TW202143376A - Sticking-off device and automatic sticking-off system for wireless electrostatic chuck - Google Patents
Sticking-off device and automatic sticking-off system for wireless electrostatic chuck Download PDFInfo
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- H01L21/6833—Details of electrostatic chucks
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- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
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- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
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- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
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- H—ELECTRICITY
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- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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Abstract
Description
本發明係隸屬一種靜電吸盤之自動粘合技術，具體而言係指一種用於無線靜電吸盤之粘脫設備、自動粘脫系統及其粘脫方法，藉以能使靜電吸盤與薄化基板如晶圓可進行自動化的粘合與解離工作，可提高工作效率，且減少粘合失敗及發生基板破損之現象，從而提高薄化基板的製程自動化。 The present invention belongs to an automatic bonding technology of electrostatic chucks, and specifically refers to a sticking-off device, automatic sticking-off system and sticking-off method for wireless electrostatic chucks, so as to make the electrostatic chuck and thinned substrate like crystals. The circle can perform automated bonding and dissociation work, which can improve work efficiency, and reduce adhesion failure and substrate damage, thereby improving the automation of the thinning of the substrate.
按，近年來受到半導體製程的微細化發展，如存儲器和功率器件，它們的微型化朝著更小的尺寸、更高的性能以及更低的成本方向發展，而為了讓晶片面積變的更小，半導體業界採行的設計方案是將原本晶片水平部署的晶片設計，改換成垂直向的堆疊方式進行，亦即所謂的3D IC堆疊封裝。由於3D IC堆疊封裝係以垂直向進行堆疊，需利用矽穿孔〔Through-Silicon Via；TSV〕技術將IC封裝內的各功能晶片進行物理電氣連結，因此矽晶圓之厚度會被壓縮在100微米以下。另外近來智慧型手機的照相品質足以媲美專業單眼相機，而智慧型手機相機鏡頭的成像品質大幅提升的關鍵之一，在於手機相機鏡頭導入超薄的藍玻璃濾光片，可吸收多餘的紅外光，還原物體的真實顏色。 According to, in recent years, due to the miniaturization of semiconductor manufacturing processes, such as memory and power devices, their miniaturization is moving towards smaller size, higher performance and lower cost, and in order to make the chip area smaller , The design scheme adopted by the semiconductor industry is to change the chip design of the original horizontal chip deployment to a vertical stacking method, which is the so-called 3D IC stack packaging. Since the 3D IC stacked package is stacked in a vertical direction, it is necessary to use Through-Silicon Via (TSV) technology to physically and electrically connect the functional chips in the IC package, so the thickness of the silicon wafer will be compressed to 100 microns the following. In addition, the camera quality of smartphones is comparable to that of professional single-lens cameras recently. One of the keys to the significant improvement in the imaging quality of smartphone camera lenses is the introduction of ultra-thin blue glass filters in the camera lens of smartphones, which can absorb excess infrared light. , To restore the true color of the object.
而這些薄化基板不論是3D IC的薄化晶圓或鏡頭的超薄濾光片，當其厚度小於200μm、100μm或甚至小於50μm，且表面積越大時如半導製程的8吋、12吋或以上時。薄化基板會變得非常柔軟有彈性，進而產生翹曲的現象。然不論是矽晶圓或玻璃片等薄化基板在製作上，需經抛光研磨、清淨、多層鍍膜、蝕刻及切割。由於超薄基板在製程中會因翹曲產生不平整及應力，會造成如鍍膜時厚度不均的製程不良問題，甚至於薄化基板也因翹曲問題在檢測時無法有效對焦而產生檢出錯誤或延緩檢測時間，而直接影響到不良品的檢出，再者薄化基板在運送與組裝過程也存在有儲存量少、易碎及脆弱等問題，故薄化基板的翹曲問題對製程可靠度產生重大不良影響，而造成提高製程成本及不良率的問題。 Whether these thinned substrates are thinned wafers for 3D ICs or ultra-thin filters for lenses, when the thickness is less than 200μm, 100μm, or even less than 50μm, and the surface area is larger, it is like 8 inches and 12 inches for semi-conductive processes. Or above. The thinned substrate will become very soft and elastic, which will cause warpage. However, whether it is a thin substrate such as a silicon wafer or a glass sheet, it needs to be polished, cleaned, multi-layer coated, etched and cut. Because the ultra-thin substrate will produce unevenness and stress due to warping during the manufacturing process, it will cause process defects such as uneven thickness during coating, and even thinned substrates will be detected due to the warpage problem, which cannot be effectively focused during inspection. Errors or delays in the inspection time directly affect the detection of defective products. In addition, the thinned substrates also have problems such as low storage, fragility and fragility during the transportation and assembly process. Therefore, the warpage of the thinned substrates affects the manufacturing process. Reliability has a major adverse effect, which leads to the problem of increasing process costs and defect rates.
為了使薄化基板能保持平整來進入製程，目前薄化基板係採行暫時接合製程〔Temporary bonding〕，來強化薄化基板的張度，而暫時接合製程主要係利用多層聚合物之接合材料將薄化基板可逆地安裝到一載體上，但在進行製程後又需進行剝離，如此在接合與剝離之間都必須保持薄化基板本身的良率，同時接合後使用的接合材料，亦必須因應接合材料、被接合材料的熱膨脹係數〔CTE〕不匹配，維持薄化晶圓的內部應力，同時維持晶圓正面/背面的表面平滑，以及製程環境中對於接合材料的酸、鹼問題，這些都是進行暫時接合製程所面臨的問題。 In order to keep the thinned substrate flat and enter the process, the current thinned substrate adopts a temporary bonding process (Temporary bonding) to strengthen the tension of the thinned substrate, and the temporary bonding process mainly uses the bonding material of multi-layer polymer The thinned substrate is reversibly mounted on a carrier, but it needs to be peeled off after the process. In this way, the yield of the thinned substrate itself must be maintained between bonding and peeling. At the same time, the bonding material used after bonding must also be adapted. The thermal expansion coefficient (CTE) of the bonding material and the material to be bonded are not matched, maintaining the internal stress of the thinned wafer, while maintaining the smooth surface of the front/back surface of the wafer, and the acid and alkali problems of the bonding material in the process environment. It is the problem faced by the temporary bonding process.
而目前最新的改善方式是使用無線靜電載盤 〔E-Chuck或Supporter〕來粘合薄化基板後，供薄化基板進行製程作業。然而目前無線靜電載盤在粘合薄化基板時係採手動方式進行，該手動粘脫設備係於一靜電力生成座一側樞設有一可選擇性蓋合之基板載座，使用上係由工作人員先將該薄化基板放置於該靜電力生成座上，然後將上方的基板載座以手動方式旋轉方式向下蓋合於該靜電力生成座上，以利用該基板載座吸附該薄化基板，之後工作人員再將該無線靜電載盤置於該靜電力生成器上，且再次將基板載座旋轉蓋合，使該薄化基板壓合於該無線靜電載盤相對表面上，最後啟動導電令該無線靜電載盤相對薄化基板產生靜止的電力場，使得該薄化基板能被粘合於該無線靜電載盤上。且在解離該無線靜電載盤與該薄化基板時，則反向操作，將粘合有薄化基板的無線靜電載盤置入該靜電力生成座上，然後蓋合基板載座於薄化基板上方，當該靜電力生成座啟動解離而釋放該無線靜電載盤的電力場後，上方的基板載座可吸附薄化基板後向上掀起，進而分離該無線靜電載盤與該薄化基板。 And the latest improvement is to use wireless electrostatic carrier [E-Chuck or Supporter] After bonding the thinned substrates, the thinned substrates can be processed. However, at present, the wireless electrostatic carrier is performed manually when bonding thinned substrates. The manual sticking and detaching device is pivoted on one side of an electrostatic force generating seat with a substrate carrier that can be selectively covered. The worker first places the thinned substrate on the electrostatic force generating seat, and then manually rotates the upper substrate carrier downward to cover the electrostatic force generating seat, so as to use the substrate carrier to adsorb the thin film. After that, the staff puts the wireless electrostatic carrier plate on the electrostatic force generator, and rotates and covers the substrate carrier again, so that the thinned substrate is pressed on the opposite surface of the wireless electrostatic carrier plate, and finally The activation of conduction causes the wireless electrostatic carrier to generate a static electric field relative to the thinned substrate, so that the thinned substrate can be adhered to the wireless electrostatic carrier. And when dissociating the wireless electrostatic carrier from the thinned substrate, the reverse operation is performed, and the wireless electrostatic carrier bonded with the thinned substrate is placed on the electrostatic force generating seat, and then the substrate carrier is covered on the thinned substrate. Above the substrate, when the electrostatic force generating seat starts to dissociate to release the electric field of the wireless electrostatic carrier, the upper substrate carrier can absorb the thinned substrate and lift up to separate the wireless electrostatic carrier from the thinned substrate.
