CN209487476U - The bonding of full-automatic wafer solution and cleaning machine - Google Patents
The bonding of full-automatic wafer solution and cleaning machine Download PDFInfo
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- CN209487476U CN209487476U CN201920469822.2U CN201920469822U CN209487476U CN 209487476 U CN209487476 U CN 209487476U CN 201920469822 U CN201920469822 U CN 201920469822U CN 209487476 U CN209487476 U CN 209487476U
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Abstract
The utility model provides a kind of bonding of full-automatic wafer solution and cleaning machine, it includes pedestals, wafer picks and places module, wafer body, preparatory alignment modules, wafer solution is bonded module and plastering agent cleaning module, module is picked and placed with wafer to take out bonded wafer to be solved to the progress center calibration of preparatory alignment modules, bonded wafer solution to be solved is bonded out semiconductor crystal wafer and carrier with wafer solution bonding module, and the disengaging of the semiconductor crystal wafer and carrier progress plastering agent of bonding is solved by the cleaning of plastering agent cleaning module, to complete the operation of the bonding of full-automatic wafer solution and cleaning, the utility model is constituted whereby.
Description
Technical field
The utility model relates to a kind of bonding of wafer solution and cleaning machine, espespecially a kind of full-automatic wafer solution bonding and cleaning
Machine.
Background technique
In manufacture of semiconductor field, there is so-called system encapsulation (System in Package, SIP), be to be loaded with multi-disc
The semiconductor crystal wafer of integrated circuit stacks layer by layer, and in the processing procedure of such system encapsulation, in order to enable semiconductor crystal wafer
It stacks layer by layer, the thickness requirement thinning for semiconductor crystal wafer monolithic, so must add to the semiconductor crystal wafer with thickness
Thinning processing (grinding cutting) is carried out to the back side after carrying integrated circuit, and in process, it will usually it will be partly using a carrier
The temporary bonding (Temporary Bonding) of semiconductor wafer, and the substrate by carrier in process as semiconductor crystal wafer,
To protect semiconductor crystal wafer not to be damaged because of thickness thinning in process, when semiconductor crystal wafer complete thinning after, it is necessary to again
By semiconductor crystal wafer and carrier solution bonding (DeBonding).However, the solution bonding and cleaning of general semiconductor crystal wafer and carrier are simultaneously
Non- full-automation, therefore can not effectively be promoted on the process efficiency for being bonded and cleaning in wafer solution, i.e. the utility model is intended to for this
Where the primary focus of solution.
Utility model content
To solve the problems, such as that above-mentioned wafer solution bonding and cleaning efficiency are low, the utility model provides a kind of full-automatic wafer solution
Bonding and cleaning machine by automated process, and can take out bonded wafer to be solved, and be aligned and partly led in advance respectively
The bonding of the solution of body wafer and carrier, finally cleans the plastering agent of semiconductor crystal wafer and carrier, to be automatically finished the bonding of wafer solution
And the operation of cleaning.
One embodiment of the utility model provides a kind of bonding of full-automatic wafer solution and cleaning machine, it includes:
Pedestal, pedestal are equipped with wafer delivery area, and body rest area, alignment area, crystalline substance are equipped with around wafer delivery area
Circle solution bonding region and wafer cleaning area；Wafer picks and places module, is set to wafer delivery area；Wafer body is set to body rest area,
To place bonded wafer to be solved, bonded wafer to be solved is formed by semiconductor crystal wafer with plastering agent fitting carrier；In advance to quasi-mode
Block, is set to alignment area, and wafer picks and places module and takes bonded wafer to be solved to preparatory alignment modules to carry out center calibration by wafer body；
Wafer solution be bonded module, be set to wafer solution bonding region, wafer pick and place module take bonded wafer to be solved to wafer solution be bonded module with
Carry out the solution bonding of semiconductor crystal wafer and carrier；And plastering agent cleaning module, it is set to wafer cleaning area, wafer picks and places module and takes
Bonded wafer to be solved to wafer solution is bonded module, to clean plastering agent accompanying by semiconductor crystal wafer and carrier.
Preferably, it is mechanical arm that wafer, which picks and places module, mechanical arm has pedestal, and is equipped with movable in pedestal and stretches
The arm of contracting, arm front end have the end effectors that can grab semiconductor crystal wafer and carrier.
