KR102502909B1 - Debonding equipment, automatic debonding system and debonding method for electrostatic chuck - Google Patents

Abstract

The present invention relates to a detachment device used for an electrostatic chuck, an automatic detachment system, and a detachment method thereof, and is used for automatic adhesion and separation of a wireless electrostatic chuck and a thin substrate, which can increase adhesion efficiency and requires a high-precision manufacturing process. and satisfies the needs of automated manufacturing of substrates.

Description

Debonding device used in electrostatic chuck, automatic debonding system and debonding method thereof

The present invention relates to an automatic attachment/detachment technology of an electrostatic chuck, and more specifically, to a attachment/detachment device used for an electrostatic chuck, an automatic attachment/detachment system, and a attachment/detachment method thereof.

With recent advances in miniaturization of semiconductor manufacturing processes, the thickness of silicon wafers has been reduced to less than 100 micrometers. In addition, the thickness of ultra-thin blue glass filters used in cell phone camera lenses is 200 μm, close to 100 μm, and even smaller than 50 μm. However, as the area of these thinned substrates increases, especially when the diameter is 6 inches or more and the thickness is 300 μm or less, the thinned substrates are very flexible and have elasticity, causing distortion. If the substrate is warped in the manufacturing process, it is not flat and stress is generated, resulting in manufacturing defects with non-uniform thickness during film coating. Time is delayed, which directly affects the detection of defective products, and there are problems such as low storage capacity, easy breakage, and vulnerability in the transportation and assembly process of the board. Therefore, the problem of warping the substrate seriously adversely affects the reliability of the manufacturing process, and increases manufacturing cost and defect rate.

In order for the substrate to enter the manufacturing process while remaining flat, the current substrate undergoes a Temporary bonding process to strengthen the tension of the substrate, and the temporary bonding process mainly uses a multi-layer polymer bonding material to bond the substrate. It is reversibly mounted on the carrier, and it is necessary to perform peeling again after the manufacturing process is in progress. In this way, the yield of the substrate itself must be maintained both between bonding and peeling, and at the same time, the coefficient of thermal expansion (CTE) of the bonding material used is not matched. There is a phenomenon that does not exist, and the problem of the acid and base of the bonding material in the manufacturing environment is an immediate problem in proceeding with the temporary bonding process.

A current improvement method uses a cordless electrostatic chuck (E-Chuck or Supporter) to bond the substrate and allow the substrate to proceed with the manufacturing operation. However, since the current electrostatic chuck adheres to a substrate in a manual manner, problems such as slow speed, poor bonding quality and efficiency, and even misalignment, slipping, or non-uniform pressure welding may cause cracks or damage.

Accordingly, a major object of the present invention is to provide a desorption device used in an electrostatic chuck capable of increasing adhesion efficiency, significantly lowering the adhesion failure rate, and reducing the occurrence of cracks or breakages.

In addition, another main object of the present invention is to provide an automatic method for use in electrostatic chucks, which can meet the requirements of high-precision manufacturing processes after automatic cleaning, baking and pre-alignment, and proceed with automated bonding to meet the requirements for automated manufacturing of substrates. It is to provide a desorption system.

In addition, another major object of the present invention is to rapidly and accurately automatically adhere an electrostatic chuck and a substrate, and to enable the electrostatic chuck to adhere to a substrate to be applied in a subsequent manufacturing process, thereby significantly increasing the yield of the substrate manufacturing process and reducing costs. It is to provide a desorption method used in an electrostatic chuck that lowers and increases profit.

Based on this, the present invention mainly realizes the above-mentioned objects and effects in detail through the following technical means.

