CN113628995A - Sticking and detaching equipment, automatic sticking and detaching system and sticking and detaching method for wireless electrostatic chuck - Google Patents
Sticking and detaching equipment, automatic sticking and detaching system and sticking and detaching method for wireless electrostatic chuck Download PDFInfo
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- CN113628995A CN113628995A CN202010885938.1A CN202010885938A CN113628995A CN 113628995 A CN113628995 A CN 113628995A CN 202010885938 A CN202010885938 A CN 202010885938A CN 113628995 A CN113628995 A CN 113628995A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
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Abstract
The invention relates to a sticking and releasing device, an automatic sticking and releasing system and a sticking and releasing method for a wireless electrostatic chuck, which are used for automatically sticking and automatically releasing a thinned substrate from a wireless electrostatic chuck, wherein the system comprises a machine body, at least one transmission device, at least one baking device, at least one pre-alignment device and at least one sticking and releasing device, the sticking and releasing device comprises a carrier plate electrostatic generating group for adsorbing a wireless electrostatic chuck and a substrate transferring group for adsorbing a thinned substrate, the substrate transferring group can linearly displace relative to the carrier plate electrostatic generating group, so that the substrate transferring group can drive the thinned substrate to be pressed on the surface of the wireless electrostatic chuck of the carrier plate electrostatic generating group, therefore, the carrier plate electrostatic generating group can be driven to enable the wireless electrostatic chuck to generate an electrostatic electric field so as to stick the thinned substrate, the bonding efficiency can be improved, and the high-precision manufacturing requirement can be met, so that the requirement of automatic manufacturing of the thinned substrate can be met.
Description
Technical Field
The invention belongs to an automatic bonding technology of an electrostatic chuck, and particularly relates to a bonding and de-bonding device, an automatic bonding and de-bonding system and a bonding and de-bonding method for a wireless electrostatic chuck, which can enable the electrostatic chuck and a thinned substrate such as a wafer to carry out automatic bonding and dissociation work, improve the work efficiency, reduce the phenomena of bonding failure and substrate damage and improve the process automation of the thinned substrate.
Background
In recent years, with the development of miniaturization of semiconductor processes, such as memories and power devices, which are being miniaturized toward smaller size, higher performance and lower cost, in order to make the chip area smaller, the design scheme adopted in the semiconductor industry is to change the chip design of the original chip horizontally disposed into a vertically stacked manner, i.e. a so-called 3D IC stacked package. Since the 3D IC stack package is stacked in a vertical direction, Through-Silicon Via (tsv; TSV technology physically and electrically connects the functional chips in the IC package, so the thickness of the silicon wafer is compressed to less than 100 microns. In addition, the photographing quality of the smart phone is comparable to that of a professional monocular camera recently, and one of the keys of the smart phone camera lens for greatly improving the imaging quality is that the smart phone camera lens introduces an ultra-thin blue glass filter which can absorb redundant infrared light and reduce the real color of an object.
The thinned substrates, whether thinned wafers of 3D ICs or ultra-thin filters for lenses, have a thickness of less than 200 μm, 100 μm or even less than 50 μm and a larger surface area, such as 8 inches, 12 inches or more for semiconductor processing. The thinned substrate becomes very flexible and elastic, thereby causing warpage. However, no matter thin substrates such as silicon wafers or glass sheets are manufactured, polishing, cleaning, multi-layer coating, etching and cutting are required. The ultra-thin substrate can generate unevenness and stress due to warping in the manufacturing process, which can cause poor manufacturing process such as uneven thickness during film coating, even the thinned substrate can not effectively focus during detection due to warping problem, thereby generating detection error or delaying detection time, which directly influences the detection of poor products, and the thinned substrate also has the problems of small storage capacity, fragility and the like in the transportation and assembly process, so the warping problem of the thinned substrate has great adverse effect on the manufacturing process reliability, thereby causing the problems of increased manufacturing process cost and poor product ratio.
In order to keep the thinned substrate flat for the process, the thinned substrate is subjected to a Temporary bonding process to strengthen the tensile strength of the thinned substrate, wherein the Temporary bonding process mainly uses a multi-layer polymer bonding material to reversibly mount the thinned substrate on a carrier, but needs to perform peeling after the process is performed, so that the yield of the thinned substrate itself must be maintained between bonding and peeling, and the bonding material used after bonding must also maintain the internal stress of the thinned wafer in response to the mismatch of the Coefficient of Thermal Expansion (CTE) of the bonding material and the bonded material, and simultaneously maintain the surface smoothness of the front/back surface of the wafer, and the acid and alkali problems for the bonding material in the process environment, which are the problems faced by the Temporary bonding process.
The latest improvement is to use an E-Chuck or a support to bond and thin the substrate before the substrate is thinned. However, in the conventional bonding process of the thinned substrate, the substrate carrier seat is selectively pivoted on one side of an electrostatic force generation seat of the manual bonding and de-bonding device, and in use, a worker first places the thinned substrate on the electrostatic force generation seat, then covers the upper substrate carrier seat on the electrostatic force generation seat in a manual rotating manner, so as to utilize the substrate carrier seat to adsorb the thinned substrate, then places the wireless electrostatic carrier disk on the electrostatic force generator, and rotationally covers the substrate carrier seat again, so that the thinned substrate is pressed on the opposite surface of the wireless electrostatic carrier disk, and finally starts up the conduction to enable the wireless electrostatic carrier disk to generate a static electric field relative to the thinned substrate, so that the thinned substrate can be bonded on the wireless electrostatic carrier disk. When the wireless electrostatic carrying disc and the thinned substrate are dissociated, the operation is reversed, the wireless electrostatic carrying disc adhered with the thinned substrate is placed on the electrostatic force generating seat, then the substrate carrying seat is covered above the thinned substrate, and after the electrostatic force generating seat starts to dissociate and releases the electric field of the wireless electrostatic carrying disc, the substrate carrying seat above can absorb the thinned substrate and lift upwards, and then the wireless electrostatic carrying disc and the thinned substrate are separated.
