JP4694102B2 - Exposure method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a multi with exposure how to expose sequentially aligning a photomask to a plurality of exposure areas of the substrate, relates to a preferred exposure how the particular exposure of large-sized substrate.
[0002]
[Prior art]
As a technique for forming a pattern on a substrate such as a color filter, multi-sided attachment is known in which a number of patterns corresponding to a plurality of devices are formed on a single substrate. As an exposure apparatus for a multi-sided substrate, an exposure apparatus is known in which a stage on which a substrate is mounted is driven with respect to a photomask, and the photomask is sequentially aligned with respect to a plurality of exposure regions for exposure.
[0003]
Although not related to multi-sided attachment, another exposure mechanism is applied to an area that is not exposed by masking after the entire surface is collectively exposed to the substrate by an exposure mechanism having a photomask partially masked. Is known (see Patent Document 1).
[0004]
[Patent Document 1]
Japanese Patent Laid-Open No. 2000-267294
[Problems to be solved by the invention]
However, in the above-described technique, the exposure apparatus becomes larger as the substrate becomes larger, causing various inconveniences. For example, when the width of the exposure apparatus becomes larger than the road, the exposure apparatus must be disassembled, transported from the exposure apparatus manufacturing factory to the ordering factory, and assembled at the ordering factory. If assembly work is required at the supplier's factory, accuracy will be reduced, delivery will be delayed, and costs will be increased.
[0006]
Accordingly, an object of the present invention to provide an exposure how the exposure apparatus can be miniaturized exposure to multi with the substrate.
[0007]
[Means for Solving the Problems]
The present invention will be described below. In order to facilitate understanding of the present invention, reference numerals in the accompanying drawings are added in parentheses, but the present invention is not limited to the illustrated embodiments.
[0008]
The exposure method of the present invention is an exposure method for sequentially exposing a plurality of exposure regions (101) of a multi-sided substrate (100), comprising a photomask (33) and a first stage (31), wherein the substrate is Exposure apparatuses (12A to 12C, 13A to 13C, and 14A to 14C) that drive the first stage placed thereon to align and expose the photomask in at least one of the plurality of exposure regions. Or a plurality of exposure areas are assigned to one of the plurality of exposure apparatuses, and the exposure to the plurality of exposure areas is shared among the plurality of exposure apparatuses. , as the first stage in which the plurality of exposure devices provided respectively to correspond to the photomask exposure region that is shared with the alignment possible range to the exposure apparatuses Utilizing that set the driving range, the substrate is for the pattern of the plurality of layers which function as part of the device to each of the plurality of exposure regions are exposed, the plurality of exposure apparatus, the plurality An optical system (24) for marking a pattern on the substrate and a second stage (21) for placing the substrate; A marking device (11) for forming a plurality of alignment marks (53) corresponding to each of the plurality of exposure regions is disposed separately from the plurality of exposure devices, and the first layer of the plurality of layers is exposed. The marking is performed while the optical system is moved from one of the plurality of exposure areas to another exposure area in a state where the substrate is placed on the second stage before. The plurality of alignment marks are formed using a device, and each of the plurality of exposure apparatuses has its own photo on the basis of a relative position between the plurality of alignment marks and an alignment mark provided on its own photomask. The above-mentioned problem is solved by aligning the mask with the exposure area assigned to the mask.
[0009]
According to the exposure method of the present invention, since exposure on a single substrate is performed among a plurality of exposure apparatuses, each exposure apparatus is within a range in which a photomask can be aligned with an exposure area assigned to itself. It is sufficient if the stage can be driven. For this reason, the space that must be secured as the moving range of the stage in each exposure apparatus is reduced, and each exposure apparatus is reduced in size. Therefore, it is not necessary to assemble the exposure apparatus at the factory where the exposure apparatus is operated, so that the accuracy of the exposure apparatus can be improved, the period necessary for delivery can be shortened, and the cost can be reduced. In addition, since a single substrate is exposed by a plurality of exposure apparatuses, it is possible to form a plurality of types of patterns on a single substrate, preventing imposition loss of the substrate, and various situations. Corresponding mixed flow production can also be performed.