但這樣的手動操作方式，不僅速度極慢，同時由於人員環境操作下該無線靜電載盤與該薄化基板的相對粘合表面無法確保其潔淨與乾燥，造成其粘合失敗的現象，而需重新進行粘合作業，且甚至可能因錯位、滑移或壓合不均勻而發生裂損或破片的問題，故其粘合效率極差。再者，由於手動操作係以人力方式進行，其難以讓該無線靜電載盤與該薄化基板在粘合時被準確對位，對於微細化高精度要求的半導體製程而言，其難以被直 接應用於高精度製程上，而只能用於傳輸、儲存等對於精度要求不高的場合。 However, this manual operation method is not only extremely slow, but also due to the fact that the relative bonding surface of the wireless electrostatic carrier and the thinned substrate cannot ensure that they are clean and dry under the operation of the personnel environment, which causes the phenomenon of bonding failure. The bonding operation is repeated, and the problem of cracks or fragments may even occur due to misalignment, slippage or uneven pressing, so the bonding efficiency is extremely poor. Furthermore, since the manual operation is performed manually, it is difficult to accurately align the wireless electrostatic carrier plate and the thinned substrate during bonding. For the semiconductor manufacturing process that requires miniaturization and high precision, it is difficult to be directly aligned. It is applied to high-precision manufacturing process, but can only be used for transmission, storage and other occasions that do not require high precision.
換言之，由於現有無線靜電載盤係以手動方式粘合薄化基板，而不僅存在效率差、失敗率高的問題，甚至可能發生裂損或破片，同時也無法應付高精度的製程需求，而如何解決前述的問題係業界所期待者，亦為本發明所欲解決的技術課題。 In other words, because the existing wireless electrostatic carrier is manually bonded to thin substrates, it not only has the problems of poor efficiency and high failure rate, but may even cause cracks or fragments, and at the same time, it cannot meet the requirements of high-precision manufacturing. Solving the aforementioned problems is what the industry expects and is also a technical problem to be solved by the present invention.
緣是，本發明人乃針對現有無線靜電載盤在粘合薄化基板時所面臨的問題深入探討，並藉由近年來技術發展的需求，經不斷努力的改良與試作，終於成功開發出一種用於無線靜電吸盤之粘脫設備、自動粘脫系統及其粘脫方法，藉以克服現有手動操作所造成的缺點與不便。 The reason is that the inventors have made in-depth discussions on the problems faced by the existing wireless electrostatic carrier plates when bonding thin substrates. Based on the needs of technological development in recent years, after continuous efforts to improve and trial production, they finally successfully developed a It is used for sticking-off equipment, automatic sticking-off system and sticking-off method of wireless electrostatic chuck, so as to overcome the shortcomings and inconveniences caused by the existing manual operation.
因此，本發明之主要目的係在提供一種用於無線靜電吸盤之粘脫設備，其可以提升粘合效率，且可大幅降低粘合失敗率，並減少生裂損或破片的發生。 Therefore, the main purpose of the present invention is to provide a sticking and releasing device for wireless electrostatic chuck, which can improve the bonding efficiency, greatly reduce the bonding failure rate, and reduce the occurrence of cracks or chipping.
又，本發明之次一主要目的係在提供一種用於無線靜電吸盤之自動粘脫系統，藉以能在自動清洗、烘烤與預對位後，可供應付高精度的製程需求，並進行自動化粘合，以滿足薄化基板之自動化製作的需求。 In addition, the second main purpose of the present invention is to provide an automatic sticking-off system for wireless electrostatic chucks, which can meet high-precision process requirements after automatic cleaning, baking and pre-alignment, and perform automation Bonding to meet the needs of automated production of thinned substrates.
再者，本發明之另一主要目的係在提供一種用於無線靜電吸盤之粘脫方法，其能快速、且準確的自動粘合無線靜電載盤與薄化基板，使無線靜電載盤能粘合薄化基板能應用於後續 製程中，可大幅提高薄化基板的製程良率，而能降低成本及增加利潤。 Furthermore, another main purpose of the present invention is to provide a sticking and detaching method for wireless electrostatic chucks, which can quickly and accurately automatically bond wireless electrostatic chucks with thinned substrates, so that the wireless electrostatic chucks can stick. The thinned substrate can be used in the follow-up During the manufacturing process, the process yield of thinned substrates can be greatly improved, and costs can be reduced and profits can be increased.
基於此，本創作主要係透過下列的技術手段，來具體實現前述之目的及功效：係用於一無線靜電載盤與一薄化基板的自動粘合與粘合後之自動解離，其該無線靜電載盤底面具有導電生成或釋放靜電電力場之導極，又該無線靜電載盤與該薄化基板周緣具有一供確定方位之定位切口，該自動粘脫系統包含有： Based on this, this creation is mainly through the following technical means to specifically achieve the aforementioned objectives and effects: It is used for the automatic bonding of a wireless electrostatic carrier plate and a thinned substrate and the automatic dissociation after bonding. The bottom surface of the electrostatic carrier plate has a conductive electrode that generates or discharges an electrostatic electric field, and the wireless electrostatic carrier plate and the periphery of the thinned substrate have a positioning cut for determining the position. The automatic adhesion and release system includes:
一機體，其包含有至少一基板入料埠及至少一載盤入料埠； A body including at least one substrate inlet port and at least one tray inlet port;
至少一烘烤裝置，其係設於該機體上，且該等烘烤裝置包含有至少一用於烘烤薄化基板之基板烘烤組及至少一用於烘烤無線靜電載盤之載盤烘烤組； At least one baking device, which is arranged on the body, and the baking devices include at least one substrate baking group for baking thinned substrates and at least one carrier plate for baking wireless electrostatic carrier plates Baking group
至少一預對位裝置，其係設於該機體上，供該無線靜電載盤與該薄化基板利用定位切口預先確定指定方位； At least one pre-alignment device, which is arranged on the body, for the wireless electrostatic carrier plate and the thinned substrate to pre-determine a designated position by using positioning cuts;
至少一粘脫設備，該粘脫設備包含有一供吸附一無線靜電載盤之載板靜電生成組及一供吸附一薄化基板之基板移載組，其中該基板移載組可相對該載板靜電生成組線性位移，使得該基板移載組可帶動薄化基板對應壓合於該載板靜電生成組之無線靜電載盤表面，以作動或釋放該無線靜電載盤生成靜電電力場，使得該無線靜電載盤與該薄化基板能以同一指定方位粘合或解離；以及 At least one sticking and releasing device, the sticking and releasing device includes a carrier electrostatic generation group for adsorbing a wireless electrostatic carrier and a substrate transfer group for adsorbing a thinned substrate, wherein the substrate transfer group can be opposite to the carrier The electrostatic generation group is linearly displaced, so that the substrate transfer group can drive the thinned substrate to be pressed on the surface of the wireless electrostatic carrier of the carrier electrostatic generation group to actuate or release the wireless electrostatic carrier to generate an electrostatic power field, so that the The wireless electrostatic carrier and the thinned substrate can be bonded or dissociated in the same designated orientation; and
至少一傳輸裝置，其係設於該機體上，該等傳輸裝 置可夾取薄化基板或無線靜電載盤於基板入料埠及載盤入料埠相對應的烘烤裝置之基板烘烤組及載盤烘烤組、預對位裝置與粘脫設備之間移動。 At least one transmission device is arranged on the body, and the transmission devices Set the substrate baking group and the carrier baking group, the pre-alignment device, and the bonding equipment that can clamp the thinned substrate or the wireless electrostatic carrier in the baking device corresponding to the substrate inlet port and the carrier inlet port Move between.
