TWI610341B - Imprint apparatus, imprint system, and method of manufacturing article - Google Patents

Abstract

The present invention provides an imprint apparatus that performs an imprint process of forming a pattern on an imprint material on a substrate using a mold, the imprint apparatus comprising: an obtaining unit configured to be in the mold and an imprint target as a substrate Before the photographing regions face each other, the shape of each of the plurality of photographing regions on the substrate is obtained; the first correcting unit is configured to correct the shape between the pattern of the mold and the photographing region for each photographing region on the substrate a measurement unit configured to measure a displacement between a pattern of the mold and a photographing area on the substrate; a second correction unit configured to correct the displacement; and a control unit configured to control the imprint process.

Description

Imprinting apparatus, imprinting system, and method of manufacturing articles

The present invention relates to an imprinting apparatus, an imprinting system, and a method of manufacturing an article.

The imprint technique is a technique for enabling a nano-scale fine pattern to be transferred, and has been disclosed as a large-scale nanolithography technique for devices such as semiconductor devices and magnetic storage media. Proposed on 2010-98310. An imprint apparatus using an imprint technique cures the resin while the patterned mold is in contact with the resin (imprint material) on the substrate, and forms a pattern on the substrate by releasing the mold from the cured resin. In this case, as a resin curing method, a photocuring method which cures a resin by irradiation with light such as ultraviolet light is generally used.

When an imprint apparatus is used, in order to maintain the performance of the apparatus, it is necessary to accurately transfer the pattern on the mold to the pattern (photographing area) on the substrate. In this case, in general, the shape of the pattern on the mold matches the shape of the pattern on the substrate. For example, in Japanese Patent Publication No. A correction mechanism for deforming a pattern by pushing and pulling the outer peripheral portion of the pattern on the mold, that is, a correction mechanism for correcting the shape of the pattern, is proposed in 2008-504141.

In addition, imprinting equipment generally uses inter-wafer alignment (die- By-die alignment) as the alignment between the mold and the substrate. The inter-wafer alignment is an alignment manner in which the displacement between the mold and the substrate is corrected by detecting a mark provided on the mold and a mark provided on the substrate for each of the photographing areas on the substrate.

Conventional imprinting equipment is typically aligned between wafers by use The mark detection result obtained in this is used to correct the shape of the pattern on the mold. However, in order to obtain the shape of the photographing area on the substrate, it is necessary to detect many marks. Therefore, a large amount of time is required for the inspection, resulting in a decrease in the productivity of the imprint apparatus. In addition, the response speed of the correction mechanism for correcting the shape of the pattern is low, and thus it may be impossible to completely correct the shape of the mold during inter-wafer alignment.

In addition, a pre-acquisition imaging area of the substrate has been proposed. The technology of the shape of the domain. In this technique, the shape of the photographing area in the substrate is represented by a fixed value (that is, the shape of each photographing area is fixed to one shape). Or, the shape of each shooting position on each of the substrates is represented by a fixed value. This makes it impossible to cope with a change in shape between the respective photographing regions within the substrate or between the substrates, resulting in failure to sufficiently correct the shape of the pattern on the mold. In recent years, with the advancement of fine processing of devices, high overlay accuracy is required. Therefore, this problem has become particularly significant.

The invention provides an overlap between a mold and a substrate An imprinting device that is advantageous in terms of precision and productivity.

According to an aspect of the present invention, an imprinting device is provided And performing an imprint process of forming a pattern on an imprint material on a substrate using a mold, the imprint apparatus comprising: an obtaining unit configured to face each other before the mold and the photographing area as an imprint target on the substrate face each other Obtaining a shape of each of the plurality of imaging regions on the substrate; a first correction unit configured to correct a shape difference between the pattern of the mold and the imaging region for each of the imaging regions on the substrate; and a measuring unit Constructed to measure displacement between the pattern of the mold and the photographing area on the substrate; a second correcting unit configured to correct the displacement; and a control unit configured to control the imprinting process, wherein the imprinting process includes The first correction unit is caused to correct the first process of the shape difference based on the shape obtained in advance by the obtaining unit, and the second process of causing the second correction unit to correct the displacement while the measurement unit measures the displacement.

The following description of the exemplary embodiments is made with reference to the accompanying drawings Further aspects of the invention will become apparent.

1‧‧‧imprint equipment

7‧‧‧ Imprinting system

10‧‧‧ Imprinting system

11‧‧‧Mold

11a‧‧‧ pattern surface

11b‧‧‧pattern area

12‧‧‧Mold holding unit

13‧‧‧Substrate

13a‧‧‧Photographing area

13b‧‧‧ wafer area

14‧‧‧Substrate holding unit

15‧‧‧Measurement unit

16‧‧‧Shape Correction Unit

16a‧‧‧Clamp unit

16b‧‧‧Actuator

17‧‧‧Control unit

18‧‧‧Mold side marking

18a‧‧‧Mold side marking

18b‧‧‧Mold side marking

18c‧‧‧Mold side marking

18d‧‧‧Mold side marking

18e‧‧‧Mold side marking

18f‧‧‧Mold side marking

18g‧‧‧Mold side marking

18h‧‧‧Mold side marking

19‧‧‧Substrate side marking

19a‧‧‧Substrate side marking

19b‧‧‧Substrate side marking

19c‧‧‧Substrate side marking

19d‧‧‧Substrate side marking

19e‧‧‧Substrate side marking

19f‧‧‧Substrate side marking

19g‧‧‧substrate side marking

19h‧‧‧Substrate side marking

700‧‧‧Measurement device

712‧‧‧Holding unit

715‧‧‧Measurement instruments

720‧‧‧ reference board

721‧‧‧ reference plate side marking

722‧‧‧Measurement instruments

723‧‧‧Interferometer

Sb‧‧‧ shooting area

Sc‧‧‧ shooting area

Sd‧‧‧ shooting area

Se‧‧‧ shooting area

Sf‧‧‧ shooting area

Sh‧‧‧ shooting area

Si‧‧‧ shooting area

Sj‧‧‧ shooting area

Sk‧‧‧ shooting area

Sl‧‧‧ Shooting area

Sm‧‧‧ shooting area

Sn‧‧‧ shooting area

S51~S58‧‧‧Steps

S61~S71‧‧‧Steps

1 is a schematic view showing the configuration of an imprint apparatus according to an aspect of the present invention.

FIG. 2 is a view showing an example of a configuration of a shape correcting unit of the imprint apparatus shown in FIG. 1.

3A and 3B are views showing an example of a mold side mark provided on a mold and a substrate side mark provided on a substrate.

4A to 4E are diagrams showing deviations between a pattern surface of a mold and a photographing region of a substrate.

FIG. 5 is a view showing a procedure of a general imprint process.

FIG. 6 is a diagram showing the sequence of the imprint process according to the present embodiment.

Fig. 7 is a schematic view showing the configuration of an imprint system according to an aspect of the present invention.

8A and 8B are schematic views each showing an example of a configuration of a measuring device in the imprint system shown in Fig. 7.

9A and 9B are diagrams each showing an example of a layout of an imaging region of a substrate.

Figure 10 is a schematic view showing the configuration of an imprint system according to an aspect of the present invention.

