201240004 六、發明說明： 【發明所屬之技術領域】 本發明係一種黏晶機，其係提供一種將晶粒以機械式 '分段式移動，以及視覺模組之對位，而能精準地且能夠避 免晶粒掉洛，以將晶粒黏貼於基板處，再將具有晶粒之基 板以機械式移動，藉此達到符合生產所需、避免晶粒掉落 與精度較佳。 【先前技術】 現有的黏晶機，其具有一機台，機台中設有一晶粒 (Die)平台與一晶圓（Wafer)平台，並於晶粒平台與晶 圓平台之間設有一甩臂式取放裝置。 於實際操作時，工作人員以人工方式分別將承載複數 個晶粒的載體放置於晶粒平台，以及將裝有晶圓之載板放 置於晶圓平台。 取放裝置係依序將晶粒由晶粒平台處取出，再將各晶 粒放置於晶圓平台中之各晶圓處，以使各晶粒黏至各晶圓 處，待此一製程完成後，再以人工方式將載體移離機台， 並將另一載體置放於機台，以進行上述之黏晶製程。 雖上述之黏晶機能夠達到將晶粒黏至晶圓之目的’但 現有的黏晶機仍具有下述的缺點： 首先，黏晶機對各廠商而言，其係為一種較新的技術， 所以各廠商僅將舊有的設備稍作修改，因此容易造成精度 不佳。 另外，甩臂式取放裝置，其甩臂需要於晶粒平台與晶 201240004 圓平台之間移動，故甩臂的長度係較長，故 f甩=運作速度過快時，甩臂的慣性作用會“晶卓 晶 洛若降低思臂運作速度’而有利控制，並不 粒掉洛，但卻嚴重影響整體製程的時間與效率。 再者’人工裝卸晶圓載體’其需要 故不符生產所需。 奸長的作業時間：201240004 VI. Description of the Invention: [Technical Field] The present invention is a die bonding machine which provides a mechanical segmentation movement of a die and a alignment of a vision module, and can be accurately and The die can be prevented from falling, so that the die is adhered to the substrate, and the substrate having the die is mechanically moved, thereby achieving the production requirement, avoiding the falling of the die and the precision. [Prior Art] The existing die bonder has a machine platform with a die platform and a wafer platform, and an arm between the die platform and the wafer platform. Pick and place device. In actual operation, the worker manually places the carrier carrying the plurality of dies on the die platform and places the wafer-mounted carrier on the wafer platform. The pick-and-place device sequentially removes the die from the die platform, and then places the die on each wafer in the wafer platform, so that the die is adhered to each wafer, and the process is completed. Thereafter, the carrier is manually removed from the machine table, and another carrier is placed on the machine table to perform the above-mentioned die bonding process. Although the above-mentioned die bonder can achieve the purpose of sticking the die to the wafer, the existing die bonder still has the following disadvantages: First, the die bonder is a relatively new technology for various manufacturers. Therefore, each manufacturer only slightly modifies the old device, so it is easy to cause poor precision. In addition, the arm-type pick-and-place device requires the arm to move between the die platform and the crystal 201240004 circular platform, so the length of the arm is longer, so f甩=the operating speed is too fast, the inertia of the arm It will be beneficial to the control of "Zhuo Jingluo if the operating speed of the arm is lowered", but it will not be granulated, but it will seriously affect the time and efficiency of the overall process. Moreover, the 'manual loading and unloading of the wafer carrier' needs to be inconsistent with the production. The long working hours of the traitor:
綜合上述，現有的黏晶機具有精度 不符生產所需的缺點。 不佳曰曰粒掉洛I 【發明内容】 有鑑於上述之缺點，本發明之目的— :使广分段定位傳送，並藉由視覺模組:對2 精度佳與符合生產所需的優點，並能克 種黏ί:達=上述之目的，本發明之技術手段在於提供 種黏曰日機，其係應用將一晶粒環之晶教黏 Γ機曰包，有-機台、-晶粒環承叫 一日日粒夂位叢置、一第一取放裝置、—第二取放裝1 一:視ί模組、—第二視覺模組與—第三視覺模組^ 係供裝置係設於機台的-端’晶粒環承載裝 係供裝置，其係設於機台的另端’基板承戴裝 基板承載裝置係认於機台’並位於晶粒環承載裝置' 201240004 第一取放裝置係設於機台，並且位於晶粒環承載裝置 的上方，第一取放裝置係取出位於晶粒環承載裝置之晶 粒’並將晶粒置放於晶粒定位裝置。 第二取放裝置係設於機台，並且位於基板承載裝置的 上方，第二取放裝置係取出位於晶粒定位裝置之晶粒，並 將晶粒置放於位於基板承載裝置之基板。 第一視覺模組係設於機台，並且位於晶粒環承載裝置 的上方，第一視覺模組係取像與對位位於晶粒環承載裝置 之晶粒。 - 第二視覺模組係設於機台，並且位於晶粒定位模組的 上方，第二視覺模組係取像與對位位於晶粒定位裝置之晶 粒。 第三視覺模組係設於機台，並且位於基板承載裝置的 上方，第三視覺模組係分別或同時垂直取像與對位位於第 二取放裝置上的晶粒以及位於基板承載裝置之基板。 如上所述之本發明的黏晶機，其係藉由第一取放裝置 與第二取放裝置，而將晶粒分段運送，藉此加快生產速度 及提高定位精度。 另外，晶粒定位裝置可使晶粒於上述的運送過程中， 予以定位，以便於隨後之黏晶作業，第三視覺模組係可提 高晶粒與基板之間定位的精準度，藉此使得黏晶作業的精 度較佳。 再者，本發明進一步具有一晶粒環移動裝置與一基板 移動裝置，其係以機械作動取代人工裝卸，藉此縮短整體 黏晶作業因人工所產生的較長的作業時間，而使本發明能 201240004 夠符合生產所需的優點。 【實施方式】 以下係藉由特定的具體實施例說明本發明之實施方 式’所屬技術領域中具有通常知識者可由本說明書所揭示 之内容輕易地瞭解本發明之其他優點與功效。 凊配合參考圖一及二所示，本發明係一種黏晶機，其 具有一機台1、一晶粒環移動裝置10、一第一滑轨11、一 晶粒環承載裝置12、一第一取放裝置13、一晶粒定位裝置 14、一基板承載裝置丨5、一第二滑軌組16、一點膠模組 Π、一基板移動裝置18、一第二取放裝置19、一晶粒提籃 升降裝置20、一晶舟盒升降裝置21、一第一視覺模組22、 一第二視覺模組23、一第三視覺模組24、一基板定位裝置 25。 機台1具有—X軸向、一 γ軸向與一 Z軸向。 晶粒環承載農置12係設於機台1的一端’晶粒環承載 裝置12具有一動力驅動的頂針模組121，如圖八及九所 示’第一滑執11係設於機台1中，並且相鄰於晶粒環承载 裝置12，第一滑執u係沿著x軸向分佈，晶粒提籃升降 裝置20係設在相鄰於晶粒環承载裝置12處，另於晶粒提 ，升降，置2G與晶粒環承載裝置12之間設有複數個晶粒 %引導益120。晶粒環移動裝置1〇係能夠移動地設於第一 滑執11。 基板承載裳置15係設於機台i的另端，基板承載 15具有稷數個動力驅動的頂柱15〇，如圖八所示，晶舟盒 201240004 升降裝置21係設在相鄰於基板承載裝置ι5 、， 承載裝置15與晶舟盒升降裝置21之間設有=於基板 18 ’基板移動裝置18係為-動力驅動之取放^動裂置 裝置18具有複數個真空吸孔18〇。基板定位^板移動 在相鄰於基板移動裝置18處。 、置託係設 晶粒定位裝置14係設於機台丨，、， 置15與晶較環承載褒置12之間 ^且位於基板承栽裝 晶粒旋轉單元141與―晶粒γ 位農置14具有一 第二滑軌組16係設於機台早+凡140。 多個分段的滑軌，其係分別位於 ^二滑軌組16具有 疋位裝置14與基板承載裝置15的'王长承载I置12、晶粒 佈，第-取敌裂置13與第二取放方’並沿著X軸向分 於第二滑執紐16，第—取放農、置19係能夠移動地設 置12的上方，第二取放裝置Γ9愈13係位於晶粒環承载裝 承載裝置 丄5的上方，第二取放膠模組Π係位於基板 以吸取尺寸0·1至3毫米9具有—真空吸管190 示，點膠模組17具有—動的晶粒2〇1，如圖十二所 ⑺，膠盤m係提供黏膠，^ =膠桿no與-膠盤 第-視覺模組22、第二視覺;勝桿170沾膠。 24係設於機台丨中，並沿著=組23與第三視覺模組 係位於晶粗環承載裝置12的上方°，t佈，第—視覺模組22 於晶粒定位裝置14的上方，，第二視覺模組23係位 承載裝置15的上方。 二視覺模組24係位於基板 請配合參考圖三至五所示 至少一晶粗提籃，各晶粒提藍中料降裝置20設有 叹有多個晶粒環200，各 201240004 晶粒T ”個晶粒201，如圖八所示。 Β曰粒提監升降袭置2〇係適時將晶粒提藍，沿著Ζ 〇予以升m降’以配合晶粒環移動裝置10取放晶粒環200。 方二Π動f置1G係沿著x軸向’並且朝向晶粒提藍 中^屮*晶粒環移動裝置10係將晶粒環自晶粒提^ 得以確實進^==導謂之引導，而使晶粒㈣ L曰载裝置12中’待晶粒環200到達定 ^ 4¼移動農置1()則持續移動以使晶粒環 置於晶粒環承载裝置12。 由 。月配口參考圖六及七所示，晶舟盒升降裝I Μ設有至 ^"7曰盒’各晶舟盒中設有多個基板，晶舟盒升降裝置 21係適時將晶弁各，、、儿f 鮮me 者軸向，予以升降，以使基板移 =褒置18㈣移動基板21G。其t，基板2 電性承載板或晶圓。 基板移動農置18係沿著γ軸向移動，並伸入晶舟盒 ~、真工吸孔180係吸取基板21〇，以使基板移動裝置18 付以將基板210移出晶舟盒，#基板移域置21Q將基板 210移動至基板定位農置25處時，基板定位裝置25係將 基板210予以定位，即調整基板21〇之位置，以利下一製 待基板210定位後，基板移動裝置21持續將基板21〇 私動至基板承錄置15處，基板承缝置15中會突伸出 Ϊ數個頂柱150，以使基板21Q與基板承裁裝置Γ5相互分 ⑴並^基板210滞留於基板承載裝置15處，基板移動裝 會回到其最初的位置’而後雜15()亦會_其最初 8 201240004 的位置。 請配合圖八至十一所示，頂針模組121係將晶粒2〇ι 頂出’以供第一取放裝置13吸取，第一視覺模組22係定 位該晶粒201，並將此一資訊傳送給第一取放裝置13，第 一取放裝置13根據該資訊，移動至該晶粒2〇1的上方。 同％，第二取放裝置19亦移動至晶粒定位裝置丨4 上方。 於第一取放裝置13移動至晶粒環承載裝置12，以及 第二取放裝置19移動至晶粒定位裝置19的時候，點膠膜 組17之點膠桿170係依據第三視覺模組24的資訊，而將 黏膠塗佈於欲黏設有晶粒2()1之基板21〇位置處，如圖十 及十一所示。 ° =圖九及十二所示，第二取放裝置㈣依據第二視覺 模、.且23的資訊，以吸取位於晶㈣位裝置14之晶粒如， 並移動至基板承載位置15處。 如圖十一所示，點膠桿17〇係回到膠盤 以待下一沾膠。 的上万 ,第一取放裝置13係吸取位於晶粒環承載裝置12 粒 2 01，並移動 $ a # φ/ aa 田 i牙夕勤至日曰粒疋位裝f 14。頂針模组ΐ2ι回 取初位置，以待再次頂出晶粒201。 八 粒定位裝置 的資訊，以 晶粒201旋 晶粒Y軸移 ’以調整晶 第一取放裝置13係將晶粒2〇1放置 二4，日日粒定位裝置14係依據第二視覺模組μ 凋整晶粒201之位置，晶粒旋轉單元141會將 轉至一適當的角度，以調整晶粒201之角度， 動單元140係將晶粒2G1沿著γ軸—適當二離 201240004 粒201的位置，該位置與角度的調整可同時或個別進疒， 以使晶粒201的位置調整至較佳吸取位置與黏晶角度。 如圖十二所示，當真空吸管190吸取晶粒201=並 延伸至第二視覺模組24下方時’真空吸管2〇1不會干播 三視覺模組24對位與取像，而使第三視覺模組24得以 時對位於第二取放裝置19之晶粒2〇1丨位於基板承載^ 15之基板210取像’因第三視覺模組24具有複數個視野 景深與視覺運算補償的功效，故經視覺運算補償，以將晶 粒201與基板210二者做精密對位，如此第二取放裴置= 方能將晶粒201精準地黏貼於基板21〇虛 待基請完成黏貼有晶粒板2二 將基板210頂離基板承置15，以使基板移動裝置18 得^得基板210，待基板移動裂置18取得基板2難， 頂才干150與基板210相互分離，頂桿15〇回到其最初位置， 基板移動裝置18係將基板21Q傳送至晶舟盒中，並如上所 述，取出另一需要黏貼有晶粒201之基板21〇。 上所述帛取放裝置13與第二取放裝置19以分 將第粒201黏貼於基板21◦處，第一取放裝置 避免、s粒201 ^/私19係縮短晶粒2Q1的移動距離，藉此 避免曰曰，201於移動過程中產生掉落的狀況。 