藉此，透過上述技術手段的具體實現，本發明利用粘脫設備使無線靜電載盤可自動粘合薄化基板，其可大幅降低粘合失敗率，並減少生裂損或破片的發生，而能在自動清洗、烘烤與預對位後，可供應付高精度的製程需求，並進行自動化粘合，以滿足薄化基板之自動化製作的需求，使無線靜電載盤能粘合薄化基板能應用於後續製程中，可大幅提高薄化基板的製程良率，而能降低成本及增加利潤，以提高其附加價值，進一步可提高其經濟效益。 Thus, through the specific realization of the above-mentioned technical means, the present invention utilizes the sticking-off device to enable the wireless electrostatic carrier to automatically bond and thin the substrate, which can greatly reduce the bonding failure rate, and reduce the occurrence of cracks or fragments, and After automatic cleaning, baking and pre-alignment, it can be used to meet high-precision process requirements and automate bonding to meet the needs of automated production of thinned substrates, so that the wireless electrostatic carrier can bond thinned substrates It can be used in subsequent processes to greatly improve the process yield of thinned substrates, reduce costs and increase profits, so as to increase its added value and further improve its economic benefits.
為使 貴審查委員能進一步了解本發明的構成、特徵及其他目的，以下乃舉本發明之較佳實施例，並配合圖式詳細說明如後，同時讓熟悉該項技術領域者能夠具體實施。 In order to enable your reviewer to further understand the composition, features and other purposes of the present invention, the following is a preferred embodiment of the present invention, and detailed descriptions in conjunction with the drawings, while allowing those familiar with the technical field to be able to implement it in detail.
100:無線靜電載盤 100: Wireless electrostatic carrier
101:定位切口 101: Positioning the incision
105:導極 105: Conductor
200:薄化基板 200: Thinned substrate
201:定位切口 201: Positioning incision
10:機體 10: Body
15:滑軌機構 15: Slide rail mechanism
16:基板出入料埠 16: Substrate inlet and outlet ports
18:載盤出入料埠 18: Loading and unloading port of tray
20:傳輸裝置 20: Transmission device
30:烘烤裝置 30: Baking device
31:基板烘烤組 31: substrate baking group
32:載盤烘烤裝置 32: tray baking device
38:清洗裝置 38: Cleaning device
40:預對位裝置 40: Pre-alignment device
45:暫存料埠 45: Temporary storage port
50:粘脫設備 50: Adhesion equipment
51:下框架 51: Lower frame
52:上框架 52: Upper frame
60:載板靜電生成組 60: Carrier board electrostatic generation group
61:主框板 61: main frame board
62:頂料件 62: Top parts
620:檢知元件 620: detection component
63:導極 63: Conductor
64:吸附件 64: Adsorption parts
65:側翼板 65: side flap
66:導柱 66: guide post
660:固定導柱 660: fixed guide post
661:斜導面 661: inclined guide surface
665:活動導柱 665: Activity guide post
666:斜導面 666: inclined guide surface
67:觸動檢知組 67: Touch the detection group
670:觸動凸柱 670: Touch the convex column
675:導正凸柱 675: Guiding convex column
68:光學檢知組 68: Optical Inspection Group
680:光電元件 680: Optoelectronics
69:吹氣單元 69: Blowing unit
690:噴射氣嘴 690: Jet Air Nozzle
70:驅動件 70: Drive
80:基板移載組 80: substrate transfer group
81:框座 81: frame seat
810:檢知元件 810: Detection component
82:升降機構 82: Lifting mechanism
83:吸附件 83: Adsorption parts
830:表面吸附件 830: Surface adsorption parts
835:邊緣吸附件 835: Edge suction parts
85:光學檢知組 85: Optical Inspection Group
850:光電元件 850: Optoelectronics
86:防落件 86: Anti-dropping parts
第一圖：本發明用於無線靜電吸盤之自動粘脫系統的架構示意圖。 The first figure: the schematic diagram of the structure of the automatic sticking and releasing system for the wireless electrostatic chuck according to the present invention.
第二圖：本發明用於無線靜電吸盤之自動粘脫系統的動作示意圖。 Figure 2: The action diagram of the automatic sticking and releasing system for wireless electrostatic chuck according to the present invention.
第三圖：本發明用於無線靜電吸盤之粘脫設備的外觀示意圖。 Figure 3: A schematic diagram of the appearance of the sticking and releasing device used in the wireless electrostatic chuck according to the present invention.
第四圖：本發明用於無線靜電吸盤之粘脫設備的側 視平面示意圖。 The fourth figure: the side of the sticking and detaching device used in the wireless electrostatic chuck of the present invention Schematic view of the plane.
第五圖：本發明用於無線靜電吸盤之粘脫設備中載盤靜電生成組的外觀示意圖。 Figure 5: A schematic diagram of the appearance of the electrostatic generation group of the carrier in the sticking and releasing device for the wireless electrostatic chuck of the present invention.
第六圖：本發明用於無線靜電吸盤之粘脫設備中載盤靜電生成組的局部俯視平面示意圖。 Figure 6: A schematic partial top plan view of the electrostatic generation group of the carrier in the sticking and detaching device for the wireless electrostatic chuck of the present invention.
第七圖：本發明用於無線靜電吸盤之粘脫設備中載盤靜電生成組的側視平面示意圖。 Figure 7: A schematic side plan view of the electrostatic generation group of the carrier in the sticking and detaching device for the wireless electrostatic chuck of the present invention.
第八圖：本發明用於無線靜電吸盤之粘脫設備中載盤靜電生成組的側視動作示意圖。 Figure 8: A schematic diagram of the side view action of the electrostatic generation group of the carrier in the sticking and detaching device for the wireless electrostatic chuck of the present invention.
第九圖：本發明用於無線靜電吸盤之粘脫設備中載盤靜電生成組的另一側視動作示意圖。 Figure Ninth: Another side view of the action of the electrostatic generation group of the carrier in the sticking and detaching device for wireless electrostatic chucks according to the present invention.
第十圖：本發明用於無線靜電吸盤之粘脫設備中基板移載組的外觀示意圖。 Figure 10: Schematic diagram of the appearance of the substrate transfer group in the adhesion and release equipment for the wireless electrostatic chuck according to the present invention.
第十一圖：本發明用於無線靜電吸盤之粘脫設備中基板移載組的局部仰視平面示意圖。 Figure eleven: a partial bottom plan view of the substrate transfer group in the adhesion and release equipment for the wireless electrostatic chuck of the present invention.
第十二圖：本發明用於無線靜電吸盤之粘脫方法的流程架構示意圖。 Figure 12: A schematic diagram of the flow structure of the sticking and detaching method for wireless electrostatic chucks according to the present invention.
本發明係一種用於無線靜電吸盤之粘脫設備、自動粘脫系統及其粘脫方法，隨附圖例示本發明之具體實施例及其構件中，所有關於前與後、左與右、頂部與底部、上部與下部、以及水平與垂直的參考，僅用於方便進行描述，並非限制本發明， 亦非將其構件限制於任何位置或空間方向。圖式與說明書中所指定的尺寸，當可在不離開本發明之申請專利範圍內，根據本發明之具體實施例的設計與需求而進行變化。 The present invention is a sticking and detaching equipment, automatic sticking and detaching system and sticking and detaching method for wireless electrostatic chuck. The attached drawings illustrate the specific embodiments of the invention and its components, all about front and back, left and right, top The references to the bottom, the top and the bottom, and the horizontal and vertical are only used for the convenience of description, and do not limit the present invention. Nor does it limit its components to any position or spatial direction. The drawings and the size specified in the specification can be changed according to the design and requirements of the specific embodiment of the present invention without departing from the scope of the patent application of the present invention.
