CN113495428A - 位置对准装置、图案形成装置及物品的制造方法 - Google Patents

位置对准装置、图案形成装置及物品的制造方法 Download PDF

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Publication number
CN113495428A
CN113495428A CN202110346461.4A CN202110346461A CN113495428A CN 113495428 A CN113495428 A CN 113495428A CN 202110346461 A CN202110346461 A CN 202110346461A CN 113495428 A CN113495428 A CN 113495428A
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CN
China
Prior art keywords
substrate
substrate holding
unit
holding portion
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110346461.4A
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English (en)
Chinese (zh)
Inventor
山口直树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of CN113495428A publication Critical patent/CN113495428A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7096—Arrangement, mounting, housing, environment, cleaning or maintenance of apparatus
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
CN202110346461.4A 2020-04-03 2021-03-31 位置对准装置、图案形成装置及物品的制造方法 Pending CN113495428A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-067783 2020-04-03
JP2020067783A JP7467207B2 (ja) 2020-04-03 2020-04-03 位置合わせ装置、パターン形成装置及び物品の製造方法

Publications (1)

Publication Number Publication Date
CN113495428A true CN113495428A (zh) 2021-10-12

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110346461.4A Pending CN113495428A (zh) 2020-04-03 2021-03-31 位置对准装置、图案形成装置及物品的制造方法

Country Status (4)

Country Link
JP (1) JP7467207B2 (https=)
KR (1) KR20210124036A (https=)
CN (1) CN113495428A (https=)
TW (1) TW202141171A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114153128A (zh) * 2021-12-16 2022-03-08 江苏特纳马智能制造有限公司 一种曝光机玻璃基板表面温度控制方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005311113A (ja) * 2004-04-22 2005-11-04 Nikon Corp 位置合わせ装置と位置合わせ方法、搬送システムと搬送方法、及び露光システムと露光方法並びにデバイス製造方法
US20070159615A1 (en) * 2006-01-12 2007-07-12 Nikon Corporation Object transfer apparatus, exposure apparatus, object temperature control apparatus, object transfer method, and microdevice manufacturing method
JP2009239097A (ja) * 2008-03-27 2009-10-15 Nikon Corp 搬送装置、露光装置、及びデバイス製造方法
KR20100013592A (ko) * 2008-07-31 2010-02-10 주식회사 케이씨텍 원자층 증착 장치
JP2010074037A (ja) * 2008-09-22 2010-04-02 Nuflare Technology Inc サセプタ、半導体製造装置および半導体製造方法
JP2012114219A (ja) * 2010-11-24 2012-06-14 Canon Inc 位置合わせ方法及び位置合わせ装置、それを用いた露光装置及びデバイスの製造方法
CN103132051A (zh) * 2011-11-23 2013-06-05 中微半导体设备(上海)有限公司 化学气相沉积反应器或外延层生长反应器及其支撑装置
JP6627936B1 (ja) * 2018-08-30 2020-01-08 住友大阪セメント株式会社 静電チャック装置および静電チャック装置の製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005311113A (ja) * 2004-04-22 2005-11-04 Nikon Corp 位置合わせ装置と位置合わせ方法、搬送システムと搬送方法、及び露光システムと露光方法並びにデバイス製造方法
US20070159615A1 (en) * 2006-01-12 2007-07-12 Nikon Corporation Object transfer apparatus, exposure apparatus, object temperature control apparatus, object transfer method, and microdevice manufacturing method
JP2009239097A (ja) * 2008-03-27 2009-10-15 Nikon Corp 搬送装置、露光装置、及びデバイス製造方法
KR20100013592A (ko) * 2008-07-31 2010-02-10 주식회사 케이씨텍 원자층 증착 장치
JP2010074037A (ja) * 2008-09-22 2010-04-02 Nuflare Technology Inc サセプタ、半導体製造装置および半導体製造方法
JP2012114219A (ja) * 2010-11-24 2012-06-14 Canon Inc 位置合わせ方法及び位置合わせ装置、それを用いた露光装置及びデバイスの製造方法
CN103132051A (zh) * 2011-11-23 2013-06-05 中微半导体设备(上海)有限公司 化学气相沉积反应器或外延层生长反应器及其支撑装置
JP6627936B1 (ja) * 2018-08-30 2020-01-08 住友大阪セメント株式会社 静電チャック装置および静電チャック装置の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114153128A (zh) * 2021-12-16 2022-03-08 江苏特纳马智能制造有限公司 一种曝光机玻璃基板表面温度控制方法
CN114153128B (zh) * 2021-12-16 2023-11-24 江苏特纳马智能制造有限公司 一种曝光机玻璃基板表面温度控制方法

Also Published As

Publication number Publication date
JP2021162821A (ja) 2021-10-11
JP7467207B2 (ja) 2024-04-15
TW202141171A (zh) 2021-11-01
KR20210124036A (ko) 2021-10-14

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