Preferably, arm is multi-joint arm, before end effectors is vacuum adsorption type, and end effectors is rotatably arranged in arm
End.
Preferably, wafer body have it is a plurality of, respectively for wait solve bonded wafer and solution bonding after semiconductor crystal wafer and
Carrier is placed.
Preferably, alignment modules have positioning region in advance, positioning region can adsorb and rotating semiconductor wafer and carrier, and with
Video capture device captures the image of semiconductor crystal wafer and carrier, to carry out center calibration.
Preferably, wafer solution bonding module has microscope carrier and the extractor on microscope carrier, heating is equipped in microscope carrier
Device, the bonded wafer to be solved melt the plastering agent in being heated on microscope carrier by heater, and with extractor by semiconductor die
Round and carrier one of them picks up and solves bonding.
Preferably, wafer solution bonding module lies in microscope carrier equipped with linear slide rail, linear slide rail is equipped with slide, and slide can
Lateral sliding, slide are equipped with pneumatic cylinder, and pneumatic cylinder can be along linear slide rail and lateral displacement, extractor are located at air pressure, and cylinder can
Length travel.
Preferably, plastering agent cleaning module has turntable and spray head, clamping of semiconductor wafers and carrier are distinguished with turntable and revolved
Turn, and sprayed to cleaning agent on semiconductor crystal wafer and carrier with spray head, and the plastering agent is made to be detached from semiconductor crystal wafer and carrier
On.
Preferably, cleaning agent is acetone or isopropanol.
Whereby, the full-automatic wafer solution bonding of the utility model and cleaning machine, can pick and place module by wafer will key be solved
Synthetic circle, which takes out, to be simultaneously displaced, and bonded wafer to be solved can be moved to preparatory alignment modules, to carry out center calibration, and can will key be solved
Synthetic circle is moved to wafer solution bonding module and is bonded with the solution for carrying out semiconductor crystal wafer and carrier, finally can be by plastering agent cleaning module
Plastering agent accompanying by semiconductor crystal wafer and carrier after solution bonding is cleaned, and the solution key of this semiconductor crystal wafer and carrier
Close and cleaning process be it is full-automatic, use reach wafer solution be bonded and clean processing procedure have effects that it is efficient.
Detailed description of the invention
Fig. 1 is the bonding of full-automatic wafer solution and the floor map one of cleaning machine of the utility model, and wafer picks and places in figure
Module takes out bonded wafer to be solved from the wafer body at place.
Fig. 2 is the bonding of full-automatic wafer solution and the floor map two of cleaning machine of the utility model, and wafer picks and places in figure
Bonded wafer to be solved is placed in preparatory alignment modules to carry out center calibration by module.
Fig. 3 is the bonding of full-automatic wafer solution and the floor map three of cleaning machine of the utility model, and wafer picks and places in figure
Bonded wafer to be solved is placed in wafer solution bonding module by module, is bonded out semiconductor crystal wafer and carrier with solution.
Fig. 4 is the bonding of full-automatic wafer solution and the floor map four of cleaning machine of the utility model, and wafer picks and places in figure
Semiconductor crystal wafer or carrier are placed in the cleaning that plastering agent cleaning module carries out plastering agent by module.
Wherein:
The bonding of full-automatic wafer solution and 100 pedestal 10 of cleaning machine
11 body rest area 12 of wafer delivery area
13 wafer solution bonding region 14 of alignment area
15 wafer of wafer cleaning area picks and places module 20
21 arm 22 of pedestal
23 wafer body 30 of end effectors
Preparatory 40 positioning region 41 of alignment modules
Wafer solution is bonded 50 microscope carrier 51 of module
52 slide 53 of linear slide rail
54 plastering agent cleaning module 60 of pneumatic cylinder
The bonded wafer A to be solved of turntable 61
Semiconductor crystal wafer B support C
Specific embodiment
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, by the following examples, it and ties
Attached drawing is closed, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only to solve
The utility model is released, is not used to limit the utility model.
It is herein component institute serialization number itself, such as " first ", " second " etc., is only used for distinguishing described object,
Without any sequence or art-recognized meanings.And " connection ", " connection " described in the application, unless otherwise instructed, include directly and
It is indirectly connected with (connection).In the description of the present invention, it should be understood that term " on ", "lower", "front", "rear",
The orientation or position of the instructions such as "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " clockwise ", " counterclockwise "
Setting relationship is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of describing the present invention and simplifying the description, and
It is not that the device of indication or suggestion meaning or element must have a particular orientation, be constructed and operated in a specific orientation, therefore
It should not be understood as limiting the present invention.