覺模日視/池22、帛三視覺触23與第三視 、另 阳粒201得以精準地黏貼於基板21〇處。 以動裝置10係以機械式移動晶粒環 此取代人工土，& <5置18係以機械式移動基板21◦，藉 、’月b縮短整體黏晶作業時間，以符合生產所 201240004 需。 惟以上所述之具體實施例，僅係用於例釋本發明之特 點及功效，而非用於限定本發明之可實施範疇，於未脫離 本發明上揭之精神與技術範疇下，任何運用本發明所揭示 内容而完成之等效改變及修飾，均仍應為下述之申請專利 範圍所涵蓋。 11 201240004 【圖式簡單說明】 圖一係本發明之黏晶機之局部立體示意圖。 圖·一係本發明之黏晶機之居部俯視不意圖。 圖三係晶粒環移動裝置之動作示意圖。 圖四係晶粒環移動裝置之另一動作示意圖。 圖五係晶粒環移動裝置之再一動作示意圖。 圖六係基板移動裝置之動作示意圖。 圖七係基板移動裝置之另一動作示意圖。 圖八係第一取放裝置與第二取放裝置之動作示意圖。 圖九係第一取放裝置與第二取放裝置之另一動作示意 圖。 圖十係點膠裝置之動作示意流程圖。 圖十一係點膠裝置之動作示意流程圖。 圖十二係第三視覺模組之動作示意圖。 【主要元件符號說明】 I 機台 10 晶粒環移動裝置 II 第一滑軌 12 晶粒環承載裝置 120 晶粒環引導器 121 頂針模組 13 第一取放裝置 14 晶粒定位裝置 140 晶粒Y軸移動單元 12 201240004 141 晶粒旋轉單元_ • ψ 15 基板承載裝置 150 頂桿 16 第二滑執組 17 點膠膜組 170 點膠桿 171 膠盤 18 基板移動裝置 ' 180 真空吸孔 * 19 第二取放裝置 190 真空吸管 20 晶粒提籃升降裝置 200 晶粒ί哀 201 晶粒 21 晶舟盒升降裝置 210 基板 22 第一視覺模組 23 第二視覺模組 24 第三視覺模組 25 基板定位裝置 13In summary, the existing die bonder has the disadvantage that the precision does not meet the production requirements. Inadequately, in view of the above disadvantages, the object of the present invention is to enable wide segmentation and positioning, and by means of a visual module: the accuracy of 2 is good and the advantages required for production are met. And can be used for the purpose of the above-mentioned purpose, the technical means of the present invention is to provide a kind of sticky Japanese machine, which is applied to a crystal ring of the crystal teaching adhesive machine, including - machine, - crystal The ring ring is called one day, the granules are placed, the first pick and place device, the second pick and place device 1 one: the visual module, the second visual module and the third visual module ^ The device is disposed at the end-end of the machine, and is mounted on the other end of the machine. The substrate receiving substrate carrying device is recognized by the machine and located in the die ring carrier. 201240004 The first pick-and-place device is disposed on the machine platform and is located above the die ring carrying device. The first pick-and-place device takes out the die located in the die ring carrier device and places the die on the die positioning device. . The second pick-and-place device is disposed on the machine table and located above the substrate carrying device. The second pick-and-place device takes out the die located in the die positioning device and places the die on the substrate of the substrate carrying device. The first visual module is disposed on the machine platform and is located above the die ring carrying device. The first visual module is imaged and aligned on the die of the die ring carrier. - The second vision module is disposed on the machine and located above the die positioning module, and the second vision module is imaged and aligned in the grain positioning device. The third visual module is disposed on the machine platform and is located above the substrate carrying device, and the third visual module is separately or simultaneously vertically imaged and aligned with the die on the second pick and place device and located in the substrate carrying device. Substrate. The die bonder of the present invention as described above transports the crystal grains in sections by the first pick-and-place device and the second pick-and-place device, thereby