本發明用於無線靜電吸盤之自動粘脫系統，則係如第一圖所示，係用於使一無線靜電載盤(100)與一薄化基板(200)之自動粘合與粘合後之自動解離，其中該薄化基板(200)可以是半導體晶圓或玻璃片或塑膠片，該自動粘脫系統包含有一機體(10)、至少一傳輸裝置(20)、至少一烘烤裝置(30)、至少一預對位裝置(40)及至少一粘脫設備(50)所組成； The present invention is used for the automatic adhesion and release system of the wireless electrostatic chuck. The automatic dissociation, wherein the thinned substrate (200) can be a semiconductor wafer or a glass sheet or a plastic sheet, and the automatic adhesion and release system includes a body (10), at least one transmission device (20), and at least one baking device ( 30). It is composed of at least one pre-alignment device (40) and at least one sticking-off device (50);
而該自動粘脫系統較佳實施例之詳細構成，則請進一步配合參看第一、二圖所示，其中該機體(10)上設有至少一基板出入料埠(16)及至少一載盤出入料埠(18)，在某些實施例中，該基板出入料埠(16)與該載盤出入料埠(18)可以是典型SEMI規範之晶圓傳送盒〔FOUP〕的出入料埠，供用於該無線靜電載盤(100)與該薄化基板(200)之自動出入料，又前述之傳輸裝置(20)可用於抓取無線靜電載盤(100)或薄化基板(200)於機體(10)於各基板出入料埠(16)或載盤出入料埠(18)與烘烤裝置(30)、預對位裝置(40)及粘脫設備(50)之間移動放置，又該等傳輸裝置(20)可以是線性、六軸或七軸之機械手臂，以提高其抓取及移動無線靜電載盤(100)或薄化基板(200)的自由度與靈活度，又在某些實施例中，該機體(10)上設有一滑軌機構(15)，而該等傳輸裝置(20)可滑設於該滑軌機構(15)， 使得該傳輸裝置(20)可於該滑軌機構(15)上選擇性滑動，而能增加該等傳輸裝置(20)的活動範圍； For the detailed structure of the preferred embodiment of the automatic sticking and release system, please refer to the first and second drawings for further cooperation, wherein the body (10) is provided with at least one substrate inlet and outlet port (16) and at least one carrier plate The inlet and outlet ports (18). In some embodiments, the substrate inlet and outlet ports (16) and the carrier tray inlet and outlet ports (18) can be the inlet and outlet ports of a typical SEMI wafer transfer box (FOUP). It is used for the automatic feeding and unloading of the wireless electrostatic carrier (100) and the thinned substrate (200), and the aforementioned transmission device (20) can be used to grab the wireless electrostatic carrier (100) or the thinned substrate (200) in The body (10) is moved and placed between the substrate inlet and outlet ports (16) or the tray inlet and outlet ports (18), the baking device (30), the pre-alignment device (40) and the adhesion-off device (50), and The transmission devices (20) can be linear, six-axis or seven-axis robotic arms to improve the degree of freedom and flexibility for grabbing and moving the wireless electrostatic carrier (100) or thinned substrate (200). In some embodiments, the body (10) is provided with a sliding rail mechanism (15), and the transmission devices (20) can be slidably arranged on the sliding rail mechanism (15), The transmission device (20) can be selectively slid on the slide rail mechanism (15), and the range of movement of the transmission devices (20) can be increased;
再者，該等烘烤裝置(30)係設於機體(10)內部且傳輸裝置(20)能將無線靜電載盤(100)或薄化基板(200)移入之位置，且該烘烤裝置(30)可以包含有至少一供容置一片或一片以上薄化基板(200)進行烘烤之基板烘烤組(31)及至少一供容置一片或一片以上無線靜電載盤(100)之載盤烘烤裝置(35)，供分別用於烘乾薄化基板(200)及無線靜電載盤(100)表面之水氣。另在某些實施例中，該機體(10)於對應載盤出入料埠(18)一側可設有一清洗裝置(38)，供無線靜電載盤(100)可於烘烤前先進行清洗，以確保該無線靜電載盤(100)表面的潔淨度，該清洗裝置(38)可以是沖洗、擦拭或非接觸式之微粒去除技術。又該等預對位裝置(40)係設於機體(10)內且傳輸裝置(20)能將無線靜電載盤(100)或薄化基板(200)移入之位置，該預對位裝置(40)可無線靜電載盤(100)或薄化基板(200)放置後旋轉，並利用該等預對位裝置(40)上之檢知單元如光學檢測儀如CCD模組〔圖中未示〕，尋找無線靜電載盤(100)或薄化基板(200)之定位切口(101、201)〔如晶圓之Notch，V型定位切口或平切邊〕，使得該無線靜電載盤(100)與該薄化基板(200)可以指定方位進入該等粘脫設備(50)，且令該無線靜電載盤(100)與該薄化基板(200)能以同一指定方位相互粘合。而根據某些實施例，該機體(10)上設有至少一暫存 料埠(45)，供暫存存放預備粘合作業之無線靜電載盤(100)或薄化基板(200)，以提升自動作業的效率； Furthermore, the baking devices (30) are arranged inside the body (10) and the transmission device (20) can move the wireless electrostatic carrier plate (100) or the thinned substrate (200) into the position, and the baking device (30) It may include at least one substrate baking group (31) for accommodating one or more thinned substrates (200) for baking and at least one for accommodating one or more wireless electrostatic carrier plates (100) The tray baking device (35) is used to dry the moisture on the surface of the thinned substrate (200) and the wireless electrostatic tray (100) respectively. In some embodiments, the body (10) may be provided with a cleaning device (38) on the side corresponding to the loading and unloading port (18) of the tray, so that the wireless electrostatic tray (100) can be cleaned before baking. To ensure the cleanliness of the surface of the wireless electrostatic carrier plate (100), the cleaning device (38) can be a rinsing, wiping or non-contact particle removal technology. The pre-alignment devices (40) are arranged in the body (10) and the transmission device (20) can move the wireless electrostatic carrier plate (100) or the thinned substrate (200) into the position, the pre-alignment device ( 40) The wireless electrostatic carrier (100) or the thinned substrate (200) can be placed and rotated, and the detection unit on the pre-alignment device (40) can be used such as an optical detector such as a CCD module (not shown in the figure) ], look for the positioning cuts (101, 201) of the wireless electrostatic carrier (100) or the thinned substrate (200) (such as the Notch of the wafer, the V-shaped positioning cut or the flat cut edge), so that the wireless electrostatic carrier (100) ) And the thinned substrate (200) can enter the adhesion and release devices (50) in a designated orientation, and the wireless electrostatic carrier plate (100) and the thinned substrate (200) can be bonded to each other in the same designated orientation. According to some embodiments, the body (10) is provided with at least one temporary storage The material port (45) is used to temporarily store the wireless electrostatic carrier plate (100) or thinned substrate (200) for pre-bonding operation to improve the efficiency of automatic operation;
至於，該等粘脫設備(50)係設於該機體(10)內且傳輸裝置(20)能將無線靜電載盤(100)或薄化基板(200)移入之位置，如第三、四圖所示，且該等粘脫設備(50)包含有相對位移之一供吸附無線靜電載盤(100)之載板靜電生成組(60)及一供吸附薄化基板(200)之基板移載組(80)，又該粘脫設備(50)具有可固設於機體(10)之框架，且框架包含有一下框架(51)及一上框架(52)，其中該載板靜電生成組(60)係設於該下框架(51)頂部，而該基板移載組(80)係利用一升降機構(82)設於該上框架(52)對應該載板靜電生成組(60)的上方，使得該基板移載組(80)可相對該載板靜電生成組(60)吸取薄化基板(200)又或帶動薄化基板(200)相對應壓合於該載板靜電生成組(60)頂面之無線靜電載盤(100)表面； As for the adhesion and release equipment (50) is set in the body (10) and the transmission device (20) can move the wireless electrostatic carrier plate (100) or the thinned substrate (200) into the position, such as the third and fourth As shown in the figure, the adhesion and release equipment (50) includes one of the relative displacements for the electrostatic generation group (60) of the carrier plate for the adsorption of the wireless electrostatic carrier plate (100) and the substrate movement for the adsorption of the thinned substrate (200). The carrier group (80), and the sticking device (50) has a frame that can be fixed to the body (10), and the frame includes a lower frame (51) and an upper frame (52), wherein the carrier board static electricity generation group (60) is arranged on the top of the lower frame (51), and the substrate transfer group (80) is arranged on the upper frame (52) by a lifting mechanism (82) corresponding to the carrier plate static electricity generation group (60) Above, so that the substrate transfer group (80) can absorb the thinned substrate (200) relative to the carrier static electricity generation group (60) or drive the thinned substrate (200) to be pressed onto the carrier static electricity generation group ( 60) The surface of the wireless electrostatic carrier plate (100) on the top surface;