[0011]
For example, the exposure of the substrate to be bonded to another substrate, the need to match the plurality of exposure regions and multiple other opposite region of the substrate, a preset relative position between the plurality of exposure areas relative It must match the position accurately. For this reason, in the conventional exposure method using a laser length measurement system, when exposure is performed only on a part of the plurality of exposure areas, the substrate is transferred to another exposure apparatus. The position of the already exposed exposure area cannot be accurately specified, and it is difficult to accurately position the photomask with respect to the remaining exposure area. Therefore, it has been necessary to perform exposure with a single exposure apparatus for all exposure regions. In the exposure method of the present invention, an alignment mark is formed before the exposure of the first layer, and the relative position between the plurality of exposure areas is specified based on the alignment mark. After the area is exposed, the photomask can be accurately positioned with respect to the remaining exposure area by moving to another exposure apparatus.
[0012]
In the exposure method of the present invention, the substrate is bonded to another substrate (200) having a plurality of facing regions (201) bonded to each of the plurality of exposure regions, When forming the alignment mark, the plurality of counter areas including the influence of the error of the apparatus for forming the pattern of the counter areas is matched with the plurality of exposure areas. The alignment mark may be formed. Even if the alignment mark is formed at a preset position, there is a possibility that the opposed area and the exposure area cannot be accurately matched due to the displacement of the opposed area based on the wrinkles unique to the apparatus that forms the pattern of the opposed area. is there. However, according to the above-described aspect of the present invention, since the alignment mark is formed in consideration of the error of the apparatus for forming the pattern of the counter area, the alignment accuracy between the exposure area and the counter area is improved. The arrangement of the counter area including the influence of the error may be acquired by measuring the position of the counter area of the counter substrate on which the pattern is formed with a marking device, or the operating characteristics of the pattern forming apparatus. You may acquire by grasping | ascertaining the wrinkle of an apparatus by some methods, such as a test.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 is a view showing the arrangement of an exposure system 1 that executes the exposure method of the present invention. The exposure system 1 is configured as a system that performs exposure on the CF substrate 100 (see FIG. 9).
[0017]
The CF substrate 100 is made of, for example, a glass substrate and has a thickness of 1 mm and an area of 4 m ² . The CF substrate 100 is bonded to the TFT substrate 200 (see FIG. 8A) by the bonding apparatus 2 after forming a pattern such as a black matrix layer, an R layer, a G layer, and a B layer. From one set of the CF substrate 100 and the TFT substrate 200, six liquid crystal display devices are manufactured. For this reason, as shown also in FIG. 9, the exposure system 1 exposes the six exposure regions 101... 101 on the CF substrate 100.
[0018]
The exposure system 1 in FIG. 1 includes a marking device 11 for forming alignment marks 53... 53 (see FIG. 9) on the CF substrate 100 and a plurality of exposure devices 12A to 12C for performing exposure on the CF substrate 100. , 13A to 13C, 14A to 14C, and 15A to 15C. For example, the exposure apparatuses 12A to 12C expose the black matrix layer, the exposure apparatuses 13A to 13C expose the R layer, the exposure apparatuses 14A to 14C expose the G layer, and the exposure apparatuses 15A to 15C expose the B layer, respectively. It is provided as. Also, in each exposure apparatus, those with an A (for example, the exposure apparatus 12A) are the exposure areas 101, 101 of the group 102A among the exposure areas 101 ... 101 ((1) and (2 in FIG. 9). )) With the symbol B attached to the exposure region 101, 101 of the group 102B ((3) and (4) in FIG. 9) and the symbol C attached to the group 102C. Exposure regions 101 and 101 ((5) and (6) in FIG. 9) are provided as exposure apparatuses. Therefore, for example, in the exposure of the black matrix layer, the exposure of the exposure regions 101... 101 is set to be shared among the exposure apparatuses 12A to 12C.
[0019]
FIG. 2A is a side view showing the configuration of the marking device 11. The marking device 11 includes a stage 21 for placing the CF substrate 100, an optical system 24 for marking the CF substrate 100, a camera 25 for imaging the stage 21, and the optical system 24 and the camera 25 in the horizontal direction. Are provided with a driving device 22 for moving the optical system 24, a laser length measuring system 23 for measuring the relative position of the optical system 24 and the stage 21, and a control device 26.
