CN107287594A - 一种铜镍多层薄膜用蚀刻液 - Google Patents
一种铜镍多层薄膜用蚀刻液 Download PDFInfo
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- CN107287594A CN107287594A CN201710405426.9A CN201710405426A CN107287594A CN 107287594 A CN107287594 A CN 107287594A CN 201710405426 A CN201710405426 A CN 201710405426A CN 107287594 A CN107287594 A CN 107287594A
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- Prior art keywords
- etching solution
- acid
- hydrogen peroxide
- etching
- nickel
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/28—Acidic compositions for etching iron group metals
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Weting (AREA)
Abstract
Description
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CN201710405426.9A CN107287594A (zh) | 2017-06-01 | 2017-06-01 | 一种铜镍多层薄膜用蚀刻液 |
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CN201710405426.9A CN107287594A (zh) | 2017-06-01 | 2017-06-01 | 一种铜镍多层薄膜用蚀刻液 |
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CN107287594A true CN107287594A (zh) | 2017-10-24 |
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CN201710405426.9A Pending CN107287594A (zh) | 2017-06-01 | 2017-06-01 | 一种铜镍多层薄膜用蚀刻液 |
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Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109136931A (zh) * | 2018-08-31 | 2019-01-04 | 深圳市华星光电技术有限公司 | 一种高效铜钼蚀刻液及蚀刻方法 |
CN110273156A (zh) * | 2018-03-14 | 2019-09-24 | 东进世美肯株式会社 | 不包含氟的蚀刻液组合物 |
WO2020015078A1 (zh) * | 2018-07-19 | 2020-01-23 | 深圳市华星光电半导体显示技术有限公司 | 铜/钼蚀刻液组合物及其应用 |
CN111455388A (zh) * | 2019-01-22 | 2020-07-28 | 达兴材料股份有限公司 | 酸性过氧化氢水溶液组合物 |
CN111647889A (zh) * | 2020-05-27 | 2020-09-11 | 湖北兴福电子材料有限公司 | 一种蚀刻速率稳定的铜蚀刻液 |
CN111719156A (zh) * | 2019-03-20 | 2020-09-29 | 易安爱富科技有限公司 | 蚀刻组合物及利用其的蚀刻方法 |
CN112385019A (zh) * | 2018-08-16 | 2021-02-19 | 朗姆研究公司 | 蚀刻剂组合物 |
CN112647079A (zh) * | 2020-12-03 | 2021-04-13 | 湖北兴福电子材料有限公司 | 一种金属钨和铜的选择性蚀刻液 |
CN112941516A (zh) * | 2020-12-29 | 2021-06-11 | 苏州运宏电子有限公司 | 一种精控式蚀刻液及其蚀刻方法 |
CN114318340A (zh) * | 2021-12-22 | 2022-04-12 | 深圳深骏微电子材料有限公司 | 一种蚀刻液组合物及其制备方法 |
CN114774922A (zh) * | 2022-04-01 | 2022-07-22 | 肇庆微纳芯材料科技有限公司 | 一种金属蚀刻液及其制备方法与蚀刻方法 |
Citations (4)
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CN102230178A (zh) * | 2011-04-29 | 2011-11-02 | 西安东旺精细化学有限公司 | 镍或镍/铜合金的蚀刻液组合物 |
CN103080382A (zh) * | 2010-08-16 | 2013-05-01 | 高级技术材料公司 | 用于铜或铜合金的蚀刻溶液 |
CN104233302A (zh) * | 2014-09-15 | 2014-12-24 | 南通万德科技有限公司 | 一种蚀刻液及其应用 |
CN106637209A (zh) * | 2016-12-29 | 2017-05-10 | 深圳市华星光电技术有限公司 | 一种蚀刻液组合物及该组合物的金属膜刻蚀方法 |
-
2017