However, such manual operation is not only very slow, but also the bonding efficiency is very poor because the bonding failure phenomenon is caused by the relative adhesion surface of the wireless electrostatic chuck and the thinned substrate being unable to ensure its cleanness and dryness under the operation of personnel environment, and the bonding operation needs to be performed again, and even the problem of cracking or breaking may occur due to dislocation, slippage or uneven pressing. Furthermore, since the manual operation is performed manually, it is difficult to accurately align the wireless electrostatic chuck and the thinned substrate during the bonding process, and for the miniaturized semiconductor process with high precision, it is difficult to directly apply the wireless electrostatic chuck and the thinned substrate to the high precision process, and only can be used in the situations with low precision, such as transmission and storage.
In other words, since the conventional wireless electrostatic chuck manually bonds and thins the substrate, there are not only the problems of low efficiency and high failure rate, but also the possibility of cracking or breaking, and the high precision process requirement cannot be met, and how to solve the above problems is desired in the art and is also a technical subject to be solved by the present invention.
Accordingly, the present inventors have made extensive studies on the problems of the conventional wireless electrostatic chuck during the bonding of the thinned substrate, and have made extensive and intensive efforts to improve and try to develop a bonding and debonding apparatus, an automatic bonding and debonding system and a bonding and debonding method for the wireless electrostatic chuck, so as to overcome the disadvantages and inconveniences caused by the conventional manual operation.
Disclosure of Invention
Therefore, it is a primary objective of the present invention to provide a bonding and detaching apparatus for a wireless electrostatic chuck, which can improve bonding efficiency, greatly reduce bonding failure rate, and reduce cracking or chipping.
Another objective of the present invention is to provide an automatic adhering and detaching system for a wireless electrostatic chuck, which can meet the requirement of high precision manufacturing process after automatic cleaning, baking and pre-alignment, and perform automatic adhesion, so as to meet the requirement of automatic manufacturing of thinned substrates.
Another objective of the present invention is to provide a method for bonding a wireless electrostatic chuck to a thinned substrate, which can bond the wireless electrostatic chuck to the thinned substrate quickly and accurately, so that the wireless electrostatic chuck can bond the thinned substrate to be applied to a subsequent process, thereby greatly increasing the yield of the thinned substrate, reducing the cost and increasing the profit.
Based on this, the present inventor mainly uses the following technical means to achieve the aforementioned purpose and effect:
the creation provides a sticking and detaching device for a wireless electrostatic chuck, which is used for the sticking or the detaching of a wireless electrostatic carrying disc and a thinned substrate, wherein the bottom surface of the wireless electrostatic carrying disc is provided with a conducting pole for conducting and generating or releasing an electrostatic electric field, and the sticking and detaching device comprises;
a frame;
a carrier plate electrostatic generating set arranged on the frame, wherein the carrier plate electrostatic generating set is provided with a working plane for selectively fixing the wireless electrostatic carrying disc, the working plane is provided with a conducting pole correspondingly contacting with the positive conducting pole and the negative conducting pole of the wireless electrostatic carrying disc, and the working plane can position the wireless electrostatic carrying disc or the thinned substrate at a correct position;
a substrate transfer set, which is arranged on the frame and opposite to the carrier plate electrostatic generating set, so that the substrate transfer set can absorb a thinned substrate with a correct position and move relative to the carrier plate electrostatic generating set;
therefore, after the substrate transfer set can drive the thinned substrate and the wireless electrostatic carrying disc to be pressed, the carrier plate electrostatic generating set can be driven to enable the wireless electrostatic carrying disc to generate an electrostatic electric field so as to adhere the thinned substrate.
The creation also provides an automatic adhering and detaching system for a wireless electrostatic chuck, which is used for automatic adhesion and automatic dissociation after adhesion of a wireless electrostatic carrying disc and a thinned substrate, wherein the bottom surface of the wireless electrostatic carrying disc is provided with a conductive electrode for generating or releasing an electrostatic power field in a conductive manner, and the periphery of the wireless electrostatic carrying disc and the thinned substrate is provided with a positioning notch for determining the orientation, the automatic adhering and detaching system comprises:
the machine body comprises at least one substrate feeding interface and at least one tray feeding interface;
the baking device is arranged on the machine body and comprises at least one substrate baking group for baking the thinned substrate and at least one carrying disc baking group for baking the wireless electrostatic carrying disc;
at least one pre-alignment device arranged on the machine body and used for pre-determining the designated orientation of the wireless electrostatic carrying disc and the thinned substrate by utilizing a positioning notch;
at least one sticking and releasing device, the sticking and releasing device comprises a carrier plate static electricity generating set for adsorbing a wireless static carrying disc and a substrate transferring set for adsorbing a thinned substrate, wherein the substrate transferring set can linearly displace relative to the carrier plate static electricity generating set, so that the substrate transferring set can drive the thinned substrate to be correspondingly pressed on the surface of the wireless static carrying disc of the carrier plate static electricity generating set so as to drive or release the wireless static carrying disc to generate a static electric field, and the wireless static carrying disc and the thinned substrate can be bonded or dissociated in the same designated direction; and
the at least one transmission device is arranged on the machine body, and the at least one transmission device can clamp and clamp the thinned substrate or the wireless electrostatic carrying disc to move between the substrate baking group and the carrying disc baking group of the baking device, the pre-alignment device and the adhering and detaching equipment, wherein the substrate baking group and the carrying disc baking group correspond to the substrate feeding interface and the carrying disc feeding interface.
