CN113677100A - 一种印制电路高厚线路蚀刻工艺 - Google Patents

一种印制电路高厚线路蚀刻工艺 Download PDF

Info

Publication number
CN113677100A
CN113677100A CN202110840213.5A CN202110840213A CN113677100A CN 113677100 A CN113677100 A CN 113677100A CN 202110840213 A CN202110840213 A CN 202110840213A CN 113677100 A CN113677100 A CN 113677100A
Authority
CN
China
Prior art keywords
etching
copper
circuit
corrosion inhibitor
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110840213.5A
Other languages
English (en)
Inventor
文泽生
王泉勇
周国云
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ganzhou Shenlian Circuit Co ltd
Original Assignee
Ganzhou Shenlian Circuit Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ganzhou Shenlian Circuit Co ltd filed Critical Ganzhou Shenlian Circuit Co ltd
Priority to CN202110840213.5A priority Critical patent/CN113677100A/zh
Publication of CN113677100A publication Critical patent/CN113677100A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/074—Features related to the fluid pressure

Abstract

本发明公开了一种印制电路高厚线路蚀刻工艺，选用甲基苯并三氮唑与2‑苯氧基乙醇复合添加剂作为高厚铜线路的蚀刻缓蚀剂，应用该缓蚀剂，并通过保护剂吸附在铜表面，先在低喷淋压力下，使保护层不被破坏，铜的蚀刻速率慢，之后，在高喷淋压力下，破坏保护层，从而实现高厚铜蚀刻，从而使高厚铜新路的蚀刻因子大于4，满足载流传输可靠性要求。通过该工艺可以使高厚铜新路的蚀刻因子大于4，满足载流传输可靠性要求。

Description

一种印制电路高厚线路蚀刻工艺
技术领域
本发明属于电路板制备领域，具体属于一种印制电路高厚线路蚀刻工艺。
背景技术
印制电路作为载流功能在新能源汽车、军工产品等中已开始大规模进行使用。在新能源汽车中，印制电路需要传输数安的电流，为此，印制电路板上必须从线路的厚度和宽度进行载流能力的提升，2OZ以上的载流线路在印制电路中已经较为常见，如果采用常规的蚀刻方法，线路容易产生较大的侧蚀，形成一个类似三角形的蚀刻形状。该形状不但极大地影响了大电流的传输。
为了减少高厚铜线路的侧蚀，因此，希望开发复合缓蚀型的蚀刻液，保护厚铜蚀刻过程中线路存在的侧蚀问题严重的瓶颈技术。
发明内容
(1)要解决的技术问题
针对现有技术的不足，本发明的目的在于提供一种印制电路高厚线路蚀刻工艺。
(2)技术方案
为了解决上述技术问题，本发明提供了这样一种印制电路高厚线路蚀刻工艺，选用甲基苯并三氮唑与2-苯氧基乙醇复合添加剂作为高厚铜线路的蚀刻缓蚀剂，应用该缓蚀剂，并通过保护剂吸附在铜表面，先在低喷淋压力下，使保护层不被破坏，铜的蚀刻速率慢，之后，在高喷淋压力下，破坏保护层，从而实现高厚铜蚀刻，从而使高厚铜新路的蚀刻因子大于4，满足载流传输可靠性要求。
通过Materials Studio软件筛选不同的缓蚀剂，得到复合型缓蚀剂效果更佳。
(3)有益效果
与现有技术相比，本发明的有益效果在于：通过该工艺可以使高厚铜新路的蚀刻因子大于4，满足载流传输可靠性要求。
具体实施方式
为使本发明实现的技术手段、创作特征、达成目的与功效易于明白了解，下面对本发明具体实施方式中的技术方案进行清楚、完整的描述，以进一步阐述本发明，显然，所描述的具体实施方式仅仅是本发明的一部分实施方式，而不是全部的样式。
实施例1
一种印制电路高厚线路蚀刻工艺，选用甲基苯并三氮唑与2-苯氧基乙醇复合添加剂作为高厚铜线路的蚀刻缓蚀剂，应用该缓蚀剂，并通过保护剂吸附在铜表面，先在低喷淋压力下，使保护层不被破坏，铜的蚀刻速率慢，之后，在高喷淋压力下，破坏保护层，从而实现高厚铜蚀刻，从而使高厚铜新路的蚀刻因子大于4，满足载流传输可靠性要求。通过该工艺可以使高厚铜新路的蚀刻因子大于4，满足载流传输可靠性要求。
以上描述了本发明的主要技术特征和基本原理及相关优点，对于本领域技术人员而言，显然本发明不限于上述示范性具体实施方式的细节，而且在不背离本发明的构思或基本特征的情况下，能够以其他的具体形式实现本发明。因此，无论从哪一点来看，均应将上述具体实施方式看作是示范性的，而且是非限制性的，本发明的范围由所附权利要求而不是上述说明限定，因此旨在将落在权利要求的等同要件的含义和范围内的所有变化囊括在本发明内。
此外，应当理解，虽然本说明书按照各实施方式加以描述，但并非每个实施方式仅包含一个独立的技术方案，说明书的这种叙述方式仅仅是为清楚起见，本领域技术人员应当将说明书作为一个整体，各实施方式中的技术方案也可以经适当组合，形成本领域技术人员可以理解的其他实施方式。

