WO2017213133A1

WO2017213133A1 - Alignment method, imprinting device, program, and article manufacturing method

Info

Publication number: WO2017213133A1
Application number: PCT/JP2017/020961
Authority: WO
Inventors: 慎一郎古賀; 伸高倉
Original assignee: キヤノン株式会社
Priority date: 2016-06-09
Filing date: 2017-06-06
Publication date: 2017-12-14
Also published as: KR102378292B1; KR20190013989A

Abstract

A method of alignment between a mold and a substrate on the basis of detection results of a mold-side mark and a substrate-side mark, comprising: a step for, on the basis of detection results obtained by detecting the mold-side mark and a first substrate-side mark at a plurality of detection points in each of a plurality of shot regions on a first substrate, finding a first positional displacement amount between the mold-side mark and the first substrate-side mark; a step for finding a shape correction amount of the mold or the first substrate on the basis of the first positional displacement amount; a step for transforming the mold or a second substrate on the basis of the shape correction amount; and a step for, on the basis of detection results obtained by detecting the mold-side mark and a second substrate-side mark at fewer detection points than the plurality of detection points in each of a plurality of shot regions on the second substrate, finding a second positional displacement amount between the mold-side mark and the second substrate-side mark, wherein alignment between the mold and the second substrate is performed on the basis of the second positional displacement amount.

Description

Alignment method, imprint apparatus, program, and article manufacturing method

The present invention relates to an alignment method, an imprint apparatus, a program, and an article manufacturing method.

There is an imprint technique for forming a fine pattern by bringing a mold into contact with an imprint material on a substrate. One of the imprint technologies is a photocuring method using a photocurable resin as an imprint material. In an imprint apparatus employing this photocuring method, first, an imprint material is supplied onto a substrate. Next, the mold is brought into contact with the imprint material on the substrate. Then, in a state where the mold and the imprint material are in contact with each other, the imprint material is cured by light irradiation, and then the pattern is formed on the substrate by peeling the mold from the cured imprint material.

Alignment between the substrate and the mold when the mold is brought into contact with the imprint material can be performed by a die-by-die alignment method. The die-by-die alignment method means that for each of a plurality of shot areas on the substrate, the positional relationship between the substrate and the mold is detected by optically detecting the marks formed on the shot area and the marks formed on the mold. Is an alignment method in which the deviation is measured and the deviation is corrected. The deviation correction can be performed by moving, rotating, and deforming the mold or the substrate. For example, the deformation of the mold or the substrate is deformed by applying a force to the side surface of the mold (Patent Document 1), a method of deforming the mold with heat (Patent Document 2), or extending the substrate by applying a force. There is a method (Patent Document 3) that causes the substrate to deform and a method that deforms the substrate with heat (Patent Document 4).

JP 2012-23092 A Japanese Patent No. 4328785 Japanese Patent No. 5064743 JP 2013-89663 A

The amount of misalignment correction may vary from substrate to substrate or from shot region to the influence of individual differences between molds and substrates, deformation of molds and substrates due to a series of imprint processes, and the like. If the number of positions where alignment measurement (positioning measurement) is performed is increased, the correction amount of deviation can be accurately obtained, but the throughput is reduced.

An object of the present invention is to provide an alignment method that is advantageous in terms of throughput, for example.

In order to solve the above problems, the present invention is an alignment method for aligning a mold and a substrate based on detection results of a mold side mark formed on the mold and a substrate side mark formed on the substrate. A detection result of detecting a mold side mark and a first substrate side mark formed on the first substrate at a plurality of detection points for each of a plurality of shot regions on the first substrate among the plurality of substrates. The first position deviation amount between the mold side mark and the first substrate side mark, and the alignment between the mold and the first substrate based on the first position deviation amount. A step of obtaining a shape correction amount of the mold or the first substrate, and a step of deforming a second substrate different from the first substrate among the mold or the plurality of substrates based on the shape correction amount A plurality of shot areas on the second substrate. With respect to each, the mold side mark and the second mark are detected based on the detection result obtained by detecting the mold side mark of the mold and the second substrate side mark formed on the second substrate at detection points fewer than the plurality of detection points. And a step of obtaining a second displacement amount between the substrate side mark and aligning the mold and the second substrate based on the second displacement amount.

According to the present invention, for example, an alignment method that is advantageous in terms of throughput can be provided.

It is a figure which shows the structure of the imprint apparatus which concerns on 1st Embodiment. 3 is a flowchart of an imprint method according to the first embodiment. It is a figure which shows the several mark area | region on a board | substrate, and the alignment mark provided in each shot area | region. It is a flowchart of the imprint process by detailed measurement mode. It is a flowchart of the imprint process by normal measurement mode. It is a flowchart of the imprint method which concerns on 2nd Embodiment. It is a figure for demonstrating the manufacturing method of articles | goods.

Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.