In the present invention unless specifically defined or limited otherwise, fisrt feature is in the second feature " on " or " down "
It can be that the first and second features directly contact or the first and second features are by intermediary mediate contact.Moreover, first is special
Sign can be fisrt feature above the second feature " above ", " above " and " above " and be directly above or diagonally above the second feature, or only
Indicate that first feature horizontal height is higher than second feature.Fisrt feature under the second feature " below ", " below " and " below " can be with
It is that fisrt feature is directly under or diagonally below the second feature, or is merely representative of first feature horizontal height less than second feature.
Shown in please referring to Fig.1 to Fig.4, the utility model provides a kind of full-automatic wafer solution bonding and cleaning machine 100, is
A kind of semi-conductor processing equipment picks and places module 20, wafer body 30, preparatory alignment modules 40, wafer solution comprising pedestal 10, wafer
It is bonded module 50 and plastering agent cleaning module 60, in which:
The pedestal 10 is equipped with wafer delivery area 11, and body rest area 12, right is equipped with around wafer delivery area 11
Quasi- area 13, wafer solution bonding region 14 and wafer cleaning area 15.Wherein, wafer picks and places module 20 and is set to wafer delivery area 11, brilliant
Circle body 30 is set to body rest area 12, and preparatory alignment modules 40 are set to alignment area 13, and wafer solution is bonded module 50 and is set to wafer
Bonding region 14 is solved, and plastering agent cleaning module 60 is set to wafer cleaning area 15, the present embodiment is in the wafer casket of body rest area 12
There are three bodies 30, and the preparatory alignment modules 40 set on alignment area 13, the wafer solution set on wafer solution bonding region 14 are bonded module 50
And the plastering agent cleaning module 60 set on wafer cleaning area 15 respectively has one.
The wafer picks and places module 20, in this present embodiment by taking mechanical arm as an example, with pedestal 21, and in pedestal 21
Equipped with arm 22, this 22 movable telescopic of arm, there is end effectors 23 in 22 front end of arm, taken or put wait solve by end effectors 23
Semiconductor crystal wafer B and support C after bonded wafer A, and solution bonding.Preferably, arm 22 is multi-joint arm, multi-joint is utilized
And it is movable and reach Telescopic；In addition, end effectors 23 is vacuum adsorption type, and end effectors 23 is rotatably arranged in arm 22
Front end, therefore the end effectors 23 of the present embodiment is described when solving bonded wafer A, semiconductor crystal wafer B and support C in absorption, can have
The displacement of four axial directions.
As shown in each figures, three wafer bodies 30, position are to be arranged wait solve bonding in intermediate wafer body 30
Wafer A, position right side wafer body 30 then to be arranged semiconductor crystal wafer B, and wafer body 30 of the position in left side is then to use
Support C is arranged.
The preparatory alignment modules 40 can pick and place module 20 for bonded wafer A to be solved from the wafer casket at place by wafer
Body 30 is placed after taking to predetermined position, and preparatory alignment modules 40 simultaneously carry out central campus standard.In this present embodiment, preparatory alignment modules
40 include positioning region 41, and bonded wafer A to be solved is adsorbed and rotated with this positioning region 41, and preparatory alignment modules 40 include image capture
Device (not shown) captures the image of bonded wafer A to be solved with this video capture device 42, to carry out center calibration.
The wafer solution is bonded module 50, can pick and place module 20 by wafer and take bonded wafer A to be solved to positioning, and will be to
Solve semiconductor crystal wafer B or the bonding of support C solution of bonded wafer A.In this present embodiment, the wafer solution bonding module 50, which has, carries
Platform 51, and have the extractor (not shown) on microscope carrier 51, Yu Zaitai 51 is equipped with heater (not shown), described wait solve
Bonded wafer A melts the plastering agent between semiconductor crystal wafer B and support C, and with institute in being heated on microscope carrier 51 by the heater
It states extractor to pick up the one of them of semiconductor crystal wafer B and support C, semiconductor crystal wafer B and support C solution can be bonded.In
In the present embodiment, wafer solution is bonded module 50 and is equipped with linear slide rail 52 in microscope carrier 51, and has slide 53 to be arranged in linear slide rail
On 52 and can lateral sliding, there is pneumatic cylinder 54 to be located at slide 53 and can be along 52 lateral displacement of linear slide rail, the extractor is located at
Pneumatic cylinder 54 and can length travel.