It is used for automatic bonding and automatic separation of the electrostatic chuck and the substrate, and a pole is provided on the bottom of the electrostatic chuck to generate or emit an electrostatic field by conducting electricity, and to determine orientation around the electrostatic chuck and the substrate. The automatic detachment system provided with a positioning incision,

a main body including at least one substrate material input unit and at least one tray material input unit;

at least one baking device installed on the main body and including at least one first baker for baking a substrate and at least one second baker for baking an electrostatic chuck;

at least one pre-alignment device installed in the main body and configured to pre-determine designated orientations of the electrostatic chuck and the substrate using a positioning cutout;

a static electricity generating unit for adsorbing an electrostatic chuck and a substrate moving unit for adsorbing a substrate, wherein the substrate moving unit linearly displaces the static electricity generating unit and presses the substrate to correspond to a surface of the electrostatic chuck of the static electricity generating unit; at least one detachable device that activates or discharges the electrostatic chuck to generate an electrostatic field, and causes the electrostatic chuck and the substrate to be attached or separated in the same designated orientation; and

At least one installed on the main body and clamping the substrate or the electrostatic chuck so that it can be moved between the first baker and the second baker of the baking device, the pre-alignment device and the detachment device corresponding to the substrate material input unit and the tray material input unit. Includes a transfer device of

1 is a schematic diagram of the architecture of an automatic detachment system of the present invention.
Figure 2 is a schematic diagram of the operation of the automatic detachment system of the present invention.
3 is a schematic view of the appearance of the desorption device of the present invention.
4 is a schematic side view of the desorption device of the present invention.
5 is a schematic external view of a tray static electricity generation unit in the detachable device of the present invention.
6 is a partially planar schematic diagram of a tray static electricity generating unit in the detachable device of the present invention.
7 is a schematic side view of a tray static electricity generating unit in the detachable device of the present invention.
8 is a schematic view of a side operation of a tray static electricity generation unit in the detachable device of the present invention.
9 is a schematic view of another lateral operation of a tray static electricity generating unit in the detachable device of the present invention.
10 is a schematic external view of a substrate moving unit in the detachment device of the present invention.
11 is a partial bottom view schematic of a substrate moving unit in the detachment device of the present invention.
12 is a schematic diagram of the flow architecture of the detachment method of the present invention.

In the automatic detachment system used in the electrostatic chuck of the present invention, as shown in FIG. 1, a wireless electrostatic chuck 100 (E-Chuck or Supporter) and a large-sized thinned substrate 200 (diameter 6 inches) or a substrate with a thickness of 300 um or less), the substrate 200 may be a semiconductor wafer or a glass sheet or a plastic sheet, and the automatic detachment system includes a main body 10, at least one transfer device 20 , at least one baking device 30 , at least one pre-alignment device 40 and at least one detachment device 50 .

Referring to FIGS. 1 and 2 for the detailed configuration of the preferred embodiment of the automatic detachment system, at least one first material input unit 16 and at least one second material input unit 18 are provided in the main body 10 The first material input unit 16 and the second material input unit 18 are material input units of a typical SEMI standard wafer carrier box (FOUP), and the electrostatic chuck 100 and the substrate 200 ), and the at least one conveying device 20 clamps the electrostatic chuck 100 or the substrate 200 to feed the first material 16 or the second material of the main body 10 It can be moved and seated between the unit 18 and the baking device 30, the pre-alignment device 40 and the detachment device 50, wherein the at least one transport device 20 is linear, 6-axis or 7-axis. It may be a mechanical arm, and in some embodiments, a rail mechanism 15 is provided on the main body 10, the at least one transfer device 20 is slidably installed on the rail mechanism 15, and the at least one Allows the conveying device 20 to selectively slide on the rail mechanism 15 .

In addition, the at least one baking device 30 is installed inside the main body 10, and the baking device 30 includes at least one first baker 31 for receiving and baking the substrate 200 and an electrostatic chuck. and at least one second baker (35) for receiving and baking the (100). In some other embodiments, a cleaning device 38 is provided on one side of the main body 10 corresponding to the second material input unit 18, and cleaning may be performed before the electrostatic chuck 100 performs baking. The cleaning device 38 may be a washing, wiping or non-contact particulate removal technique. In addition, the at least one pre-alignment device 40 is installed in the main body 10, and the pre-alignment device 40 is positioned through the positioning cutouts 101 and 201 of the electrostatic chuck 100 or the substrate 200 ( For example, a notch, a V-shaped incision, or a flat edge of a wafer) may be detected so that the electrostatic chuck 100 and the substrate 200 may enter the at least one detachment device 50 in a designated orientation. and the electrostatic chuck 100 and the substrate 200 can be bonded in the same designated direction. According to some embodiments, at least one material temporary storage unit 45 is provided in the main body 10 to temporarily store the electrostatic chuck 100 or the substrate 200 prepared for the bonding operation, thereby improving automatic work efficiency. raise it