Fig. 11 is a view showing an example of a chipped photographing area near the edge of the substrate.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. Note that, in all the drawings, the same reference numerals are given to the same members, and a repeated description thereof will not be given.

<First Embodiment>

1 is a schematic view showing the configuration of an imprint apparatus 1 according to an aspect of the present invention. The imprint apparatus 1 forms a pattern on the imprint material on the substrate by using a mold. That is, the apparatus is a lithographic apparatus which performs an imprint process of forming a pattern on a substrate by molding an imprint material on a substrate using a mold. As a resin curing method, this embodiment uses a photocuring method in which a resin is cured by irradiating a resin with ultraviolet light.

The imprint apparatus 1 includes a mold holding unit that holds the mold 11 12. The substrate holding unit 14, the measuring unit 15, the shape correcting unit 16, and the control unit 17 of the substrate 13 are held. In addition, the imprint apparatus 1 includes a resin supply unit having a dispenser for supplying a resin onto a substrate, a bridge platform for holding the mold holding unit 12, and a base platform for holding the substrate holding unit 14.

The mold 11 has a rectangular outer shape and includes a formed The pattern surface 11a of the pattern (concave-convex pattern) transferred onto the substrate 13 (resin thereon). The mold 11 is made of a material (for example, quartz) that transmits ultraviolet light for curing a resin on a substrate. The mold side mark 18 is formed on the pattern surface 11a of the mold 11.

The mold holding unit 12 is a holding machine that holds the mold 11 Structure. The mold holding unit 12 includes a mold holder for vacuum-clamping or electrostatically holding the mold 11, a mold table on which the mold holder is mounted, and a drive system for driving (moving) the mold stage. This drive system drives the die stage (i.e., the mold 11) at least in the z-axis direction (the embossing direction in which the mold 11 imprints the resin on the substrate). The drive system is not only in the z-axis direction, but also has directions in the x-axis direction, the y-axis direction, and θ (rotation around the z-axis) The function of driving the die table.

The substrate 13 is a pattern on which the pattern on the mold 11 is transferred. The substrate includes, for example, a single crystal germanium substrate and a silicon-on-insulator (SOI) substrate. The resin supply unit supplies (applies) the resin to the substrate 13. The substrate side marks 19 are formed on a plurality of imaging areas of the substrate 13, respectively.

The substrate holding unit 14 is a holding machine that holds the substrate 13 Structure. The substrate holding unit 14 includes, for example, a substrate holder for vacuum-clamping or electrostatically clamping the substrate 13, a substrate stage on which the substrate holder is mounted, and a drive system for driving (moving) the substrate stage. This drive system drives the substrate stage (i.e., the substrate 13) at least in the x-axis direction and the y-axis direction (the direction perpendicular to the embossing direction of the mold 11). The drive system has functions not only in the x-axis direction and the y-axis direction but also in driving the substrate stage in the z-axis direction and the θ (rotation around the z-axis) direction.

Each measuring unit 15 includes an oscilloscope, and the oscilloscope optically A corresponding mark of each of the mold side marks 18 provided on the mold 11 and the substrate side marks 19 provided on each of the plurality of shot areas of the substrate 13 is detected (observed). Each measuring unit 15 measures the relative position (displacement) of the mold 11 and the substrate 13 based on the detection result obtained by the oscilloscope. However, it is to be noted that each of the measuring units 15 only needs to detect the relative positional relationship between each of the mold side marks 18 and the corresponding substrate side mark 19. Thus, each measurement unit 15 may include an oscilloscope that includes an optical system for simultaneously capturing images of two markers, or a signal that reflects a relative positional relationship from two markers. An oscilloscope (for example, an interference signal or moiré). In addition, each of the measurement units 15 may not be able to simultaneously detect each of the mold side marks 18 and the corresponding substrate side marks 19. For example, each measurement unit 15 can obtain the position of each of the mold side marks 18 disposed inside and corresponding to the reference position, and the position of the corresponding substrate side mark 19 to detect between the mold side mark 18 and the substrate side mark 19. Relative positional relationship.

The shape correcting unit 16 functions as a first correcting unit that corrects a shape difference between the pattern on the mold 11 and each photographing region of the substrate 13. In the present embodiment, the shape correcting unit 16 corrects the shape of the pattern surface 11a by deforming the mold 11 (pattern surface 11a) by applying a force to the mold 11 in a direction parallel to the pattern surface 11a. For example, as shown in FIG. 2, the shape correcting unit 16 includes a gripper unit 16a that grips a side surface of the mold 11, and a direction in which the gripper unit 16a is driven in a direction of moving toward the side of the mold 11 and in a direction moving away from the side of the mold 11. Actuator 16b. Each of the gripper units 16a may have no function of gripping the side surface of the mold 11, and may be a contact member that is in contact with the side surface of the mold 11. However, it is to be noted that the shape correcting unit 16 can deform the pattern surface 11a by heating the mold 11 and controlling the temperature of the mold 11. Further, in some cases, instead of deforming the pattern surface 11a of the mold 11, the photographing region of the substrate 13 may be corrected by locally swelling the substrate 13 by irradiating the substrate with light having a constant intensity at a predetermined position (on the substrate) The shape of the pattern formed on the 13). In this case, the imprint apparatus 1 includes a heat supply unit as a shape correcting unit that supplies heat to the mold 11 or the substrate 13.

The control unit 17 includes a CPU and a memory, and controls the whole Imprinting apparatus 1 (each unit of the imprint apparatus 1). In the present embodiment, the control unit 17 controls the imprint process and related processes. For example, the control unit 17 performs alignment between the mold 11 and the substrate 13 based on the measurement result obtained by the measuring unit 15 at the time of performing the imprint process. Further, when the imprint process is performed, the control unit 17 controls the amount of deformation of the pattern surface 11a of the mold 11 by the shape correcting unit 16.

Will be described with reference to FIGS. 3A and 3B for the mold 11 and The aligned alignment marks between the substrates 13 are marked with respective mold side marks 18 and corresponding substrate side marks 19. It is assumed that in the present embodiment, six wafer regions are arranged in one photographing region of the substrate 13.

FIG. 3A shows the pattern surface 11a provided on the mold 11. Mold side marks 18a to 18h on (specifically, on the four corners of the pattern surface 11a). Referring to FIG. 3A, the mold side marks 18a, 18b, 18e, and 18f each having a longitudinal direction in the horizontal direction are marks each having a measurement direction in the x-axis direction. Conversely, the mold side marks 18c, 18d, 18g, and 18h each having a longitudinal direction in the vertical direction are marks each having a measurement direction in the y-axis direction. In addition, referring to FIG. 3A, a region surrounded by a broken line indicates a pattern region 11b forming a pattern to be respectively transferred onto the six wafer regions of the above-described substrate.

FIG. 3B shows a shooting area provided on the substrate 13. Substrate side marks 19a to 19h on the outer circumference of 13a (specifically, on the four corners of the photographing area 13a). Referring to Fig. 3B, substrate side marks 19a, 19b, 19e, and 19f each having a longitudinal direction in the horizontal direction are respective A mark having a measurement direction along the x-axis direction. Conversely, the substrate side marks 19c, 19d, 19g, and 19h each having a longitudinal direction in the vertical direction are marks each having a measurement direction in the y-axis direction. In addition, referring to FIG. 3B, the area surrounded by the solid line inside the imaging area 13a is the wafer area 13b.

