JP4694101B2 - Exposure method and pattern forming apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for exposing a substrate such as a color filter and a TFT substrate that are bonded together to form a device.
[0002]
[Prior art]
As an exposure device that sequentially exposes a mask pattern to multiple exposure areas on a substrate, the stage is driven while measuring the position of the stage by a laser length measurement system, thereby aligning the photomask and exposure area sequentially. It has been known. When performing exposure on a plurality of layers using this exposure apparatus, for example, when performing exposure on a color filter, separate exposure apparatuses corresponding to the respective layers such as the black matrix layer and the R, G, and B layers Is prepared. The exposure device for the first layer (black matrix layer) aligns the photomask using a laser length measurement system and forms an alignment mark simultaneously with the exposure, and the subsequent layers (R, G, B layers) The exposure apparatus performs exposure by aligning the photomask based on the alignment mark.
[0003]
Further, as an apparatus for exposing a field divided into a plurality by a semiconductor wafer scribe line, an apparatus that forms an alignment mark on the scribe line and aligns the alignment mark with the alignment mark of the photomask is known. (See Patent Document 1).
[0004]
[Patent Document 1]
Japanese Patent Laid-Open No. 5-109605
[0005]
[Problems to be solved by the invention]
In the above-described technique, various disadvantages occur because the laser length measurement system is provided in the exposure apparatus. For example, a high accuracy is required for the laser length measurement system because a plurality of exposure areas must match each other when bonded to another substrate. However, in the laser length measurement system, an error occurs in a measurement value due to a change in temperature, a change in atmospheric pressure, and the like, and thus it is necessary to control the temperature of the exposure apparatus with high accuracy. In addition, the exposure apparatus for the first layer and the exposure apparatus for the subsequent layers have different apparatus configurations, and it has been difficult to ensure compatibility of the exposure apparatuses. In order to ensure compatibility, it is conceivable to provide a laser length measuring system for all the exposure apparatuses of each layer, but the laser length measuring system is expensive and not practical.
[0006]
Therefore, an object of the present invention is to provide an exposure method and a pattern forming apparatus that do not require a laser length measurement system of an exposure apparatus for alignment between a photomask and an exposure area.
[0007]
[Means for Solving the Problems]
The present invention will be described below. In order to facilitate understanding of the present invention, reference numerals in the accompanying drawings are appended in parentheses, but the present invention is not limited to the illustrated embodiment.
[0008]
  The exposure method of the present invention is an exposure substrate for constituting a device bonded to a counter substrate (101).As glass substrateThe stage (31) on which (100) is placed and the photomask (33) are moved relative to each other toGlass substrateEach of the plurality of exposure regions (100a ... 100a) is exposed to a pattern of a black matrix layer, an R layer, a G layer, and a B layer as a plurality of layers functioning as a part of the device, Before the exposure of the black matrix layer as the first layer, a plurality of alignment marks (53 ... 53) are provided.By changing the optical properties inside the glass substrate by irradiating laser light,AboveInside the glass substrateA plurality of exposure regions of the plurality of layers based on relative positions of the plurality of alignment marks and alignment marks (51... 51) provided on the photomask, and photomasks corresponding to the layers. And sequentially aligningThe exposure method includes a plurality of opposing regions (101a) in which the counter substrate is bonded to each of the plurality of exposure regions, and the glass substrate is held by a chuck device that is an electrostatic chuck or a vacuum chuck. In the forming step, the plurality of the plurality of glass substrates are held in a state where the glass substrate is held by a chuck device of the same model as the chuck device used for the bonding. Form alignment marksThis solves the above-described problem.