The creation also provides a method for bonding and debonding a wireless electrostatic chuck, which is used for automatic bonding and automatic debonding after bonding between a wireless electrostatic carrier and a thinned substrate, wherein the bottom surface of the wireless electrostatic carrier has a conductive electrode for generating an electrostatic power field, and the periphery of the wireless electrostatic carrier and the thinned substrate has a design for determining a designated orientation, and the method comprises the following steps:
a step for providing a wireless electrostatic carrying disc and a thinned substrate;
a step of baking the wireless electrostatic carrying disc and the thinned substrate respectively to keep the surfaces dry;
a step of pre-aligning the wireless electrostatic carrying disc and the thinned substrate in a specified direction;
a step of fixing the electrostatic-free tray and the thinned substrate to two opposite surfaces in the same designated orientation, respectively;
a step of bonding the wireless electrostatic carrying disc and the thinned substrate which are respectively arranged on the two surfaces in a linear relative displacement mode;
a step of making the wireless electrostatic carrying disc generate an electrostatic electric field which can be mutually adhered relative to the thinned substrate; and
a step of taking out the wireless electrostatic carrying disc adhered with the thinned substrate.
Therefore, through the concrete realization of the technical means, the invention utilizes the sticking and releasing equipment to lead the wireless electrostatic carrying disc to automatically stick the thinned substrate, which can greatly reduce the sticking failure rate and reduce the occurrence of cracking or breakage, can supply the high-precision processing requirement after automatic cleaning, baking and pre-alignment, and carries out automatic sticking to meet the requirement of automatic manufacturing of the thinned substrate, lead the wireless electrostatic carrying disc to stick the thinned substrate to be applied to the subsequent processing, greatly improve the processing yield of the thinned substrate, reduce the cost and increase the profit, improve the additional value of the thinned substrate, and further improve the economic benefit.
To further clarify the structure, features and other objects of the present invention, a preferred embodiment of the present invention will be described in detail below with reference to the accompanying drawings, which will make apparent to those skilled in the art how the present invention can be embodied.
Drawings
FIG. 1: the invention is used for the structural schematic diagram of an automatic sticking and detaching system of a wireless electrostatic chuck.
FIG. 2: the invention is used for the action schematic diagram of the automatic sticking and detaching system of the wireless electrostatic chuck.
FIG. 3: the invention is used for the appearance schematic diagram of the sticking and detaching equipment of the wireless electrostatic chuck.
FIG. 4: the invention is used for the side-view plane schematic diagram of the sticking and separating equipment of the wireless electrostatic chuck.
FIG. 5: the invention is used for the appearance schematic diagram of a carrier plate static electricity generating group in the sticking and detaching equipment of a wireless static sucker.
FIG. 6: the invention is used for the partial top plan view schematic diagram of the carrier plate static electricity generating group in the sticking and detaching equipment of the wireless static sucker.
FIG. 7: the invention is used for the side-view plane schematic diagram of a carrier plate static electricity generating group in the sticking and detaching equipment of a wireless static sucker.
FIG. 8: the invention is used for a side-view action schematic diagram of a carrier plate static electricity generating group in the sticking and detaching equipment of a wireless static sucker.
FIG. 9: the invention is used for the other side view action schematic diagram of the carrier plate static electricity generating group in the sticking and separating equipment of the wireless static sucker.
FIG. 10: the invention is used for the appearance schematic diagram of a substrate shifting group in the sticking and detaching equipment of a wireless electrostatic chuck.
FIG. 11: the invention is used for the partial bottom plan view schematic diagram of the substrate transferring group in the sticking and detaching equipment of the wireless electrostatic chuck.
FIG. 12: the invention discloses a flow architecture schematic diagram of a sticking and releasing method for a wireless electrostatic chuck.
List of reference numerals: 100-wireless electrostatic carrying disc; 101-positioning the incision; 105-a conducting pole; 200-thinning the substrate; 201-positioning the incision; 10-body; 15-a slide rail mechanism; 16-substrate inlet and outlet interface; 18-loading tray loading and unloading interface; 20-a transmission device; 30-a baking device; 31-substrate baking group; 32-a boat baking apparatus; 38-a cleaning device; 40-pre-alignment device; 45-temporary storage interface; 50-a sticking and stripping device; 51-a lower frame; 52-an upper frame; 60-a carrier plate static electricity generating group; 61-a main frame plate; 62-a topping member; 620-detecting element; 63-conducting electrode; 64-an adsorbing member; 65-side wing panel; 66-guide posts; 660-fixing the guide pillar; 661-oblique guide surface; 665-a movable guide post; 666-inclined guide surface; 67-touch detection set; 670-touching the convex column; 675-correcting convex column; 68-optical detection group; 680-an optoelectronic element; 69-a blowing unit; 690-air jet nozzle; 70-a drive member; 80-substrate transfer group; 81-frame seat; 810-sensing element; 82-a lifting mechanism; 83-an adsorbing member; 830-a surface adsorption member; 835-edge suction; 85-optical detection group; 850-photovoltaic element; 86-anti-drop piece.
Detailed Description
The present invention is an adhering and detaching apparatus, an automatic adhering and detaching system and an adhering and detaching method for a wireless electrostatic chuck, wherein the attached figures illustrate embodiments of the present invention and components thereof, and all references to front and rear, left and right, top and bottom, upper and lower, and horizontal and vertical are only used for convenience of description, and do not limit the present invention, nor limit the components thereof to any position or spatial direction. The dimensions specified in the drawings and description may vary depending on the design and requirements of particular embodiments of the invention without departing from the scope of the invention.