In the at least one detachment device 50 installed in the main body 10, as shown in FIGS. 3 and 4, the at least one detachment device 50 relatively displaces the adsorption electrostatic chuck 100. ) and a substrate moving unit 80 that adsorbs the substrate 200 and a static electricity generating unit 60 that adsorbs the substrate 200, and the detachment device 50 includes a frame fixed to the main body 10, the frame It includes a lower frame 51 and an upper frame 52, the static electricity generator 60 is installed on the top of the lower frame 51, and the substrate moving unit 80 uses a lifting mechanism 82 to It is installed on the upper part of the upper frame 52 corresponding to the static electricity generating unit 60, and the substrate moving unit 80 adsorbs the substrate 200 to the static electricity generating unit 60 or moves the substrate 200 is moved to correspond to the surface of the electrostatic chuck 100 on the top surface of the static electricity generator 60 so as to be press-contacted.

As shown in FIGS. 5, 6 and 7, the static electricity generating unit 60 includes a main frame plate 61 and side wing plates 65 pivotally installed on both edges of the main frame plate 61. The main frame plate 61 and the side wing plates 65 on both sides are provided with a work plane for flatly seating the electrostatic chuck 100, and the sensing member 610 is provided on the main frame plate 61 of the work plane. ) is provided, detects the presence or absence of the electrostatic chuck 100 or the substrate 200, and a material support member 62 is provided in the other main frame plate 61, the material support member 62 It can be displaced between the working plane and the relatively high material receiving plane (as shown in FIG. 8 ), and the transfer device 20, for example, a claw of a mechanical arm, can pass through the electrostatic chuck 100 or the substrate 200. It is convenient to seat or clamp, and the material support member 62 can be composed of at least three simultaneously movable support bars or movable support plates, and the side wing plates 65 on both sides are the main frame plate ( Unlike 61), an extension cylinder 70 is provided between the center of the outer bottom edge and the lower frame 51, and the outer edge of the side wing plate 65 is selectively operated to incline downward, and the side wing plate 65 on both sides (as shown in FIG. 9 ), the electrostatic chuck 100 and the bonded substrate 200 are relatively peeled from the outer edges, and the main frame plate Adsorption members 64 (for example, vacuum chucks) corresponding to the bottom surface of the electrostatic chuck 100 are installed on the 61 and the side wing plate 65, respectively, and the electrostatic chuck 100 is mounted on the main frame plate 61. And selectively fixed to the working plane of the side wing plate 65, the main frame plate 61 is provided with two or multiple poles 63, and the bottom surface of the electrostatic chuck 100 plus and minus poles ( 105), providing power and making the surface of the electrostatic chuck 100 positively relative to the substrate 200. To generate or emit an electric field, to allow the electrostatic chuck 100 to adhere or separate from the substrate 200, and to have guide rods 66 on both sides of the wing plates 65, the guide rods 66 It surrounds the outer periphery of the electrostatic chuck 100 and includes at least two fixed guide rods 660 and at least one moving guide rod 665, and the present invention includes two fixed guide rods 660 and two moving guide rods. 665 is the main embodiment, the two movable guide rods 665 can push the electrostatic chuck 100 to the horizontal position of the two fixed guide rods 660, and position the two Inclined guide surfaces 661 and 666 are formed on the uppermost periphery of the fixed guide rod 660 and the two moving guide rods 665, and when the material support member 62 descends, the electrostatic chuck 100 or the substrate 200 is guided within an accurate range of the working plane, and a touch sensing unit 67 and an optical sensing unit 68 are installed at locations corresponding to the outer periphery of the electrostatic chuck 100 of the static electricity generator 60, respectively. , The touch sensing unit 67 includes at least two touch type protruding pillars 670 that are stretchable and surround the outer periphery of the electrostatic chuck 100 and at least one corrective protruding pillar 675 that can move forward and backward, The corrective protruding post 675 may correspond to the positioning cutouts 101 and 201 of the electrostatic chuck 100 or the substrate 200, and the corrective protruding post 675 may correspond to the electrostatic chuck 100. Alternatively, by using the positioning incisions 101 and 201 of the substrate 200, he rotates around the axis to be corrected, and furthermore, if the electrostatic chuck 100 or the substrate 200 is not placed right away, any one touch An alarm may be triggered when the protruding column 670 is touched, and the optical sensing unit 68 includes at least three photoelectric members 680 surrounding the outer periphery of the electrostatic chuck 100, and the electrostatic chuck ( 100) or the substrate 200 is An alarm can be triggered if any one photoelectric member 680 is not placed, and the positions of the electrostatic chuck 100 and the substrate 200 are accurately matched. In addition, as shown in FIG. 9, blowing units 69 are installed on both side wing plates 65 corresponding to the lower frame of the static electricity generating unit 60, respectively, and the blowing unit 69 is equipped with an electrostatic chuck ( 100) A spray nozzle 690 corresponding to the outer periphery and extending in the direction of the center of the shaft is provided, and when the electrostatic chuck 100 is operated and separated and separated from the substrate 200 by the wing plates 65 on both sides, High-speed gas is blown so that the electrostatic chuck 100 and the substrate 200 can be effectively separated.