[0009]
  According to the present invention, in all the layers that function as a part of the device, the alignment between the exposure region and the photomask is performed based on the alignment mark. Therefore, it is necessary to provide a laser measuring system in the exposure apparatus for each layer. No. Therefore, relaxation of temperature conditions during operation and ensuring of compatibility of the exposure apparatus are realized. Also, it is attached to the counter substrateGlassIn the exposure to the substrate, it is necessary to match the plurality of exposure regions with the plurality of counter regions of the counter substrate, so that the relative positions between the plurality of exposure regions must be set in advance. For this reason, in the conventional method of exposing the first layer using a laser length measurement system, when only a part of the plurality of exposure areas is exposed, the substrate is placed on another exposure apparatus. If moved, the position of the already exposed exposure area could not be specified, and the remaining exposure area could not be exposed. Therefore, it is necessary to perform exposure with one exposure apparatus for all exposure regions of one layer. However, in the present invention, since the relative positions of the plurality of exposure areas are specified by the alignment mark before exposure, after exposure to some of the plurality of exposure areas, the remaining exposure apparatus is moved to the remaining exposure apparatus. It is also possible to expose the exposure area. Thereby, it becomes possible to form each pattern of the black matrix layer, R layer, G layer, and B layer as a plurality of layers on a single substrate, to prevent imposition loss of the substrate, and to various circumstances Corresponding mixed flow production can be performed. In this case, an alignment mark is formed inside the glass.GlassThere is no possibility that the alignment mark is deformed or deleted by the processing on the substrate. For this reason, alignment of the photomask with respect to the exposure region of each layer is accurately performed.Even if the alignment mark is formed at an accurate position and exposure is performed, the glass substrate is deformed by the chuck device which is an electrostatic chuck or a vacuum chuck at the time of bonding, and the position of the exposure area is shifted, so that the exposure area and the counter area May not be accurately aligned. However, according to the present invention, since the alignment mark is formed on the glass substrate in a state where the deformation at the time of bonding is reproduced, the position of the exposure area at the time of forming the alignment mark and the position of the exposure area at the time of bonding are The exposure area and the counter area are aligned with high accuracy.
[0010]
  In the exposure method of the present invention,in frontIn the forming step, the plurality of alignment marks are arranged so that the arrangement of the plurality of counter areas including the influence of the error of the apparatus for forming the pattern of the counter area coincides with the arrangement of the plurality of exposure areas. May be formed on the exposed substrate. Even if the alignment mark is formed at a preset position, there is a possibility that the opposed area and the exposure area cannot be accurately matched due to the displacement of the opposed area based on the wrinkles unique to the apparatus that forms the pattern of the opposed area. is there. However, according to the above-described aspect of the present invention, since the alignment mark is formed in consideration of the error of the apparatus for forming the pattern of the counter area, the alignment accuracy between the exposure area and the counter area is improved. The arrangement of the counter area including the influence of the error may be acquired by measuring the position of the counter area of the counter substrate on which the pattern is formed with a marking device, or the operating characteristics of the pattern forming apparatus. You may acquire by grasping | ascertaining the wrinkle of an apparatus by some methods, such as a test.
[0013]
  The pattern forming apparatus (1) of the present invention comprises an exposure substrate for constituting a device by being bonded to a counter substrate (101).Board andGlass substrate(100)Is moved relative to the stage (31) and the photomask (33),Glass substrateExposure apparatuses (12, 13, 14) that expose the respective patterns of the black matrix layer, the R layer, the G layer, and the B layer as a plurality of layers that function as a part of the device in each of the plurality of exposure regions (100a) 15)WhenA plurality of alignment marks are provided separately from the exposure apparatus, and before the exposure of the black matrix layer, which is the first layer among the plurality of layers.The inside of the glass substrate is irradiated with laser light to change the optical properties inside the glass substrate.Marking device to be formed (11)WhenWithThe counter substrate has a plurality of counter regions (101a) bonded to each of the plurality of exposure regions.Pattern forming deviceBecause,The glass substrate is bonded to the counter substrate while being held by a chuck device which is an electrostatic chuck or a vacuum chuck, and the marking device is the same model as the chuck device used for the bonding The plurality of alignment marks are formed while the glass substrate is held by the chuck device.This solves the above-described problem.
[0014]
  According to the pattern forming apparatus of the present invention, before exposing each layer by the exposure apparatus, the marking substrate is irradiated with laser light on the exposure substrate to change the optical properties inside the glass substrate. Form alignment mark insideIn addition, when forming the alignment mark, the glass substrate is held by a chuck device of the same model as the chuck device used for bonding to the counter substrate.Thus, the above-described exposure method can be realized.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 is a diagram showing a configuration of a pattern forming apparatus 1 according to the present invention. The pattern forming apparatus 1 is formed as an apparatus for forming a pattern on the CF substrate 100 (exposure substrate, see FIG. 8) by photolithography.