[0020]
On the upper surface of the stage 21, an electrostatic chuck 21a that holds the CF substrate 100 by electrostatic force is provided. The electrostatic chuck 21a is the same as the electrostatic chuck 42a (see FIG. 3B) of the bonding apparatus 2. Various known techniques can be used for the electrostatic chuck 21a. The electrostatic chuck 21a includes, for example, an insulator (not shown) and an electrode (not shown) embedded in the insulator. A surface type electrode may be embedded in an insulator, a bipolar electrode may be embedded, or a number of electrodes may be embedded.
[0021]
The optical system 24 includes, for example, a laser 27 and an objective lens 28. As shown in FIG. 2B, the laser light L output from the laser 27 is irradiated to the irradiation position H while being condensed by the objective lens 28. If a layer 150 made of, for example, chromium or resin is formed on the CF substrate 100, a hole is made at the irradiation position H by the laser light L. Therefore, the alignment mark 53 is formed on the CF substrate 100 by scanning the CF substrate 100 on which the photosensitive resin in which the pigment for the black matrix layer is dispersed or the chromium film is formed. The scanning of the laser beam L may be performed by driving the entire optical system 24 on the stage 21 by the driving device 22 or scanning by driving a lens or a mirror included in the optical system 24. Also good. For example, a pulse laser may be used as the laser 27, and marking may be performed by connecting dots.
[0022]
The camera 25 is configured as a CCD camera, for example, and outputs a video signal based on the captured image to the control device 26. The camera 25 is provided so as to be able to move integrally with the optical system 24 on the stage 21 and is provided so as to be able to image a range irradiated with the laser light L. The control device 26 is configured as a computer including, for example, a CPU, a ROM, a RAM, and an external storage device, and various devices such as an electrostatic chuck 21a, a drive device 22, a laser 27, and the like according to a program recorded in the external storage device. Control the operation of the device. The drive device 22 includes, for example, an electric motor, and its operation is controlled by the control device 26. The laser measurement system 23 irradiates laser light toward a reflecting mirror (not shown) that moves together with the optical system 24, for example, and receives the reflected laser light and measures the distance to the reflecting mirror. And a laser interferometer (not shown). The laser interferometer outputs a signal corresponding to the measured distance to the control device 26.
[0023]
FIG. 3A is a side view showing the configuration of the exposure apparatus 12A. The exposure apparatuses 12B, 12C, 13A to 13C, 14A to 14C, and 15A to 15C have substantially the same configuration. The exposure apparatus 12A includes a stage 31 on which the CF substrate 100 is placed, a driving device 32 that drives the stage 31 in the horizontal direction, a photomask 33 disposed above the stage 31, and a stage 2 from above the photomask 33. Cameras 34 and 34 for imaging the top and a control device 35 are provided. In addition, the exposure apparatus 12A includes various apparatuses such as an illuminating apparatus for irradiating the photomask 33 with a light beam, but the description is omitted because it is not the gist of the present invention.
[0024]
As shown in FIG. 4A, the stage 31 is configured to be movable within a range (L1 × L2) in which the photomask 33 can be positioned only in the exposure areas 101 and 101 of the group 102A. Therefore, as in the conventional exposure apparatus shown in FIG. 4B, the stage 31 is within a range (L1 × L3 range) in which the photomask 33 can be aligned with respect to all the exposure regions 101... 101 on the substrate 100. The exposure apparatus 12A is downsized as compared with the case where is configured to be movable. Similarly, the exposure apparatuses 12B, 12C, 13A to 13C, 14A to 14C, and 15A to 15C are configured so that the photomask 33 can be aligned only in the exposure areas 101 and 101 of the group assigned to itself.
[0025]
A vacuum chuck 31 a is provided on the upper surface of the stage 31. The drive device 32 includes, for example, an electric motor and is controlled by the control device 35. As shown in FIG. 9, the photomask 33 has a size that covers one exposure region 101. In addition, the photomask 33 includes alignment marks 51 and 51 at positions outside the region corresponding to the exposure region 101. The cameras 34 and 34 are provided at positions where the alignment marks 51 and 51 can be imaged, and output video signals based on the captured images to the control device 35. The control device 35 is configured as a computer, for example, similarly to the control device 26, and controls the operation of various devices such as the drive device 32 in accordance with a program or the like recorded in the external storage device.
