CN113651598A - 一种izo掺杂靶材及其制备方法 - Google Patents

一种izo掺杂靶材及其制备方法 Download PDF

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CN113651598A
CN113651598A CN202110918688.1A CN202110918688A CN113651598A CN 113651598 A CN113651598 A CN 113651598A CN 202110918688 A CN202110918688 A CN 202110918688A CN 113651598 A CN113651598 A CN 113651598A
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CN113651598B (zh
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曾墩风
王志强
石煜
陶成
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Wuhu Yingri Technology Co ltd
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Abstract

本发明涉及一种IZO掺杂靶材及其制备方法,所述靶材的靶胚由下列质量份数的氧化物烧结而成:In2O3 90份、ZnO 8份、Ga2O3 1‑1.5份、SnO2 1‑1.5份、Nb2O5 0.01‑1份。所述制备方法包括(1)混粉、(2)造粒、(3)成型、(4)烧结、(5)制靶等步骤。本发明IZO掺杂靶材具有较高的纯度和致密度,强度、导电率等性能较佳。上述技术效果的取得是产品配方、制备方法等多个技术手段综合作用的结果。

Description

一种IZO掺杂靶材及其制备方法
技术领域
本发明涉及金属粉末加工,尤其涉及同时用压实和烧结方法加工金属粉末制品。
背景技术
靶材是磁控溅射过程中的基本耗材,不仅使用量大,而且靶材质量的好坏对薄膜的性能起着至关重要的决定作用。靶材应用领域比较广泛,主要包括光学靶材、显示薄膜用靶材、半导体领域用靶材、记录介质用靶材、超导靶材等。其中半导体领域用靶材、显示用靶材和记录介质用靶材是当前使用最为广泛的三大靶材。为提升薄膜制备速率和保证薄膜的生长质量,溅射靶材要达到一定的指标要求。现有技术中,把控制靶材质量的关键因素概括为纯度、致密度、强度、晶粒尺寸及尺寸分布等几个方面。
近年来,液晶显示、有源有机发光二极管显示以及柔性显示等平板显示技术迅猛发展,作为核心部件的薄膜晶体管(TFT)的重要性不言而喻。其中,基于氧化物半导体的TFT以其较高的载流子迁移率、良好的电学均匀性、高的可见光透过性、较低的制备温度、以及较低的成本等优势受到广泛的关注。
现有技术中,光透过性及导电性优异的铟锡氧化物 (Indium Tin Oxide,ITO)膜是TFT的主流。但是,ITO膜的耐湿性较差,有因湿气导致电阻值增大的缺点。为了改善上述缺点,本技术领域正在研究包含In、Zn、O的氧化铟锌(In2O3-ZnO,IZO)半导体,IZO具有较高的载流子迁移率、大的禁带宽度,可以满足大尺寸、高分辨率、高开口率等显示要求,具有极大的应用潜力。
