CN113474885B - 散热构件及其制造方法 - Google Patents
散热构件及其制造方法 Download PDFInfo
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- CN113474885B CN113474885B CN202080006024.1A CN202080006024A CN113474885B CN 113474885 B CN113474885 B CN 113474885B CN 202080006024 A CN202080006024 A CN 202080006024A CN 113474885 B CN113474885 B CN 113474885B
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| JP6996008B2 (ja) * | 2018-11-29 | 2022-01-17 | デンカ株式会社 | 放熱部材 |
| JP6875588B1 (ja) * | 2020-09-18 | 2021-05-26 | 住友電気工業株式会社 | 半導体装置 |
| EP4411810A4 (en) * | 2021-10-06 | 2025-02-12 | Denka Company Limited | Heat dissipation member |
| JP7714134B6 (ja) * | 2022-06-29 | 2025-08-27 | 株式会社東芝 | セラミックス銅回路基板およびそれを用いた半導体装置 |
| CN120752754A (zh) | 2023-02-27 | 2025-10-03 | 电化株式会社 | 陶瓷板、包装体、陶瓷板的制造方法、模块及电气电子产品 |
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| CN103443315A (zh) * | 2011-03-22 | 2013-12-11 | 住友电气工业株式会社 | 包含由复合材料制成的衬底的复合构件 |
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| CN116086232B (zh) | 2025-10-28 |
| EP3920215A1 (en) | 2021-12-08 |
| JP7116689B2 (ja) | 2022-08-10 |
| WO2020158774A1 (ja) | 2020-08-06 |
| EP3920215A4 (en) | 2022-03-30 |
| US12213286B2 (en) | 2025-01-28 |
| US20220104400A1 (en) | 2022-03-31 |
| JP2020123638A (ja) | 2020-08-13 |
| EP3920215B1 (en) | 2023-06-14 |
| CN116086232A (zh) | 2023-05-09 |
| CN113474885A (zh) | 2021-10-01 |
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