accelerating the production speed and improving the positioning accuracy. In addition, the die positioning device can position the die during the above-mentioned transportation process to facilitate the subsequent die bonding operation, and the third vision module can improve the positioning accuracy between the die and the substrate, thereby The precision of the die bonding operation is better. Furthermore, the present invention further has a die ring moving device and a substrate moving device, which replaces manual loading and unloading by mechanical actuation, thereby shortening the long working time of the overall die bonding operation due to manual operation, thereby making the present invention Can 201240004 enough to meet the advantages of production. [Embodiment] The following describes the embodiments of the present invention by way of specific embodiments. Those skilled in the art can readily understand the other advantages and effects of the present invention from the disclosure of the present disclosure. Referring to Figures 1 and 2, the present invention is a die bonder having a machine table 1, a die ring moving device 10, a first slide rail 11, a die ring carrying device 12, and a first a pick and place device 13, a die positioning device 14, a substrate carrying device 5, a second slide group 16, a glue module, a substrate moving device 18, a second pick and place device 19, and a The crystal basket lifting device 20, a wafer cassette lifting device 21, a first visual module 22, a second visual module 23, a third visual module 24, and a substrate positioning device 25. The machine table 1 has an -X axial direction, a γ axial direction and a Z axial direction. The die ring bearing agricultural system 12 is disposed at one end of the machine table 1 The die ring bearing device 12 has a power driven ejector module 121, as shown in Figures 8 and 9 'the first sliding 11 is set on the machine 1 and adjacent to the die ring carrier 12, the first sliding u is distributed along the x-axis, and the crystal basket lifting device 20 is disposed adjacent to the die ring carrying device 12, and A plurality of grain% guides 120 are provided between the grain lifter, the lifter, and the 2G and the die ring carrying device 12. The die ring moving device 1 is movably disposed on the first slider 11. The substrate carrying skirt 15 is disposed at the other end of the machine table i. The substrate carrying 15 has a plurality of power driven top posts 15〇. As shown in FIG. 8, the boat box 201240004 lifting device 21 is disposed adjacent to the substrate. The carrying device ι5 , the carrying device 15 and the boat hoisting device 21 are disposed between the substrate 18 and the substrate moving device 18 are driven by the power absorbing device 18 having a plurality of vacuum suction holes 18 〇 . The substrate positioning plate moves adjacent to the substrate moving device 18. The setting device 14 is disposed on the machine 丨, and between the 15 and the crystal ring bearing device 12, and is located in the substrate bearing device rotating unit 141 and the “grain γ” The set 14 has a second set of slides 16 that are attached to the machine. The plurality of segmented slide rails are respectively located in