而前述之載板靜電生成組(60)係如第五、六及七圖所示，其具有一主框板(61)及樞設於該主框板(61)兩側邊緣之側翼板(65)，且該主框板(61)與兩側之側翼板(65)具有供無線靜電載盤(100)平置之工作平面，且該工作平面之主框板(61)上設有一檢知元件(610)，供檢知該無線靜電載盤(100)或薄化基板(200)是否存在，另該主框板(61)內設有一頂料件(62)，該頂料件(62)可於工作平面及一較高之接料平面間位移〔如第八圖所示〕，可便於傳輸裝置(20)如機械手臂之夾 爪穿入放置或取走無線靜電載盤(100)或薄化基板(200)，該頂料件(62)可以是由至少三根可同步升降之頂桿所構成、又或由一可升降之頂板所構成，又兩側側翼板(65)於異於主框板(61)的外側底緣中央與下框架(51)間設有一伸縮缸(70)，供選擇性作動側翼板(65)外側緣向下傾斜兩側之側翼板(65)的相異外側緣可被選擇性向下作動傾斜〔如第九圖所示〕，供用於帶動該無線靜電載盤(100)與粘合的薄化基板(200)由外緣相對剝離，再者該主框板(61)與該側翼板(65)上分設有系列對應無線靜電載盤(100)底面之吸附件(64)〔如真空吸盤〕，供選擇性將無線靜電載盤(100)固定於主框板(61)與側翼板(65)之工作平面上，且該主框板(61)上具有二或二之倍數的導極(63)，供對應無線靜電載盤(100)之底面正負導極(105)，以提供電力使無線靜電載盤(100)表面可相對薄化基板(200)生成或解離靜電電力場，用於讓無線靜電載盤(100)可與薄化基板(200)相互粘合或解離，又兩側之側翼板(65)上具有一導位組(66)，該導位組(66)包含有圍繞於無線靜電載盤(100)外周緣之至少二個固定導柱(660)及至少一個活動導柱(665)，本發明係以二個固定導柱(660)及二個活動導柱(665)為主要實施例，其中該等活動導柱(665)可將無線靜電載盤(100)推向該等固定導柱(660)之水平正確位置定位，再者該等固定導柱(660)與該等活動導柱(665)頂端周緣形成有一斜導緣(661、666)，讓該頂料件(62)下降時該無線靜電載盤(100)或薄化 基板(200)可導引至工作平面之正確範圍內，再者該載板靜電生成組(60)於對應無線靜電載盤(100)外周緣處分設有一觸動檢知組(67)及一光學檢知組(68)，其中該觸動檢知組(67)包含有可伸縮且圍繞於無線靜電載盤(100)外周緣之至少二根觸動凸柱(670)及至少一根可前後移動之導正凸柱(675)，其中該導正凸柱(675)可對應該無線靜電載盤(100)或薄化基板(200)之定位缺口(101、201)，使該導正凸柱(675)能利用該無線靜電載盤(100)或薄化基板(200)之定位切口(101、201)令其以軸線為中心旋轉導正，且進一步用以當無線靜電載盤(100)或薄化基板(200)未擺正而碰觸任何一根觸動凸柱(670)時可觸發警報，至於該光學檢知組(68)包含有至少三個圍繞於無線靜電載盤(100)外周緣之光電元件(680)，用以當無線靜電載盤(100)或薄化基板(200)未擺正而遮蔽任何一光電元件(680)時可觸發警報，以確保無線靜電載盤(100)及薄化基板(200)準確對位，另如第九圖所示，該載板靜電生成組(60)於下框架對應兩側側翼板(65)處分別設有一吹氣單元(69)，該吹氣單元(69)具有一對應無線靜電載盤(100)外周緣向軸心方向沿伸之噴射氣嘴(690)，用於當無線靜電載盤(100)於啟動解離且被兩側側翼板(65)帶動與薄化基板(200)剝離時，可吹入高速氣體令無線靜電載盤(100)與薄化基板(200)能被有效的分離； The aforementioned carrier board static electricity generation group (60) is shown in Figures 5, 6 and 7, which has a main frame plate (61) and side wing plates ( 65), and the main frame plate (61) and the side wing plates (65) on both sides have a working plane for the wireless electrostatic carrier (100) to be flat, and the main frame plate (61) of the working plane is provided with a check The known component (610) is used to check whether the wireless electrostatic carrier (100) or the thinned substrate (200) exists, and the main frame plate (61) is provided with an ejector (62), the ejector ( 62) It can be displaced between the working plane and a higher receiving plane (as shown in the eighth figure), which can facilitate the transfer device (20) such as the grip of a robot arm The claw penetrates to place or remove the wireless electrostatic carrier plate (100) or the thinned substrate (200). The ejector member (62) can be composed of at least three jacks that can be raised and lowered synchronously, or by one that can be raised and lowered. A telescopic cylinder (70) is provided between the center of the outer bottom edge of the outer bottom edge of the main frame plate (61) and the lower frame (51) to selectively actuate the side wing plates (65). The outer edge is inclined downward. The different outer edges of the side wing plates (65) on both sides can be selectively actuated downwardly (as shown in the ninth figure) for driving the wireless electrostatic carrier (100) and the glued thin plate. The base plate (200) is relatively peeled off from the outer edge, and the main frame plate (61) and the side wing plate (65) are separately provided with a series of adsorption parts (64) corresponding to the bottom surface of the wireless electrostatic carrier plate (100) (such as vacuum Sucker] for selectively fixing the wireless electrostatic carrier plate (100) on the working plane of the main frame plate (61) and the side wing plate (65), and the main frame plate (61) has two or a multiple of two guides The pole (63) is for the positive and negative conductors (105) corresponding to the bottom surface of the wireless electrostatic carrier (100) to provide power so that the surface of the wireless electrostatic carrier (100) can generate or dissociate the electrostatic electric field from the relatively thin substrate (200), It is used to allow the wireless electrostatic carrier plate (100) and the thinned substrate (200) to bond or dissociate each other, and there is a guide group (66) on the side wing plates (65) on both sides, the guide group (66) It includes at least two fixed guide posts (660) and at least one movable guide post (665) surrounding the outer periphery of the wireless electrostatic carrier plate (100). The present invention uses two fixed guide posts (660) and two movable guides Pillars (665) are the main embodiment, in which the movable guide pillars (665) can push the wireless electrostatic carrier plate (100) to the correct horizontal position of the fixed guide pillars (660), and the fixed guide pillars (660) An oblique guide edge (661, 666) is formed with the top peripheral edge of the movable guide posts (665), so that the wireless electrostatic carrier plate (100) may become thinner when the ejector (62) is lowered The substrate (200) can be guided to the correct range of the working plane, and the carrier plate static electricity generation group (60) is provided with a touch detection group (67) and an optical sensor at the outer periphery of the corresponding wireless electrostatic carrier plate (100). The detection group (68), wherein the touch detection group (67) includes at least two touch protruding pillars (670) that can be retracted and surround the outer periphery of the wireless electrostatic carrier (100) and at least one movable back and forth The guiding protrusion (675), wherein the guiding protrusion (675) can correspond to the positioning notch (101, 201) of the wireless electrostatic carrier (100) or the thinned substrate (200), so that the guiding protrusion ( 675) The positioning slits (101, 201) of the wireless electrostatic carrier (100) or the thinned substrate (200) can be used to make it rotate and guide around the axis, and further used as a wireless electrostatic carrier (100) or An alarm can be triggered when the thinned substrate (200) is not aligned and touches any of the touching protrusions (670). As for the optical detection group (68), there are at least three surrounding the outer periphery of the wireless electrostatic carrier (100) The optoelectronic component (680) of the edge is used to trigger an alarm when the wireless electrostatic carrier (100) or the thinned substrate (200) is not aligned and shields any optoelectronic component (680) to ensure that the wireless electrostatic carrier (100) ) And the thinned substrate (200) are accurately aligned. As shown in the ninth figure, the carrier plate static electricity generation group (60) is provided with a blowing unit (69) at the corresponding side wing plates (65) on both sides of the lower frame. , The blowing unit (69) has a spray nozzle (690) corresponding to the outer periphery of the wireless electrostatic carrier (100) extending in the axial direction, which is used when the wireless electrostatic carrier (100) is dissociated at startup and is dissociated on both sides When the side wing plate (65) is driven to peel off the thinned substrate (200), high-speed gas can be blown into the wireless electrostatic carrier (100) and the thinned substrate (200) to be effectively separated;