First embodiment

FIGS. 1A and 1B are diagrams showing the configuration of the imprint apparatus 100 and the configuration of the deformation unit 123 according to the first embodiment of the present invention. The imprint apparatus is an apparatus that forms a pattern of a cured product in which a concave / convex pattern of a mold is transferred by bringing an imprint material supplied on a substrate into contact with a mold and applying energy for curing to the imprint material. is there. Here, as the imprint apparatus using the photocuring method, an ultraviolet curable imprint apparatus that cures the uncured imprint material R on the substrate W by ultraviolet irradiation is used. In the following drawings, the X axis and the Y axis are parallel to the optical axis of the ultraviolet ray irradiated to the imprint material R on the substrate W and are orthogonal to each other in a plane perpendicular to the Z axis. Is taking. The imprint apparatus of this embodiment is configured to form patterns in a plurality of shot areas (shots) of the substrate W by repeating the imprint process. Here, imprint processing means supply of the imprint material R to the substrate W, contact between the mold M and the imprint material R, filling of the pattern of the mold M with the imprint material R, alignment (alignment), It shall refer to a series of cycles including curing (exposure) and mold M peeling.

The imprint apparatus 100 includes a substrate stage 110, a structure 120, an application unit (dispenser) 130, a first control unit 140, and a second control unit 150. The substrate stage 110 holds the substrate (wafer) W (for example, by vacuum suction) and is controlled by the second control unit 150 to be movable with six degrees of freedom. The substrate W is carried into the substrate stage 110 from outside the imprint apparatus 100 by a conveyance unit (not shown). After the imprint process, the substrate stage 110 is carried out of the imprint apparatus 100 by the transport unit. The second control unit 150 includes a measurement unit that measures the position of the substrate stage 110, and controls the substrate stage 110 based on the measurement result (detection result).

The structure 120 is provided with an irradiation unit 121, an alignment measurement unit 122, and a deformation unit 123, respectively. The irradiation unit 121 irradiates the imprint material R with ultraviolet light through the mold M. The alignment measurement unit 122 includes a plurality of scopes 122a to 122d and a drive unit (not shown). In the present embodiment, the relative position between the mold M and the substrate W is measured and aligned by the die-by-die alignment method. Accordingly, as the scopes 122a to 122d, a TTM (Through The Mask) that detects the alignment mark (mold side mark) formed on the mold M and the alignment mark (substrate side mark) formed on the substrate W through the mold M. ) Use scope. In the present embodiment, the alignment mark is detected after the mold M and the substrate W (imprint material R) are brought into contact with each other. In addition, the alignment measurement unit 122 may detect an image of the alignment mark formed on the mold M and an image of the alignment mark formed on the substrate W, respectively. Light from the substrate side mark may be detected. Note that the number of scopes is not limited to four. The drive unit of the alignment measurement unit 122 positions the plurality of scopes 122a to 122d.

The deformation unit 123 is a mechanism that deforms the mold M and adjusts the relative position and shape difference between the mold M and the substrate W. For example, the mold M is deformed by pressurizing the mold M from the outer peripheral direction using a cylinder that operates with a fluid such as air or oil. Further, the deforming unit 123 may be a mechanism that includes a temperature control unit that controls the temperature of the substrate W by applying heat to the substrate W, and that deforms the shape of the substrate W by controlling the temperature of the substrate W. . The substrate W may be deformed (typically expanded or contracted) through a process such as heat treatment. The deformation unit 123 corrects the shape of the mold M or the substrate W so that the positions of the substrate W and the mold M are matched in accordance with the deformation of the substrate W. In addition, the deformation | transformation part 123 may deform | transform the shape of the type | mold M and the board | substrate W not only by the above-mentioned pressurization and temperature control but by another method. Further, a plurality of means may be used in combination, such as the deformation portion 123 having both a means for deforming the mold M by pressurization from the outer peripheral direction and a means for controlling the temperature of the substrate W.

For example, the application unit 130 is provided in a tank that stores the imprint material R, a nozzle (discharge port) that discharges the imprint material R supplied from the tank through the supply path to the substrate W, and the supply path. And a supply amount control unit. The supply amount control unit typically controls the supply amount of the imprint material to the substrate W by controlling the valve so that the imprint material R is applied to one shot region in one ejection operation. Control.

As the imprint material R, a curable composition (which may be referred to as an uncured resin) that cures when given energy for curing is used. As the energy for curing, electromagnetic waves or heat is used. Examples of the electromagnetic wave include light such as infrared light, visible light, or ultraviolet light whose wavelength is selected from a range of 10 nm to 1 mm. A curable composition is a composition which hardens | cures by irradiation of light or by heating. Among these, the photocurable composition that is cured by light irradiation contains at least a polymerizable compound and a photopolymerization initiator, and may contain a non-polymerizable compound or a solvent as necessary. The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal release agent, a surfactant, an antioxidant, and a polymer component.