When the imprint process is to be performed, that is, the mold 11 is separately When contacting the resin of the substrate, the mold side marks 18a to 18h provided on the mold 11 are brought close to the substrate side marks 19a to 19h provided on the substrate 13. Therefore, the position and shape of the pattern surface 11a of the mold 11 can be compared with the position and shape of the photographing area 13a of the substrate 13 by detecting the mold side mark 18 and the substrate side mark 19 by using the measuring unit 15. If a difference (deviation) occurs between the position and shape of the pattern surface 11a of the mold 11 and the position and shape of the photographing region 13a of the substrate 13, the overlap precision is lowered, resulting in pattern transfer defects (product defects).

4A to 4H are diagrams showing the pattern surface 11a of the mold 11. A deviation between the position and shape of the position and shape of the photographing region 13a of the substrate 13 (hereinafter referred to as "the deviation between the mold 11 and the photographing region 13a"). The deviation between the mold 11 and the photographing region 13a includes displacement, magnification deviation, and rotation. The displacement (displacement amount) of the mold side mark 18 with respect to the substrate side mark 19 is detected so as to be able to determine whether the deviation between the mold 11 and the imaging region 13a is displacement, magnification deviation, or rotation.

FIG. 4A shows the between the mold 11 and the photographing area 13a. The deviation is the case of shifting. It is detected that each of the mold side marks 18 is deviated from the corresponding substrate side mark 19 in one direction, and the mold 11 can be judged and photographed. The deviation between the regions 13a is a shift.

FIG. 4B shows the between the mold 11 and the photographing area 13a. The deviation is the case of rotation. If the deviation direction of each of the mold side marks 18 is different between the upper side, the lower side, the left side, and the right side of the photographing region 13a, thereby drawing a circle centering on a given point in the photographing region, it is possible to judge the mold 11 and photographing The deviation between the regions 13a is a rotation.

FIG. 4C shows the between the mold 11 and the photographing area 13a. The deviation is the case of the deviation of the magnification. If it is detected that the respective mold side marks 18 are uniformly deviated inward or outward with respect to the center of the imaging region 13a, it can be judged that the deviation between the mold 11 and the imaging region 13a is a magnification deviation.

FIG. 4D shows the between the mold 11 and the photographing area 13a. The deviation is the case of trapezoidal deviation. If it is detected that each of the mold side marks 18 is inward or outward with respect to the center of the photographing area 13a and the direction is different between the upper side and the lower side of the photographing area 13a or between the left side and the right side of the photographing area 13a, it can be judged The deviation between the ejection die 11 and the imaging region 13a is a trapezoidal deviation. In addition, if it is detected that each of the mold side marks 18 is deviated inward or outward with respect to the center of the photographing area 13a and the amount of deviation is different between the upper side and the lower side of the photographing area 13a or between the left side and the right side of the photographing area 13a, Then, it can be judged that the deviation between the mold 11 and the imaging region 13a is a trapezoidal deviation.

FIG. 4E shows the between the mold 11 and the photographing area 13a. Deviation is the case of reversal. If it is detected that the deviation direction for each of the mold side marks 18 is different between the upper side and the lower side of the photographing area 13a or between the left side and the right side of the photographing area 13a, it is possible to judge the mold 11 and The deviation between the photographing regions 13a is a twist.

As shown in FIG. 4C to FIG. 4E, in the mold 11 and the photographing area In the case where the deviation between the 13a is the magnification deviation, the trapezoidal deviation, the twist, or the like, the control unit 17 causes the shape correcting unit 16 to deform the shape of the pattern surface 11a of the mold 11. Although not shown, even in the case where the deviation between the mold 11 and the photographing region 13a is an arch deviation, a barrel deviation, a pincushion deviation, or the like, the control unit 17 causes the shape correcting unit 16 to de-deform the pattern of the mold 11. The shape of the surface 11a. More specifically, the control unit 17 controls the amount of deformation of the pattern surface 11a by the shape correcting unit 16 so that the shape of the pattern surface 11a of the mold 11 matches the shape of the photographing region 13a of the substrate 13. Depending on the type of deviation between the mold 11 and the photographing area 13a, it is necessary to detect other alignment marks in addition to the alignment marks shown in Figs. 3A and 3B. Since the number of measuring units 15 that can be arranged in the imprint apparatus 1 is limited, the measuring unit 15 can be moved to detect a plurality of alignment marks. The control unit 17 obtains in advance data representing the correspondence relationship between the driving amount of each actuator 16b (that is, the force applied to the mold 11) and the amount of deformation of the pattern surface 11a, and stores the data in a memory or the like. The control unit 17 calculates the amount of deformation (degree of deformation of the pattern surface 11a) required to match the shape of the pattern surface 11a with the shape of the photographing region 13a based on the measurement results obtained by the respective measuring units 15. Next, the control unit 17 obtains the driving amount of each of the actuators 16b corresponding to the calculated amount of deformation of the pattern surface 11a from the material stored in the memory, and drives the actuator 16b.

In this way, the imprint apparatus 1 is correcting the mold 11 and the base. The pattern on the mold 11 is transferred onto the resin on the substrate while the alignment between the sheets 13 (the photographing regions 13a) and the shape of the mold 11 (the pattern surface 11a).

FIG. 5 is a view showing a pair including the mold 11 and the substrate 13. A diagram of the sequence of the general imprint process of the correction of the shape of the mold 11. Fig. 5 respectively shows a main process associated with the operation of the mold 11 for forming a pattern on a substrate, and the alignment with the mold 11 and the substrate 13 and the shape of the mold 11 in the imprint process. Correct the associated alignment process. Note that in the imprinting step, since the mold 11 needs to be in contact with the resin of the substrate, the substrate holding unit 14 holding the substrate 13 can be vertically driven.

In step S51, an imprinting step is performed, in the imprinting step In the middle, the mold 11 is faced to the photographing region 13a which is an imprint target on the substrate 13, and the mold 11 is brought into contact with the resin of the substrate. In step S52, a filling step is started in which the pattern on the mold 11 is filled with the resin while maintaining the contact state between the mold 11 and the resin on the substrate. In the filling step, the resin placed between the mold 11 and the substrate 13 is expanded by being sandwiched between the mold 11 and the substrate 13, and the resin simultaneously fills the pattern on the mold 11.

When the filling step starts, in step S53, the measurement sheet The element 15 starts measuring the displacement between the pattern surface 11a of the mold 11 and the photographing region 13a, and the shape difference between the pattern surface 11a of the mold 11 and the photographing region 13a. When the alignment marks on the mold 11 and on the substrate 13 are simultaneously measured, since the distance between the marks needs to be sufficiently small, the measurement is filled. It does not begin until the charging step begins. Note that the measurement by the measuring unit 15 can be started before the filling step starts as long as the measuring unit 15 can detect the alignment marks on the mold 11 and the substrate 13. In step 53, since it is necessary to measure the shape difference between the pattern surface 11a of the mold 11 and the photographing region 13a, the measuring unit 15 needs to detect a plurality of the mold side marks 18 and the substrate side marks 19.