In addition, as shown in FIGS. 10 and 11, the substrate moving unit 80 is composed of a frame base 81 capable of selectively adsorbing the substrate 200, and the frame base 81 is a lifting mechanism ( 82), the substrate 200 is selectively pressed against the lower electrostatic chuck 100, the sensing member 810 is provided on the surface of the frame base 81, and the substrate 200 is 200 is detected, a suction surface is provided on the frame base 81, a plurality of suction members 83 are provided on the suction surface of the frame base 81, and the substrate 200 is within range. A corresponding surface adsorption member 830 or an edge adsorption member 835 adjacent to the edge of the substrate 200 is provided, and the surface adsorption member 830 may be a Bernoulli's adsorption technique, and the substrate 200 adsorbs the substrate in the adsorption process. Reduce damage done to (200). In addition, an optical sensing unit 85 is provided at a location corresponding to the outer periphery of the substrate 200 of the substrate moving unit 80, and the optical sensing unit 85 includes at least three photoelectric cells surrounding the outer periphery of the substrate 200. member 850, an alarm is triggered when the substrate 200 is not placed rightly and covers any one photoelectric member 850, ensuring that the positions of the substrate 200 correspond accurately. According to some other embodiments, a selectively elastic fall prevention member 86 is provided on the periphery of the substrate moving unit 80, and the range surrounding it when drawn out is smaller than the outer diameter of the substrate 200, and the substrate ( 200) enters the substrate moving unit 80 and adsorbs the surface, the anti-fall member 86 is pulled out to prevent the substrate 200 from being effectively adsorbed and falling, and the substrate 200 moves After confirming that it is effectively adsorbed by the unit 80, it can be reduced and returned. According to some embodiments, the substrate moving unit 80 may be a mechanical arm capable of clamping the substrate 200 with respect to the static electricity generating unit 60 .

Accordingly, an automatic detachment system capable of automatically attaching and automatically separating the electrostatic chuck 100 and the substrate 200 may be configured.