The imprint material R is applied onto the substrate by the application unit 130 in the form of droplets or islands or films formed by connecting a plurality of droplets. Alternatively, the imprint material R may be applied in a film shape on the substrate by a spin coater or a slit coater. The viscosity of the imprint material R (viscosity at 25 ° C.) is, for example, 1 mPa · s or more and 100 mPa · s or less.

The mold M has, for example, a rectangular outer peripheral portion, a predetermined uneven pattern is formed in a three-dimensional manner on the surface facing the substrate W, and is made of a material that transmits ultraviolet rays (quartz or the like). The substrate W is a substrate onto which the uneven pattern is transferred, and includes, for example, a single crystal silicon substrate, an SOI (Silicon on Insulator) substrate, or the like. Further, the substrate W is made of glass, ceramics, metal, semiconductor, resin, or the like, and a member made of a material different from the substrate may be formed on the surface as necessary. Specific examples of the substrate include a silicon wafer, a compound semiconductor wafer, and quartz glass.

The mold 120 may be provided with a mold holding unit that holds the mold M. The mold holding unit includes a chuck that holds the mold M, a drive unit that drives the chuck to move the mold M, and a base that supports the drive unit. The mold M is held by the chuck by a vacuum suction force or electrostatic force. The drive unit of the mold holding unit adjusts the position of the mold M with six degrees of freedom, brings the mold M into contact with the substrate W or the imprint material R on the substrate W, or molds from the cured imprint material R. M is peeled off (released).

The first control unit 140 and the second control unit 150 are connected to each component of the imprint apparatus 100 via a line, and control the operation and adjustment of each component according to a program or the like. The first control unit 140 and the second control unit 150 are configured by, for example, a computer and the like. Although not illustrated, a calculation unit such as a CPU or a DSP, a storage unit such as a memory or a hard disk for storing a recipe or the like Including. Here, the recipe is information (data) including a series of processing parameters when processing the substrate W or a lot which is a group of substrates performing the same processing. The processing parameters are, for example, the layout of shot areas, the order of shot areas to be imprinted, or imprint conditions in each shot area. The imprint conditions include, for example, a filling time, which is a time for pressing the mold M against the imprint material R applied onto the substrate W, and a time (exposure time) for curing the imprint material R by irradiating ultraviolet rays. As the imprint condition, there is also an application amount of the imprint material R applied for each shot area.

FIG. 1B is a diagram showing a configuration of the deforming portion 123. The alignment measurement unit 122 includes a plurality of scopes 122a to 122d. The deforming part 123 includes a plurality of actuators arranged on the side surface of the mold M. Each actuator is individually controlled based on a command value (control amount) stored in the storage unit of the first control unit 140 and applies a force toward the center of the mold M. Note that the number, arrangement position, size, and the like of the actuator are not limited to the example illustrated in FIG. The deformation method may be, for example, a method in which the mold M is attracted from the side surface and stretched. In addition, a sensor that measures the position of the actuator may be arranged, and the first control unit 140 may control the position of the actuator based on the measurement value. As described above, other methods such as controlling the temperature of the substrate W in addition to deforming the mold M by pressurization may be used. Moreover, you may match the shape of the board | substrate W and the type | mold M using a some means as the deformation | transformation part 123. FIG.

Note that the alignment between the substrate W and the mold M refers to matching the position (including relative rotation) and shape. The alignment of the substrate W and the mold M is performed by deforming or moving at least one of the substrate W and the mold M. The shape deviation includes a linear deviation such that the substrate W or the mold M is deformed at different magnifications in the X direction and the Y direction, or is deformed into a rhombus shape, and a nonlinear deviation due to random deformation.

FIG. 2 is a flowchart of the imprint method according to the present embodiment. In the imprint method according to the present embodiment, an alignment method between the substrate W and the mold M is employed, which includes a detailed measurement mode for performing alignment measurement in detail and a normal measurement mode for performing alignment measurement at fewer measurement points than the mode. To do. The mode switching timing is stored in advance in the recipe. When the present invention is applied to a group of substrates subjected to similar processing such as a lot, a higher effect can be obtained. For example, the alignment measurement is performed in the detailed measurement mode only for the first lot (first substrate) of the lot, and the normal measurement mode is applied to the second and subsequent substrates (second substrate) selected from the same lot. Switching timing such as is conceivable. Each process proceeds under the control of the first control unit 140 or the second control unit 150. In step S <b> 101, a transport unit (not shown) carries the substrate W from the imprint apparatus 100 to the substrate stage 110. In step S102, the first control unit 140 refers to the recipe, and sets a measurement mode at the time of alignment measurement of the substrate W carried into the substrate stage 110 in step S101. In step S102, when the detailed measurement mode is set, the process proceeds to step S103, and when the normal measurement mode is set, the process proceeds to step S106.