In step S54, based on the obtained by the measuring unit 15 The result of the measurement is used to start the alignment between the mold 11 and the substrate 13 and the correction of the shape of the mold 11. Specifically, while the measuring unit 15 measures the displacement between the pattern surface 11a of the mold 11 and the photographing region 13a of the substrate 13, the displacement between the pattern surface 11a and the photographing region 13a is corrected by driving the mold stage and the substrate stage. . Further, while the measuring unit 15 measures the shape difference between the pattern surface 11a of the mold 11 and the photographing region 13a of the substrate 13, the shape correcting unit 16 corrects the between the pattern surface 11a and the photographing region 13a by deforming the pattern surface 11a. The shape is poor.

The measuring unit 15 sequentially measures the pattern surface 11a and the photographing area The shape difference between the domains 13a and the displacement between the pattern surface 11a and the photographing region 13a. The measurement results are sequentially reflected in the alignment between the mold 11 and the substrate 13 and the correction of the shape of the mold 11.

If the position between the pattern surface 11a and the photographing area 13a The shift and the difference in shape between the pattern surface 11a and the photographing region 13a fall within the allowable range, and the alignment between the mold 11 and the substrate 13 and the correction of the shape of the mold 11 are completed in step S55. In addition, in step S56, the measuring unit 15 completes the relationship between the pattern surface 11a and the photographing region 13a. The displacement and the measurement of the difference in shape between the pattern surface 11a and the photographing region 13a.

In step S57, a curing step is performed, in the curing step In the state where the mold 11 is in contact with the resin on the substrate, the resin which is supplied as the imprint target 13a is cured by irradiation with ultraviolet light passing through the mold 11.

In step S58, a release step is performed, in the release step In the middle, the mold stage is driven to release the mold 11 from the cured resin on the image capturing area 13a of the substrate 13. By this processing, the pattern on the mold 11 is transferred onto the resin on the image capturing region 13a of the substrate 13, and a pattern on the resin is formed on the image capturing region 13a.

Filling step according to the order of the imprint processing shown in FIG. The step (step S52) generally requires the most time, and thus the productivity is determined. However, if the overlap between the mold 11 and the substrate 13 requires high precision, the alignment between the mold 11 and the substrate 13 and the correction of the shape of the mold 11 (step 54) require more time. In particular, since the response speed of the shape correcting unit 16 is low, the correction of the shape of the mold 11 requires more time. On the other hand, imprinting equipment is required to further increase productivity. In this case, the present embodiment provides an imprint process which suppresses a decrease in productivity even if the correction of the shape of the mold 11 requires more time.

For the deviation between the mold 11 and the photographing region 13a, The shift shown in Fig. 4A and the rotation shown in Fig. 4B can be corrected by relatively driving and rotating the mold 11 and the substrate 13. For example, due to the substrate The response speed of the station is high, so it does not take much time to correct the shift and rotation. In addition, it is impossible to detect the displacement and the rotation in the imprint process until the mold 11 is faced to the photographing region 13a which is the imprint target on the substrate 13, and thus it is difficult to measure them in advance.

For the deviation between the mold 11 and the photographing area 13a, Before the mold 11 is faced to the photographing region 13a which is the imprint target of the substrate 13, the magnification deviation shown in Fig. 4C, the trapezoidal deviation shown in Fig. 4D, and the twist shown in Fig. 4E are determined. Therefore, the magnification deviation and the trapezoidal deviation can be measured in advance. As described above, since the response speed of the shape correcting unit 16 is low, it takes a lot of time to correct the shape of the mold 11. For this reason, the magnification deviation, the trapezoidal deviation, the twist, and the like associated with the correction of the shape of the mold 11 are measured (obtained) in advance, and the shape of the mold 11 is corrected by using the predicted amount result. In addition, the alignment between the mold 11 and the substrate 13 is performed simultaneously with the correction of the shape of the mold 11.

Note that in the present embodiment, the main mold 11 is explained. A variant is made as a solution for correcting the shape difference between the pattern surface 11a and the photographing region 13a. However, as described above, a proposal of correcting the shape difference between the pattern surface 11a and the photographing region 13a by deforming the substrate 13 has also been proposed. Although the response speed of this scheme is relatively high, it is necessary to measure a sufficient number of alignment marks to accurately measure the shape difference between the pattern surface 11a and the photographing region 13a (improve the shape correction).

In the imprint process, it is required to measure a large number of alignment marks Measuring unit to accurately position the mold 11 facing the substrate 13 The shape difference between the pattern surface 11a and the photographing region 13a is measured. In addition, when the order of the imprint processing requiring the productivity (the imprinting step, the filling step, the curing step, and the releasing step in a short time) is taken into consideration, it is difficult to measure a large number of alignment marks in the order of the imprint processing.

Therefore, the shape correction response is also relevant, but no Regarding the shape correction scheme, the shape difference between the pattern surface 11a and the photographing region 13a can be measured with effective precision to improve the shape correction.

FIG. 6 is a view showing the sequence of imprint processing according to the present embodiment. Figure. FIG. 6 respectively shows the main process associated with the operation for forming a pattern on the substrate, and the alignment with the mold 11 and the substrate 13 and the correction of the shape of the mold 11 in the imprint process. Alignment processing. Further, in the present embodiment, the alignment processing is divided into a first process of correcting the difference in shape between the pattern on the mold 11 and the shot region 13a of the substrate 13, and the pattern on the correction mold 11 and the photographing area of the substrate 13. A second treatment of the displacement between 13a. Note that the embossing step in step S61, the filling step in step S62, the curing step in step S67, and the releasing step in step S68 shown in FIG. 6 are the same as steps S51, S52, S57, and S58 in FIG. The same is true, so their detailed description is omitted.

First, the pattern on the correction mold 11 and the substrate 13 will be described. The second processing of the displacement between the photographing areas 13a. When the filling step is started, in step S63, the measuring unit 15 starts measuring the displacement between the pattern surface 11a of the mold 11 and the photographing region 13a. In step S63, it is not necessary to measure the shape between the pattern surface 11a of the mold 11 and the photographing region 13a. The difference is made, and only the displacement between the pattern surface 11a and the photographing area 13a needs to be measured. Therefore, the measuring unit 15 can detect the mold side mark 18 and the substrate side mark 19 in a smaller number than the number in the step S53. This makes the measurement unit 15 perform the measurement in a shorter time in step S63 than the measurement performed in step S53. In the present embodiment, the measuring unit 15 mainly measures the displacement shown in FIG. 4A between the pattern surface 11a of the mold 11 and the photographing region 13a, and the rotation shown in FIG. 4B.

In step S64, based on obtained by each measurement unit 15 As a result of the measurement, the alignment between the mold 11 and the substrate 13 is started. Specifically, while the measuring unit 15 measures the displacement between the pattern surface 11a of the mold 11 and the photographing region 13a of the substrate 13, the mold stage and the substrate stage are driven to correct the displacement between the pattern surface 11a and the photographing area 13a. In this manner, the mold holding unit 12 including the die stage and the substrate holding unit 14 including the substrate stage serve as a second correcting unit that corrects the displacement between the pattern surface 11a of the mold 11 and the shot region 13a of the substrate 13. The measuring unit 15 sequentially measures the displacement between the pattern surface 11a of the mold 11 and the photographing region 13a. The measurement results are sequentially reflected in the alignment between the mold 11 and the substrate 13.