The present invention relates to an automatic adhering and detaching system for a wireless electrostatic chuck, as shown in fig. 1, for automatically adhering and automatically detaching a wireless electrostatic chuck (100) and a thinned substrate (200), wherein the thinned substrate (200) may be a semiconductor wafer, a glass sheet or a plastic sheet, the automatic adhering and detaching system comprises a body (10), at least one transmission device (20), at least one baking device (30), at least one pre-alignment device (40) and at least one adhering and detaching apparatus (50);
the detailed structure of the preferred embodiment of the automatic bonding and de-bonding system please refer to fig. 1 and fig. 2, wherein the body (10) is provided with at least one substrate loading and unloading interface (port) (16) and at least one tray loading and unloading interface (18), in some embodiments, the substrate loading and unloading interface (16) and the tray loading and unloading interface (18) may be loading and unloading interfaces of a wafer transfer box (FOUP) of a typical SEMI standard for automatic loading and unloading of the wireless electrostatic tray (100) and the thinned substrate (200), and the aforementioned transmission device (20) may be used to grasp the wireless electrostatic tray (100) or the thinned substrate (200) for moving and placing the body (10) between each substrate loading and unloading interface (16) or the tray loading and unloading interface (18) and the baking device (30), the pre-alignment device (40) and the bonding and de-bonding equipment (50), the at least one transmission device (20) may be a linear, six-axis or seven-axis robot arm to improve the degree of freedom and flexibility for grasping and moving the wireless electrostatic chuck (100) or the thinned substrate (200), and in some embodiments, the body (10) is provided with a slide mechanism (15), and the at least one transmission device (20) may be slidably disposed on the slide mechanism (15), such that the transmission device (20) may selectively slide on the slide mechanism (15) to increase the range of motion of the at least one transmission device (20);
furthermore, the at least one baking device (30) is disposed inside the machine body (10), the transmission device (20) can move the wireless electrostatic carrying disc (100) or the thinned substrate (200) into the position, and the baking device (30) can include at least one substrate baking group (31) for accommodating one or more thinned substrates (200) for baking and at least one carrying disc baking device (35) for accommodating one or more wireless electrostatic carrying discs (100) for respectively drying the water vapor on the surfaces of the thinned substrate (200) and the wireless electrostatic carrying discs (100). In some embodiments, a cleaning device (38) may be disposed on the body (10) at a side corresponding to the tray loading/unloading interface (18) for cleaning the wireless electrostatic tray (100) before baking to ensure the cleanliness of the surface of the wireless electrostatic tray (100), and the cleaning device (38) may be a washing, wiping or non-contact particle removal technique. The at least one pre-alignment device (40) is disposed in the body (10) and the transmission device (20) can move the wireless electrostatic carrying disc (100) or the thinned substrate (200) into a position, the pre-alignment device (40) can rotate after the wireless electrostatic carrying disc (100) or the thinned substrate (200) is placed, and a detection unit such as an optical detector such as a CCD module (not shown) on the at least one pre-alignment device (40) is utilized to search for a positioning Notch (101, 201) (such as Notch, V-shaped positioning Notch or flat cutting edge of a wafer) of the wireless electrostatic carrying disc (100) or the thinned substrate (200), so that the wireless electrostatic carrying disc (100) and the thinned substrate (200) can enter the at least one adhering and detaching device (50) in an appointed orientation, and the wireless electrostatic carrying disc (100) and the thinned substrate (200) can be adhered to each other in the same appointed orientation. According to some embodiments, the machine body (10) is provided with at least one temporary storage interface (45) for temporarily storing the wireless electrostatic tray (100) or the thinned substrate (200) for bonding operation, so as to improve the efficiency of automatic operation;
as for the position where the at least one adhering and detaching device (50) is disposed in the machine body (10) and the transmission device (20) can move the wireless electrostatic carrying tray (100) or the thinned substrate (200) into, as shown in fig. 3 and 4, the at least one adhering and detaching device (50) includes a carrier plate electrostatic generating set (60) for adsorbing the wireless electrostatic carrying tray (100) and a substrate transferring set (80) for adsorbing the thinned substrate (200) which are relatively displaced, the adhering and detaching device (50) has a frame which can be fixedly disposed on the machine body (10) and includes a lower frame (51) and an upper frame (52), wherein the carrier plate electrostatic generating set (60) is disposed on the top of the lower frame (51), and the substrate transferring set (80) is disposed above the upper frame (52) corresponding to the carrier plate electrostatic generating set (60) by using a lifting mechanism (82), so that the substrate transferring set (80) can adsorb or bring the thinned substrate (200) to the carrier plate electrostatic transferring set (60) relative to the carrier plate electrostatic generating set (60) The dynamic thinning substrate (200) is correspondingly pressed on the surface of the wireless electrostatic carrying disc (100) on the top surface of the carrying plate electrostatic generating set (60);
the aforementioned carrier plate electrostatic generating set (60) is, as shown in fig. 5, 6, and 7, provided with a main frame plate (61) and side wing plates (65) pivoted to two side edges of the main frame plate (61), and the main frame plate (61) and the side wing plates (65) at two sides have a working plane for the wireless electrostatic carrying tray (100) to be placed flatly, and the main frame plate (61) of the working plane is provided with a detecting element (610) for detecting whether the wireless electrostatic carrying tray (100) or the thinned substrate (200) exists, and the main frame plate (61) is provided with a material ejecting member (62), the material ejecting member (62) can be displaced between the working plane and a higher material receiving plane (as shown in fig. 8), so that the transmission device (20) such as a clamping jaw of a mechanical arm can be inserted into the wireless electrostatic carrying tray (100) or taken away or the thinned substrate (200), and the material ejecting member (62) can be composed of at least three ejector rods capable of being lifted and lowered synchronously, Or a lifting top plate, wherein a telescopic cylinder (70) is arranged between the center of the bottom edge of the