[0026]
FIG. 3B is a side view showing the configuration of the bonding apparatus 2. The laminating apparatus 2 is configured as an apparatus for laminating the CF substrate 100 and the TFT substrate 200 in a vacuum after the CF substrate 100 and the TFT substrate 200 are vertically opposed to each other and liquid crystal is dropped on the lower substrate. ing.
[0027]
The bonding apparatus 2 includes a chamber 41 capable of maintaining the inside thereof in a reduced pressure state, and surface plates 42 and 43 provided inside the chamber 41 and opposed to each other in the vertical direction. In addition, the laminating apparatus 2 includes a driving apparatus that drives the surface plates 42 and 43 up and down to approach or separate from each other, but the description is omitted because it is not the gist of the present invention. The surface plates 42 and 43 include electrostatic chucks 42a and 43a for holding the CF substrate 100 and the TFT substrate 200 by electrostatic force, respectively. The CF substrate 100 and the TFT substrate 200 are held by the electrostatic chucks 42a and 43a, respectively. It is pasted together.
[0028]
An operation of the exposure system 1 having the above-described configuration will be described.
[0029]
The exposure system 1 learns the positions of the opposed regions 201... 201 of the TFT substrate 200 by the marking device 11 before the CF substrate 100 is exposed. FIG. 5 is a flowchart showing the procedure of the position measurement process executed by the control device 26 of the marking device 11 during the learning. This process is executed, for example, when the user performs a predetermined input operation on the control device 26. This process is based on the premise that the TFT substrate 200 is placed on the stage 21 as shown in FIG.
[0030]
As shown in FIG. 8A, the TFT substrate 200 has opposing regions 201... 201 to be bonded to the exposure regions 101... 101 of the CF substrate 100, respectively. Exposure has already been performed by an exposure system different from the exposure system 1. The TFT substrate 200 has a plurality of sets of alignment marks 52 and 52 around the opposing areas 201. The alignment marks 52 and 52 indicate the positions of the opposing areas 201... 201, and, for example, when the opposing area 201 is exposed, the pattern of the alignment marks 52 is also exposed at the same time.
[0031]
The TFT substrate 200 is placed on the stage 21 with the surface (film surface) to be bonded to the CF substrate 100 facing down. Note that the placement of the TFT substrate 200 on the stage 21 may be performed manually by the user, or by a transfer device (not shown) of the marking device 11 for placing the CF substrate 100 on the stage 21. Also good.
[0032]
In step S <b> 1 of FIG. 5, the control device 26 controls the operation of the driving device 22 to position the optical system 24 and the camera 25 so that any one of the alignment marks 52... 52 is positioned below the camera 25. Move. This control is performed based on a control amount recorded in advance in the control device 26, for example.
[0033]
Next, based on the position of the alignment mark 52 relative to the camera 25 measured by the camera 25 and the position of the optical system 24 (camera 25) measured by the laser length measurement system 23, the control device 26 determines the alignment mark 52. The position is specified (step S2). In step S3, it is determined whether or not measurement has been completed for all alignment marks 52 ... 52. If it is determined that measurement has not been completed, steps S1 and S2 are repeatedly executed, and the remaining alignment marks 52 ... 52 are checked. The position is measured sequentially. If it is determined that the process has ended, the process ends. If the offset between the position of the camera 25 and the irradiation position H is specified by, for example, marking on the test substrate by the optical system 24 in advance, the irradiation position H at the position of the alignment mark 52. The position of the optical system 24 when these are combined is specified.
[0034]
After learning the opposing regions 201... 201 of the TFT substrate 200, the exposure system 1 receives the CF substrate 100 on the surface of which is made of chromium, resin, or resist to be a black matrix layer. Processing for forming the alignment mark 53 on 100 is executed.
[0035]
FIG. 6 is a flowchart showing the procedure of the marking process executed by the control device 26 of the marking device 11. This process is started, for example, when the CF substrate 100 is placed on the stage 21. While this processing is being performed, the CF substrate 100 is held by suction by the electrostatic chuck 21a.
[0036]
In step S11, the control device 26 of the optical system 24 that the laser length measurement system 23 measures so as to make the irradiation position H coincide with one of the positions of the alignment mark 52 measured in the position measurement process (see FIG. 5). The optical system 24 is moved by controlling the operation of the driving device 22 while referring to the position. Next, the laser 27 is driven to form an alignment mark 53 on the CF substrate 100. In step S13, it is determined whether or not the alignment marks 53... 53 are formed corresponding to all the alignment marks 52... 52 of the TFT substrate 200. If it is determined that they are not formed, steps S11 and S12 are performed. Run repeatedly. Thus, as shown in FIGS. 8A and 8B, the alignment marks 53... 53 of the CF substrate 100 are sequentially formed in the same arrangement as the alignment marks 52.
