TWM580796U - Fully automatic wafer separation and cleaning machine - Google Patents

Abstract

The present invention provides a fully automated wafer separation and cleaning machine comprising a susceptor, a wafer pick and place module, a wafer raft, a pre-alignment module, a wafer separation module, and a sizing cleaning module. The round pick-and-place module takes the wafer to be separated out to the pre-alignment module for center calibration, and separates the wafer to be separated from the semiconductor wafer and the carrier by the wafer separation module, and the cleaning is separated by the cleaning agent cleaning module. The semiconductor wafer and the carrier are detached from the bonding agent to complete the automatic wafer separation and cleaning operation, thereby constituting the creation.

Description

Fully automatic wafer separation and cleaning machine

This creation is about a wafer separation and cleaning machine, especially a fully automated wafer separation and cleaning machine.

In the field of semiconductor manufacturing, there is a system in package (SIP), which is formed by laminating a plurality of semiconductor wafer layers carrying integrated circuits, and in the process of such system packaging, in order to make semiconductors The wafer energy layer is laminated, and the thickness of the semiconductor wafer is required to be thin. Therefore, the semiconductor wafer having the thickness must be thinned (grinding) after loading the integrated circuit, and during the processing. Generally, a semiconductor wafer is temporarily bonded by a carrier, and the carrier is used as a base of the semiconductor wafer during processing to protect the semiconductor wafer from being damaged due to thickness thinning during processing. After the semiconductor wafer is thinned, the semiconductor wafer and the carrier must be separated (DeBonding). However, the separation and cleaning of semiconductor wafers and carriers is not fully automated, so the process efficiency of wafer separation and cleaning cannot be effectively improved. This is the main focus of the creative solution.

In order to solve the above problems, the present invention provides a fully automatic wafer separation and cleaning machine, which can take out the wafer to be separated by an automated process, separately pre-align and separate the semiconductor wafer and the carrier, and finally clean the semiconductor. Wafer and carrier bonding agent for fully automated wafer separation and cleaning operations.

An embodiment of the present invention provides a fully automated wafer separation and cleaning machine comprising:

a pedestal having a wafer transfer area, and a slab placement area, an alignment area, a wafer separation area and a wafer cleaning area around the wafer transfer area; a wafer pick-and-place module, Provided in a wafer transfer area; a wafer body disposed in the body placement area for placing a wafer to be separated, wherein the wafer to be separated is a semiconductor wafer with a bonding agent attached to a carrier; The alignment module is disposed in the alignment area, the wafer pick-and-place module is to be separated from the wafer body to the pre-aligned module for center calibration; and a wafer separation module is disposed in the wafer separation area The wafer pick-and-place module takes the separated wafer to the wafer separation module to separate the semiconductor wafer and the carrier; and a paste cleaning module is disposed in the wafer cleaning area, and the wafer pick-and-place module takes The wafer is to be separated into a wafer separation module to clean the semiconductor wafer and the adhesive attached to the carrier.

The wafer pick-and-place module is a mechanical arm having a base, and the base is provided with a movable and telescopic arm, and the front end of the arm has an end effector that can take the semiconductor wafer and the carrier.

Wherein, the arm portion is a multi-joint arm, the end effector is vacuum suction type, and the end effector is rotatably disposed at the front end of the arm portion.

The wafer body has a plurality of wafers for respectively separating the wafer to be separated and the separated semiconductor wafer and the carrier.

The pre-alignment module has a positioning portion for adsorbing and rotating the semiconductor wafer and the carrier, and capturing an image of the semiconductor wafer and the carrier by an image extractor for center calibration.

The wafer separation module has a stage and a suction device disposed on the stage, and a heater is disposed on the stage, and the wafer to be separated is heated on the stage by a heater to melt the adhesive. And sucking and separating one of the semiconductor wafer and the carrier by a suction.

The wafer separation module is provided with a linear slide rail on the stage, and a slide seat is disposed on the linear slide rail to slide laterally, and a pneumatic cylinder is disposed on the slide seat and can be laterally along the linear slide rail. Displacement, the suction device is arranged in the pneumatic cylinder and can be longitudinally displaced.