作为IZO靶材的主要原料之一,ZnO属于一种Ⅱ-Ⅵ族半导体材料,常温下其禁带宽度为3.37eV,激子结合能为60meV。由于其低介电常量、高的化学稳定性、优异的压电、光电等特性,使其在光学、催化剂、太阳能电池等方面具有很大潜力的应用价值。氧化锌拥有六方纤锌矿型、立方闪锌矿型及四方岩盐矿型三种结构晶型。但是,ZnO有着自身的点缺陷,具体来说,ZnO的本征点缺陷主要有六种,分别是锌间隙Znj、锌空位VZn、反位锌Zno、氧间隙Oj、氧空位Vo及反位氧OZn。六种点缺陷中主要的施主缺陷是锌间隙与氧空位,这也是本征氧化锌呈N型的主要原因。未掺杂的氧化锌载流子浓度较低,通过掺杂合适的元素,可以大幅度提高其载流子浓度,以满足该材料在现代工业领域的应用要求。
为了改善ZnO在靶材中的性能,现有技术中进行了诸多尝试。譬如:中国专利文献CN104619673A、CN104619674A披露了一种氧化物烧结体及溅射靶,将氧化锌、氧化铟、氧化镓和氧化锡混合并烧结而得到的氧化物烧结体;中国专利文献CN104416160A披露了一种高致密度氧化锌基靶材,以氧化锌作为主源,掺杂源至少为氧化铟粉末、氧化镓粉末、氧化锂粉、锰粉、氧化钇粉、氧化锆粉、钨粉、银粉、铜粉、氧化锡粉、铋粉、钴粉、镍粉、钛粉、钼粉、铬粉、氧化钒粉、硼粉和氧化铝粉末中的一种;所述锌源和氧源的总质量与所述掺杂源的质量比为5:1至500:1;中国专利文献CN108947518A披露了一种多元掺杂的ZnO镀膜材料,组分包括氧化锌粉体与掺杂氧化物粉体,掺杂粉体选自氧化镓、氧化钇、氧化锡、氧化硅、氧化钛中的一种;美国专利文献US20190177230A1披露了一种氧化物烧结体,其中包括锌、铟、镓、锆和锡等元素;日本专利文献JP2015189632A披露了一种氧化物烧结体,其中包括In、Ga、Zn、Hf和Zr等元素。
上述现有技术存在一个共同的问题,那就是靶材中ZnO的比例很大,虽然采用了掺杂等技术进行改善,但ZnO的固有缺陷并没有完全被克服。因此,如何通过调整掺杂配方及制备方法来克服ZnO的固有缺陷,从而提高IZO靶材的性能成为亟待解决的技术问题。
发明内容
本发明所要解决的技术问题是提供一种IZO掺杂靶材,使该靶材具有较高的纯度和致密度,强度、导电率等性能较佳。
本发明所要解决的另一个技术问题是提供一种IZO掺杂靶材的制备方法,目的是通过该方法制备出靶材,并且使产品能达到上述标准。
为了解决上述技术问题,本发明采用如下技术方案:
一种IZO掺杂靶材,其靶胚由下列质量份数的氧化物烧结而成:In2O3 90份、ZnO 8份、Ga2O3 1-1.5份、SnO2 1-1.5份、Nb2O5 0.01-1份。
优选的,所述靶材的靶胚由下列质量份数的氧化物烧结而成:In2O3 90份、ZnO 8份、Ga2O3 1.2份、SnO2 1.2份、Nb2O5 0.1份。
进一步的,为了保证产品的纯度,所述In2O3、ZnO、Ga2O3、SnO2、Nb2O5五种原料粉体的纯度均大于99.99%。
进一步的,本发明IZO掺杂靶材的制备方法包括下列步骤:
(1)混粉:将In2O3、ZnO、Ga2O3、SnO2、Nb2O5五种粉体按质量比加入到球磨罐中,进行充分混合。
(2)造粒:采用喷雾造粒机进行造粒,得到IZO掺杂粉体。
(3)成型:将IZO掺杂粉体装入钢模中,四周覆盖乳胶包套,冷等静压成型,得IZO掺杂素胚。
进一步的,所述冷等静压的压力为280-320Mpa。
进一步的,所述IZO掺杂素胚的相对密度为70-85%。
(4)烧结:将IZO掺杂素胚放入气氛保护高温烧结炉中进行烧结,烧结温度呈曲线升温,最高温度在控制在1400-1580℃,得IZO掺杂旋转靶胚。
进一步的,烧结的步骤如下:
(4-1)0℃升温到600℃,升温6小时,保温15小时;
(4-2)600℃升温到1200℃,升温6小时,保温16个小时;保温开始时通入氧气,氧气流量20L/min;
(4-3)1200℃升温到1580℃,升温6小时,保温20小时;
(4-4)1580℃降温到1400℃,降温6小时;
(4-5)1400℃降温到1000℃,降温8小时,开始断氧;
(4-6)1000℃后开始通入空气,加速冷却,直至出炉。