又前述之基板移載組(80)係如第十、十一圖所示， 其係由一可選擇性吸附薄化基板(200)之框座(81)所構成，該框座(81)可被升降機構(82)上下線性作動，供帶動薄化基板(200)相對下方無線靜電載盤(100)選擇性壓合，又該框座(81)表面設有一檢知元件(810)，供檢知該薄化基板(200)是否存在，且該框座(81)具有一吸附表面，該框座(81)之吸附表面有複數吸附件(83)，其可包含對應薄化基板(200)範圍內之表面吸附件(830)或薄化基板(200)鄰近邊緣之邊緣吸附件(835)，其中表面吸附件(830)可以是伯努利定律〔Bernoulli〕之吸附技術，以降低對薄化基板(200)在吸附過程中可能造成的損傷，再者該基板移載組(80)於對應薄化基板(200)外周緣處設有一光學檢知組(85)，該光學檢知組(85)包含有至少三個圍繞於薄化基板(200)外周緣之光電元件(850)，用以當薄化基板(200)未擺正而遮蔽任何一光電元件(850)時可觸發警報，以確保薄化基板(200)準確對位。另根據某些實施例，該基板移載組(80)周緣可設有可選擇性伸縮之防落件(86)，其伸出時所圍範圍小於薄化基板(200)外徑，用於當薄化基板(200)進入基板移載組(80)吸附表面時，可伸出防落件(86)，以避免薄化基板(200)因未有效吸附而掉落，其可以確認薄化基板(200)被基板移載組(80)有效吸附後縮回。根據某些實施例，該基板移載組(80)可以是能相對載板靜電生成組(60)夾取薄化基板(200)之機械手臂； The aforementioned substrate transfer group (80) is shown in Figures 10 and 11. It is composed of a frame (81) that can selectively adsorb the thinned substrate (200), and the frame (81) can be linearly moved up and down by the lifting mechanism (82) to drive the thinned substrate (200) to be relatively lower The wireless electrostatic carrier plate (100) is selectively pressed together, and a detecting element (810) is provided on the surface of the frame seat (81) for detecting whether the thinned substrate (200) exists, and the frame seat (81) has A suction surface. The suction surface of the frame (81) has a plurality of suction members (83), which may include surface suction members (830) within the range of the thinned substrate (200) or adjacent edges of the thinned substrate (200) The edge adsorption member (835), wherein the surface adsorption member (830) can be the adsorption technology of Bernoulli's law [Bernoulli] to reduce the damage that may be caused to the thinned substrate (200) during the adsorption process, and the substrate is moved The carrier group (80) is provided with an optical detection group (85) corresponding to the outer periphery of the thinned substrate (200), and the optical detection group (85) includes at least three surrounding edges of the thinned substrate (200). The photoelectric element (850) is used to trigger an alarm when the thinned substrate (200) is not aligned to shield any photoelectric element (850) to ensure the accurate alignment of the thinned substrate (200). According to some embodiments, the peripheral edge of the substrate transfer group (80) may be provided with a selectively retractable anti-dropping member (86), which extends smaller than the outer diameter of the thinned substrate (200) for When the thinned substrate (200) enters the adsorption surface of the substrate transfer group (80), the anti-dropping piece (86) can be extended to prevent the thinned substrate (200) from falling due to ineffective adsorption, which can confirm the thinning The substrate (200) is effectively sucked by the substrate transfer group (80) and then retracted. According to some embodiments, the substrate transfer group (80) may be a robotic arm that can grip the thinned substrate (200) relative to the carrier static electricity generation group (60);
藉此，組構成一可讓無線靜電載盤(100)與薄化 基板(200)能自動粘合與自動解離之自動粘脫系統者。 In this way, the assembly constitutes a wireless electrostatic carrier (100) and thinner Substrate (200) can be automatically bonded and automatically dissociated with an automatic adhesion system.
又如第十二圖所示為用於無線靜電吸盤之自動粘脫方法的流程圖，係用於一無線靜電載盤(100)與一薄化基板(200)的自動粘合與粘合後之自動解離，其中該薄化基板(200)可以是半導體晶圓或玻璃片或塑膠片，且該無線靜電載盤(100)底面具有導電生成靜電電力場之導極(105)，又該無線靜電載盤(100)與該薄化基板(200)周緣具有一供確定方位之定位切口(101、201)。該粘脫方法之流程步驟包含有一供一無線靜電載盤及一薄化基板；一將上述無線靜電載盤及上述薄化基板分別烘烤使表面保持乾燥；一使上述無線靜電載盤及上述薄化基板分別進行指定方位之預對位；一將上述無靜電載盤及上述薄化基板分別以前述同一指定方位固定於兩相對表面；一使分置於前述兩表面之上述無線靜電載盤及上述薄化基板以線性相對位移方式貼合；一令上述無線靜電載盤相對上述薄化基板產生可相互粘合之靜電電力場；以及一將粘合有上述薄化基板之上述無線靜電載盤取出等步驟。而本發明粘脫方法之較佳實施例，則請配合參看第一、二及三圖所揭示者； As shown in Figure 12, it is a flow chart of the automatic adhesion method for the wireless electrostatic chuck. The automatic dissociation, wherein the thinned substrate (200) can be a semiconductor wafer or a glass sheet or a plastic sheet, and the bottom surface of the wireless electrostatic carrier (100) has a conductive electrode (105) that generates an electrostatic electric field, and the wireless The electrostatic carrier plate (100) and the periphery of the thinned substrate (200) are provided with a positioning slit (101, 201) for determining the orientation. The process steps of the adhesion and release method include a wireless electrostatic carrier and a thinned substrate; one baking the wireless electrostatic carrier and the thinned substrate to keep the surface dry; one making the wireless electrostatic carrier and the above The thinned substrates are respectively pre-aligned in designated positions; one is to fix the non-static carrier and the thinned substrate to two opposite surfaces in the same designated position; one to place the wireless electrostatic carrier on the two surfaces separately And the above-mentioned thinned substrates are attached in a linear relative displacement manner; one is to cause the wireless electrostatic carrier to generate an electrostatic power field that can be bonded to the thinned substrate; and one to bond the above-mentioned wireless electrostatic carrier to the thinned substrate Steps such as disk removal. Please refer to the first, second and third figures for the preferred embodiment of the adhesion-release method of the present invention;
一供一無線靜電載盤及一薄化基板之步驟：其透過自動粘脫系統之機體(10)上的其中一傳輸裝置(20)由載盤出入料埠(18)取得一無線靜電載盤(100)，且由另一傳輸裝置(20)由該基板出入料埠(16)取得一無線靜電載盤(100)； A step of supplying a wireless electrostatic carrier and a thinned substrate: it obtains a wireless electrostatic carrier from the carrier inlet and outlet port (18) through one of the transmission devices (20) on the body (10) of the automatic sticking-off system (100), and another transmission device (20) obtains a wireless electrostatic carrier plate (100) from the substrate inlet and outlet port (16);
一將上述無線靜電載盤及上述薄化基板分別烘烤 使表面保持乾燥之步驟：在分別取得上述之無線靜電載盤(100)與薄化基板(200)後，其中一傳輸裝置(20)可將該無線靜電載盤(100)置入相對應的烘烤裝置(30)之載盤烘烤組(35)，而另一傳輸裝置(20)可將該薄化基板(200)置入相對應的烘烤裝置(30)之基板烘烤組(31)，分別予以烘烤使其表面保持乾燥； 1. Bake the above-mentioned wireless electrostatic carrier plate and the above-mentioned thinned substrate separately The step of keeping the surface dry: After obtaining the above-mentioned wireless electrostatic carrier (100) and the thinned substrate (200) separately, one of the transmission devices (20) can place the wireless electrostatic carrier (100) into the corresponding The tray baking group (35) of the baking device (30), and the other conveying device (20) can put the thinned substrate (200) into the substrate baking group (30) of the corresponding baking device (30). 31), respectively bake to keep the surface dry;