The plastering agent cleaning module 60, by wafer pick and place module 20 successively take wait solve bonding after semiconductor crystal wafer B and
Support C is to positioning, to clean plastering agent accompanying by semiconductor crystal wafer and carrier.In this present embodiment, plastering agent cleaning module
60 include turntable 61 and spray head (not shown), and the semiconductor crystal wafer B for having solved bonding and support C are successively adsorbed with turntable 61 and is revolved
Turn, and the cleaning agent is supplied on semiconductor crystal wafer B and support C, successively by semiconductor crystal wafer B and carrier with the spray head
Plastering agent on C is detached from.The cleaning agent can be acetone (Acetone) or isopropanol (IPA), in this present embodiment with acetone
For preferred embodiment.
When actually carrying out the solution bonding wait solve bonded wafer A with washing and cleaning operation, being first will be wait solve by wafer pick-and-place module 20
Bonded wafer A by taking out (as shown in Figure 1) in the wafer body 30 at place, and be moved to alignment area 13 and be placed on it is preparatory right
The positioning region 41 (can Fig. 2 shown in) of quasi-mode block 40 carries out image capture with the video capture device and carries out the quasi- movement of central campus,
After again by wafer pick and place module 20 will bonded wafer A be solved move to wafer solution bonding region 14 and be placed on wafer solution bonding module
On 50 microscope carrier 51 (as shown in Figure 3), wait solve bonded wafer A after by heater heating, between semiconductor crystal wafer B and support C
Plastering agent melt, slide 5 can slide into the top of semiconductor crystal wafer B and support C, and by 54 length travel of pneumatic cylinder and
The movement of the extractor, and semiconductor crystal wafer B and the bonding of support C solution are arranged.Then it is successive, then by wafer to pick and place module 20
By semiconductor crystal wafer B and support C by being taken on microscope carrier 51 to the turntable 61 (as shown in Figure 4) of plastering agent cleaning module 60, and by turning
Disk 61 rotates, and cleaning agent is sprayed to semiconductor crystal wafer B and support C by the spray head, so that in semiconductor crystal wafer B and support C
The joint adhesive of attachment is detached from.After, then by wafer pick and place module 20 by after cleaning semiconductor crystal wafer B and support C put back to respectively
In affiliated wafer body 30, completes bonded wafer A to be solved and automatically solve bonding and cleaning.
By above-mentioned explanation it is seen that the utility model is mainly characterized by, the utility model can pick and place mould by wafer
Block 20 is taken out bonded wafer A to be solved by the wafer body 30 at place, and bonded wafer A to be solved is moved to preparatory alignment modules 40
To carry out center calibration, and bonded wafer A to be solved is moved into wafer solution bonding module 50 to carry out semiconductor crystal wafer B and support C
Solution bonding, finally semiconductor crystal wafer B and support C are cleaned to be detached from plastering agent, this reality by plastering agent cleaning module 60
Bonded wafer A solution to be solved is bonded out by semiconductor die with full-automatic process with the bonding of new automatic wafer solution and cleaning machine 100
Circle B and support C are simultaneously cleaned, to reach efficient effect of processing procedure of the bonding of wafer solution and cleaning.
Each technical characteristic of above embodiments can be combined arbitrarily, for simplicity of description, not to above-described embodiment
In each technical characteristic it is all possible combination be all described, as long as however, the combination of these technical characteristics be not present lance
Shield all should be considered as described in this specification.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But it should not be understood as limiting the scope of the patent of the utility model.It should be pointed out that for the common of this field
For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to
In the protection scope of the utility model.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.