outer side of the two side wing plates (65) different from the main frame plate (61) and the lower frame (51), the outer side edge of the side wing plates (65) which is selectively driven to incline downwards and the different outer side edge of the side wing plates (65) which are arranged at the two sides of the outer side edge of the side wing plates (65) can be selectively driven to incline downwards (as shown in figure 9), the wireless electrostatic carrying disc (100) and the adhered thinned substrate (200) are driven to be relatively stripped from the outer edge, furthermore, a series of adsorption pieces (64) which are corresponding to the bottom surface of the wireless electrostatic carrying disc (100) are respectively arranged on the main frame plate (61) and the side wing plates (65), such as vacuum suction cups, the wireless electrostatic carrying disc (100) is selectively fixed on the working plane of the main frame plate (61) and the side wing plates (65), and the main frame plate (61) is provided with two or two times of a plurality of conducting poles (63), the invention provides a positive and negative electrode (105) corresponding to the bottom surface of the wireless electrostatic chuck (100) for providing power to enable the surface of the wireless electrostatic chuck (100) to generate or dissociate an electrostatic power field relative to the thinned substrate (200) for enabling the wireless electrostatic chuck (100) and the thinned substrate (200) to be adhered to or dissociated from each other, and a guide group (66) is arranged on the side wing plates (65) at two sides, the guide group (66) comprises at least two fixed guide posts (660) and at least one movable guide post (665) surrounding the outer periphery of the wireless electrostatic chuck (100), the invention takes the two fixed guide posts (660) and the two movable guide posts (665) as main embodiments, wherein the at least one movable guide post (665) can push the wireless electrostatic chuck (100) to the correct horizontal position of the at least one fixed guide post (660), and an inclined guide edge (661) is formed at the top end of the at least one fixed guide post (660) and the at least one movable guide post (665) 666) When the ejector (62) descends, the wireless electrostatic carrier disc (100) or the thinned substrate (200) can be guided to the correct range of the working plane, moreover, the carrier plate electrostatic generation group (60) is provided with a touch detection group (67) and an optical detection group (68) at the position corresponding to the outer periphery of the wireless electrostatic carrier disc (100), wherein the touch detection group (67) comprises at least two touch convex columns (670) which can stretch and surround the outer periphery of the wireless electrostatic carrier disc (100) and at least one guide convex column (675) which can move back and forth, the guide convex column (675) can correspond to the positioning notches (101, 201) of the wireless electrostatic carrier disc (100) or the thinned substrate (200), so that the guide convex column (675) can rotate and guide by taking the axis as the center by utilizing the positioning notches (101, 201) of the wireless electrostatic carrier disc (100) or the thinned substrate (200), and further for triggering an alarm when the wireless electrostatic chuck (100) or the thinned substrate (200) is not aligned and touches any touching convex pillar (670), the optical detection set (68) comprises at least three optoelectronic devices (680) surrounding the outer periphery of the wireless electrostatic chuck (100) for triggering an alarm when the wireless electrostatic chuck (100) or the thinned substrate (200) is not aligned and shields any optoelectronic device (680), so as to ensure the accurate alignment of the wireless electrostatic chuck (100) and the thinned substrate (200), and as shown in fig. 9, the carrier electrostatic generation set (60) is respectively provided with an air blowing unit (69) at the position of the lower frame corresponding to the two side wing plates (65), the air blowing unit (69) is provided with a pair of air injection nozzles (690) extending along the axial direction corresponding to the outer periphery of the wireless electrostatic chuck (100), so that when the wireless electrostatic chuck (100) is started to be dissociated and is driven by the two side wing plates (65) to be peeled from the thinned substrate (200), high-speed gas can be blown in to effectively separate the wireless electrostatic carrying disc (100) and the thinned substrate (200);
as shown in fig. 10 and 11, the substrate transfer group (80) is composed of a frame seat (81) capable of selectively adsorbing the thinned substrate (200), the frame seat (81) can be driven linearly up and down by a lifting mechanism (82) for driving the thinned substrate (200) to be selectively pressed against the lower wireless electrostatic chuck (100), a detecting element (810) is disposed on the surface of the frame seat (81) for detecting whether the thinned substrate (200) exists, the frame seat (81) has an adsorbing surface, the adsorbing surface of the frame seat (81) has a plurality of adsorbing members (83) which can include a surface adsorbing member (830) corresponding to the range of the thinned substrate (200) or an edge adsorbing member (835) adjacent to the edge of the thinned substrate (200), wherein the surface adsorbing member (830) can apply the adsorption technique of Bernoulli's law to reduce the possible damage to the thinned substrate (200) during the adsorption process, the substrate transferring set (80) is provided with an optical detection set (85) corresponding to the outer periphery of the thinned substrate (200), and the optical detection set (85) comprises at least three photoelectric elements (850) surrounding the outer periphery of the thinned substrate (200) and is used for triggering an alarm when the thinned substrate (200) is not aligned and any photoelectric element (850) is shielded so as to ensure the accurate alignment of the thinned substrate (200). In addition, according to some embodiments, the substrate transfer group (80) may be provided with a selectively retractable anti-falling member (86) at a periphery thereof, wherein the range of the extended anti-falling member is smaller than the outer diameter of the thinned substrate (200), so that the anti-falling member (86) can be extended when the thinned substrate (200) enters the adsorption surface of the substrate transfer group (80), thereby preventing the thinned substrate (200) from falling off due to ineffective adsorption, and confirming that the thinned substrate (200) is retracted after being effectively adsorbed by the substrate transfer group (80). According to some embodiments, the substrate transfer assembly (80) may be a robot capable of clamping the thinned substrate (200) relative to the carrier electrostatic generating assembly (60);
thus, an automatic bonding and de-bonding system is formed to allow the wireless electrostatic chuck (100) and the thinned substrate (200) to be bonded and de-bonded automatically.