Wherein, the adhesive cleaning module has a turntable and a shower head, respectively, the spinner is respectively adsorbed and rotated by the turntable, and the cleaning agent is sprayed onto the semiconductor wafer and the carrier by the nozzle, and the adhesive is released from the semiconductor wafer. And on the carrier.

Among them, the cleaning agent is acetone or isopropyl alcohol.

Therefore, the fully automatic wafer separating and cleaning machine of the present invention can take out and displace the wafer to be separated by the wafer pick-and-place module, and can move the wafer to be separated to the pre-aligned module for centering. Calibrating, and moving the wafer to be separated to the wafer separation module to separate the semiconductor wafer and the carrier, and finally, the adhesive cleaning module can clean the separated semiconductor wafer and the adhesive attached to the carrier. The separation and cleaning process of the semiconductor wafer and the carrier is fully automated, thereby achieving high efficiency in the process of wafer separation and cleaning.

For the convenience of the description, the central idea expressed in the column of the above novel content is expressed by a specific embodiment. The various items in the examples are drawn to scale in the description and not to the actual elements, and are described in the foregoing.

Referring to FIG. 1 to FIG. 4 , the present invention provides a fully automatic wafer separation and cleaning machine 100 , which is a semiconductor processing device and includes a susceptor 10 , a wafer pick-and-place module 20 , and a wafer stack . The body 30, a pre-alignment module 40, a wafer separation module 50, and a patch cleaning module 60, wherein:

The susceptor 10 is provided with a wafer transfer area 11 , and a corpuscular placement area 12 , an alignment area 13 , a wafer separation area 14 , and a wafer cleaning area 15 are disposed around the wafer transfer area 11 . . The wafer pick-and-place module 20 is disposed in the wafer transfer area 11 , the wafer cassette 30 is disposed in the body placement area 12 , and the pre-alignment module 40 is disposed in the alignment area 13 . The group 50 is disposed in the wafer separation area 14, and the adhesive cleaning module 60 is disposed in the wafer cleaning area 15. In the present embodiment, there are three so-called wafer cassettes 30 in the body placement area 12, which are disposed in the alignment. The pre-alignment module 40 of the region 13 , the wafer separation module 50 disposed in the wafer separation region 14 , and the adhesive cleaning module 60 disposed in the wafer cleaning region 15 are each included.

In the embodiment, the wafer pick-and-place module 20 has a base 21, and the base 21 is provided with an arm portion 22, and the arm portion 22 can be expanded and contracted by the movable arm. The front end of the portion 22 has an end effector 23, whereby the end effector 23 takes or places the wafer A to be separated, and the separated semiconductor wafer B and carrier C. Preferably, the arm portion 22 is a multi-joint arm, which is movable by a plurality of joints to achieve a telescopic function; further, the end effector 23 is of a vacuum suction type, and the end effector 23 is rotatably disposed at the front end of the arm portion 22, The end effector 23 of the present embodiment may have four axial displacements when adsorbing the wafer A to be separated, the semiconductor wafer B, and the carrier C.

As shown in the respective figures, the three wafer bodies 30, the wafer body 30 in the middle is used to set the wafer A to be separated, and the wafer body 30 on the right side is used to set the semiconductor crystal. Circle B, and the wafer body 30 on the left side is used to set the carrier C.

The pre-alignment module 40 can take the wafer A to be separated from the wafer body 30 to be positioned by the wafer pick-and-place module 20, and then pre-align the module 40 and perform center calibration. In this embodiment, the pre-alignment module 40 has a positioning portion 41. The positioning portion 41 adsorbs and rotates the wafer A to be separated, and the pre-alignment module 40 has an image picker (not shown). The image capture device 42 captures the image of the wafer A to be separated for center calibration.