Claims (9)
1. a kind of bonding of full-automatic wafer solution and cleaning machine, characterized by comprising:
Pedestal, the pedestal are equipped with wafer delivery area, and body rest area, alignment are equipped with around the wafer delivery area
Area, wafer solution bonding region and wafer cleaning area；
Wafer picks and places module, is set to the wafer delivery area；
Wafer body is set to the body rest area, and to place bonded wafer to be solved, the bonded wafer to be solved is by semiconductor
Wafer is formed with plastering agent fitting carrier；
Preparatory alignment modules, are set to the alignment area, and the wafer pick-and-place module is taken described wait solve bonding by the wafer body
Wafer to the preparatory alignment modules carry out center calibration；
Wafer solution is bonded module, is set to the wafer solution bonding region, and the wafer picks and places module and takes the bonded wafer to be solved extremely
The wafer solution bonding module is bonded with the solution for carrying out the semiconductor crystal wafer and the carrier；And
Plastering agent cleaning module, is set to the wafer cleaning area, and the wafer picks and places module and takes the bonded wafer to be solved to institute
Wafer solution bonding module is stated, to clean plastering agent accompanying by the semiconductor crystal wafer and the carrier.
2. full-automatic wafer solution bonding as described in claim 1 and cleaning machine, which is characterized in that the wafer picks and places module and is
Mechanical arm, the mechanical arm has pedestal, and is equipped with movable and flexible arm, the arm front end in the pedestal
With the end effectors that can grab the semiconductor crystal wafer and the carrier.
3. full-automatic wafer solution bonding as claimed in claim 2 and cleaning machine, which is characterized in that the arm is multi-joint
Arm, the end effectors is vacuum adsorption type, and the end effectors is rotatably arranged in the arm front end.
4. full-automatic wafer solution bonding as described in claim 1 and cleaning machine, which is characterized in that the wafer body has plural number
It is a, it is placed respectively for the semiconductor crystal wafer after solving bonded wafer and solution bonding and the carrier.
5. full-automatic wafer solution bonding as described in claim 1 and cleaning machine, which is characterized in that the preparatory alignment modules have
Positioning region, the semiconductor crystal wafer and the carrier can be adsorbed and be rotated in the positioning region, and capture institute with video capture device
The image of semiconductor crystal wafer and the carrier is stated, to carry out center calibration.
6. full-automatic wafer solution bonding as described in claim 1 and cleaning machine, which is characterized in that the wafer solution is bonded module
Extractor with microscope carrier and on the microscope carrier, Yu Suoshu microscope carrier be equipped with heater, the bonded wafer to be solved in
It is heated on the microscope carrier by the heater and melts the plastering agent, and with the extractor by the semiconductor crystal wafer and institute
The one of them for stating carrier picks up and solves bonding.
7. full-automatic wafer solution bonding as claimed in claim 6 and cleaning machine, which is characterized in that the wafer solution is bonded module
In the microscope carrier be equipped with linear slide rail, and on the linear slide rail be equipped with slide, the slide can lateral sliding, the cunning
Seat is equipped with pneumatic cylinder, and the pneumatic cylinder can be located at the pneumatic cylinder, the suction along linear slide rail lateral displacement, the extractor
Take device can length travel.
8. full-automatic wafer solution bonding as described in claim 1 and cleaning machine, which is characterized in that the plastering agent cleaning module
There are turntable and spray head, the semiconductor crystal wafer and the carrier are adsorbed respectively with the turntable and rotate, and will with the spray head
Cleaning agent sprays on the semiconductor crystal wafer and the carrier, and the plastering agent is made to be detached from the semiconductor crystal wafer and the load
On body.
9. full-automatic wafer solution as claimed in claim 8 bonding and cleaning machine, which is characterized in that the cleaning agent be acetone or
Isopropanol.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920469822.2U CN209487476U (en) | 2019-04-09 | 2019-04-09 | The bonding of full-automatic wafer solution and cleaning machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920469822.2U CN209487476U (en) | 2019-04-09 | 2019-04-09 | The bonding of full-automatic wafer solution and cleaning machine |
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| CN209487476U true CN209487476U (en) | 2019-10-11 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI809901B (en) * | 2022-05-27 | 2023-07-21 | 弘塑科技股份有限公司 | Integrated wafer debonding and cleaning apparatus and debonding and cleaning method |
-
2019
- 2019-04-09 CN CN201920469822.2U patent/CN209487476U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI809901B (en) * | 2022-05-27 | 2023-07-21 | 弘塑科技股份有限公司 | Integrated wafer debonding and cleaning apparatus and debonding and cleaning method |
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