CN113709990B - 一种基于pcb板蚀刻、检测、钻孔的自动化设备 - Google Patents
一种基于pcb板蚀刻、检测、钻孔的自动化设备 Download PDFInfo
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- CN113709990B CN113709990B CN202111034915.0A CN202111034915A CN113709990B CN 113709990 B CN113709990 B CN 113709990B CN 202111034915 A CN202111034915 A CN 202111034915A CN 113709990 B CN113709990 B CN 113709990B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- ing And Chemical Polishing (AREA)
Abstract
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Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111034915.0A CN113709990B (zh) | 2021-09-04 | 2021-09-04 | 一种基于pcb板蚀刻、检测、钻孔的自动化设备 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202111034915.0A CN113709990B (zh) | 2021-09-04 | 2021-09-04 | 一种基于pcb板蚀刻、检测、钻孔的自动化设备 |
Publications (2)
Publication Number | Publication Date |
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CN113709990A CN113709990A (zh) | 2021-11-26 |
CN113709990B true CN113709990B (zh) | 2022-11-22 |
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CN202111034915.0A Active CN113709990B (zh) | 2021-09-04 | 2021-09-04 | 一种基于pcb板蚀刻、检测、钻孔的自动化设备 |
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CN (1) | CN113709990B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN115066098B (zh) * | 2022-07-08 | 2023-07-07 | 广东竞成电子有限公司 | 一种用于电子线路板蚀刻和钻孔的设备和控制方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT1165541B (it) * | 1983-02-17 | 1987-04-22 | Prt Pluritec Italia Spa | Metodo di foratura e relativa foratrice per piastre impilate particolarmente piastre di supporto di circuiti stampati |
CN205408295U (zh) * | 2016-02-22 | 2016-07-27 | 荣旗工业科技(苏州)有限公司 | 贴膜机构 |
CN209627847U (zh) * | 2018-09-20 | 2019-11-12 | 东莞宇宙电路板设备有限公司 | 超声波蚀刻装置及超声波蚀刻机 |
CN109773876A (zh) * | 2019-01-23 | 2019-05-21 | 海安交睿机器人科技有限公司 | 一种自动上下料打孔设备 |
CN112689401A (zh) * | 2020-12-31 | 2021-04-20 | 新余市木林森线路板有限公司 | 一种柔性线路vcp黑孔及镀铜一体式生产设备及生产工艺 |
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2021
- 2021-09-04 CN CN202111034915.0A patent/CN113709990B/zh active Active
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Effective date of registration: 20221103 Address after: 518000 B-17D, Jingzhou Building, No. 87, Shangbao East Road, Futian District, Shenzhen, Guangdong Applicant after: Zhao Wenzhen Address before: 518000 2nd floor, No.7, fukeng South Street, Xikeng community, Yuanshan street, Longgang District, Shenzhen City, Guangdong Province Applicant before: Shenzhen Tuoshi Intelligent Technology Co.,Ltd. |
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Effective date of registration: 20230508 Address after: 518000 5th Floor, Building B, Oyster Industry Branch Plant, Bao'an Taohuayuan Technology Innovation Park, Fenghuanggang Community, Xixiang Street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Hanpu Intelligent Manufacturing Technology Co.,Ltd. Address before: 518000 B-17D, Jingzhou Building, No. 87, Shangbao East Road, Futian District, Shenzhen, Guangdong Patentee before: Zhao Wenzhen |
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