Also shown in fig. 12 is a flow chart of an automatic bonding and debonding method for a wireless electrostatic chuck, which is used for automatic bonding and automatic debonding after bonding between a wireless electrostatic chuck (100) and a thinned substrate (200), wherein the thinned substrate (200) may be a semiconductor wafer or a glass sheet or a plastic sheet, and the bottom surface of the wireless electrostatic chuck (100) has a conductive electrode (105) for generating an electrostatic power field, and the peripheries of the wireless electrostatic chuck (100) and the thinned substrate (200) have positioning notches (101, 201) for determining orientation. The process of the adhesive-stripping method comprises a step of providing a wireless electrostatic carrying disc and a thinned substrate; baking the wireless electrostatic carrying disc and the thinned substrate respectively to keep the surfaces dry; pre-aligning the wireless electrostatic carrying disc and the thinned substrate in a specified direction respectively; fixing the electrostatic-free carrier and the thinned substrate to two opposite surfaces in the same designated orientation; the wireless electrostatic carrying disc and the thinned substrate which are respectively arranged on the two surfaces are jointed in a linear relative displacement mode; a electrostatic field for bonding the wireless electrostatic carrying disc with the thinned substrate; and taking out the wireless electrostatic carrying disc adhered with the thinned substrate. The preferred embodiment of the adhesion-detachment method of the present invention is disclosed with reference to fig. 1, fig. 2 and fig. 3;
a step for a wireless electrostatic chuck and a thinned substrate: a wireless electrostatic carrier (100) is obtained from a carrier outlet/inlet interface (18) by one of the transmission devices (20) on the machine body (10) of the automatic adhering and detaching system, and a wireless electrostatic carrier (100) is obtained from the substrate outlet/inlet interface (16) by the other transmission device (20);
a step of baking the wireless electrostatic carrying disc and the thinned substrate respectively to keep the surfaces dry: after the wireless electrostatic carrying disc (100) and the thinned substrate (200) are respectively obtained, one transmission device (20) can place the wireless electrostatic carrying disc (100) into a carrying disc baking group (35) of the corresponding baking device (30), and the other transmission device (20) can place the thinned substrate (200) into a substrate baking group (31) of the corresponding baking device (30) and respectively bake the surfaces of the thinned substrate to keep dry;
a step of pre-aligning the wireless electrostatic chuck and the thinned substrate in a predetermined orientation, respectively: after the baking and drying actions of the wireless electrostatic carrying disc (100) and the thinned substrate (200) are finished, the at least one transmission device (20) respectively transfers the wireless electrostatic carrying disc (100) and the thinned substrate (200) to corresponding pre-alignment devices (40), so that the wireless electrostatic carrying disc (100) and the thinned substrate (200) can be positioned at the same designated orientation by utilizing the positioning notches (101, 201), and the wireless electrostatic carrying disc (100) and the thinned substrate (200) can be completely overlapped and attached at the same designated orientation, thereby facilitating the subsequent processing;
a step of fixing the electrostatic-free carrier and the thinned substrate to two opposite surfaces in the same designated orientation, respectively: after the pre-alignment is completed, as shown in fig. 5, the transmission device (20) first places the thinned substrate (200) on the working planes of the main frame plate (61) and the side wing plate (65) of the carrier electrostatic generating set (60), and uses the guide group (66) to guide the thinned substrate (200) to the correct position of the working plane of the carrier electrostatic generating set (60), and uses the touch detection group (67) and the optical detection group (68) to ensure that the wireless electrostatic carrier (100) is accurately positioned in the designated direction, then the substrate transfer group (80) can be lowered, and uses the adsorption member (83) of the substrate transfer group (80) to adsorb the thinned substrate (200) at the correct position of the adsorption plane, and then the substrate transfer group (80) synchronously takes the thinned substrate (200) away from the working plane of the carrier electrostatic generating set (60), and then the transmission device (20) places the wireless electrostatic carrier (100) on the electrostatic carrier (60) to the correct position of the electrostatic generating set 60) The main frame plate (61) and the side wing plate (65) of the carrier plate, and the guide group (66) of the main frame plate guides the wireless electrostatic carrying disc (100) to the correct position of the working plane of the carrier plate electrostatic generating group (60), and the carrier plate electrostatic generating group (60) can fix the wireless electrostatic carrying disc (100) by an adsorption piece (64) after the wireless electrostatic carrying disc (100) is accurately positioned in the appointed direction by the touch detection group (67) and the optical detection group (68), so that the thinned substrate (200) and the wireless electrostatic carrying disc (100) can be opposite to each other in the same appointed direction;
a step of bonding the wireless electrostatic carrying disc and the thinned substrate which are respectively arranged on the two surfaces in a linear relative displacement mode: after the wireless electrostatic chuck (100) and the thinned substrate (200) are fixed on the opposite surfaces in the same designated orientation, as shown in fig. 3 and 4, the substrate transfer group (80) drives the thinned substrate (200) to linearly displace relative to the wireless electrostatic chuck (100) of the carrier electrostatic generating group (60), so that the thinned substrate (200) can be attached to the surface of the wireless electrostatic chuck (100) in the same designated orientation, and the outer peripheries of the two substrates are completely overlapped;
a step of generating an electrostatic power field capable of being adhered to each other by the wireless electrostatic chuck relative to the thinned substrate: after the wireless electrostatic chuck (100) and the thinned substrate (200) are bonded, the carrier electrostatic generating set (60) can be electrically conducted to the wireless electrostatic chuck (100), so that the wireless electrostatic chuck (100) can generate an electrostatic electric field relative to the thinned substrate (200), and the wireless electrostatic chuck (100) can be bonded with the thinned substrate (200) electrostatically; and
a step of taking out the wireless electrostatic carrying disc adhered with the thinned substrate: finally, after the wireless electrostatic carrying tray (100) and the thinned substrate (200) are bonded, the substrate transfer group (80) and the carrier plate electrostatic generating group (60) can be relatively separated in a linear displacement mode, and the wireless electrostatic carrying tray (100) bonded with the thinned substrate (200) is taken out by utilizing one of the transmission devices (20) and is sequentially stored in the corresponding substrate material inlet and outlet interface (16) or the carrying tray material inlet and outlet interface (18), so that the whole bonding operation is completed for the application of the subsequent process.