Process S103 to process S105 are processes in the detailed measurement mode, and process S106 to process S108 are processes in the normal measurement mode. In step S103, the first control unit 140 and the second control unit 150 perform imprint processing. Details of step S103 will be described later. In step S104, the first control unit 140 stores the shape correction amount of the mold M by the deforming unit 123 in step S103 in the storage unit for each shot area. Here, the shape correction amount means a control amount (position) of each actuator included in the deformation unit 123. When the deformation unit 123 includes means for controlling the temperature of the substrate W, the applied heat distribution (position and amount of applied heat) is stored as a shape correction amount. In step S105, the first control unit 140 determines whether steps S103 and S104 have been performed for all shot regions. If it is determined that the processing of all the shot areas has been completed (Yes), a transport unit (not shown) carries the substrate W out of the imprint apparatus 100 in step S109. When it is determined that the processing of all shot areas has not been completed (No), Step S103 and Step S104 are repeated for an unprocessed shot area.

In step S106, the first control unit 140 refers to the shape correction amount of the mold M corresponding to the shot area to be processed, which is stored in the storage unit in step S104. In step S107, an imprint process is performed by the first control unit 140 and the second control unit 150 based on the shape correction amount obtained in step S106. Details of step S107 will be described later. In step S108, the first control unit 140 determines whether or not steps S106 and S107 have been performed for all shot regions. If it is determined that the processing has been completed for all the shot areas (Yes), a transport unit (not shown) carries the substrate W out of the imprint apparatus 100 in step S109. If it is determined that the processing has not been completed for all shot areas (No), Step S106 and Step S107 are repeated for the unprocessed shot areas.

3A to 3C are diagrams showing a plurality of shot areas on the substrate W and alignment marks provided in each shot area. FIG. 3A is a diagram showing a plurality of shot regions SR partitioned on the substrate W and some representative shot regions (sample shot regions) SS among the plurality of shot regions SR. In FIG. 3A, the sample shot area SS is hatched with diagonal lines. 3B and 3C are diagrams showing alignment marks AM provided in the shot region SR. The number in the alignment mark AM indicates a set (detection point) of the alignment mark AM to be measured simultaneously. That is, the alignment mark AM indicated by the number 1 is simultaneously measured by the alignment measuring unit 122. The alignment mark AM in FIG. 3B is an alignment mark AM measured in the detailed measurement mode, and the alignment mark AM in FIG. 3C is an alignment mark AM measured in the normal measurement mode.

FIG. 4 is a flowchart of the imprint process in the detailed measurement mode in step S103 of the flowchart of FIG. In the detailed measurement mode, a plurality of alignment marks AM as shown in FIG. 3B are measured for each shot area. Each process proceeds under the control of the first control unit 140 or the second control unit 150. In step S401, application of the imprint material R to the substrate W, contact between the mold M and the imprint material R, and filling of the pattern of the mold M with the imprint material R are performed. Specifically, the second control unit 150 controls the substrate stage 110 to move the substrate W to a position immediately below the coating unit 130, the first control unit 140 controls the coating unit 130 based on the recipe, The imprint material R is applied to the target shot area. When the application is finished, the second control unit 150 controls the substrate stage 110 to move the substrate W to just below the mold M. Based on the recipe, the first controller 140 brings the mold M into contact with the imprint material R applied on the substrate W, and fills the pattern of the mold M with the imprint material R.

In step S402, the first control unit 140 controls a driving unit (not shown) to move the plurality of scopes 122a to 122d included in the alignment measurement unit 122. In the first measurement, the scopes 122a to 122d are moved to positions where the alignment mark AM given the number 1 shown in FIG. 3B is measured. A set of alignment marks AM to be measured simultaneously is stored in a recipe in advance. In step S403, the first control unit 140 causes the scopes 122a to 122d after movement to measure the alignment mark AM, and obtains a displacement amount of the positional relationship between the mold M and the substrate W based on the measurement result. In step S404, the first control unit 140 determines whether the deviation amount obtained in step S403 has exceeded a predetermined threshold value. When the threshold value is not exceeded (No), the process proceeds to step S407, and the first control unit 140 determines whether measurement and alignment of all the alignment mark AM sets have been completed. When it is determined that the measurement and alignment have been completed (Yes), in step S408, the first control unit 140 or the second control unit 150 controls each unit to perform curing (exposure) and mold M Peeling is performed and a series of imprint processes is completed.

If it is determined in step S404 that the threshold has been exceeded (Yes), in step S405, the first control unit 140 controls each actuator included in the deformation unit 123 to correct the shape of the mold M. When the deformation unit 123 includes means for controlling the temperature of the substrate W, the shape of the substrate W is corrected by applying heat to the substrate W. In step S406, the second control unit 150 controls the substrate stage 110 to correct the position of the substrate W in the XY direction and the position of each axis in the rotational direction. When the corrections in step S405 and step S406 are completed, the process returns to step S403, and alignment measurement of the set of alignment marks AM is performed again. In subsequent step S404, if it is determined that the deviation amount does not exceed the predetermined threshold (No), the process proceeds to step S407.