[0016]
The CF substrate 100 is made of, for example, a glass substrate, and has a thickness of 1 mm and an area of 4 m.²Is formed. The CF substrate 100 is bonded to the TFT substrate 101 (see FIG. 7A) by the bonding device 2 after pattern formation by the pattern forming device 1. From one set of the CF substrate 100 and the TFT substrate 101, six liquid crystal display devices are manufactured. Therefore, as shown in FIG. 8, the pattern forming apparatus 1 exposes the six exposure regions 100a... 100a on the CF substrate 100.
[0017]
The pattern forming apparatus 1 in FIG. 1 includes a marking device 11 for forming alignment marks 53 (see FIG. 7B) on the CF substrate 100, and a plurality of devices for performing exposure on each layer on the CF substrate 100. Exposure apparatuses 12 to 15. The exposure apparatuses 12 to 15 are provided corresponding to, for example, a black matrix layer, an R layer, a G layer, and a B layer, respectively. In addition to this, the pattern forming apparatus 1 includes a coater for forming a thin film of a photosensitive resin or a resist in which a pigment is dispersed on the surface of the CF substrate 100 before exposure by each of the exposure apparatuses 12 to 15, and a CF substrate after exposure. Various devices such as a developing device for performing development processing on 100 are provided, but since they are not the gist of the present invention, description thereof will be omitted.
[0018]
FIG. 2A is a side view showing the configuration of the marking device 11. The marking device 11 includes a stage 21 for mounting the CF substrate 100, a driving device 22 for driving the stage 21 in the horizontal direction, a laser length measurement system 23 for measuring the position of the stage 21, and a CF An optical system 24 for marking the substrate 100, a camera 25 for imaging the stage 21, and a control device 26 are provided.
[0019]
On the upper surface of the stage 21, an electrostatic chuck 21a that holds the CF substrate 100 by electrostatic force is provided. The electrostatic chuck 21a is the same as the electrostatic chuck 42a (see FIG. 3B) of the bonding apparatus 2. Various known techniques can be used for the electrostatic chuck 21a. The electrostatic chuck 21a includes, for example, an insulator (not shown) and an electrode (not shown) embedded in the insulator. A surface type electrode may be embedded in an insulator, a bipolar electrode may be embedded, or a number of electrodes may be embedded.
[0020]
The drive device 22 includes, for example, an electric motor, and its operation is controlled by the control device 26. The laser length measurement system 23 is configured to include, for example, a laser interferometer (not shown) that irradiates the stage 21 with laser light and receives the reflected laser light to measure the distance to the stage. . The laser interferometer outputs a signal corresponding to the measured distance to the control device 26.
[0021]
The optical system 24 includes, for example, a laser 27 and an objective lens 28. As shown in FIG. 2B, the laser light L output from the laser 27 is condensed at the condensing point Q by the objective lens 28. At the condensing point Q, the optical properties of the CF substrate 100 are changed by the laser light L. For example, bubbles are generated inside the glass by the laser light L, and light is easily scattered at the condensing point Q. Therefore, the alignment mark 53 is formed on the CF substrate 100 by scanning the laser beam L with respect to the CF substrate 100. The scanning with the laser beam L may be performed by driving the stage 21 in the horizontal direction, or may be performed by driving a lens or a mirror included in the optical system 24. For example, a pulse laser may be used as the laser 27, and marking may be performed by connecting dots.
[0022]
The camera 25 is configured as a CCD camera, for example, and outputs a video signal based on the captured image to the control device 26. The camera 25 is provided so as to be able to take an image of a range irradiated with the laser light L by the optical system 24. The control device 26 is configured as a computer including, for example, a CPU, a ROM, a RAM, and an external storage device, and various devices such as an electrostatic chuck 21a, a drive device 22, a laser 27, and the like according to a program recorded in the external storage device. Control the operation of the device.
[0023]
FIG. 3A is a side view showing the configuration of the exposure apparatus 12. The exposure apparatuses 13 to 15 have the same configuration. The exposure apparatus 12 includes a stage 31 on which the CF substrate 100 is placed, a driving device 32 that drives the stage 31 in the horizontal direction and the vertical direction, a photomask 33 disposed above the stage 31, and an upper side of the photomask 33. Cameras 34 and 34 for capturing images on the stage 2 and a control device 35. In addition, the exposure apparatus 12 includes various devices such as an illuminating device for irradiating the photomask 33 with a light beam, but the description is omitted because it is not the gist of the present invention. However, the exposure apparatus 12 has a scale for measuring the position of the stage 31 in the horizontal direction, but is not provided with a laser length measurement system.