According to some embodiments, before the baking operation of the wireless electrostatic chuck (100) and the thinned substrate (200), a step of cleaning the surface of the wireless electrostatic chuck may be added, wherein the step of cleaning the surface of the wireless electrostatic chuck is performed by washing or wiping with a cleaning agent, or removing particles on the surface of the wireless electrostatic chuck (100) in a non-contact manner, so as to improve the adhesion effectiveness.
Furthermore, the bonded thinned substrate (200) and the wireless electrostatic chuck (100) can be detached, the wireless electrostatic chuck (100) bonded with the thinned substrate (200) is placed into the carrier electrostatic generating set (60) for adsorption and fixation through the transmission device (20), the substrate transfer set (80) is fixed on the surface of the thinned substrate (200) on the side different from the wireless electrostatic chuck (100) in a linear displacement manner, then the carrier electrostatic generating set (60) releases the electrostatic power field of the wireless electrostatic chuck (100), the static electricity of the wireless electrostatic chuck (100) is released, the thinned substrate (200) can be detached, the substrate transfer set (80) is driven to move in the reverse direction to drive the thinned substrate (200) and the wireless electrostatic chuck (100) to be relatively separated, and finally the wireless electrostatic chuck (100) and the substrate (200) are respectively placed into the corresponding chuck discharging port (18) and substrate discharging port (18) through the transmission device (20) The plate is inserted into the loading port (16). According to some embodiments, as shown in fig. 9, after the static electricity is discharged, the wireless electrostatic chuck (100) may drive the outer periphery of the wireless electrostatic chuck (100) downward, so that the outer periphery of the wireless electrostatic chuck (100) may be peeled off from the thinned substrate (200) to form an opening, and a high-speed gas is blown from the outer periphery of the wireless electrostatic chuck (100) through a nozzle (690) of a gas spraying unit (69), so that the wireless electrostatic chuck (100) and the thinned substrate (200) may be effectively separated.
Therefore, the adhering and detaching device, the automatic adhering and detaching system and the adhering and detaching method for the wireless electrostatic chuck can improve the adhering efficiency, greatly reduce the adhering failure rate, reduce the occurrence of cracking or breaking, meet the high-precision processing requirement after automatic cleaning, baking and pre-alignment, and carry out automatic adhesion so as to meet the requirement of automatic manufacturing of the thinned substrate, so that the wireless electrostatic chuck can adhere the thinned substrate to be applied to the subsequent processing, the processing yield of the thinned substrate can be greatly improved, the cost can be reduced, and the profit can be increased.
Claims (10)
1. An adhesion and detachment device for a wireless electrostatic chuck is used for adhesion or detachment of a wireless electrostatic carrying disc and a thinned substrate, and the bottom surface of the wireless electrostatic carrying disc is provided with a conducting pole for conducting generation or release of an electrostatic electric field;
a frame;
a carrier plate electrostatic generating set arranged on the frame, wherein the carrier plate electrostatic generating set is provided with a working plane for selectively fixing the wireless electrostatic carrying disc, the working plane is provided with a conducting pole correspondingly contacting with the positive conducting pole and the negative conducting pole of the wireless electrostatic carrying disc, and the working plane can position the wireless electrostatic carrying disc or the thinned substrate at a correct position;
a substrate transfer set, which is arranged on the frame and opposite to the carrier plate electrostatic generating set, so that the substrate transfer set can adsorb a thinned substrate with a correct position and move relative to the carrier plate electrostatic generating set;
therefore, after the substrate transfer group can drive the thinned substrate to be pressed with the wireless electrostatic carrying disc, the carrier plate electrostatic generating group can be driven to enable the wireless electrostatic carrying disc to generate an electrostatic electric field so as to adhere the thinned substrate.
2. The debonding apparatus for a wireless electrostatic chuck according to claim 1, wherein the working plane has a guide pillar set thereon, the guide pillar set comprises at least two fixed guide pillars surrounding the outer periphery of the wireless electrostatic chuck for limiting the lateral position of the chuck and at least one movable guide pillar capable of pushing the chuck to engage with the fixed guide pillars, so that the wireless electrostatic chuck or the thinned substrate is positioned at a correct position on the working plane.
3. The apparatus as claimed in claim 1, wherein the working plane comprises a main frame plate and side plates pivotally disposed at two side edges of the main frame plate, and one end of each side plate different from the main frame plate can be selectively moved downward.
4. The adhering and detaching apparatus for a wireless electrostatic chuck as claimed in claim 3, wherein the electrostatic generating set of the carrier has a blowing unit disposed at the side wing plates corresponding to the two side wings, the blowing unit has a nozzle extending along the axial direction corresponding to the outer periphery of the wireless electrostatic carrier, for blowing high speed gas to effectively separate the wireless electrostatic carrier from the thinned substrate.
5. The apparatus of claim 1, wherein the substrate transfer assembly comprises a frame, and the frame has a plurality of suction members on a surface thereof, the suction members include surface suction members corresponding to the thin substrate or edge suction members adjacent to the edge of the thin substrate, wherein the surface suction members are adapted to Bernoulli's law suction technique.
