CN113474474A - 用于恶劣使用条件的高可靠性无铅焊料合金 - Google Patents

用于恶劣使用条件的高可靠性无铅焊料合金 Download PDF

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Publication number
CN113474474A
CN113474474A CN202080016268.8A CN202080016268A CN113474474A CN 113474474 A CN113474474 A CN 113474474A CN 202080016268 A CN202080016268 A CN 202080016268A CN 113474474 A CN113474474 A CN 113474474A
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CN
China
Prior art keywords
solder alloy
solder
balance
alloy
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080016268.8A
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English (en)
Chinese (zh)
Inventor
耿杰
张宏闻
李宁成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Indium Corp
Original Assignee
Indium Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Indium Corp filed Critical Indium Corp
Publication of CN113474474A publication Critical patent/CN113474474A/zh
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CN202080016268.8A 2019-02-26 2020-02-26 用于恶劣使用条件的高可靠性无铅焊料合金 Pending CN113474474A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962810619P 2019-02-26 2019-02-26
US62/810,619 2019-02-26
PCT/US2020/019831 WO2020176583A1 (en) 2019-02-26 2020-02-26 High reliability leadfree solder alloys for harsh service conditions

Publications (1)

Publication Number Publication Date
CN113474474A true CN113474474A (zh) 2021-10-01

Family

ID=70190079

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080016268.8A Pending CN113474474A (zh) 2019-02-26 2020-02-26 用于恶劣使用条件的高可靠性无铅焊料合金

Country Status (6)

Country Link
US (1) US11752579B2 (enExample)
EP (1) EP3931364A1 (enExample)
JP (1) JP7630436B2 (enExample)
KR (1) KR102873457B1 (enExample)
CN (1) CN113474474A (enExample)
WO (1) WO2020176583A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114340835A (zh) * 2019-09-02 2022-04-12 阿尔法装配解决方案公司 高温超高可靠性合金
WO2025098076A1 (zh) * 2023-11-10 2025-05-15 苏州优诺电子材料科技有限公司 一种高强抗热疲劳无铅焊料合金及其制备方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240019350A (ko) * 2021-06-11 2024-02-14 인듐 코포레이션 혼합 땜납 합금 분말을 갖는 고 신뢰성 무연 땜납 페이스트

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105063419A (zh) * 2005-12-13 2015-11-18 美国铟泰公司 具有改良的抗跌落冲击性的无铅焊料合金及其焊接接头
US20160279741A1 (en) * 2015-03-24 2016-09-29 Tamura Corporation Lead-free solder alloy, electronic circuit board, and electronic control device
CN106163732A (zh) * 2014-04-02 2016-11-23 千住金属工业株式会社 Led用软钎料合金及led组件
JP2017170522A (ja) * 2016-09-20 2017-09-28 株式会社タムラ製作所 鉛フリーはんだ合金、電子回路基板および電子制御装置
CN107635716A (zh) * 2015-05-05 2018-01-26 铟泰公司 用于严苛环境电子器件应用的高可靠性无铅焊料合金

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120043569A1 (en) 2010-08-23 2012-02-23 Kabushiki Kaisha Toshiba Light emitting device and manufacturing method thereof
JP2014057974A (ja) 2012-09-14 2014-04-03 Senju Metal Ind Co Ltd はんだ合金
JP2015077601A (ja) 2013-04-02 2015-04-23 千住金属工業株式会社 鉛フリーはんだ合金
JP6370110B2 (ja) 2014-05-27 2018-08-08 株式会社タムラ製作所 はんだ接合構造体の製造方法、はんだ接合構造体およびはんだ接合方法
JP6200534B2 (ja) 2015-03-24 2017-09-20 株式会社タムラ製作所 鉛フリーはんだ合金、電子回路基板および電子制御装置
KR102685941B1 (ko) 2015-05-05 2024-07-17 인듐 코포레이션 전자장치 적용을 위한 무연 땜납 합금
JP6745453B2 (ja) * 2016-05-18 2020-08-26 パナソニックＩｐマネジメント株式会社 はんだ合金およびそれを用いた実装構造体
JP2018056397A (ja) 2016-09-29 2018-04-05 日亜化学工業株式会社 メタルベース基板の製造方法、半導体装置の製造方法、メタルベース基板、及び、半導体装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105063419A (zh) * 2005-12-13 2015-11-18 美国铟泰公司 具有改良的抗跌落冲击性的无铅焊料合金及其焊接接头
CN106163732A (zh) * 2014-04-02 2016-11-23 千住金属工业株式会社 Led用软钎料合金及led组件
US20160279741A1 (en) * 2015-03-24 2016-09-29 Tamura Corporation Lead-free solder alloy, electronic circuit board, and electronic control device
CN107635716A (zh) * 2015-05-05 2018-01-26 铟泰公司 用于严苛环境电子器件应用的高可靠性无铅焊料合金
JP2017170522A (ja) * 2016-09-20 2017-09-28 株式会社タムラ製作所 鉛フリーはんだ合金、電子回路基板および電子制御装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114340835A (zh) * 2019-09-02 2022-04-12 阿尔法装配解决方案公司 高温超高可靠性合金
CN114340835B (zh) * 2019-09-02 2024-07-12 阿尔法装配解决方案公司 高温超高可靠性合金
WO2025098076A1 (zh) * 2023-11-10 2025-05-15 苏州优诺电子材料科技有限公司 一种高强抗热疲劳无铅焊料合金及其制备方法

Also Published As

Publication number Publication date
WO2020176583A1 (en) 2020-09-03
KR20210138614A (ko) 2021-11-19
US11752579B2 (en) 2023-09-12
US20200269360A1 (en) 2020-08-27
EP3931364A1 (en) 2022-01-05
JP2022523203A (ja) 2022-04-21
KR102873457B1 (ko) 2025-10-17
JP7630436B2 (ja) 2025-02-17

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