The wafer separation module 50 can take the wafer A to be separated to be positioned by the wafer pick-and-place module 20, and separate the semiconductor wafer B or the carrier C of the wafer A to be separated. In the embodiment, the wafer separation module 50 has a stage 51, and has a suction device (not shown) disposed on the stage 51. The heater 51 is provided with a heater (not shown). The wafer A to be separated is heated by the heater on the stage 51, the bonding agent between the semiconductor wafer B and the carrier C is melted, and the semiconductor wafer B and the carrier C are fed by the suction device. The semiconductor wafer B and the carrier C can be separated by one of them being sucked up. In this embodiment, the wafer separation module 50 is provided with a linear slide 52 on the stage 51, and a slide 53 is disposed on the linear slide 52 to be laterally slidable, and a pneumatic cylinder 54 is disposed on the slide. The seat 53 is laterally displaceable along the linear slide 52 which is disposed in the pneumatic cylinder 54 for longitudinal displacement.

The adhesive cleaning module 60 is configured by the wafer pick-and-place module 20 to sequentially separate the separated semiconductor wafer B and the carrier C to clean the semiconductor wafer and the adhesive attached to the carrier. In the embodiment, the adhesive cleaning module 60 has a turntable 61 and a shower head (not shown). The turntable 61 sequentially adsorbs the separated semiconductor wafer B and the carrier C and rotates, and the nozzle supply unit The cleaning agent is applied to the semiconductor wafer B and the carrier C to successively detach the bonding agent on the semiconductor wafer B and the carrier C. The cleaning agent may be acetone (Acetone) or isopropyl alcohol (IPA). In the present embodiment, acetone is preferred.

When actually performing the separation and cleaning operation of the wafer A to be separated, the wafer pick-and-place module 20 first takes out the wafer A to be separated from the wafer body 30 (as shown in FIG. 1), and moves Positioned in the alignment area 13 and placed in the positioning portion 41 of the pre-alignment module 40 (as shown in FIG. 2), the image capturing device performs image capturing and center calibration, and then is taken by the wafer. The module 20 moves the wafer A to be separated to the wafer separation area 14 and places it on the stage 51 of the wafer separation module 50 (as shown in FIG. 3). After the wafer A to be separated is heated by the heater The bonding agent between the semiconductor wafer B and the carrier C is melted, so that the slider 5 can be slid over the semiconductor wafer B and the carrier C, and the longitudinal displacement of the pneumatic cylinder 54 and the action of the suction device can be used to Wafer B and carrier C are disposed separately. Then, the wafer pick-and-place module 20 sequentially takes the semiconductor wafer B and the carrier C from the stage 51 to the turntable 61 of the adhesive cleaning module 60 (as shown in FIG. 4), and rotates by the turntable 61. The cleaning agent is sprayed onto the semiconductor wafer B and the carrier C by the nozzle to detach the bonding paste attached to the semiconductor wafer B and the carrier C. After that, the cleaned semiconductor wafer B and the carrier C are respectively returned to the associated wafer body 30 by the wafer pick-and-place module 20, thereby completing the automatic separation and cleaning of the wafer A to be separated.

It is not difficult to find out from the above description that the main feature of the present invention is that the wafer A can be separated from the wafer body 30 to be separated by the wafer pick-and-place module 20, and the wafer A to be separated is moved. Go to the pre-alignment module 40 for center calibration, and move the wafer A to be separated to the wafer separation module 50 for separation of the semiconductor wafer B and the carrier C, and finally the paste cleaning module 60 for the semiconductor crystal Circle B and carrier C are cleaned to remove the adhesive. The fully automatic wafer separation and cleaning machine 100 separates the wafer A to be separated from the semiconductor wafer B and the carrier C in a fully automated process and cleans it. The efficiency of separation and cleaning processes.

The above embodiments are merely illustrative of the present invention and are not intended to limit the scope of the present invention. All kinds of modifications or changes that are not in violation of the spirit of this creation are all in the scope of this creative intention.