采用本发明的烧结方法,尤其是采用本发明的曲线升温法,有利于提升产品的性能(测试数据详见下文)。
进一步的,所述IZO掺杂旋转靶胚的相对密度大于99.5%。
(5)制靶:对IZO掺杂旋转靶胚进行表面加工,然后绑定到钛背管上,得到IZO掺杂旋转靶材。
与现有技术相比,本发明的有益技术效果至少可以体现在如下几个方面:
1.产品有较高的致密度和强度,导电率性能较佳
由下文实施例的测试结果可知,本发明IZO掺杂旋转靶材各项性能较佳,均优于现有技术制备的IZO掺杂靶材(按对比例1制备)。
(1)本发明IZO掺杂靶材(靶胚)的抗弯强度达到135.6-137.4MPa,远高于对比例的99.3MPa。
(2)本发明IZO掺杂靶材(靶胚)的致密性佳。线收缩率达到5.25-5.36%,远低于对比例1的12.27%;质量烧损率达到0.24-0.25%,远低于对比例1的3.35%;相对密度大于99.5%,远高于对比例1的89.3%。
(3)本发明IZO掺杂靶材(靶胚)的导电率佳。电阻率达到1.2-1.3×10-4Ω·cm,远低于对比例1的11.6×10-4Ω·cm。
在IZO配方中掺入少量Nb2O5,有利于提高靶材的导电率
由实施例3与对比例2的数据对比可知,实施例3的电阻率是1.2×10-4Ω·cm,而对比例2的电阻率是7.6×10-4Ω·cm。实施例3与对比例2的唯一区别是,对比例2中未掺杂Nb2O5。结果表明,在IZO配方中掺入少量Nb2O5,有利于提高靶材的导电率,其原理并不明确,有待进一步的探讨。
采用本发明的烧结方法,尤其是曲线升温法,有利于提升产品的综合性能
由实施例3与对比例3的数据对比可知,实施例3制备的IZO掺杂靶材(靶胚),其各项性能均优于对比例3。实施例3与对比例3的唯一区别是烧结的方式不一样,尤其是烧结的温度不一样。结果表明,采用本发明的烧结方法,尤其是曲线升温法,有利于提升产品的综合性能,其原理并不明确,有待进一步的探讨。
综上所述,本发明IZO掺杂靶材具有较高的纯度和致密度,强度、导电率等性能较佳。上述技术效果的取得是产品配方、制备方法等多个技术手段综合作用的结果。
试验例 IZO掺杂靶材的性能测试
1.试验方法
下文所述实施例及对比例制成的IZO掺杂旋转靶胚,分别采用下列方法进行性能测试:
1.1 抗弯强度
本发明采用三点抗弯法测试IZO掺杂旋转靶胚的强度,采用的设备是电子万能试验机。通过多测量,对测得的数据进行统计,来判断靶材实际强度。
抗弯强度计算公式为:σ=3PL/2bh2
其中:P—断裂载荷;L—支点跨距;b—样品宽度;h—样品高度。
线收缩率
通过游标卡尺测量烧结前后的长度变化计算。
线收缩率=△L/L0。其中:L0-烧结前素胚长度;L-烧结后样品长度。
质量烧损率
通过高精密度电子天平称量靶胚烧结前后重量,经过计算得出质量烧损率。
质量烧损率=△M/M0,其中:M0-烧结前素胚重量;M-烧结后样品重量。
密度
采用多功能电子比重计测出样品的实际密度,通过计算实际密度与理论密度的比值即可得样品的相对密度。
电阻率
采用四探针测试仪测量样品电阻率,选取多个区域进行测量,取平均值。
试验结果
试验结果见表1。结果表明,(1)本发明IZO掺杂靶材有较高的致密度和强度,导电率性能较佳;(2)在IZO配方中掺入少量Nb2O5,有利于提高靶材的导电率;(3)采用本发明的烧结方法,尤其是曲线升温法,有利于提升产品的综合性能。
表1 IZO掺杂靶材的性能测试
Figure DEST_PATH_IMAGE001
具体实施方式
下面结合实施例对本发明的技术方案做进一步的说明。
实施例1 IZO掺杂靶材的制备
配方:In2O3 90份、ZnO 8份、Ga2O3 1份、SnO2 1份、Nb2O5 0.01份。In2O3、ZnO、Ga2O3、SnO2、Nb2O5五种原料粉体的纯度均大于99.99%。
