 71, and controls the θ table 53 and the XY table 54 to move the heating table 51 (i.e., the circuit board 10) in the horizontal direction so that the alignment marks of the circuit board 10 and the alignment marks of the wafer 25 coincide with each other when there is a positional deviation between the circuit board 10 and the wafer 25. At this time, the circuit board 10 does not abut on the wafer 25.
When the alignment mark of the circuit board 10 matches the alignment mark of the wafer 25, as shown in fig. 15 (D), the circuit board 10 and the wafer 25 are sandwiched between the heating table 51 and the suction pad 62, and pressure is applied from both sides of the circuit board 10 and the wafer 25.
Thereby, the circuit board 10 and the wafer 25 are pressed. Since the circuit board 10 and the wafer 25 are held between the heating table 51 and the suction pad 62, the circuit board 10 and the wafer 25 are not bent at the time of pressing, the entire surface of the wafer 25 can be pressed substantially uniformly, the plurality of LEDs 20 formed on the wafer 25 can be fixed to the circuit board 10 at one time, and breakage of the LED20, uneven lighting of the LED20, and breakage of the wafer 25 can be prevented.
3. Inspection step (Steps S110 to S118)
< Steps S110, S112>
As shown in fig. 15 (E), in a state where pressure is applied from both sides of the wafer 25 and the circuit board 10, the controller 151a moves the probes 81 in the-Z direction to bring the probes 81 into contact with the wiring pattern 11, and applies current from the power supply 85 to the wiring pattern 11 via the probes 81.
< Steps S114 to S118>
The control unit 151a checks whether or not all of the LEDs 20 are on based on the image captured by the imaging unit 71. In the case where all the LEDs 20 are not lit (even in the case where there is one unlit LED 20), the controller 151a controls the Z moving unit 55 to move the heating table 51 in the-Z direction, and separates the circuit board 10 from the wafer 25, thereby correcting the defect. Then, the control unit 151a returns the process to step S106.
4. Curing step
< step S200>
When all the LEDs 20 are lit, the control unit 151a moves the probes 81 away from the wiring pattern 11 by the moving unit 82, and heats the circuit board 10 and the wafer 25 by heating the entire heating table 51 by a heating unit, not shown, in a state where pressure is applied from both sides of the circuit board 10 and the wafer 25, thereby curing the adhesive 41. Thus, the LED20 is fixed to the circuit board 10.
5. Pressure release process
< Steps S202 to S206>
The controller 151a stops the air suction by the air suction device 92 and separates the wafer 25 from the suction pad 62. Then, as shown in fig. 15 (F), the controller 151a controls the Z moving unit 55 to move the heating table 51 in the-Z direction, and moves the member to which the wafer 25 is connected to the circuit board 10 together with the heating table 51 in the-Z direction. Finally, the control unit 151a stops the air suction by the air suction device 91 and separates the circuit board 10 from the upper surface 51 a. Then, the circuit board 10 is taken out from the upper surface 51 a.
According to the present embodiment, since the imaging units 76 and 77 are used, the alignment process can be performed simply.
In the present embodiment, the imaging units 76 and 77 are used, but the imaging unit 76 is not essential. When the imaging unit 76 is not used, the processing may be performed in the order of steps S100 (see fig. 10), S102 (see fig. 10), S104 (see fig. 14), and S105 (see fig. 14).
While the embodiments of the present invention have been described in detail with reference to the drawings, the specific configuration is not limited to the embodiments, and design changes and the like are included without departing from the scope of the present invention. Further, the configurations described as the above embodiments and modifications can be combined as appropriate.
In particular, although the bonding apparatuses 2 and 3 for bonding the circuit board 10 and the wafer 25 have been described in the above embodiment, the objects to be bonded by the bonding apparatuses 2 and 3 (corresponding to the 1 st member and the 2 nd member) are not limited to the circuit board 10 and the wafer 25, and the bonding apparatuses 2 and 3 can be used for bonding various members having a substantially plate shape. In the above embodiment, the circuit board 10 is fixed to the heating table 51 and the wafer 25 is fixed to the suction pad 62, but the wafer 25 may be fixed to the heating table 51 and the circuit board 10 may be fixed to the suction pad 62.