Displacement between the pattern surface 11a and the photographing region 13a When falling within the allowable range, the alignment between the mold 11 and the substrate 13 is completed in step S65. Further, in step S66, the measuring unit 15 completes the measurement of the displacement between the pattern surface 11a of the mold 11 and the photographing region 13a.

Next, the correction of the mold 11 and the substrate 13 will be described. The first process of the difference in shape between the shot areas 13a. As described above, the shape of the pattern surface 11a of the mold 11 and the shape of the photographing region 13a of the substrate 13 can be measured in advance without requiring the mold 11 to be held facing the photographing region 13a of the substrate 13. For this reason, the present embodiment provides an imprinting system that preliminarily measures the shape of the photographing region 13a of the substrate 13 by using a measuring device external to the imprinting apparatus 1 before loading the substrate 13 into the imprint apparatus 1. .

Figure 7 is a view showing an imprinting system according to an aspect of the present invention. Schematic diagram of the configuration of the system 7. The imprint system 7 includes a plurality of imprint apparatuses 1 and a measuring apparatus 700, each of which is configured to perform an imprint process of forming a pattern on a resin on a substrate by using a mold 11. According to the prior art, the substrate 13 is directly loaded into the imprint apparatus 1. On the contrary, according to the present embodiment, the substrate 13 is loaded into the measuring device 700 before the substrate 13 is loaded into the imprint apparatus 1. The measuring device 700 measures the shape of each of the plurality of imaging regions 13a of the substrate 13, and transmits the measurement result as the imaging shape information to the control unit 17. Further, the substrate 13 having the imaging region 13a whose shape is measured by the measuring device 700 is sequentially loaded into the imprint apparatus 1. Note that FIG. 7 shows one of the control units 17 of the plurality of imprint apparatuses 1 as a main control unit for controlling each of the corresponding imprint apparatuses of the plurality of imprint apparatuses 1. Note, however, that in addition to the control unit 17 of each of the imprint apparatuses 1, the system may be provided with a main control unit that controls each of the plurality of imprint apparatuses 1.

8A and 8B are diagrams showing measurement in the imprint system 7. A schematic diagram of an example of the configuration of device 700. The measuring device 700 shown in Fig. 8A uses the same measuring method as that used by the measuring unit 15 in the imprinting apparatus 1, that is, the inter-wafer alignment method. The measuring device 700 shown in FIG. 8A includes a measuring instrument 715, a reference plate 720, and a holding unit 712 that holds the reference plate 720. The reference plate 720 is a plate member as a reference for the shape of the imaging region 13a of the substrate 13, and has a reference plate side mark 721 at a position corresponding to the substrate side mark 19 provided on the substrate 13. The measuring instrument 715 optically detects (observes) the respective reference plate side marks 721 and the corresponding substrate side marks 19, and measures the shapes of the respective photographing areas 13a of the substrate 13 similarly to those shown in FIGS. 4A to 4E. In the present embodiment, the measuring instrument 715 detects the substrate side marks 19 provided on the four corners of the photographing area 13a of the substrate 13. However, the number of the substrate side marks 19 as the detected object can be increased in accordance with the component of the shape of the photographing region 13a as the measurement target. For example, if the photographing region 13a of the substrate 13 has an arch shape, a barrel shape, or a pincushion shape, it is not only necessary to detect the substrate side marks 19 provided on the four corners of the photographing region 13a of the substrate 13, but also need to detect other Substrate side mark 19.

The measuring device 700 shown in Figure 8B includes a measuring instrument 722 and interferometer 723. The measuring instrument 722 has a measurement accuracy higher than the measurement accuracy of the measuring unit 15 in the imprint apparatus 1. The measuring instrument 722 includes an image sensor, and the substrate side marks 19 provided on the substrate 13 are sequentially detected by referring to absolute position measurement of the image sensor. In the imprint apparatus 1, the measuring unit 15 needs to be compact due to space constraints and the like. another On the one hand, the measuring device 700 allows the formation of a measuring instrument 722 with high measurement accuracy due to a relatively modest spatial limitation. Unlike the measuring device 700 shown in FIG. 8A, the measuring device 700 shown in FIG. 8B does not require a reference plate 720 that is relatively compared with the substrate side mark 19. However, the positional accuracy of the substrate holding unit 14 (substrate stage) affects the measurement accuracy of the measuring instrument 722. For this reason, the measuring device 700 shown in FIG. 8B is provided with an interferometer 723 that accurately measures the position of the substrate holding unit 14. The measuring device 700 shown in Fig. 8B is capable of measuring various components of the shape of the photographing region 13a by sequentially detecting a required number of substrate side marks 19 within a time limit. In addition, the measuring device 700 may be provided with a plurality of measuring instruments 722 to shorten the time required to measure the shape of the photographing region 13a. Alternatively, the detection field of view of the measuring instrument 722 can be expanded to simultaneously detect a plurality of substrate side marks 19.

Referring back to FIG. 6, in step S69, the control unit 17 obtains shooting shape information from the measuring device 700. In this way, the control unit 17 functions as an obtaining unit that obtains the photographing shape information (that is, the shape of each of the plurality of photographing regions 13a of the substrate 13).

In step S70, the correction of the shape of the mold 11 is started based on the photographing shape information obtained in advance by the control unit 17. Specifically, the control unit 17 causes the shape correcting unit 16 to correct the pattern surface 11a of the mold 11 and the photographing area as the imprint target of the substrate 13 based on the shapes of the respective photographing regions 13a of the substrate 13 obtained in advance by the control unit 17. The shape between 13a is poor. In this case, the pattern surface 11a of the mold 11 and the photographing area 13a which is an imprint target of the substrate 13 The shape difference between them includes at least one of the magnification deviation shown in FIG. 4C, the trapezoidal deviation shown in FIG. 4D, and the twist shown in FIG. 4E.

This embodiment can be based on pre-obtained shooting shape information To correct the shape of the mold 11, and thus with respect to the previous photographing area, it is possible to start correcting the shape of the mold 11 after the releasing step. Therefore, it is possible to ensure sufficient time to correct the shape of the mold 11.

In addition, measurement (obtained) in the plane of the substrate 13 The change in the rotation of each array or photographing area can reduce the displacement between the pattern surface 11a of the mold 11 and the photographing area 13a at the start of the measurement by the measuring unit 15 in step S63. When the mold 11 or the substrate 13 is moved while the mold 11 is in contact with the resin on the substrate, the shearing force acts to cause deformation of the mold 11. Therefore, it is preferable to minimize the amount of movement of the mold 11 or the substrate 13 when the alignment between the mold 11 and the substrate 13 is performed.

In addition, the measurement substrate is determined according to the required overlay accuracy. The frequency of the shape of the photographing area 13a of 13. For example, in a case where the shape difference in the imaging region 13a of the substrate within the lot is sufficiently small, only the shape of the imaging region of the first substrate in the lot can be measured. Conversely, in the case where the shape difference among the imaging regions 13a of the substrate within the batch cannot be ignored, it is necessary to measure the shape of the imaging region of all the substrates in the batch.