制备方法:
(1)混粉:将In2O3、ZnO、Ga2O3、SnO2、Nb2O5五种粉体按质量比加入到球磨罐中,进行充分混合。
(2)造粒:喷雾造粒机进行造粒,得到IZO掺杂粉体。
(3)成型:将IZO掺杂粉体装入钢模中,四周覆盖乳胶包套,冷等静压成型,得IZO掺杂素胚。
所述冷等静压的压力为280Mpa。
所述IZO掺杂素胚的相对密度为70%。
(4)烧结:将IZO掺杂素胚放入气氛保护高温烧结炉中进行烧结,烧结温度呈曲线升温,最高温度在控制在1580℃,得IZO掺杂旋转靶胚。
烧结的步骤如下:
(4-1)0℃升温到600℃,升温6小时,保温15小时;
(4-2)600℃升温到1200℃,升温6小时,保温16个小时;保温开始时通入氧气,氧气流量20L/min;
(4-3)1200℃升温到1580℃,升温6小时,保温20小时;
(4-4)1580℃降温到1400℃,降温6小时;
(4-5)1400℃降温到1000℃,降温8小时,开始断氧;
(4-6)1000℃后开始通入空气,加速冷却,直至出炉。
(5)制靶:对IZO掺杂旋转靶胚进行表面加工,然后绑定到钛背管上,得到IZO掺杂旋转靶材。
产品性能测试:
详见前文试验例。
实施例2 IZO掺杂靶材的制备
配方:In2O3 90份、ZnO 8份、Ga2O3 1.5份、SnO2 1.5份、Nb2O5 1份。In2O3、ZnO、Ga2O3、SnO2、Nb2O5五种原料粉体的纯度均大于99.99%。
制备方法:
(1)混粉:将In2O3、ZnO、Ga2O3、SnO2、Nb2O5五种粉体按质量比加入到球磨罐中,进行充分混合。
(2)造粒:喷雾造粒机进行造粒,得到IZO掺杂粉体。
(3)成型:将IZO掺杂粉体装入钢模中,四周覆盖乳胶包套,冷等静压成型,得IZO掺杂素胚。
所述冷等静压的压力为310Mpa。
所述IZO掺杂素胚的相对密度为84%。
(4)烧结:将IZO掺杂素胚放入气氛保护高温烧结炉中进行烧结,烧结温度呈曲线升温,最高温度在控制在1580℃,得IZO掺杂旋转靶胚。
烧结的步骤如下:
(4-1)0℃升温到600℃,升温6小时,保温15小时;
(4-2)600℃升温到1200℃,升温6小时,保温16个小时;保温开始时通入氧气,氧气流量20L/min;
(4-3)1200℃升温到1580℃,升温6小时,保温20小时;
(4-4)1580℃降温到1400℃,降温6小时;
(4-5)1400℃降温到1000℃,降温8小时,开始断氧;
(4-6)1000℃后开始通入空气,加速冷却,直至出炉。
(5)制靶:对IZO掺杂旋转靶胚进行表面加工,然后绑定到钛背管上,得到IZO掺杂旋转靶材。
产品性能测试:
详见前文试验例。
实施例3 IZO掺杂靶材的制备
配方:In2O3 90份、ZnO 8份、Ga2O3 1.2份、SnO2 1.2份、Nb2O5 0.1份。In2O3、ZnO、Ga2O3、SnO2、Nb2O5五种原料粉体的纯度均大于99.99%。
制备方法:
(1)混粉:将In2O3、ZnO、Ga2O3、SnO2、Nb2O5五种粉体按质量比加入到球磨罐中,进行充分混合。
(2)造粒:喷雾造粒机进行造粒,得到IZO掺杂粉体。
(3)成型:将IZO掺杂粉体装入钢模中,四周覆盖乳胶包套,冷等静压成型,得IZO掺杂素胚。
所述冷等静压的压力为320Mpa。
所述IZO掺杂素胚的相对密度为85%。
(4)烧结:将IZO掺杂素胚放入气氛保护高温烧结炉中进行烧结,烧结温度呈曲线升温,最高温度在控制在1580℃,得IZO掺杂旋转靶胚。
烧结的步骤如下:
(4-1)0℃升温到600℃,升温6小时,保温15小时;
(4-2)600℃升温到1200℃,升温6小时,保温16个小时;保温开始时通入氧气,氧气流量20L/min;