the second slide rail group 16 having the clamping device 14 and the substrate carrying device 15 of the 'Wangchang bearing I set 12, the crystal cloth, the first - the enemy splitting 13 and the first The second take-out side is divided into the second sliding button 16 along the X-axis. The first pick-and-place farm and the 19-series can be moved to the top of the 12, and the second pick-and-place device Γ9 is located in the grain ring. Above the carrying device 丄5, the second pick-and-place rubber module is located on the substrate to absorb the size of 0·1 to 3 mm 9 has a vacuum suction pipe 190, and the dispensing module 17 has a moving die 2〇 1, as shown in Figure 12 (7), the rubber plate m provides glue, ^ = glue rod no and - rubber plate first - vision module 22, second vision; wins 170 glue. The 24 series is disposed in the machine cymbal, and is located above the crystal ring support device 12 along the = group 23 and the third visual module, and the first visual module 22 is above the die positioning device 14. The second vision module 23 is above the system carrier device 15. The second vision module 24 is located on the substrate, and the at least one crystal coarse basket is shown in reference to Figures 3 to 5. Each of the crystal blue lifting device 20 is provided with a plurality of grain rings 200, and each 201240004 grain T ” A die 201, as shown in Fig. 8. The granules are lifted and raised, and the ruthenium is lifted in a timely manner, and the crystal grains are blue, and the dies are raised along the Ζ ' to match the die ring moving device 10 Ring 200. Square two f f f 1G system along the x-axis 'and toward the crystal grain blue ^ ^ * grain ring moving device 10 system to extract the grain ring from the grain ^ ^ = = In the case of the grain (4) L-carrying device 12, the 'to-bezel ring 200 reaches the fixed hole 41' and then moves continuously to place the die ring on the die ring carrier 12. Referring to Figures 6 and 7 of the monthly matching port, the boat box lifting and lowering device I is provided with a plurality of substrates in each of the box boxes, and the wafer boat lifting device 21 is a timely wafer. Each of the elements is lifted and lowered to move the substrate to the substrate 18 (four) to move the substrate 21G. t, the substrate 2 is electrically placed on the substrate or the wafer. Moving and extending into the boat box~, the real suction hole 180 is sucking the substrate 21〇, so that the substrate moving device 18 is moved to move the substrate 210 out of the wafer cassette, and the substrate shifting region 21Q moves the substrate 210 to the substrate. When the positioning device 25 is positioned, the substrate positioning device 25 positions the substrate 210, that is, adjusts the position of the substrate 21 to facilitate the positioning of the substrate 210, and the substrate moving device 21 continues to move the substrate 21 to the substrate. 