[0024]
A vacuum chuck 31 a is provided on the upper surface of the stage 31. The drive device 32 includes, for example, an electric motor and is controlled by the control device 35. As shown in FIG. 8, the photomask 33 has a size that covers one exposure region 100a. Further, the photomask 33 includes alignment marks 51 and 51 at positions outside the region corresponding to the exposure region 100a. The cameras 34 and 34 are provided at positions where the alignment marks 51 and 51 can be imaged, and output video signals based on the captured images to the control device 35. The control device 35 is configured as a computer, for example, similarly to the control device 26, and controls the operation of various devices such as the drive device 32 in accordance with a program or the like recorded in the external storage device. Note that one of the control device 26 and the control device 35 may be used as the other.
[0025]
FIG. 3B is a side view showing the configuration of the bonding apparatus 2. The laminating apparatus 2 is configured as an apparatus for laminating the CF substrate 100 and the TFT substrate 101 in a vacuum after the CF substrate 100 and the TFT substrate 101 are vertically opposed to each other and liquid crystal is dropped on the lower substrate. ing.
[0026]
The bonding apparatus 2 includes a chamber 41 capable of maintaining the inside thereof in a reduced pressure state, and surface plates 42 and 43 provided inside the chamber 41 and opposed to each other in the vertical direction. In addition, the laminating apparatus 2 includes a driving apparatus that drives the surface plates 42 and 43 up and down to approach or separate from each other, but the description is omitted because it is not the gist of the present invention. The surface plates 42 and 43 include electrostatic chucks 42a and 43a for holding the CF substrate 100 and the TFT substrate 101 by electrostatic force, respectively. The CF substrate 100 and the TFT substrate 101 are held by the electrostatic chucks 42a and 43a, respectively. It is pasted together.
[0027]
The operation of the pattern forming apparatus 1 having the above configuration will be described.
[0028]
The pattern forming apparatus 1 learns the positions of the exposure regions 101a to 101a of the TFT substrate 101 by the marking device 11 before processing the CF substrate 100. FIG. 4 is a flowchart showing a procedure of position measurement processing executed by the control device 26 of the marking device 11 during the learning. This process is executed, for example, when the user performs a predetermined input operation on the control device 26. This process is based on the premise that the TFT substrate 101 is placed on the stage 21 as shown in FIG.
[0029]
As shown in FIG. 7A, the TFT substrate 101 has regions 101a... 101a to be bonded to the exposure regions 100a... 100a of the CF substrate 100, respectively. Patterning has already been performed by a manufacturing apparatus different from the apparatus 1. The TFT substrate 101 has a plurality of sets of alignment marks 52 and 52 around the areas 101a. The alignment marks 52 and 52 indicate the positions of the regions 101a to 101a. For example, when the region 101a is exposed, the pattern of the alignment marks 52 is also exposed and formed.
[0030]
The TFT substrate 101 is placed on the stage 21 with the surface (film surface) to be bonded to the CF substrate 100 facing down. Note that the placement of the TFT substrate 101 on the stage 21 may be performed manually by the user, or by a transfer device (not shown) of the marking device 11 for placing the CF substrate 100 on the stage 21. Also good.
[0031]
In step S <b> 1 of FIG. 4, the control device 26 moves the stage 21 by controlling the operation of the driving device 22 so that any one of the alignment marks 52... 52 is positioned below the camera 25. This control is performed based on a control amount recorded in advance in the control device 26, for example.
[0032]
Next, the control device 26 specifies a deviation between the alignment mark 52 and the condensing point Q based on the video signal from the camera 25 (step S2), and controls the driving device 22 to collect the alignment mark 52 and the collection mark. The light spot Q is aligned (step S3). Then, the position of the stage 21 when aligned is measured and recorded by the laser length measurement system 23 (step S4). In step S5, it is determined whether or not the measurement has been completed for all the alignment marks 52... 52. If it is determined that the measurement has not been completed, steps S1 to S4 are repeatedly executed, and the remaining alignment marks 52. The stage position when the condensing point Q is matched is sequentially measured. If it is determined that the process has ended, the process ends. Note that the position of the condensing point Q may be specified in advance by marking the test substrate with the optical system 24 in advance, for example.
[0033]
After learning the exposure areas 101a... 101a of the TFT substrate 101, when the pattern forming apparatus 1 receives the CF substrate 100 on which the resist of each layer has not yet been formed, the marking apparatus 11 is carried out by a transport device (not shown). The CF substrate 100 is transported in the order of the exposure apparatuses 12, 13, 14, and 15, and various processes are executed on the CF substrate 100 by the apparatuses 11 to 15.