In the present invention, the term "substantially" includes not only the case where the two components are strictly identical but also the case where the two components are not identical. For example, the term "substantially parallel" is not limited to a case of being strictly parallel. For example, when simply expressed as parallel, orthogonal, or the like, the term includes not only the case where the two are strictly parallel, orthogonal, or the like, but also the case where the two are substantially parallel, substantially orthogonal, or the like.
Description of the symbols
1: a display device;
2. 3: a bonding device;
10: a circuit substrate;
11: a wiring pattern;
12: a connection pattern;
20：LED；
22: a p-electrode;
23: an n electrode;
25: a wafer;
30: a fluorescent light-emitting layer;
30B: a blue fluorescent light-emitting layer;
30G: a green fluorescent light-emitting layer;
30R: a red fluorescent light-emitting layer;
31: a partition wall;
32: a planarization film;
33: a metal film;
40: a drive circuit;
41: an adhesive;
43: a rigid flexible substrate;
50: a work table;
51: heating the working table;
51 a: an upper surface;
52: inclining the workbench;
53: a theta stage;
54: an XY stage;
55: a Z moving part;
60: an adsorption work table;
61: a cylindrical bracket;
61 a: a recess;
62: adsorbing the bonding pad;
62 a: an aperture;
62 b: a bottom surface;
63: a cover glass;
64: inclining the workbench;
a 65: theta stage;
68: a vacuum adsorption joint;
69: an adsorption part;
71. 76, 77: an image pickup unit;
72: an installation part;
73: a light irradiation section;
74: a mirror;
80: an inspection unit;
81: a probe;
82: a moving part;
85: a power source;
90: a support frame;
91. 92: an air suction device;
101. 102, 103, 104, 105, 106: a mask;
151：CPU；
151 a: a control unit;
152：RAM；
153：ROM；
154: an input/output interface;
155: a communication interface;
156: a media interface;
161: an input/output device;
162: a network;
163: a storage medium.
Claims (12)
1. A bonding apparatus for bonding a substantially plate-shaped member 1 and a transparent substantially plate-shaped member 2, the bonding apparatus comprising:
a substantially plate-shaped 1 st suction portion for sucking the 1 st member;
a substantially plate-shaped 2 nd suction portion provided above the 1 st suction portion in the vertical direction and configured to suck the 2 nd member;
a 1 st moving unit that moves the 1 st suction unit or the 2 nd suction unit in a vertical direction;
a 2 nd moving unit that moves the 1 st suction unit in a horizontal direction; and
an imaging unit provided above the 2 nd suction unit in the vertical direction,
the 2 nd adsorption part is a substantially cylindrical member with both ends covered, and is provided with a suction port for sucking air,
at least a part of the upper surface of the 2 nd adsorption part comprises a transparent component,
the lower surface of the 2 nd adsorption part is a transparent adsorption pad with a through hole in the thickness direction,
the imaging unit images the 1 st member and/or the 2 nd member through the transparent member and the suction pad.
2. The laminating device of claim 1,
the 1 st member and the 2 nd member have a plurality of LEDs formed on one side and a connection pattern formed on the other side,
the bonding apparatus includes a plurality of probes connected to a power supply,
the probe is movable in the vertical direction between a position in contact with the connection pattern and a position not in contact with the connection pattern.
3. The bonding apparatus according to claim 1 or 2, comprising:
a 3 rd moving part which moves the 2 nd adsorption part in a horizontal direction,
the 3 rd moving portion is a substantially cylindrical member and is provided on the upper side of the 2 nd suction portion in the vertical direction.
4. The bonding apparatus according to any one of claims 1 to 3, comprising:
a substantially columnar mounting portion that holds the imaging portion and the 2 nd suction portion;
a light irradiation section provided to the mounting section so as to be positioned at a height between the image pickup section and the 2 nd suction section; and
and a mirror movable in a horizontal direction between a position overlapping with an optical path of the image pickup unit and a position not overlapping with the optical path.