15 substrates are placed, and a plurality of top posts 150 are protruded from the substrate receiving portion 15 so that the substrate 21Q and the substrate receiving device Γ5 are separated from each other (1) and the substrate 210 is retained at the substrate carrying device 15, and the substrate is moved. The assembly will return to its original position' and then the miscellaneous 15() will also be in its original position of 8 201240004. Please match the figures shown in Figures 8 to 11 for the ejector module 121 to eject the die 2〇ι The first pick-and-place device 13 picks up the first visual module 22 to locate the die 201 and transmits the information to the first pick-and-place device 13. The first pick-and-place device 13 moves to the die according to the information. Above 2〇1. With the same %, the second pick-and-place device 19 is also moved to the die positioning device丨4. When the first pick-and-place device 13 moves to the die ring carrying device 12, and the second pick-and-place device 19 moves to the die positioning device 19, the dispensing bar 170 of the dispensing film group 17 is based on the third The information of the visual module 24 is applied to the substrate 21 where the die 2()1 is to be bonded, as shown in Figs. 10 and 11. ° = shown in Figures 9 and 12. The second pick-and-place device (4) according to the information of the second visual mode, and 23, sucks the die located in the crystal (four) position device 14 and moves to the substrate carrying position 15. As shown in Fig. 11, the dispensing rod 17〇 returned to the rubber plate to wait for the next glue. In the tens of thousands, the first pick-and-place device 13 draws the particles 2 01 located in the die ring carrying device, and moves the $ a φ / aa field to the day. The thimble module ΐ2ι returns to the initial position to be used to eject the die 201 again. The information of the eight-position positioning device is such that the grain 201 is rotated by the Y-axis of the grain to adjust the crystal. The first pick-and-place device 13 places the die 2〇1 into two 4, and the day-to-day particle positioning device 14 is based on the second visual mode. The position of the group μ is neat grain 201, the grain rotation unit 141 will be rotated to an appropriate angle to adjust the angle of the grain 201, and the moving unit 140 will be the grain 2G1 along the γ axis - suitably two from 201240004 The position of the position 201 can be adjusted simultaneously or individually to adjust the position of the die 201 to a preferred suction position and a die angle. As shown in FIG. 12, when the vacuum suction pipe 190 sucks the die 201= and extends below the second visual module 24, the vacuum suction pipe 2〇1 does not dry the alignment and image capturing of the three vision modules 24, so that The third visual module 24 is capable of taking images of the substrate 210 located on the substrate of the second pick-and-place device 19, which is located on the substrate 210 of the substrate carrier, and has a plurality of visual depth of field and visual operation compensation. The function is compensated by visual operation to precisely align the die 201 and the substrate 210, so that the second pick-and-place device can accurately adhere the die 201 to the substrate 21. Adhering to the die plate 2, the substrate 210 is placed away from the substrate 15 so that the substrate moving device 18 can obtain the substrate 210. The substrate is moved to the substrate 18 to obtain the substrate 2. The top electrode 150 and the