[0034]
FIG. 5 is a flowchart showing the procedure of the marking process executed by the control device 26 of the marking device 11. This process is started, for example, when the CF substrate 100 is placed on the stage 21. While this processing is being performed, the CF substrate 100 is held by suction by the electrostatic chuck 21a. Note that a resist or the like corresponding to each layer is not yet formed on the CF substrate 100 placed on the stage 21.
[0035]
In step S11, the control device 26 operates the drive device 22 so that the stage position measured by the laser length measurement system 23 matches one of the stage positions measured in step S4 of the position measurement process (see FIG. 4). To move the stage 21. Next, the laser 27 is driven to form an alignment mark 53 on the CF substrate 100. In step S13, it is determined whether or not the alignment marks 53... 53 are formed corresponding to all the alignment marks 52... 52 of the TFT substrate 101. If it is determined that they are not formed, steps S11 and S12 are performed. Run repeatedly. Thus, as shown in FIGS. 7A and 7B, the alignment marks 53... 53 of the CF substrate 100 are sequentially formed in the same arrangement as the alignment marks 52.
[0036]
FIG. 6 is a flowchart showing a procedure of exposure processing executed by the control device 35 of the exposure apparatus 12. This process is started when the CF substrate 100 is placed on the stage 31, for example, as shown in FIG. While this process is being performed, the CF substrate 100 is held by suction by the vacuum chuck 31a. A black matrix layer resist is formed on the CF substrate 100 placed on the stage 31.
[0037]
First, the control device 35 controls the operation of the drive device 32 so as to position any one of the exposure regions 100a... 100a below the photomask 33 (step S21). This control is performed based on a control amount recorded in advance in the control device 35, for example. Next, the camera 7 images the alignment mark 51 of the photomask 33 and the alignment mark 53 of the CF substrate 100 (step S22), and specifies the positional deviation between the alignment mark 51 and the alignment mark 53 (step S23). Then, as shown in FIG. 8, the photomask 33 and the exposure region 100a are aligned based on the positional deviation (step S24). Thereafter, in step S25, an illumination device (not shown) is driven to perform exposure. In step S15, it is determined whether or not the exposure has been completed for all the exposure areas 100a... 100a. If it is determined that the exposure has not been completed, steps S21 to S25 are repeatedly executed. As a result, as shown in FIG. 8, the exposure regions 100a... 100a are sequentially exposed.
[0038]
In the exposure apparatuses 13 to 15, the same processing is executed by the control device provided in each apparatus, and exposure is sequentially performed on the exposure areas 100 a to 100 a of the R layer, G layer, and B layer.
[0039]
The present invention is not limited to the above embodiment, and may be implemented in various forms as long as it is substantially the same as the technical idea of the present invention.
[0040]
The holding method of the TFT substrate 101 at the time of measuring the alignment mark 52 of the TFT substrate 101 and the holding method of the CF substrate 100 at the time of forming the alignment mark 53 of the CF substrate 100 are further matched with the holding method by the bonding apparatus 2. May be. For example, when measuring the position of the alignment mark 52 on the TFT substrate 101, the TFT substrate 101 may be held from above by the same electrostatic chuck as the electrostatic chuck 43a.
[0041]
In the bonding apparatus 2, the CF substrate 100 is illustrated on the lower side, but the CF substrate 100 may be on the upper side. In this case, in the marking device 11, the alignment mark 53 may be formed in a state where the CF substrate 100 is held from above by an electrostatic chuck.
[0042]
In the marking device 11, the CF substrate 100 is held by an electrostatic chuck. However, the CF substrate 100 may be held by a vacuum chuck.
[0043]
Various methods may be used for position measurement of the exposure regions 101a... 101a of the TFT substrate 101. Measurement may be performed by a device different from the marking device 11 and data of the measurement result may be input to the marking device 11. For example, the position of the exposure region 101a may be directly measured based on the pattern of the exposure region 101a.
[0044]
The alignment mark 53 of the CF substrate 100 may be formed by various methods. For example, the CF substrate 100 may be irradiated with laser light through a photomask having an alignment mark pattern to change the optical properties of the CF substrate 100. Other materials may be deposited, such as by depositing a chromium film. Since the alignment mark 53 only needs to be formed before the pattern of the black matrix layer is exposed, the chromium mark or the resin BM film may be marked with a laser.