一使上述無線靜電載盤及上述薄化基板分別進行指定方位之預對位之步驟：在完成上述無線靜電載盤(100)與上述薄化基板(200)之烘烤乾燥動作後，該等傳輸裝置(20)分別將該無線靜電載盤(100)與該薄化基板(200)移送至相對應之預對位裝置(40)，使得該無線靜電載盤(100)與該薄化基板(200)能利用其定位切口(101、201)定位於同一指定方位，令該無線靜電載盤(100)與該薄化基板(200)可在同一指定方位下完全重疊貼合，以利後續製程加工； A step of pre-aligning the wireless electrostatic carrier plate and the thinned substrate in a designated position respectively: after the baking and drying of the wireless electrostatic carrier plate (100) and the thinned substrate (200) are completed, these The transmission device (20) respectively transfers the wireless electrostatic carrier plate (100) and the thinned substrate (200) to the corresponding pre-alignment device (40), so that the wireless electrostatic carrier plate (100) and the thinned substrate (200) can use its positioning cuts (101, 201) to be positioned in the same designated position, so that the wireless electrostatic carrier plate (100) and the thinned substrate (200) can be completely overlapped and attached in the same designated position to facilitate subsequent follow-up Process processing;
一將上述無靜電載盤及上述薄化基板分別以前述同一指定方位固定於兩相對表面之步驟：且在完成前述的預對位後，可如第五圖示，該傳輸裝置(20)係先將薄化基板(200)置於該載板靜電生成組(60)之主框板(61)與側翼板(65)的工作平面上，且利用其導位組(66)導正該薄化基板(200)於載板靜電生成組(60)工作平面之正確位置，且透過該觸動檢知組(67)及該光學檢知組(68)確保該無線靜電載盤(100)被以指定方位準確定位後，可令該基板移載組(80)下降，並利用 該基板移載組(80)之吸附件(83)將該薄化基板(200)吸附在吸附平面之正確位置，之後再升起該基板移載組(80)同步將該薄化基板(200)帶離該載板靜電生成組(60)之工作平面，緊接著該傳輸裝置(20)再將無線靜電載盤(100)置於該載板靜電生成組(60)之主框板(61)與側翼板(65)的工作平面上，且利用其導位組(66)導正該無線靜電載盤(100)於載板靜電生成組(60)工作平面之正確位置，並透過該觸動檢知組(67)及該光學檢知組(68)確保該無線靜電載盤(100)被以指定方位準確定位後，該載板靜電生成組(60)可利用吸附件(64)固定該無線靜電載盤(100)，使得該薄化基板(200)與該無線靜電載盤(100)可以同一指定方位相對； A step of fixing the non-static carrier plate and the thinned substrate to two opposite surfaces in the same designated orientation respectively: and after completing the aforementioned pre-alignment, as shown in the fifth figure, the transmission device (20) is First place the thinned substrate (200) on the working plane of the main frame plate (61) and the side wing plate (65) of the carrier plate static electricity generation group (60), and use its guide group (66) to guide the thin The substrate (200) is in the correct position on the working plane of the electrostatic generation group (60) of the carrier, and the touch detection group (67) and the optical detection group (68) are used to ensure that the wireless electrostatic carrier (100) is After the specified position is accurately positioned, the substrate transfer group (80) can be lowered and used The suction member (83) of the substrate transfer group (80) sucks the thinned substrate (200) at the correct position on the suction plane, and then raises the substrate transfer group (80) to synchronize the thinned substrate (200) ) Is taken away from the working plane of the carrier electrostatic generation group (60), and then the wireless electrostatic carrier (100) is placed on the main frame plate (61) of the carrier electrostatic generation group (60) immediately after the transmission device (20) ) And the working plane of the side wing board (65), and use its guiding group (66) to guide the wireless electrostatic carrier plate (100) to the correct position of the working plane of the carrier board electrostatic generating group (60), and through the touch After the detection group (67) and the optical detection group (68) ensure that the wireless electrostatic carrier (100) is accurately positioned in the specified position, the carrier electrostatic generation group (60) can use the suction member (64) to fix the The wireless electrostatic carrier (100), so that the thinned substrate (200) and the wireless electrostatic carrier (100) can face each other in the same designated orientation;
一使分置於前述兩表面之上述無線靜電載盤及上述薄化基板以線性相對位移方式貼合之步驟：當無線靜電載盤(100)與薄化基板(200)被以同一指定方位固定在相對表面後，如第三、四圖所示，將該基板移載組(80)帶動薄化基板(200)相對該載板靜電生成組(60)之無線靜電載盤(100)線性位移，使得該薄化基板(200)可以同一指定方位貼合於該無線靜電載盤(100)表面，且兩者外周緣完全重疊； A step of attaching the wireless electrostatic carrier and the thinned substrate separated on the two surfaces in a linear relative displacement manner: when the wireless electrostatic carrier (100) and the thinned substrate (200) are fixed in the same designated orientation After the opposite surface, as shown in the third and fourth figures, the substrate transfer group (80) drives the thinned substrate (200) to linearly shift relative to the wireless electrostatic carrier (100) of the carrier electrostatic generation group (60) , So that the thinned substrate (200) can be attached to the surface of the wireless electrostatic carrier plate (100) in the same designated orientation, and the outer peripheries of the two are completely overlapped;
一令上述無線靜電載盤相對上述薄化基板產生可相互粘合之靜電電力場之步驟：在完成該無線靜電載盤(100)與該薄化基板(200)之貼合後，該載板靜電生成組(60)可電氣導通對該無線靜電載盤(100)，使該無線靜電載盤(100)可 相對該薄化基板(200)生成一靜電電力場，而完成該無線靜電載盤(100)以靜電粘合該薄化基板(200)之工作；以及 A step of causing the wireless electrostatic carrier to generate an electrostatic electric field that can be bonded to the thinned substrate: after the wireless electrostatic carrier (100) and the thinned substrate (200) are bonded together, the carrier The electrostatic generation group (60) can be electrically connected to the wireless electrostatic carrier (100) so that the wireless electrostatic carrier (100) can be Generate an electrostatic electric field with respect to the thinned substrate (200), and complete the work of the wireless electrostatic carrier (100) to electrostatically bond the thinned substrate (200); and
一將粘合有上述薄化基板之上述無線靜電載盤取出之步驟：最後在完成該無線靜電載盤(100)與該薄化基板(200)之粘合後，可將該基板移載組(80)與該載板靜電生成組(60)以線性位移方式相對分開，並利用其中一傳輸裝置(20)將該粘合有薄化基板(200)之無線靜電載盤(100)取出，並依序存放於相對應之基板出入料埠(16)或載盤出入料埠(18)內，而完成整個粘合之作業，以供後續製程應用。 A step of taking out the wireless electrostatic carrier plate bonded with the thinned substrate: Finally, after the wireless electrostatic carrier plate (100) and the thinned substrate (200) are bonded together, the substrate can be transferred to the assembly (80) The electrostatic generation group (60) of the carrier board is relatively separated by linear displacement, and one of the transmission devices (20) is used to take out the wireless electrostatic carrier plate (100) bonded with the thinned substrate (200), They are sequentially stored in the corresponding substrate inlet/outlet port (16) or the tray inlet/outlet port (18) to complete the entire bonding operation for subsequent process applications.
而根據某些實施例，該無線靜電載盤(100)與該薄化基板(200)在進行烘烤動作前，可增加一將該無線靜電載盤進行表面潔淨之步驟，其係以清洗劑沖洗或擦拭，又或非接觸方式去除該無線靜電載盤(100)貼合表面之微粒，以提升其粘合的有效性。 According to some embodiments, before the wireless electrostatic carrier (100) and the thinned substrate (200) are baked, a step of cleaning the surface of the wireless electrostatic carrier may be added, which uses a cleaning agent. Washing or wiping, or non-contact method to remove particles on the surface of the wireless electrostatic carrier (100) to improve the effectiveness of adhesion.