100‧‧‧Automatic wafer separation and cleaning machine

10‧‧‧ Pedestal  11‧‧‧ Wafer transfer area

12‧‧‧Carcass placement area  13‧‧‧Alignment area

14‧‧‧ Wafer separation area  15‧‧‧ Wafer Cleaning Area

20‧‧‧ wafer pick and place module  21‧‧‧Base

22‧‧‧ Arms  23‧‧‧End effector

30‧‧‧ Wafer carcass  40‧‧‧Pre-alignment module

41‧‧‧ Positioning Department  50‧‧‧ Wafer separation module

51‧‧‧ stage  52‧‧‧Linear slides

53‧‧‧Slide  54‧‧‧ pneumatic cylinder

60‧‧‧Adhesive cleaning module  61‧‧‧ Turntable

A‧‧‧ wafer to be separated  B‧‧‧Semiconductor Wafer

C‧‧‧ Carrier  

Figure 1 is a schematic plan view of the fully automated wafer separation and cleaning machine of the present invention. The wafer pick-and-place module removes the wafer to be separated from the wafer body in which it is placed.  Figure 2 is a schematic plan view of the fully automated wafer separation and cleaning machine of the present invention. The wafer pick-and-place module places the wafer to be separated in a pre-aligned module for center calibration.  Figure 3 is a schematic plan view of the fully automated wafer separation and cleaning machine of the present invention. The wafer pick-and-place module places the wafer to be separated on the wafer separation module to separate the semiconductor wafer and the carrier.  Figure 4 is a schematic plan view of the fully automated wafer separation and cleaning machine of the present invention. The wafer pick-and-place module places the semiconductor wafer or carrier in the adhesive cleaning module for cleaning of the bonding agent.  

Claims (9)

A fully automatic wafer separation and cleaning machine comprising:  a pedestal is provided with a wafer transfer area, and a casket placement area, an alignment area, a wafer separation area and a wafer cleaning area are disposed around the wafer transfer area;  a wafer pick-and-place module disposed in the wafer transfer area;  a wafer body disposed in the body placement area for placing a wafer to be separated, wherein the semiconductor wafer to be separated is a semiconductor wafer bonded with a carrier;  a pre-alignment module is disposed in the alignment area, and the wafer pick-and-place module takes the wafer to be separated from the wafer body to the pre-alignment module for center calibration;  a wafer separation module is disposed in the wafer separation area, and the wafer pick-and-place module takes the wafer to be separated to the wafer separation module to perform separation of the semiconductor wafer and the carrier;  a paste cleaning module is disposed in the wafer cleaning area, and the wafer pick-and-place module takes the wafer to be separated to the wafer separation module to clean the semiconductor wafer and the adhesive attached to the carrier .   The fully automatic wafer separating and cleaning machine of claim 1, wherein the wafer pick-and-place module is a robot arm having a base, and the base is provided with a movable and telescopic arm, the arm The front end has an end effector that can take the semiconductor wafer and the carrier. The fully automatic wafer separating and cleaning machine of claim 2, wherein the arm portion is a multi-joint arm, the end effector is vacuum suction type, and the end effector is rotatably disposed at the front end of the arm portion. The fully automatic wafer separating and cleaning machine of claim 1, wherein the wafer body has a plurality of wafers for respectively separating the wafer to be separated and the separated semiconductor wafer and the carrier. The fully automatic wafer separating and cleaning machine of claim 1, wherein the pre-alignment module has a positioning portion for adsorbing and rotating the semiconductor wafer and the carrier, and capturing the semiconductor crystal with an image extractor. A circle and an image of the carrier for center calibration. The fully automatic wafer separation and cleaning machine of claim 1, wherein the wafer separation module has a stage and a suction device disposed on the stage, and a heater is disposed on the stage. The separation wafer is heated on the stage by the heater to melt the adhesive, and the semiconductor wafer and the carrier are sucked up and separated by the suction device. The fully automatic wafer separation and cleaning machine of claim 6, wherein the wafer separation module is provided with a linear slide rail on the stage, and a slide seat is disposed on the linear slide rail and can be side To slide, a pneumatic cylinder is disposed on the carriage to be laterally displaced along the linear slide, and the suction device is disposed in the pneumatic cylinder to be longitudinally displaceable. The fully automatic wafer separating and cleaning machine of claim 1, wherein the adhesive cleaning module has a turntable and a showerhead, respectively, the turntable adsorbs the semiconductor wafer and the carrier and rotates, and the sprayer will A cleaning agent is sprayed onto the semiconductor wafer and the carrier to disengage the bonding agent from the semiconductor wafer and the carrier. The fully automatic wafer separation and cleaning machine of claim 8, wherein the cleaning agent is acetone or isopropanol.