5. The bonding apparatus according to any one of claims 1 to 4, comprising:
and a 1 st control unit that controls the 2 nd moving unit to move the 1 st suction unit while the 1 st member is imaged and observed by the imaging unit through the 2 nd suction unit and the 2 nd member.
6. The bonding apparatus according to claim 2, comprising:
a 4 th moving part which moves the probe in a vertical direction; and
and a 2 nd control unit for controlling the 1 st moving unit to press the 1 st member and the 2 nd member, and controlling the 4 th moving unit to bring the probe into contact with the connection pattern while maintaining the pressed state.
7. A bonding method is characterized by comprising:
placing a plate-like 1 st member on a substantially plate-like 1 st suction portion, sucking a transparent plate-like 2 nd member on a transparent substantially plate-like 2 nd suction portion provided on an upper side of the 1 st suction portion in a vertical direction, and disposing the 1 st member and the 2 nd member substantially in parallel;
moving the 1 st member in a horizontal direction while observing the 1 st member by an imaging unit provided on an upper side of the 2 nd suction unit in a vertical direction through the 2 nd suction unit and the 2 nd member, thereby aligning the 1 st member and the 2 nd member; and
and a step of pressurizing the 1 st member and the 2 nd member.
8. The attaching method according to claim 7,
the 1 st member and the 2 nd member have a plurality of LEDs formed on one side and a connection pattern formed on the other side,
an adhesive is coated on the 1 st component and/or the 2 nd component,
the bonding method comprises:
moving a probe while keeping the 1 st member and the 2 nd member pressurized, and bringing the probe into contact with the connection pattern to light the LED;
a step of photographing the 1 st member and the 2 nd member by the image pickup unit and confirming lighting of the LED by the photographed images; and
and curing the adhesive when all the LEDs are turned on.
9. The attaching method according to claim 7 or 8,
the 1 st member and the 2 nd member are arranged substantially in parallel by a process including:
placing the 2 nd member on the 1 st suction portion;
moving the 1 st suction unit in a horizontal direction while imaging and observing the 2 nd member through the 2 nd suction unit by the imaging unit;
a step of adsorbing the 2 nd member by the 2 nd adsorption part; and
and a step of placing the 1 st member on the 1 st suction portion.
10. A method for manufacturing a display device, comprising a bonding step of bonding a substantially plate-shaped member 1 having a plurality of LEDs formed on one side and a connection pattern formed on the other side and a substantially plate-shaped member 2 having a transparent property,
the bonding step includes:
placing the 1 st member on a substantially plate-shaped 1 st suction portion, sucking the 2 nd member on a transparent substantially plate-shaped 2 nd suction portion provided on an upper side of the 1 st suction portion in a vertical direction, and disposing the 1 st member and the 2 nd member substantially in parallel;
moving the 1 st member in a horizontal direction while observing the 1 st member by an imaging unit provided on an upper side of the 2 nd suction unit in a vertical direction through the 2 nd suction unit and the 2 nd member, thereby aligning the 1 st member and the 2 nd member; and
and a step of pressurizing the 1 st member and the 2 nd member.
11. The method for manufacturing a display device according to claim 10,
an adhesive is coated on the 1 st component and/or the 2 nd component,
the bonding step includes:
moving a probe while keeping the 1 st member and the 2 nd member pressurized, and bringing the probe into contact with the connection pattern to light the LED;
a step of photographing the 1 st member and the 2 nd member by the image pickup unit and confirming lighting of the LED by the photographed images; and
and curing the adhesive when all the LEDs are turned on.