[0045]
【The invention's effect】
As described above, according to the present invention, the alignment of the exposure region and the photomask is performed based on the alignment mark in all the layers functioning as a part of the device. There is no need to provide a length measurement system. Therefore, relaxation of temperature conditions during operation and ensuring of compatibility of the exposure apparatus are realized. In addition, after exposing a part of the plurality of exposure areas, the exposure area can be transferred to another exposure apparatus to expose the remaining exposure areas. This makes it possible to form a plurality of types of patterns on a single substrate, prevent imposition loss of the substrate, and perform mixed flow production according to various circumstances.
[Brief description of the drawings]
FIG. 1 is a diagram showing a configuration of a pattern forming apparatus to which the present invention is applied.
FIG. 2 is a diagram illustrating a configuration of a marking device included in the pattern forming apparatus of FIG.
3 is a view showing the configuration of an exposure apparatus and a bonding apparatus included in the pattern forming apparatus of FIG.
4 is a flowchart showing a procedure of position measurement processing executed by the control device of the marking device of FIG. 2;
5 is a flowchart showing a procedure of marking processing executed by the control device of the marking device in FIG. 2;
6 is a flowchart showing the procedure of exposure processing executed by the control device of the exposure apparatus in FIG. 3;
7 is a diagram illustrating a state of the marking device in FIG. 2 when the position measurement process in FIG. 4 and the marking process in FIG. 5 are performed.
8 is a view showing a state of the exposure apparatus of FIG. 3 when the exposure process of FIG. 6 is executed.
[Explanation of symbols]
1 Pattern forming device
11 Marking device
12, 13, 14, 15 Exposure apparatus
21a, 42a Electrostatic chuck
31 stages
33 Photomask
51, 53 Alignment mark
100 CF substrate
100a Exposure area
101 TFT substrate
101a Exposure area (opposite area)

Claims (3)

A stage on which a glass substrate as an exposure substrate for laminating a counter substrate and a device is placed and a photomask are moved relative to each other, and a part of the device is placed in each of a plurality of exposure regions of the glass substrate. The black matrix layer, the R layer, the G layer, and the B layer are exposed as a plurality of layers functioning as a plurality of alignment marks before the exposure of the black matrix layer that is the first layer among the plurality of layers. Irradiating laser light to change the optical properties inside the glass substrate, thereby forming the glass substrate inside , and the relative alignment between the plurality of alignment marks and the alignment marks provided on the photomask. Based on the position, the exposure areas of the plurality of layers and the photomasks corresponding to the layers are sequentially aligned. Comprising the steps of, a, there is provided an exposure method having a plurality of opposing region in which the counter substrate is bonded to each other and each of the plurality of exposure regions,
The glass substrate is bonded to the counter substrate while being held by a chuck device that is an electrostatic chuck or a vacuum chuck. In the forming step, the glass substrate is the same as the chuck device used for the bonding. An exposure method comprising: forming the plurality of alignment marks in a state where the glass substrate is held by a model chuck device . In the step of pre-Symbol form, the arrangement of the opposing region and the plurality of opposing region including the influence of the error of the apparatus for forming a pattern of, so as to match the arrangement of the plurality of exposure regions, the plurality of alignment 2. The exposure method according to claim 1, wherein a mark is formed on the exposure substrate. A stage on which a glass substrate as an exposure substrate for laminating a counter substrate and a device is placed and a photomask are moved relative to each other, and a part of the device is placed in each of a plurality of exposure regions of the glass substrate. a black matrix layer as a plurality of layers which functions as, R layer, G layer, and an exposure apparatus for exposing a respective pattern of B layer, provided separately from the said exposure device, said a first layer of said plurality of layers A marking device that forms a plurality of alignment marks inside the glass substrate by irradiating laser light to change the optical properties inside the glass substrate before exposure of the black matrix layer, and the counter substrate there a patterning device having a plurality of facing areas to be bonded to each other and each of the plurality of exposure regions,
The glass substrate is bonded to the counter substrate while being held by a chuck device which is an electrostatic chuck or a vacuum chuck, and the marking device is the same model as the chuck device used for the bonding The pattern forming apparatus , wherein the plurality of alignment marks are formed in a state where the glass substrate is held by the chuck apparatus.

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