In addition, in consideration of productivity, it can be based on The number of shot regions 13a of the shape to be measured is adjusted inside the panel. If sufficient measurement time can be ensured, all the shooting areas of the substrate 13 can be measured The shape of the field 13a. This makes it possible to obtain the actual shape of all the photographing regions 13a of the substrate 13. Conversely, if a sufficient measurement time cannot be ensured, the shape of some of the imaging regions 13a of all the imaging regions 13a (for example, the shape of each several imaging regions) can be measured. In this case, the shape of the remaining photographing regions in all the photographing regions 13a of the substrate 13 can be obtained from the measured shapes of some photographing regions. For example, if the shapes of the respective photographing regions 13a of the substrate 13 linearly change with respect to the positions of the respective photographing regions 13a, the remaining photographing regions can be obtained by performing a least square approximation on the measured shapes of the certain photographing regions. shape. If the shapes of the respective imaging regions 13a of the substrate 13 do not change linearly with respect to the positions of the respective imaging regions 13a, the shape of the remaining imaging regions can be obtained by weighted averaging the measured shapes of certain imaging regions.

FIG. 9A is a layout showing the photographing region 13a of the substrate 13. A diagram of the example. Referring to FIG. 9A, a photographing area indicated by oblique lines represents a photographing area whose shape is measured, and a white photographing area represents a photographing area whose shape is not measured. In general, the shape of each of the imaging regions 13a of the substrate 13 is continuously changed. Therefore, the shape of the photographing region Sb whose shape is not measured can be regarded as continuously changing from the shapes of the photographing regions Sc, Sd, Se, and Sf surrounding the photographing region Sb. Therefore, by averaging the measured shapes of the photographing regions Sc, Sd, Se, and Sf, it is possible to obtain (predict) the shape of the photographing region Sb whose shape is not measured.

FIG. 9B is a view showing an example of the layout of the imaging region 13a of the substrate 13. Referring to FIG. 9B, a photographing area indicated by oblique lines represents a photographing area whose shape is measured, and a white photographing area represents a photographing area whose shape is not measured. Likewise, in FIG. 9B, the shape of each of the photographing regions 13a of the substrate 13 is considered to be continuously changed, and the shape of the photographing region whose shape is not measured is obtained from the measured shape of the photographing region. For example, the shape of the photographing region Sh is an average of the shape of the photographing region Sj and the shape of the photographing region Sk, but is closer to the shape of the photographing region Sj. Specifically, in consideration of the distance between the imaging regions, the influence of the imaging region Sk on the imaging region Sh is 1/2 of the influence of the imaging region Sj on the imaging region Sh. In this way, the degree of influence is proportional to the reciprocal of the distance between the shot regions. Therefore, the shape of the photographing area Sh can be obtained by weighted averaging as follows:

In a similar manner, the shape of the photographing area Si can be obtained as follows:

The shape of the imaging region S1 can be obtained by weighting the shapes of the four imaging regions Sj, Sk, Sm, and Sn. The distances from the photographing regions Sj, Sk, Sm, and Sn to the photographing region S1 are 1.2, 2, 1, and 1.2, respectively. Therefore, the shape of the photographing area S1 can be obtained as follows:

It can be determined from the actual substrate that for a shooting area whose shape is not measured, how many shooting areas whose shapes are measured should be considered.

In this embodiment, it is assumed that the inter-wafer alignment measurement is measurement of the displacement between the pattern surface 11a of the mold 11 of the measuring unit 15 and the photographing region 13a (step S63). However, this is not exhaustive. It is also possible to obtain the same effect by so-called global alignment measurement, that is, performing statistical operation processing by measuring a representative photographing area in the photographing region 13a of the substrate 13, and performing the mold 11 based on the processing result. Alignment between the substrates 13.

As described above, the present embodiment controls the imprint process to start the first process before the mold 11 faces the photographing region 13a of the substrate 13, and starts the second process after the mold 11 faces the photographing region 13a. This makes it possible to take time to correct the shape of the mold 11, and sufficiently correct the shape of the mold 11 while suppressing the decrease in productivity, thereby achieving high overlap precision.

In addition, the imprint process may be controlled to simultaneously perform the first process portion and the second process portion, or to start the first process while relatively moving the mold 11 and the substrate 13 to face the mold 11 with the photographing region 13a of the substrate 13. This makes it possible to spend more time for correcting the shape of the mold 11.

Further, in the second process, it is preferable to consider the pattern on the mold 11 and the photographing area of the substrate 13 caused by the first processing. In the case of the displacement between the 13a, the displacement between the pattern surface 11a of the mold 11 and the photographing region 13a of the substrate 13 is corrected. This makes it possible to shorten the time required for the alignment between the mold 11 and the substrate 13 even if the portion of the first process and the portion of the second process are simultaneously performed.

In addition, it is preferably directed to being loaded into the imprint apparatus 1 Each of the substrates obtains the shape information of the photographing, that is, the shape of the photographing region 13a of the substrate 13. This makes it possible to sufficiently correct the shape of the mold 11 even if the shape of each of the image capturing regions in the substrate has changed.

Further, in the present embodiment, the external measurement of the imprint apparatus 1 The measuring device 700 measures the shape of each of the imaging regions 13a of the plurality of imaging regions 13a of the substrate 13 in advance. Note, however, that the measuring unit 15 of the imprint apparatus 1 can measure the shape of each of the photographing regions 13a of the plurality of photographing regions 13a of the substrate 13 in advance before the imprinting process is started.

<Second embodiment>

FIG. 10 is a schematic view showing the configuration of an imprint system 10 according to an aspect of the present invention. The imprint system 10 includes a plurality of imprint apparatuses 1, each of which is configured to perform an imprint process of forming a pattern on a resin on a substrate by using a mold 11. Note that FIG. 10 shows one of the control units 17 of the plurality of imprint apparatuses 1 as a main control unit that controls each of the corresponding ones of the plurality of imprint apparatuses 1. Note, however, that in addition to the control unit 17 of the respective imprint apparatus 1, the system may be provided with a main control unit that controls each of the plurality of imprint apparatuses 1.

It is pointed out that the imprinting equipment is lower in productivity than the exposure. Device, this is because the imprinting device takes time to perform the filling step, as described above. Under these circumstances, a technique of forming a cluster of a plurality of imprint apparatuses and simultaneously performing imprint processing for a plurality of substrates has been proposed. According to this technique, since the imprint apparatus can share some units, it is possible to reduce the total area occupied by the apparatus and increase the productivity per unit area.

For example, as shown in FIG. 10, the imprint system 10 includes four Imprinting device 1. At least one of the four imprint apparatuses 1 has a function of measuring the shape of each of the plurality of photographing areas 13a of the plurality of photographing areas 13a of the substrate 13 in the lower right imprint apparatus of the present embodiment. This function can be implemented by the measurement unit 15 or by having the measurement device 700 shown in Figures 8A and 8B.