substrate 210 are separated from each other. The rod 15 is returned to its original position, and the substrate moving device 18 transfers the substrate 21Q to the wafer cassette, and as described above, another substrate 21 to which the die 201 is to be attached is taken out. The first pick-and-place device 13 and the second pick-and-place device 19 adhere the first particle 201 to the substrate 21, and the first pick-and-place device avoids, the s grain 201 ^ / private 19 series shortens the moving distance of the crystal 2Q1 In order to avoid smashing, 201 is in a state of falling during the movement. The model time/pool 22, the third visual contact 23 and the third view, and the other positive particles 201 are accurately adhered to the substrate 21〇. The moving device 10 replaces the artificial soil with a mechanical moving die ring, &<5 sets the 18 series to mechanically move the substrate 21◦, borrowing, 'month b shortens the overall die bonding operation time to conform to the production site 201240004 need. However, the specific embodiments described above are merely used to exemplify the features and functions of the present invention, and are not intended to limit the scope of the present invention, and may be applied without departing from the spirit and scope of the present invention. Equivalent changes and modifications made to the disclosure of the present invention are still covered by the scope of the following claims. 11 201240004 [Simple description of the drawings] Fig. 1 is a partial perspective view of the die bonding machine of the present invention. Fig. 1 is a plan view of the die bonder of the present invention. Figure 3 is a schematic diagram of the operation of the die ring moving device. Figure 4 is a schematic diagram of another operation of the die ring moving device. Figure 5 is a schematic diagram of another action of the die ring moving device. Fig. 6 is a schematic view showing the operation of the substrate moving device. Fig. 7 is a schematic view showing another operation of the substrate moving device. Figure 8 is a schematic view showing the operation of the first pick-and-place device and the second pick-and-place device. Figure 9 is a schematic view showing another operation of the first pick-and-place device and the second pick-and-place device. Figure 10 is a flow chart showing the action of the dispensing device. Figure 11 is a schematic flow chart of the action of the dispensing device. Figure 12 is a schematic diagram of the action of the third visual module. [Main component symbol description] I Machine 10 die ring moving device II first slide rail 12 die ring carrier 120 die ring guide 121 thimble module 13 first pick and place device 14 die positioning device 140 die Y-axis moving unit 12 201240004 141 Die rotation unit _ • ψ 15 Substrate carrying device 150 Plunger 16 Second sliding group 17 Dispensing film set 170 Dispensing rod 171 Rubber plate 18 Substrate moving device '180 Vacuum suction hole* 19 Second pick and place device 190 Vacuum pipette 20 Grain basket lifting device 200 Grain 201 201 Grain 21 Crystal boat lifting device 210 Substrate 22 First vision module 23 Second vision module 24 Third vision module 25 Substrate Positioning device 13