[0037]
After forming the alignment marks 53 ... 53, the exposure system 1 transports the CF substrate 100 in the order of the exposure apparatuses 12A, 12B, and 12C by a transport apparatus (not shown), and exposes the black matrix layer by the exposure apparatuses 12A to 12C. To do.
[0038]
FIG. 7 is a flowchart showing a procedure of exposure processing executed by the control device 35 of the exposure apparatus 12A. This process is started when the CF substrate 100 is placed on the stage 31, for example, as shown in FIG. While this process is being performed, the CF substrate 100 is held by suction by the vacuum chuck 31a.
[0039]
First, the control device 35 controls the operation of the drive device 32 so that one of the exposure regions 101 and 101 of the group 102A is positioned below the photomask 33 (step S21). This control is performed based on a control amount recorded in advance in the control device 35, for example. Next, the camera 7 images the alignment mark 51 of the photomask 33 and the alignment mark 53 of the CF substrate 100 (step S22), and specifies the positional deviation between the alignment mark 51 and the alignment mark 53 (step S23). Then, as shown in FIG. 9, the photomask 33 and the exposure area 101 are aligned based on the positional deviation (step S24). Thereafter, in step S25, an illumination device (not shown) is driven to perform exposure. In step S15, it is determined whether or not the exposure has been completed for all the exposure areas 101 and 101 of the group 102A. If it is determined that the exposure has not ended, steps S21 to S25 are repeatedly executed. As a result, as shown in FIG. 9, the exposure areas 101 and 101 of the group 102A are sequentially exposed.
[0040]
In the exposure apparatuses 12B and 12C, the same processing is executed by the control device included in each exposure apparatus, and exposure is sequentially performed on the exposure regions 101... 101 of the groups 102B and 102C.
[0041]
After the exposure of the black matrix layer, the CF substrate 100 is transported to various apparatuses such as a development processing apparatus (not shown). In the R layer, G layer, and B layer as well as the black matrix layer, after a resist or the like is formed by a coater (not shown), exposure to each layer is performed by the exposure devices 13A to 13C, 14A to 14C, and 15A to 15C. Is executed. In these exposure apparatuses as well, the alignment of the photomask 33 is performed with reference to the alignment marks 53... 53 formed by the marking apparatus 11 before the black matrix layer is exposed.
[0042]
The present invention is not limited to the above embodiment, and may be implemented in various forms as long as it is substantially the same as the technical idea of the present invention.
[0043]
Various methods may be used for measuring the positions of the opposing regions 201... 201 of the TFT substrate 200. Measurement may be performed by a device different from the marking device 11 and data of the measurement result may be input to the marking device 11. For example, the position of the facing area 201 may be directly measured based on the pattern of the facing area 201.
[0044]
In the marking device 11, the CF substrate 100 is held by an electrostatic chuck. However, the CF substrate 100 may be held by a vacuum chuck.
[0045]
The alignment mark 53 of the substrate to be exposed may be formed by various methods. For example, if the light transmittance of the layer formed on the substrate is high, laser light is condensed inside the glass substrate, and marking is performed by changing the optical properties of the glass substrate at the condensing point, so-called inner glass Marking (IGM) may be used. When marking by IGM, for example, bubbles may be generated inside the glass by laser light, and the optical properties may be changed so that the light is scattered at the focal point. Laser light may be scanned or the substrate may be irradiated with laser light through a photomask having an alignment mark pattern to change the optical properties of the substrate. Marking may be performed by depositing another material, for example, by depositing a chromium film.
[0046]
As shown in FIG. 10A, the exposure regions 101 of the groups 102A to 102C may have different patterns. As shown in FIG. 10B, the sizes of the exposure regions 101 of the groups 102A to 102C may be different from each other. The number and arrangement of groups and the number and arrangement of exposure areas 101 in each group may be set as appropriate.