(4-3)1200℃升温到1580℃,升温6小时,保温20小时;
(4-4)1580℃降温到1400℃,降温6小时;
(4-5)1400℃降温到1000℃,降温8小时,开始断氧;
(4-6)1000℃后开始通入空气,加速冷却,直至出炉。
(5)制靶:对IZO掺杂旋转靶胚进行表面加工,然后绑定到钛背管上,得到IZO掺杂旋转靶材。
产品性能测试:
详见前文试验例。
对比例1 IZO掺杂靶材的制备
参照中国专利文献CN104619673A实施例NO.1方法制备。
对比例2 IZO掺杂靶材的制备
除配方中不含Nb2O5外,余同实施例3。
对比例3 IZO掺杂靶材的制备
烧结的步骤如下:
(4-1)0℃升温到1580℃,升温12小时,保温30小时;一开始就通入氧气,氧气流量20L/min;
(4-2)1580℃降温到室温,降温6小时;降温时断氧,在1000℃时,通入空气,直至出炉。
余同实施例3。
显然,上述实施例仅仅是为清楚地说明技术方案而作的举例,并非对本发明实施方式的限定。对于所属领域的普通技术人员来说,在上述说明的基础上还可以做出其它不同形式的变化或变动。这里无需也无法对所有的实施方式予以穷举。凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等,均应包含在本发明要求的保护范围之内。

Claims (8)

1.IZO掺杂靶材,其特征在于,所述靶材的靶胚由下列质量份数的氧化物烧结而成:In2O3 90份、ZnO 8份、Ga2O3 1-1.5份、SnO2 1-1.5份、Nb2O5 0.01-1份。
2.IZO掺杂靶材,其特征在于,所述靶材的靶胚由下列质量份数的氧化物烧结而成:In2O3 90份、ZnO 8份、Ga2O3 1.2份、SnO2 1.2份、Nb2O5 0.1份。
3.权利要求1所述IZO掺杂靶材的制备方法,其特征在于,所述的方法包括下列步骤:
(1)混粉:将In2O3、ZnO、Ga2O3、SnO2、Nb2O5五种粉体按质量比加入到球磨罐中,进行充分混合;
(2)造粒:采用喷雾造粒机进行造粒,得到IZO掺杂粉体;
(3)成型:将IZO掺杂粉体装入钢模中,四周覆盖乳胶包套,冷等静压成型,得IZO掺杂素胚;
(4)烧结:将IZO掺杂素胚放入气氛保护高温烧结炉中进行烧结,烧结温度呈曲线升温,最高温度在控制在1400-1580℃,得IZO掺杂旋转靶胚;
(5)制靶:对IZO掺杂旋转靶胚进行表面加工,然后绑定到钛背管上,得到IZO掺杂旋转靶材。
4.权利要求3所述IZO掺杂靶材的制备方法,其特征在于,所述第(4)步,烧结的步骤如下:
(4-1)0℃升温到600℃,升温6小时,保温15小时;
(4-2)600℃升温到1200℃,升温6小时,保温16个小时;保温开始时通入氧气,氧气流量20L/min;
(4-3)1200℃升温到1580℃,升温6小时,保温20小时;
(4-4)1580℃降温到1400℃,降温6小时;
(4-5)1400℃降温到1000℃,降温8小时,开始断氧;
(4-6)1000℃后开始通入空气,加速冷却,直至出炉。
5.权利要求3所述IZO掺杂靶材的制备方法,其特征在于,所述第(3)步,冷等静压的压力为280-320Mpa。
6.权利要求3所述IZO掺杂靶材的制备方法,其特征在于,所述第(3)步,所述IZO掺杂素胚的相对密度为70-85%。
7.权利要求3所述IZO掺杂靶材的制备方法,其特征在于,所述第(4)步,IZO掺杂旋转靶胚的相对密度大于99.5%。
8.权利要求3-7任一项所述IZO掺杂靶材的制备方法,其特征在于,所述In2O3、ZnO、Ga2O3、SnO2、Nb2O5五种粉体的纯度均大于99.99%。
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