The base to be loaded into the imprinting system 10 according to the prior art The plate 13 is directly loaded into each of the imprint apparatuses 1 and subjected to imprint processing. On the contrary, according to the present embodiment, the substrate 13 is first loaded into the imprint apparatus 1 having the function of measuring the shape of each of the plurality of imaging regions 13a of the substrate 13 . The imprint apparatus 1 measures the shape of each of the plurality of photographing regions 13a of the substrate 13, and transmits the measurement result as the photographing shape information to the control unit 17. The substrate 13 whose shape of each of the photographing regions 13a is measured is sequentially loaded into the remaining imprint apparatus 1. The remaining imprint apparatus 1 in which the substrate 13 is loaded is subjected to imprint processing in accordance with the sequence shown in FIG.

In this embodiment, only one imprinting device 1 has a test Each of the plurality of imaging regions 13a of the substrate 13 is measured. The shape of the feature. However, this is not an exhaustive list. For example, each of the four imprint apparatuses 1 may have a function of measuring the shape of each of the plurality of photographing areas 13a of the substrate 13, and may be based on the recipe or state of the imprint process. The number of imprinting apparatuses 1 for measuring the shape of each photographing area 13a is increased/reduced (changed).

Specifically, when only the first substrate in the batch is measured When photographing the shape of the area, there is no great need to use this function of measuring the shape of the shot area. Therefore, as shown in FIG. 10, only one imprint apparatus 1 can have a function of measuring the shape of the photographing area. Further, the above-described imprint apparatus 1 can directly perform an imprint process after measuring the first substrate in the lot. Conversely, when the photographing areas of all the substrates are to be measured, the imprint apparatus to be used for measuring the shape of the photographing area can be determined according to the productivity of each imprint apparatus, or the throughput of the function of measuring the shape of the photographing area.

The photographing area 13a of the substrate 13 has been described so far. The shape (a unique amount). However, for example, if the deformation caused when the substrate stage is held by the substrate stage is large, some consideration must be made for such deformation. In the present embodiment, since the substrate 13 is transported inside the imprinting system 10, the shape of the photographing region 13a can be measured while the substrate stage holds the substrate 13, and the substrates are transferred in this state (so-called clip-on transfer). To the corresponding imprinting device in the imprinting apparatus 1. Therefore, it is possible to measure the shape of the photographing region 13a including the deformation caused when the substrate stage holds the substrate 13. This makes it possible to correct the shape of the mold 11 more accurately shape.

<Third embodiment>

Conventionally, the measuring unit 15 of the imprint apparatus 1 performs a condition setting operation of detecting the mold side mark 18 and the substrate side mark 19 while changing the measurement conditions and determining the optimum measurement condition based on the detection result. In this case, since the substrate side mark 19 cannot be detected due to foreign matter and transfer failure or processing failure in the process before the imprint process, the detectable mark (that is, the measurement target) is searched. . As described above, the measurement conditions include, for example, at least one of the light amount/wavelength of the light that irradiates the mold side mark 18 and the substrate side mark 19, and the substrate side mark 19 as the measurement target.

Note, however, that if the measuring unit 15 spends too much time When measured in between, the productivity of the imprint apparatus 1 is remarkably lowered. Therefore, in the present embodiment, when the shape of each of the plurality of imaging regions 13a of the substrate 13 is measured in advance, the optimum measurement conditions are introduced to further shorten the time taken for the measurement by the measuring unit 15.

The measuring device 700 shown in Figure 8A is used with embossing The measurement unit 15 of the standby 1 uses a measurement method similar to that of the measurement method (that is, has a similar configuration). Therefore, the measuring device 700 shown in FIG. 8A can be determined based on the mark information obtained by detecting the substrate side mark 19 when measuring the shape of each of the plurality of shooting regions 13a of the substrate 13 The measurement conditions set for the measurement unit 15 in the process. In this case, the tag information includes, for example, At least one of a ratio, information indicating deformation of the marker, and information indicating an abnormality of the marker.

In contrast to this, the measuring device 700 shown in FIG. 8B A measurement method different from the measurement method used by the measuring unit 15 of the imprint apparatus 1 is used. In this case, the relationship between the measurement conditions set for the measuring device 700 shown in FIG. 8B and the measurement conditions set for the measuring unit 15 can be sufficiently obtained in advance, that is, for use in FIG. 8B. The measurement conditions set by the measuring device 700 shown are converted into a relationship with respect to the measurement conditions set by the measuring unit 15. Based on this relationship and the mark information obtained by detecting the substrate side marks 19 at the time of measuring the shapes of the respective photographing regions 13a of the substrate 13, the measurement conditions of the measuring unit 15 in the second process can be determined.

In addition, as described above, it is possible to determine in advance whether or not it is possible to borrow Each of the substrate side marks 19 is detected by the detecting unit 15. For example, in order to increase the yield, the imprint apparatus 1 needs to perform imprint processing on a notched photographing area even near the edge of the substrate 13 to obtain several wafers from even a notched photographing area. FIG. 11 is a view showing an example of a chipped photographing region near the edge of the substrate 13. Referring to Fig. 11, nine wafer regions are arranged in one photographing region of the substrate 13, and substrate side marks 19 are disposed on four corners of the respective wafer regions. When the rotation as the deviation between the mold 11 and the substrate 13 is obtained, it is necessary to detect a plurality of substrate side marks 19 separated from each other, and thus the substrate side marks 19 on the outer circumference can be detected. Note, however, that as shown in FIG. 11, if the substrate side mark on the outer circumference cannot be detected 19, based on the mark information obtained by detecting the substrate side mark 19 when measuring the shape of each of the image capturing areas 13a of the substrate 13, the other substrate side marks 19 close to the outer circumference can be selected. Preselecting the substrate side marks 19 that can be detected by the measuring unit 15 in this manner can suppress the decrease in productivity of the imprint apparatus 1.

In addition, the measuring device 700 shown in FIG. 8B can be high-spirited. Sensitivity to detect measurement errors caused by irregularities or deformation of the substrate-side marks 19 occurring during processing (so-called Wafer Induced Shift (WIS)). It is also possible to obtain in advance the relationship between the asymmetry characteristic of the mark signal obtained by detecting the substrate side mark 19 and the measurement error (error amount), and to increase the compensation of the measurement result based on the obtained relationship. If the WIS is very large, the substrate side mark 19 as a measurement target can be selected (changed) to detect the other substrate side marks 19. In addition, since the WIS continuously changes in the plane of the substrate 13, the shape of each of the photographing regions can be predicted by weighted averaging the measured shapes of the photographing regions, as described in the first embodiment.

<Fourth embodiment>

A method of manufacturing an apparatus (a semiconductor device, a magnetic storage medium, a liquid crystal display device, or the like) as an article will be described. This manufacturing method includes a process of forming a pattern on a substrate (wafer, glass plate, film substrate, etc.) by using the imprint apparatus 1 or the imprint system 7 or 10. The manufacturing method also includes a process of processing the substrate on which the pattern is formed. The step in this process may include the step of removing the residual film of the pattern. In addition, the steps may include His known steps, for example, the step of etching the substrate by using a pattern as a mask. The method of manufacturing an article according to the present embodiment is advantageous in at least one of performance and quality of the article, productivity, and production cost as compared with the prior art.