[0047]
The exposure apparatus may expose a plurality of layers. For example, the photomasks for the black matrix layer, R layer, G layer, and B layer are attached to the exposure apparatuses 12A to 12C, respectively, and each layer is exposed by the exposure apparatuses 12A to 12C, and the exposure apparatuses 13A to 13C, 14A-14C and 15A-15C may be omitted.
[0048]
【The invention's effect】
As described above, according to the exposure method of the present invention, since exposure on a single substrate is performed among a plurality of exposure apparatuses, each exposure apparatus can apply a photomask to an exposure area assigned to itself. It suffices if the stage can be driven within the range in which the positions can be aligned. For this reason, the space that must be secured as the moving range of the stage in each exposure apparatus is reduced, and each exposure apparatus is reduced in size. Therefore, it is not necessary to assemble the exposure apparatus at the factory where the exposure apparatus is operated, so that the accuracy of the exposure apparatus can be improved, the period necessary for delivery can be shortened, and the cost can be reduced. In addition, since a single substrate is exposed by a plurality of exposure apparatuses, it is possible to form a plurality of types of patterns on a single substrate, preventing imposition loss of the substrate, and various situations. Corresponding mixed flow production can also be performed.
[Brief description of the drawings]
FIG. 1 is a view showing the arrangement of an exposure system according to the present invention.
FIG. 2 is a view showing the configuration of a marking device included in the exposure system of FIG.
3 is a view showing the arrangements of an exposure apparatus and a bonding apparatus included in the exposure system of FIG.
4 is a view showing a moving range of a stage of the exposure apparatus in FIG. 3. FIG.
FIG. 5 is a flowchart showing a procedure of position measurement processing executed by the control device of the marking device of FIG. 2;
6 is a flowchart showing a procedure of marking processing executed by the control device of the marking device of FIG. 2;
7 is a flowchart showing the procedure of exposure processing executed by the control device of the exposure apparatus in FIG. 3;
8 is a diagram illustrating a state of the marking device in FIG. 2 when the position measurement process in FIG. 5 and the marking process in FIG. 6 are performed.
9 is a view showing a state of the exposure apparatus of FIG. 3 when the exposure process of FIG. 7 is executed.
FIG. 10 is a view showing a modification of imposition of a substrate to be exposed.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Exposure system 11 Marking apparatus 12A-12C, 13A-13C Exposure apparatus 14A-14C, 15A-15C Exposure apparatus 31 Stage 33 Photomask 55 Alignment mark 100 CF substrate 101 Exposure area 200 TFT substrate 201 Opposite substrate

Claims (2)

In an exposure method of sequentially exposing a plurality of exposure areas of a multi-sided substrate,
A photomask and a first stage are provided, and the first stage on which the substrate is placed is driven to align the photomask to at least one of the plurality of exposure regions and perform exposure. Multiple exposure devices to be
Assigning each of the plurality of exposure areas to any of the plurality of exposure apparatuses, and performing exposure for the plurality of exposure areas among the plurality of exposure apparatuses,
As the first stage provided in each of the plurality of exposure apparatuses, a driving range is set so as to correspond to a range in which the photomask can be aligned with an exposure area assigned to each exposure apparatus,
The substrate is one in which a pattern of a plurality of layers functioning as a part of a device is exposed to each of the plurality of exposure regions,
The plurality of exposure apparatuses expose at least one pattern of the plurality of layers,
Marking comprising an optical system for marking on the substrate and a second stage for mounting the substrate, and forming a plurality of alignment marks respectively corresponding to the plurality of exposure regions on the substrate. An apparatus is disposed separately from the plurality of exposure apparatuses,
While moving the optical system from any one of the plurality of exposure areas to another exposure area with the substrate placed on the second stage before the exposure of the first layer of the plurality of layers. using the marking device forms a plurality of alignment marks,
Each of the plurality of exposure apparatuses aligns its own photomask to an exposure area assigned to itself based on a relative position between the plurality of alignment marks and an alignment mark provided on the photomask. An exposure method characterized by the above. The substrate is bonded to another substrate having a plurality of opposing regions bonded to each of the plurality of exposure regions,
When forming the plurality of alignment marks, the arrangement of the plurality of counter areas including the influence of the error of the apparatus for forming the pattern of the counter area is matched with the arrangement of the plurality of exposure areas. The exposure method according to claim 1, wherein the plurality of alignment marks are formed.

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