If it is determined in step S407 that measurement of all alignment mark AM sets has not been completed (No), another set of alignment marks AM (for example, a set assigned number 2) is processed in step S402. The subsequent steps are performed. Note that the control amount of each actuator included in the deforming unit 123 in step S405 is stored in the storage unit by the first control unit 140 (step S104). Here, when the deformation | transformation part 123 contains the means to control the temperature of the board | substrate W, the added heat distribution is preserve | saved at a memory | storage part.

In the present embodiment, an example in which curing and mold release are performed after measurement of all set alignment marks AM set in advance has been described, but the present invention is not limited to this. For example, after all the alignment mark AM sets have been measured in step S407, the process returns to step S402, and steps S402 to S406 may be repeated a predetermined number of times to perform alignment with higher accuracy. Absent.

FIG. 5 is a flowchart of the imprint process in the normal measurement mode in step S107 of the flowchart of FIG. In the present embodiment, the same number of alignment marks AM as the number of a plurality of scopes included in the alignment measurement unit 122 are simultaneously measured for each shot region. The alignment mark AM that is simultaneously measured is, for example, the mark indicated by the number 1 in FIG. In the normal measurement mode, the alignment mark AM is measured after correcting the shape of the mold M by the shape correction amount (control amount of each actuator) corresponding to the shot area of the mold M obtained in the detailed measurement mode. Here, when the deformation unit 123 includes means for controlling the temperature of the substrate W, the shape of the substrate W is obtained by applying heat to the substrate W based on the shape correction amount (heat distribution) obtained in the detailed measurement mode. Correct. Thereafter, the second control unit 150 controls the substrate stage 110 based on the measurement result (detection result) of the alignment mark AM, and corrects the position of the substrate W in the XY direction and the position of each axis in the rotation direction. Each process proceeds under the control of the first control unit 140 or the second control unit 150.

In step S501, similar to step S401, the imprint material R is applied to the substrate W, the contact between the mold M and the imprint material R, and the pattern of the mold M is filled with the imprint material R. In step S502, based on the control amount of each actuator obtained in the detailed measurement mode referred to in step S106, the first control unit 140 controls each actuator included in the deformation unit 123 to correct the shape of the mold M. . Here, as described above, when the deformation unit 123 includes a means for controlling the temperature of the substrate W, heat is applied to the substrate W based on the heat distribution obtained in the detailed measurement mode, and the shape of the substrate W is changed. to correct. In step S503, the first controller 140 causes the scopes 122a to 122d to measure the number 1 alignment mark AM shown in FIG. 3C, and obtains the amount of deviation in the positional relationship between the mold M and the substrate W. In step S504, the second control unit 150 controls the substrate stage 110 to correct the position of the substrate W in the XY direction and the position of each axis in the rotation direction. In step S505, the first control unit 140 or the second control unit 150 controls each unit to perform curing (exposure) and peeling of the mold M, and a series of imprint processes is completed.

In addition, you may add the process of shape correction of the type | mold M similar to process S502 between process S503 and process S504. In this step, the first control unit 140 obtains a control amount from the measurement result in step S503 using the control amount of each actuator used in step S502 as a reference, and corrects the shape of the mold M based on the obtained control amount. Do. In addition, when the deformation unit 123 includes means for controlling the temperature of the substrate W, the substrate W is further heated based on the measurement result in the step S503 with the heat distribution used in the step S502 as a reference. The shape correction may be performed.

Here, a detailed description will be given of a case where a shape correction process for the mold M similar to that in step S502 is added between step S503 and step S504. For example, consider a case where the amount of deviation measured in step S503 has different magnifications (G _{x in} the X direction and G _{y in} the Y direction) in the X direction and the Y direction. For the actuators provided on each side of the mold M in FIG. 1B, the required control amounts are A _{i for} the upper side, B _{i for} the left side, C _{i for} the right side, and D _i for the lower side (i is 1). ~ N natural number). n indicates the number of actuators, and in this embodiment, n = 7. The control amounts used in step S502 are the upper side a _i , the left side b _i , the right side c _i , and the lower side d _i for the actuator provided on each side of the mold M (i is 1). ~ N natural number). G _x and G _y are 1.0 when the pattern area of the mold M and the shot area of the substrate W are the same, and when the pattern area of the mold M is smaller, 1.0 or more, The value is 1.0 or less. The control amount to be obtained using the above parameters is as shown in the following equation (1).

When the deviation amount measured in step S503 is an orthogonality error T (an error in inclination between the X axis and the Y axis) with respect to the shot area of the substrate W in the pattern area of the mold M (in the case of deviation into a rhombus shape) ) Is a control amount to be obtained as shown in the following equation (2). T is a value that is 0 when there is no tilt error between the X and Y axes (the axes are orthogonal to each other). Further, y represents the Y coordinate of the actuator in a coordinate system with the center of the pattern area on the mold M as the origin.