12 is a flow chart of an automatic attachment/detachment method of an electrostatic chuck, which is used for automatic attachment and separation of the electrostatic chuck 100 and a substrate 200, and the substrate 200 may be a semiconductor wafer, glass sheet, or plastic sheet. A pole 105 for generating an electrostatic field by conducting electricity is provided on the bottom surface of the electrostatic chuck 100, and a positioning cutout 101 for determining orientation around the electrostatic chuck 100 and the substrate 200 , 201) is provided. The flow of the detachment method includes the following steps. (Please refer to FIGS. 1, 2 and 3 together)

Step of providing an electrostatic chuck and a substrate: obtaining a substrate 100 through one transfer device 20 of the main body 10 of the automatic detachment system to the second material input unit 18, and another transfer device 20 ) to obtain the electrostatic chuck 100 through the first material input unit 16 .

Step of cleaning the surface of the electrostatic chuck: The surface of the electrostatic chuck 100 may be selectively washed to perform surface cleaning, and the cleaning may be performed by rinsing or wiping with a detergent or of the adhesive surface of the electrostatic chuck 100 to improve its adhesion effect. It is selected from non-contact methods that remove particulates.

Baking the electrostatic chuck and the substrate respectively to keep their surfaces dry: After obtaining the electrostatic chuck 100 and the substrate 200, respectively, one transfer device 20 transfers the electrostatic chuck 100 to a corresponding The substrate 200 can be seated on the second baker 35 of the baking device 30, and the other transfer device 20 can seat the substrate 200 on the first baker 31 of the corresponding baking device 30. and bake each to keep the surface dry.

Step of pre-aligning the electrostatic chuck and the substrate to respective designated orientations: after the baking and drying operations of the electrostatic chuck 100 and the substrate 200 are completed, the at least one transfer device 20 moves the electrostatic chuck ( 100) and the substrate 200 are respectively moved to the corresponding pre-alignment device 40, and the electrostatic chuck 100 and the substrate 200 are positioned in the same designated orientation using the positioning cutouts 101 and 201. position, and the electrostatic chuck 100 and the substrate 200 are completely overlapped and bonded in the same designated orientation, which is advantageous for subsequent manufacturing processes.

Fixing the wireless electrostatic chuck and the substrate to two corresponding surfaces in the same designated orientation, respectively: After the pre-alignment is completed, as shown in FIG. 5, the transfer device 20 first moves the substrate 200 ) is seated on the working planes of the main frame plate 61 and the side wing plate 65 of the static electricity generating unit 60, and the board 200 is moved to the static electricity generating unit 60 using the guide rod 66. It is calibrated to the correct position of the working plane, and after ensuring that the electrostatic chuck 100 is accurately positioned in a designated direction through the touch sensing unit 67 and the optical sensing unit 68, the substrate moving unit 80 ) is lowered, and the substrate 200 is adsorbed to the proper position of the adsorption plane using the adsorption member 83 of the substrate moving unit 80, and then the substrate moving unit 80 is raised and the substrate 200 is simultaneously raised. 200 is separated from the working plane of the static electricity generator 60, and then the at least one transfer device 20 again moves the electrostatic chuck 100 to the main frame plate 61 of the static electricity generator 60. And seated on the working plane of the side wing plate 65, using the guide rod 66 to calibrate the electrostatic chuck 100 to the static electricity generator 60 in the working plane, and the touch sensing unit 67 ) After ensuring that the electrostatic chuck 100 is accurately positioned in a designated orientation through the optical sensing unit 68, the static electricity generating unit 60 uses the suction member 64 to move the electrostatic chuck 100 ) is fixed, so that the substrate 200 and the electrostatic chuck 100 correspond in the same designated orientation.

Bonding the electrostatic chuck and the substrate respectively seated on the two surfaces in a linear relative displacement method: After the electrostatic chuck 100 and the substrate 200 are fixed to the corresponding surfaces in the same designated orientation, FIG. 3 and as shown in FIG. 4, the substrate 200 is linearly displaced with respect to the electrostatic chuck 100 of the static electricity generating unit 60 by the substrate moving unit 80, and the substrate 200 has the same designation. It is bonded to the surface of the electrostatic chuck 100 in orientation, and both outer peripheries completely overlap.