- 2017-06-01 CN CN201710405426.9A patent/CN107287594A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103080382A (zh) * | 2010-08-16 | 2013-05-01 | 高级技术材料公司 | 用于铜或铜合金的蚀刻溶液 |
CN106435587A (zh) * | 2010-08-16 | 2017-02-22 | 恩特格里斯公司 | 用于铜或铜合金的蚀刻溶液 |
CN102230178A (zh) * | 2011-04-29 | 2011-11-02 | 西安东旺精细化学有限公司 | 镍或镍/铜合金的蚀刻液组合物 |
CN104233302A (zh) * | 2014-09-15 | 2014-12-24 | 南通万德科技有限公司 | 一种蚀刻液及其应用 |
CN106637209A (zh) * | 2016-12-29 | 2017-05-10 | 深圳市华星光电技术有限公司 | 一种蚀刻液组合物及该组合物的金属膜刻蚀方法 |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110273156A (zh) * | 2018-03-14 | 2019-09-24 | 东进世美肯株式会社 | 不包含氟的蚀刻液组合物 |
CN110273156B (zh) * | 2018-03-14 | 2023-06-30 | 东进世美肯株式会社 | 不包含氟的蚀刻液组合物 |
WO2020015078A1 (zh) * | 2018-07-19 | 2020-01-23 | 深圳市华星光电半导体显示技术有限公司 | 铜/钼蚀刻液组合物及其应用 |
US11345852B2 (en) * | 2018-08-16 | 2022-05-31 | Lam Research Corporation | Etchant composition |
TWI815947B (zh) * | 2018-08-16 | 2023-09-21 | 奧地利商蘭姆研究股份公司 | 蝕刻劑組成物 |
CN112385019A (zh) * | 2018-08-16 | 2021-02-19 | 朗姆研究公司 | 蚀刻剂组合物 |
WO2020042234A1 (zh) * | 2018-08-31 | 2020-03-05 | 深圳市华星光电技术有限公司 | 一种高效铜钼蚀刻液及蚀刻方法 |
CN109136931A (zh) * | 2018-08-31 | 2019-01-04 | 深圳市华星光电技术有限公司 | 一种高效铜钼蚀刻液及蚀刻方法 |
CN111455388A (zh) * | 2019-01-22 | 2020-07-28 | 达兴材料股份有限公司 | 酸性过氧化氢水溶液组合物 |
TWI749287B (zh) * | 2019-01-22 | 2021-12-11 | 達興材料股份有限公司 | 酸性過氧化氫水溶液組成物 |
CN111719156A (zh) * | 2019-03-20 | 2020-09-29 | 易安爱富科技有限公司 | 蚀刻组合物及利用其的蚀刻方法 |
CN111647889A (zh) * | 2020-05-27 | 2020-09-11 | 湖北兴福电子材料有限公司 | 一种蚀刻速率稳定的铜蚀刻液 |
CN112647079A (zh) * | 2020-12-03 | 2021-04-13 | 湖北兴福电子材料有限公司 | 一种金属钨和铜的选择性蚀刻液 |
CN112941516A (zh) * | 2020-12-29 | 2021-06-11 | 苏州运宏电子有限公司 | 一种精控式蚀刻液及其蚀刻方法 |
CN114318340A (zh) * | 2021-12-22 | 2022-04-12 | 深圳深骏微电子材料有限公司 | 一种蚀刻液组合物及其制备方法 |
CN114318340B (zh) * | 2021-12-22 | 2023-09-29 | 惠州达诚微电子材料有限公司 | 一种蚀刻液组合物及其制备方法 |
CN114774922A (zh) * | 2022-04-01 | 2022-07-22 | 肇庆微纳芯材料科技有限公司 | 一种金属蚀刻液及其制备方法与蚀刻方法 |
CN114774922B (zh) * | 2022-04-01 | 2022-11-15 | 肇庆微纳芯材料科技有限公司 | 一种钼铝金属蚀刻液及其制备方法与蚀刻方法 |
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Effective date of registration: 20190327 Address after: 516265 West of Maintenance Workshop of McCort Science and Technology Industrial Park, Weilong Management Zone, Liangjing Town, Huiyang District, Huizhou City, Guangdong Province Applicant after: Huizhou Dacheng Microelectronic Materials Co., Ltd. Address before: 518000 No. 54 Huansheng Avenue, Yanchuan Community, Songgang Street, Baoan District, Shenzhen City, Guangdong Province Applicant before: Shenzhen Dacheng cleaning agent Co., Ltd. |
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Application publication date: 20171024 |