In the case where the same step of correcting the shape of the mold M as in step S502 is included between step S503 and step S504, the substrate stage 110 is driven based on the deviation amount measured in step S503 in step S504 after this step. To do. Therefore, by adding the shape correction process for the mold M after step S503, the shape of the mold M or the substrate W by the deforming unit 123 can be corrected based on the actual measurement result on the substrate W to which the normal measurement mode is applied. .

In this embodiment, the example in which the shape correction amount is determined (step S103), stored (step S104), and referred to (step S106) is described in the same imprint apparatus, but is not limited thereto. For example, the determined shape correction amount for each shot area may be transmitted to an external control device. In this case, when the equivalent imprint process is performed, the shape correction amount determined by the own apparatus or another equivalent apparatus can be received from the external control apparatus and used.

As described above, the alignment method of the present embodiment performs detailed alignment on a substrate specified in advance, obtains a control amount of the actuator, and uses the control amount in the subsequent imprint process of the substrate. . Thereby, alignment accuracy can be improved without reducing the throughput. According to the present embodiment, an alignment method that is advantageous in terms of throughput can be provided.

Second embodiment

In the first embodiment, in the detailed measurement mode, the imprint process for all shot areas in the substrate is performed on the substrate specified in advance (for example, the first substrate of the lot). In the second embodiment, an imprint process is performed on the sample shot area SS shown in FIG. 3A on a substrate designated in advance in the detailed measurement mode. That is, in the first embodiment, the measurement mode is set for each substrate, whereas in the present embodiment, the measurement mode is set for each shot area.

Specifically, first, only the sample shot area SS is imprinted in the detailed measurement mode. Next, the shape correction amount in the sample shot region SS is statistically calculated, and the shape correction amount in the shot region other than the sample shot region SS is calculated. Finally, the shot area other than the sample shot area SS is imprinted in the normal measurement mode. Hereinafter, the measurement mode including both the detailed measurement mode and the normal measurement mode for one substrate is referred to as a sample shot measurement mode.

FIG. 6 is a flowchart of the imprint method according to this embodiment. Each step proceeds under the control of the first control unit 140 or the second control unit 150 as in the first embodiment. In steps S701 and S702, the substrate W is loaded and the measurement mode is set in the same manner as in steps S101 and S102. In step S702, when the sample shot measurement mode is set for the substrate W carried into the substrate stage 110, the process proceeds to step S703, and when the normal measurement mode is set, the process proceeds to step S106.

Process S703 to Process S705 are processes in the sample shot measurement mode. Further, steps S709 to S711 are normal measurement mode steps similar to steps S106 to S108 of the first embodiment, respectively, and therefore details thereof are omitted. In step S703, an imprint process similar to that in step S103 is performed. In step S704, the first control unit 140 determines whether or not the processing of all sample shot areas SS has been completed. If it is determined in step S704 that the process has not been completed (No), the process returns to step S703 to perform imprint processing for the unprocessed sample shot area SS. If it is determined that the process has been completed (Yes), the process proceeds to step S705. .

In step S705, the first control unit 140 performs statistical processing on the shape correction amount in each sample shot region SS when the imprint treatment is performed in the detailed measurement mode in step S703, and shot regions other than the sample shot region SS are processed. The shape correction amount at is calculated. Here, the calculated shape correction amount is stored in the storage unit by the first control unit 140.

In step S706, the first control unit 140 reads the shape correction amount obtained in step S705 from the storage unit. In step S707, an imprint process is performed on shot areas other than the sample shot area SS in the normal measurement mode similar to the first embodiment based on the read shape correction amount. In step S708, the first control unit 140 determines whether the processes of steps S706 and S707 have been performed in all shot areas other than the sample shot area SS, and when it is determined that the process has ended (Yes). Advances to step S712. If it is determined that the process has not been completed (No), the processes in steps S706 and S707 are performed on the unprocessed shot area. In step S712, the substrate W is unloaded from the imprint apparatus 100 by a transport unit (not shown).

Next, an example of a method for calculating the shape correction amount of the shot area other than the sample shot area SS by the first control unit 140 in step S705 will be described. First, as a statistic amount of each actuator, an average value S of the control amount, a change amount M of the control amount in the X direction, and a change amount R of the control amount in the Y direction are calculated. Actually, the following equation (3) using these statistics as coefficients is calculated by a known least square method. At the time of calculation, the center positions x and y of the sample shot area in the XY coordinates on the substrate plane with the origin of the position of each actuator in the sample shot and the center of the substrate W are used.