12. The method for manufacturing a display device according to claim 10 or 11,
the 1 st member and the 2 nd member are arranged substantially in parallel by a process including:
placing the 2 nd member on the 1 st suction portion;
moving the 1 st suction unit in a horizontal direction while imaging and observing the 2 nd member through the 2 nd suction unit by the imaging unit;
a step of adsorbing the 2 nd member by the 2 nd adsorption part; and
and a step of placing the 1 st member on the 1 st suction portion.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019-107225 | 2019-06-07 | ||
| JP2019107225A JP7343891B2 (en) | 2019-06-07 | 2019-06-07 | Bonding device, bonding method, and display device manufacturing method |
| PCT/JP2020/020943 WO2020246339A1 (en) | 2019-06-07 | 2020-05-27 | Bonding device, bonding method, and display device production method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113728423A true CN113728423A (en) | 2021-11-30 |
Family
ID=73652867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080031258.1A Pending CN113728423A (en) | 2019-06-07 | 2020-05-27 | Bonding apparatus, bonding method, and method for manufacturing display apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7343891B2 (en) |
| KR (1) | KR20220017391A (en) |
| CN (1) | CN113728423A (en) |
| WO (1) | WO2020246339A1 (en) |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0775817B2 (en) * | 1989-02-27 | 1995-08-16 | 富士機械製造株式会社 | Electronic component holding position detector |
| JP2000183404A (en) | 1998-12-14 | 2000-06-30 | Fuji Photo Film Co Ltd | Light emitting element array and method and apparatus for bonding it |
| JP2008185870A (en) | 2007-01-31 | 2008-08-14 | Epson Imaging Devices Corp | Electro-optical device, method for manufacturing the same, and electronic equipment |
| EP2182791A4 (en) | 2007-08-17 | 2015-07-15 | Fujitsu Ltd | Component mounting apparatus and method |
| JP4247296B1 (en) | 2008-02-22 | 2009-04-02 | 三菱重工業株式会社 | Lamination bonding apparatus and lamination bonding method |
| JP2009295853A (en) | 2008-06-06 | 2009-12-17 | Sony Corp | Element transfer device, element transfer method, and method of manufacturing display device |
| JP5304481B2 (en) | 2009-06-29 | 2013-10-02 | 富士通株式会社 | Mounting apparatus and mounting method |
| JP5444885B2 (en) | 2009-06-29 | 2014-03-19 | 富士通株式会社 | Mounting apparatus and mounting method |
| JP2011138902A (en) | 2009-12-28 | 2011-07-14 | Tokyo Electron Ltd | Mounting method and mounting device |
| CN102449787B (en) | 2010-05-19 | 2014-10-15 | 松下电器产业株式会社 | Method and device for mounting semiconductor light-emitting element |
| JP2012227201A (en) | 2011-04-15 | 2012-11-15 | Citizen Holdings Co Ltd | Inspection device and inspection method for semiconductor light-emitting device |
| JP2014042055A (en) | 2013-10-18 | 2014-03-06 | Nikon Corp | Substrate overlaying device, substrate holding device, and method of manufacturing semiconductor device |
| KR102192572B1 (en) | 2014-06-09 | 2020-12-18 | 삼성전자주식회사 | Method of manufacturing light source module |
| JP6724421B2 (en) | 2016-03-02 | 2020-07-15 | Tdk株式会社 | Component mounting apparatus and mounting method |
| US20200091120A1 (en) | 2017-05-30 | 2020-03-19 | Sharp Kabushiki Kaisha | Semiconductor module, display device, and semiconductor module manufacturing method |
| JP2019015899A (en) | 2017-07-10 | 2019-01-31 | 株式会社ブイ・テクノロジー | Display device manufacturing method, chip component transferring method, and transferring member |
-
2019
- 2019-06-07 JP JP2019107225A patent/JP7343891B2/en active Active
-
2020
- 2020-05-27 KR KR1020217034514A patent/KR20220017391A/en unknown
- 2020-05-27 WO PCT/JP2020/020943 patent/WO2020246339A1/en active Application Filing
- 2020-05-27 CN CN202080031258.1A patent/CN113728423A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2020202252A (en) | 2020-12-17 |
| WO2020246339A1 (en) | 2020-12-10 |
| TW202046528A (en) | 2020-12-16 |
| KR20220017391A (en) | 2022-02-11 |
| JP7343891B2 (en) | 2023-09-13 |
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