CN113555288A - 封装基板制作方法 - Google Patents
封装基板制作方法 Download PDFInfo
- Publication number
- CN113555288A CN113555288A CN202110715575.1A CN202110715575A CN113555288A CN 113555288 A CN113555288 A CN 113555288A CN 202110715575 A CN202110715575 A CN 202110715575A CN 113555288 A CN113555288 A CN 113555288A
- Authority
- CN
- China
- Prior art keywords
- layer
- circuit layer
- metal
- cavity
- solder mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000758 substrate Substances 0.000 title claims abstract description 46
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 28
- 238000000034 method Methods 0.000 title claims description 26
- 229910052751 metal Inorganic materials 0.000 claims abstract description 69
- 239000002184 metal Substances 0.000 claims abstract description 69
- 229910000679 solder Inorganic materials 0.000 claims abstract description 58
- 238000000151 deposition Methods 0.000 claims abstract description 26
- 238000005530 etching Methods 0.000 claims abstract description 19
- 238000000059 patterning Methods 0.000 claims abstract description 11
- 238000005520 cutting process Methods 0.000 claims abstract description 9
- 238000003825 pressing Methods 0.000 claims abstract description 4
- 239000010410 layer Substances 0.000 claims description 254
- 239000011241 protective layer Substances 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 238000005553 drilling Methods 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 5
- 238000004544 sputter deposition Methods 0.000 claims description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- 238000001465 metallisation Methods 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- 239000003755 preservative agent Substances 0.000 claims description 3
- 230000002335 preservative effect Effects 0.000 claims description 3
- 238000007772 electroless plating Methods 0.000 claims description 2
- 229920013716 polyethylene resin Polymers 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 abstract description 17
- 238000003466 welding Methods 0.000 abstract description 7
- 238000001514 detection method Methods 0.000 abstract description 4
- 239000010408 film Substances 0.000 description 23
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 238000009713 electroplating Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 238000007747 plating Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000007494 plate polishing Methods 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4828—Etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49894—Materials of the insulating layers or coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76841—Barrier, adhesion or liner layers
- H01L21/76871—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4857—Multilayer substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/486—Via connections through the substrate with or without pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68345—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during the manufacture of self supporting substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Optics & Photonics (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010679169.XA CN111564374A (zh) | 2020-07-15 | 2020-07-15 | 封装基板制作方法 |
CN202010679169X | 2020-07-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN113555288A true CN113555288A (zh) | 2021-10-26 |
CN113555288B CN113555288B (zh) | 2022-08-23 |
Family
ID=72075480
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010679169.XA Withdrawn CN111564374A (zh) | 2020-07-15 | 2020-07-15 | 封装基板制作方法 |
CN202110715575.1A Active CN113555288B (zh) | 2020-07-15 | 2021-06-28 | 封装基板制作方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010679169.XA Withdrawn CN111564374A (zh) | 2020-07-15 | 2020-07-15 | 封装基板制作方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20230326765A1 (zh) |
JP (1) | JP7534523B2 (zh) |
KR (1) | KR20230038559A (zh) |
CN (2) | CN111564374A (zh) |
DE (1) | DE112021003770T5 (zh) |
GB (1) | GB2611941A (zh) |
WO (1) | WO2022012422A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023143117A1 (zh) * | 2022-01-27 | 2023-08-03 | 深圳中科四合科技有限公司 | 大尺寸芯片适配小尺寸封装体的封装结构及其加工方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111564374A (zh) * | 2020-07-15 | 2020-08-21 | 珠海越亚半导体股份有限公司 | 封装基板制作方法 |