In formula (3), a _i , b _i , c _i and d _i are the same as in formula (1). The average value S, the X-direction change amount M, and the Y-direction change amount R are calculated for each actuator, and the subscript indicates the corresponding actuator. After obtaining the coefficient of equation (3), which is the statistical value, the center position of each shot at XY coordinates on the substrate plane with the substrate center as the origin is substituted for x and y in equation (3) for each shot. Thereby, each actuator control amount in each shot is calculated. In the present embodiment, a first order polynomial is used for the expression (3), but an expression of an arbitrary order may be used.

As described above, the alignment method of this embodiment can be expected to further reduce the throughput because the shot area using the detailed measurement mode is less than that of the first embodiment. In this embodiment, an example of switching between the sample shot measurement mode and the normal measurement mode according to the measurement mode set for each substrate has been described. However, even if all substrates are imprinted in the sample shot measurement mode, I do not care.

In the above embodiment, the mold M is deformed at the time of alignment. However, the present invention is not limited to this, and the substrate W may be deformed, or both of them may be deformed. Instead of the configuration including the first control unit 140 and the second control unit 150 with which the imprint apparatus 100 can communicate with each other as in the above embodiment, a configuration including an integrated control unit may be used. In addition, the first control unit 140 and the second control unit 150 may be configured integrally with other parts of the imprint apparatus 100 (in a common housing), or other parts of the imprint apparatus 100. You may comprise separately from (in another housing | casing). In addition, the method according to the above embodiment can be executed by the computer of the first control unit 140 as a program.

Embodiment according to article manufacturing method

The manufacturing method of a device (semiconductor integrated circuit element, liquid crystal display element, etc.) as an article includes a step of forming a pattern on a substrate (wafer, glass plate, film-like substrate) by an imprint apparatus using the method described above. Furthermore, the manufacturing method may include a step of etching the substrate on which the pattern is formed. When manufacturing other articles such as patterned media (recording media) and optical elements, the manufacturing method may include other processes for processing a substrate on which a pattern is formed instead of etching. The method for manufacturing an article according to the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the conventional method.

The pattern of the cured product formed using the imprint apparatus is used permanently on at least a part of various articles, or temporarily when manufacturing various articles. The article is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, or a mold. Examples of the electric circuit element include a volatile or nonvolatile semiconductor memory such as DRAM, SRAM, flash memory, or MRAM, and a semiconductor element such as LSI, CCD, image sensor, or FPGA. Examples of the mold include an imprint mold.

The pattern of the cured product is used as it is as at least a part of the above-mentioned article or temporarily used as a resist mask. After etching or ion implantation is performed in the substrate processing step, the resist mask is removed.

Next, a specific method for manufacturing an article will be described. As shown in FIG. 7A, a substrate 1z such as a silicon wafer on which a workpiece 2z such as an insulator is formed is prepared. Subsequently, the substrate 1z is formed on the surface of the workpiece 2z by an inkjet method or the like. The printing material 3z is applied (applied). Here, a state in which the imprint material 3z in the form of a plurality of droplets is applied on the substrate is shown.

As shown in FIG. 7B, the imprint mold 4z is opposed to the imprint material 3z on the substrate with the side having the concave / convex pattern formed thereon. As shown in FIG. 7C, the substrate 1 coated with the imprint material 3z is brought into contact with the mold 4z, and pressure is applied. The imprint material 3z is filled in a gap between the mold 4z and the workpiece 2z. In this state, when light is irradiated as energy for curing through the mold 4z, the imprint material 3z is cured.

As shown in FIG. 7D, when the imprint material 3z is cured and then the mold 4z and the substrate 1z are separated, a pattern of a cured product of the imprint material 3z is formed on the substrate 1z. The pattern of the cured product is such that the concave portion of the mold 4z corresponds to the convex portion of the cured product, and the concave portion of the mold 4z corresponds to the convex portion of the cured product, that is, the uneven pattern of the mold 4z on the imprint material 3z. Has been transcribed.

As shown in FIG. 7E, when etching is performed using the pattern of the cured product as an etching resistant mask, the portion of the surface of the workpiece 2z where there is no cured product or remains thin is removed, and the grooves 5z and Become. As shown in FIG. 7F, when the pattern of the cured product is removed, an article in which the groove 5z is formed on the surface of the workpiece 2z can be obtained. Although the cured product pattern is removed here, it may be used as, for example, an interlayer insulating film included in a semiconductor element, that is, a constituent member of an article, without being removed after processing.

Other embodiments

The present invention also provides a process of supplying a program that realizes one or more functions of the above-described embodiments to a system or apparatus via a network or a storage medium, and one or more processors in those computers reading and executing the program. It is feasible. It can also be realized by a circuit (for example, ASIC) that realizes one or more functions.

As mentioned above, although preferable embodiment of this invention was described, this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary.