While the invention has been described with reference to the preferred embodiments thereof, it is understood that the invention is not limited to the illustrative embodiments disclosed. The scope of the following claims is to be accorded the broadest understanding of the invention

1‧‧‧imprint equipment

11‧‧‧Mold

11a‧‧‧ pattern surface

12‧‧‧Mold holding unit

13‧‧‧Substrate

14‧‧‧Substrate holding unit

15‧‧‧Measurement unit

16‧‧‧Shape Correction Unit

17‧‧‧Control unit

18‧‧‧Mold side marking

19‧‧‧Substrate side marking

Claims (20)

An embossing apparatus that performs an embossing process of forming a pattern of an embossed material on a substrate using a mold, the embossing apparatus comprising: an obtaining unit configured to emboss the mold and the pattern by the embossing Obtaining a shape of each of a plurality of imaging regions on the substrate before processing the imaging regions of the substrate formed thereon to face each other; a first correction unit configured to be directed to each of the imaging regions on the substrate Correcting a shape difference between the pattern of the mold and the photographing region; a measuring unit configured to measure a displacement between the pattern of the mold and the photographing region on the substrate; and a second correcting unit configured To correct the displacement; and a control unit configured to control the imprint process, wherein the imprint process includes causing the first correction unit to correct the shape difference based on the shape obtained in advance by the obtaining unit a first process, and a second process of causing the second correcting unit to correct the displacement while the measuring unit measures the displacement. The imprint apparatus according to claim 1, wherein the control unit controls the imprint process such that the portion of the first process and the portion of the second process are simultaneously performed. The imprint apparatus according to claim 1, wherein the control unit controls the imprint process such that the mold moves relative to the substrate such that the mold and the photographing area on the substrate face each other. At the same time, the first process is started. An imprint apparatus according to claim 1 of the patent application, The control unit, in the second process, based on the displacement measured by the measuring unit and the displacement between the mold pattern generated in the first process and the photographing region on the substrate. The second correction unit corrects the displacement. The imprint apparatus according to claim 1, wherein the obtaining unit obtains a shape of each of the substrates loaded in the imprint apparatus. The imprint apparatus according to claim 1, wherein the obtaining unit obtains a shape measured by an external measuring device of the imprint apparatus. The imprint apparatus according to claim 1, wherein the measuring unit measures a shape of each of the plurality of photographing regions on the substrate, and the obtaining unit obtains the shape measured by the measuring unit. The imprint apparatus according to claim 1, wherein the obtaining unit obtains a measured shape of all the photographing areas on the substrate. The imprint apparatus according to claim 1, wherein the obtaining unit obtains a measured shape of some of the photographing areas of the photographing areas on the substrate, and based on the shapes of the photographing areas The shape of the remaining imaging regions among all the imaging regions on the substrate is obtained. The imprint apparatus according to claim 9, wherein the obtaining unit has a minimum flatness of the shapes of the certain photographing regions A least-square approximation is used to obtain the shapes of the remaining shot regions. The imprint apparatus according to claim 9, wherein the obtaining unit obtains the shapes of the remaining photographing regions by weighted averaging of the shapes of the certain photographing regions. The imprint apparatus according to claim 6, wherein the measuring device is configured to measure the shape by detecting a mark provided on the substrate, and the control unit is based on the obtained by detecting the mark The information is marked to determine the measurement condition of the measurement unit in the second process. The imprint apparatus according to claim 7, wherein the measuring unit measures the shape by detecting a mark provided on the substrate, and the control unit is based on the mark information obtained by detecting the mark. The measurement conditions of the measurement unit in the second process are determined. The imprint apparatus according to claim 12, wherein the mark information includes at least one of a contrast of the mark, information indicating a deformation of the mark, and information indicating an abnormality of the mark. The imprint apparatus according to claim 12, wherein the measurement condition comprises illuminating a mark provided on the mold, and a light amount and a wavelength of the marked light disposed on the substrate, and setting as a measurement target At least one of the indicia on the substrate. An imprint apparatus according to claim 1 of the patent application, The shape difference includes at least one of a magnification deviation, a trapezoidal deviation, and a twist between the mold and the photographing region on the substrate. An embossing system comprising a plurality of embossing devices and measuring devices, each embossing device being configured to perform an embossing process of forming a pattern of embossed material on a substrate using a mold, the measuring device being configured to Measuring the shape of each of the plurality of imaging regions on the substrate, each of the plurality of imprinting devices comprising: a first correction unit configured to correct for each of the imaging regions on the substrate a shape difference between the mold pattern of the mold and the photographing region; a measuring unit configured to measure a displacement between the mold pattern and the photographing region on the substrate; and a second correcting unit configured to correct The displacement, and the imprinting system includes a control unit configured to control the imprinting process of the measuring device and each of the imprinting devices, wherein the imprinting process includes the mold and the pattern by the The first correction unit is based on the measurement previously measured by the measurement device before the imprinting process is performed on the imaging regions of the substrate on which the imaging regions are formed A correction process to form a first difference of the shape, and causing the second correcting unit in the measuring unit measures to correct the displacement while the second process of the displacement. The embossing system according to claim 17, wherein the control unit controls the embossing process such that the first process is started before the embossed target image capturing area on the substrate and the substrate face each other, And after the mold and the imprinting target photographing area face each other, Start the second process. A method of manufacturing an article, the method comprising: forming a pattern on a substrate using an imprint apparatus; and processing a substrate on which the pattern has been formed, wherein the imprint apparatus performs imprinting on the substrate using a mold An imprint process of the pattern of the material, and the imprint apparatus includes: an obtaining unit configured to face each other before the mold and the photographing area of the substrate on which the pattern is formed by the imprint process Obtaining a shape of each of the plurality of imaging regions on the substrate; the first correcting unit configured to correct a shape difference between the pattern of the mold and the imaging region for each of the imaging regions on the substrate; a measuring unit configured to measure a displacement between the pattern of the mold and the photographing region on the substrate; a second correcting unit configured to correct the displacement; and a control unit configured to control the pressure Printing process, wherein the imprint process includes causing the first correction unit to correct the first difference of the shape difference based on the shape obtained in advance by the obtaining unit And a second processing unit such that the second correction unit measures the displacement of the measurement to correct the displacement while. A method of manufacturing an article, the method comprising: forming a pattern on a substrate using an imprinting system; and processing the substrate on which the pattern is formed, wherein the imprinting system includes a plurality of imprinting devices and a measuring device, Each embossing device is configured to perform a shape on the substrate using a mold An imprint process of the pattern of the imprinted material, the measuring device configured to measure a shape of each of the plurality of photographing regions on the substrate, each of the plurality of imprinting devices comprising: a first correcting unit, It is configured to correct a shape difference between the mold pattern of the mold and the photographing area for each photographing area on the substrate; a measuring unit configured to measure the mold pattern and the photographing area on the substrate And a second correcting unit configured to correct the displacement, and the imprinting system includes a control unit configured to control the imprinting process of the measuring device and each of the imprinting devices, wherein The imprint process includes, prior to the mold and the photographing region of the substrate on which the pattern is formed by the imprint process, the first correcting unit based on the measurement previously measured by the measuring device The shape is used to correct the first process of the shape difference, and the second process of causing the second correction unit to correct the displacement while the measurement unit measures the displacement.