6. An automatic adhering and detaching system for a wireless electrostatic chuck, comprising the adhering and detaching apparatus according to claim 1, wherein the automatic adhering and detaching system is used for automatic adhesion and automatic detachment of a wireless electrostatic chuck and a thinned substrate, the wireless electrostatic chuck has a conductive pole for generating an electrostatic power field, and the wireless electrostatic chuck and the thinned substrate have a positioning notch for determining an orientation, the automatic adhering and detaching system comprises:
the machine body comprises at least one substrate feeding interface and at least one tray feeding interface;
the baking device is arranged on the machine body and comprises at least one substrate baking group for baking the thinned substrate and at least one carrying disc baking group for baking the wireless electrostatic carrying disc;
at least one pre-alignment device arranged on the machine body and used for pre-determining the designated orientation of the wireless electrostatic carrying disc and the thinned substrate by utilizing a positioning notch;
at least one sticking-releasing apparatus according to claim 1, for driving or releasing the wireless electrostatic chuck to generate an electrostatic power field, so that the wireless electrostatic chuck and the thinned substrate can be stuck or released in the same designated orientation; and
the at least one transmission device is arranged on the machine body and can clamp and clamp the thinned substrate or the wireless electrostatic carrying disc to move between the substrate baking group and the carrying disc baking group of the baking device, the pre-alignment device and the adhering and detaching equipment, wherein the substrate baking group and the carrying disc baking group correspond to the substrate feeding interface and the carrying disc feeding interface.
7. The system of claim 6, wherein a cleaning device is disposed on the body within a range of the transportation device for selectively cleaning the bonding surface of the electrostatic chuck or the thinned substrate.
8. The automatic adhering and detaching system for a wireless electrostatic chuck of claim 1, wherein the body is provided with a sliding track mechanism, and the at least one transmission device is slidably disposed on the sliding track mechanism, so as to increase the range of motion of the at least one transmission device.
9. A method for bonding and debonding a wireless electrostatic chuck, which is used for automatic bonding and automatic debonding after bonding between a wireless electrostatic chuck and a thinned substrate, wherein the bottom surface of the wireless electrostatic chuck has a conductive electrode for generating an electrostatic power field, and the periphery of the wireless electrostatic chuck and the thinned substrate has a design for determining a designated orientation, the method comprising the steps of:
a step for providing a wireless electrostatic carrying disc and a thinned substrate;
a step of baking the wireless electrostatic carrying disc and the thinned substrate respectively to keep the surfaces dry;
a step of pre-aligning the wireless electrostatic carrying disc and the thinned substrate in a specified direction;
a step of fixing the electrostatic-free tray and the thinned substrate to two opposite surfaces in the same designated orientation, respectively;
a step of bonding the wireless electrostatic carrying disc and the thinned substrate which are respectively arranged on the two surfaces in a linear relative displacement mode;
a step of making the wireless electrostatic carrying disc generate an electrostatic electric field which can be mutually adhered relative to the thinned substrate; and
a step of taking out the wireless electrostatic carrying disc adhered with the thinned substrate.
10. The method as claimed in claim 9, wherein a step of cleaning the surface of the electrostatic chuck is added before the step of baking the electrostatic chuck and the thinned substrate to dry the surface of the electrostatic chuck, so as to improve the adhesion efficiency.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW109115329 | 2020-05-08 | ||
| TW109115329A TWI752489B (en) | 2020-05-08 | 2020-05-08 | Debonding equipment, automatic debonding system and debonding method for wireless electrostatic chuck |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113628995A true CN113628995A (en) | 2021-11-09 |
Family
ID=75301253
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021846699.0U Active CN212934582U (en) | 2020-05-08 | 2020-08-28 | A glue and take off equipment and automatic system of taking off of gluing for wireless electrostatic chuck |
| CN202010885938.1A Pending CN113628995A (en) | 2020-05-08 | 2020-08-28 | Sticking and detaching equipment, automatic sticking and detaching system and sticking and detaching method for wireless electrostatic chuck |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021846699.0U Active CN212934582U (en) | 2020-05-08 | 2020-08-28 | A glue and take off equipment and automatic system of taking off of gluing for wireless electrostatic chuck |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR102502909B1 (en) |
| CN (2) | CN212934582U (en) |
| DE (1) | DE102021110238A1 (en) |
| TW (1) | TWI752489B (en) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120227886A1 (en) * | 2011-03-10 | 2012-09-13 | Taipei Semiconductor Manufacturing Company, Ltd. | Substrate Assembly Carrier Using Electrostatic Force |
| JP6112016B2 (en) * | 2011-12-14 | 2017-04-12 | 株式会社ニコン | Substrate holder and substrate bonding apparatus |
| US9740111B2 (en) * | 2014-05-16 | 2017-08-22 | Applied Materials, Inc. | Electrostatic carrier for handling substrates for processing |
| WO2016160322A1 (en) * | 2015-04-01 | 2016-10-06 | Sxaymiq Technologies Llc | Electrostatic cleaning device |
| US10332773B2 (en) * | 2015-06-04 | 2019-06-25 | Applied Materials, Inc. | Transparent electrostatic carrier |
| TWI601677B (en) * | 2016-12-22 | 2017-10-11 | Usun Technology Co Ltd | Device capable of adsorbing curved objects and a fitting device using the device |
| TWI622832B (en) * | 2017-05-23 | 2018-05-01 | 元太科技工業股份有限公司 | Carrier apparatus and display |
| TWM604487U (en) * | 2020-05-08 | 2020-11-21 | 特銓股份有限公司 | Bonding and releasing device for wireless electrostatic chuck and automatic bonding and releasing system thereof |
-
2020
- 2020-05-08 TW TW109115329A patent/TWI752489B/en active
- 2020-08-28 CN CN202021846699.0U patent/CN212934582U/en active Active
- 2020-08-28 CN CN202010885938.1A patent/CN113628995A/en active Pending
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2021
- 2021-04-22 DE DE102021110238.3A patent/DE102021110238A1/en active Pending
- 2021-05-07 KR KR1020210058909A patent/KR102502909B1/en active IP Right Grant
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| KR20210137400A (en) | 2021-11-17 |
| DE102021110238A1 (en) | 2021-11-11 |
| TW202143376A (en) | 2021-11-16 |
| CN212934582U (en) | 2021-04-09 |
| TWI752489B (en) | 2022-01-11 |
| KR102502909B1 (en) | 2023-02-23 |
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