DESCRIPTION OF SYMBOLS 100 Imprint apparatus 110 Substrate stage 120 Structure 121 Irradiation part 122 Alignment measurement part 123 Deformation part 130 Application part (dispenser)
140 first control unit 150 second control unit M-type W substrate

Claims

An alignment method for aligning the mold and the substrate based on the detection result of the mold side mark formed on the mold and the substrate side mark formed on the substrate,
Detection in which the mold side mark and the first substrate side mark formed on the first substrate are detected at a plurality of detection points in each of a plurality of shot regions on the first substrate among the plurality of substrates. A step of obtaining a first positional deviation amount between the mold side mark and the first substrate side mark based on a result;
Obtaining a shape correction amount of the mold or the first substrate for aligning the mold with the first substrate based on the first displacement amount;
Deforming the mold or a second substrate different from the first substrate among the plurality of substrates based on the shape correction amount;
In each of the plurality of shot regions on the second substrate, the mold side mark and the second substrate side mark formed on the second substrate are the plurality of the plurality of the plurality of shot regions on which the first substrate side mark has been detected. A step of obtaining a second positional deviation amount between the mold side mark and the second substrate side mark based on a detection result detected at detection points smaller than the detection points;
Have
Based on the second displacement amount, the mold and the second substrate are aligned.
An alignment method characterized by that.
A plurality of shot regions on the first substrate corresponding to a plurality of shot regions on the second substrate, and the first substrate side mark corresponding to the second substrate side mark; The alignment method according to claim 1, wherein:
3. The alignment method according to claim 1, wherein the first substrate and the second substrate are selected from the same lot.
The alignment of the mold and the second substrate based on the second positional deviation amount includes deforming at least one of the mold or the second substrate. 4. The alignment method according to any one of 3.
The alignment between the mold and the second substrate based on the second displacement amount is performed by applying a force to a side surface of the mold. 2. The alignment method according to item 1.
The alignment between the mold and the second substrate based on the second displacement amount is performed by applying heat to the second substrate. The alignment method according to claim 1.
The alignment between the mold and the second substrate based on the second positional deviation amount includes moving at least one of the mold or the second substrate. 6. The alignment method according to claim 1.
The deformation of the mold or the second substrate is performed based on a correction amount obtained from the second positional deviation amount with reference to the shape correction amount obtained from the first positional deviation amount. The alignment method according to any one of claims 4 to 7, wherein:
In the step of obtaining the first positional deviation amount, the first mark formed on the mold side mark and the first substrate with respect to a part of the shot regions among the plurality of shot regions on the first substrate. A substrate-side mark is detected at a plurality of detection points, and a positional deviation amount calculated from the detection result and a statistical quantity of the detection result is used as the first positional deviation amount. The alignment method according to any one of claims 1 to 8.
An alignment method for aligning the mold and the substrate based on the detection result of the mold side mark formed on the mold and the substrate side mark formed on the substrate,
Detection in which the mold side mark and the first substrate side mark formed on the first substrate are detected at a plurality of detection points in each of a plurality of shot regions on the first substrate among the plurality of substrates. A step of obtaining a first positional deviation amount between the mold side mark and the first substrate side mark based on a result;
Obtaining a shape correction amount of the mold or the first substrate for aligning the mold with the first substrate based on the first displacement amount;
In each of a plurality of shot regions on the second substrate, the plurality of detections in which the first substrate side mark is detected by using the mold side mark and the second substrate side mark formed on the second substrate. A second positional shift amount between the mold side mark and the second substrate side mark based on a detection result detected at a detection point less than a point, and the mold based on the shape correction amount, Or a step of deforming a second substrate different from the first substrate among the plurality of substrates;
An alignment method comprising:
An imprint apparatus for forming a pattern on an imprint material supplied on a substrate using a mold,
A measurement unit for measuring the relative position of the mold and the substrate;
A mechanism for adjusting the relative position by deforming the mold or the substrate;
A control unit for controlling the measurement unit and the mechanism;
Have
The controller is
Among the plurality of substrates, a plurality of detection points include a mold side mark formed on the mold and a first substrate side mark formed on the first substrate in each of a plurality of shot regions on the first substrate. Controlling the measurement unit to detect in
The mold for aligning the mold and the first substrate based on a first positional deviation amount between the mold side mark and the first substrate side mark obtained from a detection result. Alternatively, the shape correction amount of the first substrate is obtained,
Based on the shape correction amount, the mechanism is controlled so as to deform the mold or a second substrate different from the first substrate among the plurality of substrates,
The plurality of detections in which the first substrate side mark is detected by using the mold side mark and the second substrate side mark formed on the second substrate in each of a plurality of shot regions on the second substrate. Controlling the measurement unit to detect at fewer detection points than points,
Controlling the mechanism based on a second positional deviation amount between the mold side mark and the second substrate side mark obtained from a detection result;
An imprint apparatus characterized by that.
A program that causes a computer to execute the method according to any one of claims 1 to 10.
Forming an imprint material pattern on a substrate using the imprint apparatus according to claim 11;
And a processing step of processing the substrate on which the pattern is formed in the step, and manufacturing the article from the substrate processed by the processing step.