再者，該粘合的薄化基板(200)與無線靜電載盤(100)也能被解離，其係透過傳輸裝置(20)將該粘合有薄化基板(200)之無線靜電載盤(100)置入該載板靜電生成組(60)中吸附固定，並將該基板移載組(80)線性位移吸附固定於該薄化基板(200)異於無線靜電載盤(100)的一側表面，接著令該載板靜電生成組(60)釋放該無線靜電載盤(100)之靜電電力場，使該無線靜電載盤(100)之靜電被釋放，進而使該薄化基板(200)能被解離，並由該基板移載組(80)反向位移帶動該 薄化基板(200)與該無線靜電載盤(100)相對分離，最後再利用相對之傳輸裝置(20)將該無線靜電載盤(100)與該薄化基板(200)分別置入相對應的載盤出入料埠(18)及基板出入料埠(16)中。而根據某些實施例，如第九圖示，該無線靜電載盤(100)在靜電釋放後，可將該無線靜電載盤(100)外周緣向下作動，令該無線靜電載盤(100)外周緣可相對該薄化基板(200)預先剝離生成一開口，並透過一噴氣單元(69)之噴射氣嘴(690)將高速氣體由無線靜電載盤(100)外周緣吹入，使得該無線靜電載盤(100)與該薄化基板(200)能被有效分離。 Furthermore, the bonded thinned substrate (200) and the wireless electrostatic carrier (100) can also be dissociated, which is the wireless electrostatic carrier bonded with the thinned substrate (200) through the transmission device (20) (100) Put into the carrier plate static electricity generation group (60) to adsorb and fix, and the substrate transfer group (80) linear displacement suction and fix to the thinned substrate (200) different from the wireless electrostatic carrier plate (100) On one side of the surface, the carrier static electricity generation group (60) is then allowed to release the electrostatic power field of the wireless electrostatic carrier (100), so that the static electricity of the wireless electrostatic carrier (100) is discharged, and then the thinned substrate ( 200) can be dissociated and driven by the reverse displacement of the substrate transfer group (80) The thinned substrate (200) is relatively separated from the wireless electrostatic carrier (100), and finally the wireless electrostatic carrier (100) and the thinned substrate (200) are respectively placed into the corresponding corresponding transmission device (20) In the loading and unloading port (18) of the carrier plate and the loading and unloading port (16) of the substrate. According to some embodiments, as shown in the ninth figure, after the electrostatic discharge of the wireless electrostatic carrier (100), the outer periphery of the wireless electrostatic carrier (100) can be moved downwards, so that the wireless electrostatic carrier (100) ) The outer periphery of the thinned substrate (200) can be peeled off in advance to generate an opening, and the high-speed gas is blown in from the outer periphery of the wireless electrostatic carrier (100) through the jet nozzle (690) of a jet unit (69), so that The wireless electrostatic carrier plate (100) and the thinned substrate (200) can be effectively separated.
而由上述可知，本發明之用於無線靜電吸盤之粘脫設備、自動粘脫系統及其粘脫方法可以提升粘合效率，且可大幅降低粘合失敗率，並減少生裂損或破片的發生，而能在自動清洗、烘烤與預對位後，可供應付高精度的製程需求，並進行自動化粘合，以滿足薄化基板之自動化製作的需求，使無線靜電載盤能粘合薄化基板能應用於後續製程中，可大幅提高薄化基板的製程良率，而能降低成本及增加利潤。 It can be seen from the above that the sticking and releasing equipment, automatic sticking and releasing system and the sticking and releasing method for wireless electrostatic chuck of the present invention can improve the bonding efficiency, and can greatly reduce the failure rate of bonding, and reduce the occurrence of cracks or fragments. After automatic cleaning, baking and pre-alignment, it can meet the high-precision process requirements and automate the bonding to meet the needs of automated production of thinned substrates, so that the wireless electrostatic carrier can be bonded Thinned substrates can be used in subsequent manufacturing processes, which can greatly improve the process yield of thinned substrates, and can reduce costs and increase profits.
綜上所述，可以理解到本發明為一創意極佳之發明，除了有效解決習式者所面臨的問題，更大幅增進功效，且在相同的技術領域中未見相同或近似的產品創作或公開使用，同時具有功效的增進，故本發明已符合發明專利有關「新穎性」與「進步性」的要件，乃依法提出申請發明專利。 In summary, it can be understood that the present invention is an extremely creative invention. In addition to effectively solving the problems faced by habitants, it also greatly enhances its efficacy. In addition, there is no similar or similar product creation or creation in the same technical field. It is publicly used and has enhanced efficacy. Therefore, the present invention has met the requirements of "novelty" and "progressiveness" of invention patents, and an application for invention patents has been filed in accordance with the law.
10:機體 10: Body
15:滑軌機構 15: Slide rail mechanism
16:基板出入料埠 16: Substrate inlet and outlet ports
18:載盤出入料埠 18: Loading and unloading port of tray
20:傳輸裝置 20: Transmission device
30:烘烤裝置 30: Baking device
31:基板烘烤組 31: substrate baking group
32:載盤烘烤裝置 32: tray baking device
38:清洗裝置 38: Cleaning device
40:預對位裝置 40: Pre-alignment device
45:暫存料埠 45: Temporary storage port
50:粘脫設備 50: Adhesion equipment
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| Application Number | Priority Date | Filing Date | Title |
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| TW109115329A TWI752489B (en) | 2020-05-08 | 2020-05-08 | Debonding equipment, automatic debonding system and debonding method for wireless electrostatic chuck |
| CN202021846699.0U CN212934582U (en) | 2020-05-08 | 2020-08-28 | A glue and take off equipment and automatic system of taking off of gluing for wireless electrostatic chuck |
| CN202010885938.1A CN113628995A (en) | 2020-05-08 | 2020-08-28 | Sticking and detaching equipment, automatic sticking and detaching system and sticking and detaching method for wireless electrostatic chuck |
| DE102021110238.3A DE102021110238A1 (en) | 2020-05-08 | 2021-04-22 | Gluing device for electrostatic suction cups, automatic gluing system and method for gluing the same |
| KR1020210058909A KR102502909B1 (en) | 2020-05-08 | 2021-05-07 | Debonding equipment, automatic debonding system and debonding method for electrostatic chuck |
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| TW109115329A TWI752489B (en) | 2020-05-08 | 2020-05-08 | Debonding equipment, automatic debonding system and debonding method for wireless electrostatic chuck |
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| TWI752489B TWI752489B (en) | 2022-01-11 |
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| CN (2) | CN113628995A (en) |
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| US20120227886A1 (en) * | 2011-03-10 | 2012-09-13 | Taipei Semiconductor Manufacturing Company, Ltd. | Substrate Assembly Carrier Using Electrostatic Force |
| TWI616975B (en) * | 2011-12-14 | 2018-03-01 | Nikon Corp | Substrate holder and substrate bonding device |
| US9740111B2 (en) * | 2014-05-16 | 2017-08-22 | Applied Materials, Inc. | Electrostatic carrier for handling substrates for processing |
| WO2016160322A1 (en) * | 2015-04-01 | 2016-10-06 | Sxaymiq Technologies Llc | Electrostatic cleaning device |
| WO2016195945A1 (en) * | 2015-06-04 | 2016-12-08 | Applied Materials, Inc. | Transparent electrostatic carrier |
| TWI601677B (en) * | 2016-12-22 | 2017-10-11 | Usun Technology Co Ltd | Device capable of adsorbing curved objects and a fitting device using the device |
| TWI622832B (en) * | 2017-05-23 | 2018-05-01 | 元太科技工業股份有限公司 | Carrier apparatus and display |
| TWM604487U (en) * | 2020-05-08 | 2020-11-21 | 特銓股份有限公司 | Bonding and releasing device for wireless electrostatic chuck and automatic bonding and releasing system thereof |
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- 2020-08-28 CN CN202010885938.1A patent/CN113628995A/en active Pending
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| CN113628995A (en) | 2021-11-09 |
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| KR102502909B1 (en) | 2023-02-23 |
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