Step of causing the electrostatic chuck to generate an electrostatic field capable of adhering to the substrate: After bonding of the electrostatic chuck 100 and the substrate 200 is completed, the static electricity generating unit 60 generates the electrostatic chuck 100 to conduct electricity so that the electrostatic chuck 100 generates an electrostatic field with respect to the substrate 200, and the electrostatic chuck 100 is bonded to the substrate 200 by static electricity. complete

Taking out the electrostatic chuck to which the substrate is bonded: Finally, after the bonding of the electrostatic chuck 100 and the substrate 200 is completed, the substrate moving unit 80 and the static electricity generating unit 60 are linearly displaced. method, the electrostatic chuck 100 to which the substrate 200 is attached is taken out using one transfer device 20, and the first material input part 16 or the second material input part sequentially corresponding thereto (18) for a while to complete the entire bonding operation and to be used in the subsequent manufacturing process.

In addition, the bonded substrate 200 and the electrostatic chuck 100 may be separated, and the electrostatic chuck 100 to which the substrate 200 is bonded may be transferred to the static electricity generator 60 through the transfer device 20. The substrate moving unit 80 is linearly displaced to be adsorbed and fixed to the surface of the substrate 200, which is different from the electrostatic chuck 100, and then the static electricity generating unit 60 moves the electrostatic chuck ( 100) and the static electricity of the electrostatic chuck 100 is discharged so that the substrate 200 can be separated, and the substrate moving part 80 is displaced in the opposite direction so that the substrate The electrostatic chuck 200 and the electrostatic chuck 100 are separated from each other, and finally, the electrostatic chuck 100 and the substrate 200 are transferred to the corresponding second material input unit 18 using the relative transfer device 20 And it is seated in the first material input unit 16, respectively. According to some embodiments, as shown in FIG. 9 , after the electrostatic chuck 100 discharges static electricity, the outer periphery of the electrostatic chuck 100 is operated downward, and the outer periphery of the electrostatic chuck 100 is The substrate 200 is pre-peeled to form an opening, and high-speed gas is blown from the outer periphery of the electrostatic chuck 100 through the injection nozzle 690 of the blowing unit 69, so that the electrostatic chuck 100 and the The substrate 200 is effectively separated.

100: electrostatic chuck 101: positioning incision 105: pole
200: substrate 201: positioning incision 10: main body
15: rail mechanism 16: first material input unit 18: second material input unit
20: transfer device 30: baking device 31: first baker
32: second baker 38: cleaning device 40: pre-sorting device
45: material temporary storage unit 50: detachment device
51: lower frame 52: upper frame 60: static electricity generator
61: main frame plate 62: material support member 620: sensing member
63: pole 64: suction member 65: side wing plate
66: guide rod 660: fixed guide rod 661: inclined guide surface
665: moving guide rod 666: inclined guide surface
67: touch sensing unit 670: touch type protruding pillar 675: correction type protruding pillar
68: optical sensor 680: photoelectric member 69: blowing unit
690: injection nozzle 70: telescopic cylinder 80: substrate moving unit
81: frame base 810: sensing member 82: lifting mechanism
83 adsorption member 830 surface adsorption member 835 edge adsorption member
85: optical sensing unit 850: photoelectric member 86: fall prevention member

Claims (10)