Claims (1)

1.一种印制电路高厚线路蚀刻工艺，其特征在于，选用甲基苯并三氮唑与2-苯氧基乙醇复合添加剂作为高厚铜线路的蚀刻缓蚀剂，应用该缓蚀剂，并通过保护剂吸附在铜表面，先在低喷淋压力下，使保护层不被破坏，铜的蚀刻速率慢，之后，在高喷淋压力下，破坏保护层，从而实现高厚铜蚀刻，从而使高厚铜新路的蚀刻因子大于4，满足载流传输可靠性要求。
CN202110840213.5A 2021-07-24 2021-07-24 一种印制电路高厚线路蚀刻工艺 Pending CN113677100A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110840213.5A CN113677100A (zh) 2021-07-24 2021-07-24 一种印制电路高厚线路蚀刻工艺

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110840213.5A CN113677100A (zh) 2021-07-24 2021-07-24 一种印制电路高厚线路蚀刻工艺

Publications (1)

Publication Number Publication Date
CN113677100A true CN113677100A (zh) 2021-11-19

Family

ID=78540058

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110840213.5A Pending CN113677100A (zh) 2021-07-24 2021-07-24 一种印制电路高厚线路蚀刻工艺

Country Status (1)

Country Link
CN (1) CN113677100A (zh)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011166028A (ja) * 2010-02-12 2011-08-25 Sumitomo Metal Mining Co Ltd Ｃｏｆ基板の製造方法
CN110438505A (zh) * 2019-09-23 2019-11-12 昆山成功环保科技有限公司 晶圆级封装用钛种子蚀刻液
CN112399723A (zh) * 2020-10-23 2021-02-23 武汉大学 一种柔性pcb板的高精细蚀刻生产系统及方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011166028A (ja) * 2010-02-12 2011-08-25 Sumitomo Metal Mining Co Ltd Ｃｏｆ基板の製造方法
CN110438505A (zh) * 2019-09-23 2019-11-12 昆山成功环保科技有限公司 晶圆级封装用钛种子蚀刻液
CN112399723A (zh) * 2020-10-23 2021-02-23 武汉大学 一种柔性pcb板的高精细蚀刻生产系统及方法

Similar Documents

Publication Publication Date Title
TWI452173B (zh) 銅或銅合金用之蝕刻液，蝕刻前處理液及蝕刻方法
KR20120060844A (ko) 내열성 동박 및 그 제조 방법, 회로 기판, 동장 적층 기판 및 그 제조 방법
CN107287594A (zh) 一种铜镍多层薄膜用蚀刻液
EP1200968A4 (en) AQUEOUS CARBON COMPOSITION AND METHOD FOR COATING A NON-LEADING SUBSTRATE
CN104519656A (zh) 减少单端互连和总线中的远端串扰
CN105448466A (zh) 一种金属化铁粉芯磁芯及其制备方法
ZA200006623B (en) Method for metal coating of substrates.
CN107022762A (zh) 三胺基取代苯酚或三胺基取代苯硫酚的应用及微蚀处理液
CN113677100A (zh) 一种印制电路高厚线路蚀刻工艺
JPH0298994A (ja) ポリイミド絶縁層上への導体層形成方法
CN1059244C (zh) 有机防锈处理铜箔
CN103179785B (zh) 一种线路板及其制作方法
CN103402697A (zh) 助焊剂
CN1174814C (zh) 电缆的抗腐蚀镀层和包带
US8965159B1 (en) Implementing twisted pair waveguide for electronic substrates
US6296897B1 (en) Process for reducing extraneous metal plating
CN213522524U (zh) 一种新颖接地螺钉孔焊盘
CN114521064A (zh) 一种多段式三防涂覆工艺及其pcba制备方法和产品
KR100401340B1 (ko) Ｐｃｂ용 전해동박의 표면처리방법
CN112822871A (zh) 一种用于电路板盲槽的加工方法
EP3564988A1 (en) Heat-dissipating substrate, preparation method and application thereof, and electronic component
CN116583026B (zh) 一种ic载板退锡方法及其应用
JPH04267597A (ja) フレキシブルプリント配線板の製造方法
CN201608980U (zh) 一种应用于osp板子前处理线上的烘干装置
KR20150071947A (ko) 표면처리층을 포함하는 어스볼트 및 어스볼트의 표면처리방법

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20211119

WD01 Invention patent application deemed withdrawn after publication