CN112103194A (zh) * | 2020-08-27 | 2020-12-18 | 珠海越亚半导体股份有限公司 | 转接基板及其制作方法、器件封装结构 |
CN112420524B (zh) * | 2020-10-27 | 2022-03-15 | 珠海越亚半导体股份有限公司 | 一种支撑框架及其制造方法 |
CN113555326A (zh) * | 2021-06-03 | 2021-10-26 | 珠海越亚半导体股份有限公司 | 可润湿侧面的封装结构与其制作方法及垂直封装模块 |
CN115966514B (zh) * | 2023-03-17 | 2023-06-13 | 深圳明阳电路科技股份有限公司 | 一种半导体载板的制备方法 |
CN116581032A (zh) * | 2023-05-30 | 2023-08-11 | 江苏普诺威电子股份有限公司 | 具有中空结构封装载板及其制作工艺 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102263076A (zh) * | 2010-05-27 | 2011-11-30 | 精材科技股份有限公司 | 封装结构及形成封装结构的方法 |
CN102810549A (zh) * | 2012-08-29 | 2012-12-05 | 格科微电子(上海)有限公司 | 图像传感器的晶圆级封装的制作方法 |
TW201343018A (zh) * | 2012-04-03 | 2013-10-16 | 矽品精密工業股份有限公司 | 無核心封裝結構之製法及無核心封裝基板之製法 |
TW201601224A (zh) * | 2014-06-17 | 2016-01-01 | 矽品精密工業股份有限公司 | 封裝基板結構及其製法 |
CN106206484A (zh) * | 2016-08-23 | 2016-12-07 | 苏州科阳光电科技有限公司 | 芯片封装方法及封装结构 |
US20170005057A1 (en) * | 2015-07-01 | 2017-01-05 | Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. | Chip package |
CN106997870A (zh) * | 2016-01-26 | 2017-08-01 | 珠海越亚封装基板技术股份有限公司 | 新型嵌入式封装 |
WO2017152714A1 (zh) * | 2016-03-07 | 2017-09-14 | 武汉光谷创元电子有限公司 | 载体、其制造方法及使用载体制造无芯封装基板的方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI286372B (en) | 2003-08-13 | 2007-09-01 | Phoenix Prec Technology Corp | Semiconductor package substrate with protective metal layer on pads formed thereon and method for fabricating the same |
JP4146864B2 (ja) | 2005-05-31 | 2008-09-10 | 新光電気工業株式会社 | 配線基板及びその製造方法、並びに半導体装置及び半導体装置の製造方法 |
CN1873935B (zh) * | 2005-05-31 | 2010-06-16 | 新光电气工业株式会社 | 配线基板的制造方法及半导体器件的制造方法 |
US8786062B2 (en) | 2009-10-14 | 2014-07-22 | Advanced Semiconductor Engineering, Inc. | Semiconductor package and process for fabricating same |
US8569894B2 (en) * | 2010-01-13 | 2013-10-29 | Advanced Semiconductor Engineering, Inc. | Semiconductor package with single sided substrate design and manufacturing methods thereof |
JP5121875B2 (ja) | 2010-04-16 | 2013-01-16 | 三洋電機株式会社 | 回路装置 |
TWI473540B (zh) | 2010-06-10 | 2015-02-11 | Subtron Technology Co Ltd | 線路板的製作方法 |
CN102593085B (zh) * | 2011-01-10 | 2014-08-13 | 原相科技股份有限公司 | 芯片封装结构以及芯片封装制程 |
CN102881644B (zh) * | 2012-10-12 | 2014-09-03 | 江阴长电先进封装有限公司 | 一种圆片级芯片封装方法 |
JP6816486B2 (ja) | 2016-12-07 | 2021-01-20 | 凸版印刷株式会社 | コア基板、多層配線基板、半導体パッケージ、半導体モジュール、銅張基板、及びコア基板の製造方法 |
CN111564374A (zh) * | 2020-07-15 | 2020-08-21 | 珠海越亚半导体股份有限公司 | 封装基板制作方法 |
-
2020
- 2020-07-15 CN CN202010679169.XA patent/CN111564374A/zh not_active Withdrawn
-
2021
- 2021-06-28 CN CN202110715575.1A patent/CN113555288B/zh active Active
- 2021-07-09 KR KR1020237005278A patent/KR20230038559A/ko unknown
- 2021-07-09 JP JP2023502730A patent/JP7534523B2/ja active Active
- 2021-07-09 GB GB2300796.6A patent/GB2611941A/en active Pending
- 2021-07-09 WO PCT/CN2021/105394 patent/WO2022012422A1/zh active Application Filing
- 2021-07-09 US US18/005,608 patent/US20230326765A1/en active Pending
- 2021-07-09 DE DE112021003770.6T patent/DE112021003770T5/de active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102263076A (zh) * | 2010-05-27 | 2011-11-30 | 精材科技股份有限公司 | 封装结构及形成封装结构的方法 |
TW201343018A (zh) * | 2012-04-03 | 2013-10-16 | 矽品精密工業股份有限公司 | 無核心封裝結構之製法及無核心封裝基板之製法 |
CN102810549A (zh) * | 2012-08-29 | 2012-12-05 | 格科微电子(上海)有限公司 | 图像传感器的晶圆级封装的制作方法 |
TW201601224A (zh) * | 2014-06-17 | 2016-01-01 | 矽品精密工業股份有限公司 | 封裝基板結構及其製法 |
US20170005057A1 (en) * | 2015-07-01 | 2017-01-05 | Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. | Chip package |
CN106997870A (zh) * | 2016-01-26 | 2017-08-01 | 珠海越亚封装基板技术股份有限公司 | 新型嵌入式封装 |
WO2017152714A1 (zh) * | 2016-03-07 | 2017-09-14 | 武汉光谷创元电子有限公司 | 载体、其制造方法及使用载体制造无芯封装基板的方法 |
CN106206484A (zh) * | 2016-08-23 | 2016-12-07 | 苏州科阳光电科技有限公司 | 芯片封装方法及封装结构 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023143117A1 (zh) * | 2022-01-27 | 2023-08-03 | 深圳中科四合科技有限公司 | 大尺寸芯片适配小尺寸封装体的封装结构及其加工方法 |
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GB202300796D0 (en) | 2023-03-08 |
WO2022012422A1 (zh) | 2022-01-20 |
DE112021003770T5 (de) | 2023-04-27 |
KR20230038559A (ko) | 2023-03-20 |
CN113555288B (zh) | 2022-08-23 |
JP2023534256A (ja) | 2023-08-08 |
GB2611941A (en) | 2023-04-19 |
CN111564374A (zh) | 2020-08-21 |
US20230326765A1 (en) | 2023-10-12 |
JP7534523B2 (ja) | 2024-08-14 |
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