A detachable device used for an electrostatic chuck, which is used for attaching or separating an electrostatic chuck and a substrate, and has a pole on the bottom of the electrostatic chuck for generating or discharging an electrostatic field by conducting electricity,
frame;
It is installed on the frame, is provided with a working plane for selectively fixing the electrostatic chuck, and has poles in contact with the positive and negative poles of the electrostatic chuck on the working plane, and the working plane is provided with the electrostatic chuck or the substrate. a static electricity generating unit that can be positioned at a location; and
a substrate moving unit installed on the frame, facing the static electricity generating unit, and adsorbing a substrate positioned in place to generate displacement with respect to the static electricity generating unit;
After the substrate moving unit press-contacts the substrate and the electrostatic chuck, the static electricity generating unit operates so that the electrostatic chuck generates an electrostatic field to adhere the substrate to the electrostatic chuck. The method of claim 1, wherein a guide rod is provided on the working plane, the guide rod surrounds an outer periphery of the electrostatic chuck and at least two fixed guide rods limiting a horizontal position of the tray and engages with the fixed guide rod by pushing the tray, A dismounting device used in an electrostatic chuck comprising at least one moving guide rod for positioning the electrostatic chuck or the substrate in place on a working plane. The electrostatic chuck of claim 1 , wherein the work plane is composed of a main frame plate and side wing plates pivotally installed on both edges of the main frame plate, and the side wing plates on both sides can selectively move downward unlike one end of the main frame plate. Desorption device used for 4. The method of claim 3 , wherein a blowing unit is provided at each side of the static electricity generator corresponding to the wing plates on both sides, the blowing unit corresponds to the outer periphery of the electrostatic chuck and extends toward the center of the shaft, and blows high-speed gas to the electrostatic chuck and the substrate A desorption device used in an electrostatic chuck equipped with a spray nozzle enabling effective separation. The method of claim 1 , wherein a frame base is provided on the substrate moving unit, and a plurality of adsorption members are provided on the surface of the frame base, including a surface adsorption member corresponding to a substrate range or an edge adsorption member adjacent to an edge of the substrate. and the surface adsorption member may be an adsorption technique of Bernoulli's law. It is used for automatic bonding and automatic separation of the electrostatic chuck and the substrate, and a pole for generating an electrostatic field by conducting electricity is provided on the bottom of the electrostatic chuck, and a positioning cutout for determining orientation around the electrostatic chuck and the substrate In the automatic detachment system used in the electrostatic chuck provided with,
a main body including at least one substrate material input unit and at least one tray material input unit;
at least one baking device installed on the main body and including at least one first baker for baking a substrate and at least one second baker for baking an electrostatic chuck;
at least one pre-alignment device installed in the main body and configured to pre-determine designated orientations of the electrostatic chuck and the substrate using a positioning cutout;
at least one detachable device according to claim 1 for actuating or discharging the electrostatic chuck to generate an electrostatic field, and causing the electrostatic chuck and the substrate to be attached or detached in the same designated orientation; and
At least one installed on the main body and clamping the substrate or the electrostatic chuck so that it can be moved between the first baker and the second baker of the baking device, the pre-alignment device and the detachment device corresponding to the substrate material input unit and the tray material input unit. An automatic detachment system used for an electrostatic chuck including a transfer device. 7. The automatic chuck of claim 6 , wherein a cleaning device is provided in the main body, and the cleaning device is used in the electrostatic chuck or the electrostatic chuck for selectively cleaning the adhesive surface of the substrate within a range in which the transfer device clamps and moves. detachment system. 7. The automatic desorption system of claim 6, wherein a rail mechanism is provided on the main body, and the at least one transfer device is slidably installed on the rail mechanism to increase an active range of the at least one transfer device. . It is used for automatic bonding and automatic separation of the electrostatic chuck and the substrate, and a pole for generating an electrostatic field by conducting electricity is provided on the bottom of the electrostatic chuck, and a configuration for determining a designated orientation around the electrostatic chuck and the substrate. In the detachment method used for the electrostatic chuck provided with the
preparing an electrostatic chuck and a substrate;
baking the electrostatic chuck and the substrate respectively to keep their surfaces dry;
pre-aligning the electrostatic chuck and the substrate to respective designated orientations;
fixing the electrostatic chuck and the substrate to two corresponding surfaces in the same designated orientation, respectively;
bonding the electrostatic chuck and the substrate respectively seated on the two surfaces in a linear relative displacement manner;
allowing the electrostatic chuck to generate an electrostatic field capable of adhering to the substrate; and
A detachment method used for an electrostatic chuck comprising the step of taking out the electrostatic chuck to which the substrate is attached. 10. The detachment method for an electrostatic chuck according to claim 9, wherein a step of cleaning the surface of the electrostatic chuck is added to increase the effectiveness of adhesion before performing the baking.

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