JP7630436B2 - 過酷な使用条件のための高信頼性無鉛はんだ合金 - Google Patents

過酷な使用条件のための高信頼性無鉛はんだ合金 Download PDF

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JP7630436B2
JP7630436B2 JP2021549601A JP2021549601A JP7630436B2 JP 7630436 B2 JP7630436 B2 JP 7630436B2 JP 2021549601 A JP2021549601 A JP 2021549601A JP 2021549601 A JP2021549601 A JP 2021549601A JP 7630436 B2 JP7630436 B2 JP 7630436B2
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Prior art keywords
solder
solder alloy
balance
alloy
alloys
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Japanese (ja)
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JP2022523203A (ja
JP2022523203A5 (enExample
Inventor
ゲング，ジエ
チャン，ホンウェン
リー，ニン－チェン
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インディウム コーポレーション
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2021549601A 2019-02-26 2020-02-26 過酷な使用条件のための高信頼性無鉛はんだ合金 Active JP7630436B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962810619P 2019-02-26 2019-02-26
US62/810,619 2019-02-26
PCT/US2020/019831 WO2020176583A1 (en) 2019-02-26 2020-02-26 High reliability leadfree solder alloys for harsh service conditions

Publications (3)

Publication Number Publication Date
JP2022523203A JP2022523203A (ja) 2022-04-21
JP2022523203A5 JP2022523203A5 (enExample) 2023-03-03
JP7630436B2 true JP7630436B2 (ja) 2025-02-17

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ID=70190079

Family Applications (1)

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JP2021549601A Active JP7630436B2 (ja) 2019-02-26 2020-02-26 過酷な使用条件のための高信頼性無鉛はんだ合金

Country Status (6)

Country Link
US (1) US11752579B2 (enExample)
EP (1) EP3931364A1 (enExample)
JP (1) JP7630436B2 (enExample)
KR (1) KR102873457B1 (enExample)
CN (1) CN113474474A (enExample)
WO (1) WO2020176583A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI814081B (zh) * 2019-09-02 2023-09-01 美商阿爾發金屬化工公司 高溫超高可靠性合金、其製造方法及其應用
KR20240019350A (ko) * 2021-06-11 2024-02-14 인듐 코포레이션 혼합 땜납 합금 분말을 갖는 고 신뢰성 무연 땜납 페이스트
CN117798544B (zh) * 2023-11-10 2024-09-20 苏州优诺电子材料科技有限公司 一种高强抗热疲劳无铅焊料合金及其制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012169653A (ja) 2010-08-23 2012-09-06 Toshiba Corp 発光装置の製造方法
JP2014057974A (ja) 2012-09-14 2014-04-03 Senju Metal Ind Co Ltd はんだ合金
WO2015152387A1 (ja) 2014-04-02 2015-10-08 千住金属工業株式会社 Ｌｅｄ用はんだ合金およびｌｅｄモジュール
JP2015225938A (ja) 2014-05-27 2015-12-14 株式会社タムラ製作所 はんだ接合構造体の製造方法、はんだ接合構造体およびはんだ接合方法
JP2016179498A (ja) 2015-03-24 2016-10-13 株式会社タムラ製作所 鉛フリーはんだ合金、電子回路基板および電子制御装置
JP2018056397A (ja) 2016-09-29 2018-04-05 日亜化学工業株式会社 メタルベース基板の製造方法、半導体装置の製造方法、メタルベース基板、及び、半導体装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9260768B2 (en) * 2005-12-13 2016-02-16 Indium Corporation Lead-free solder alloys and solder joints thereof with improved drop impact resistance
JP2015077601A (ja) 2013-04-02 2015-04-23 千住金属工業株式会社 鉛フリーはんだ合金
US20160279741A1 (en) 2015-03-24 2016-09-29 Tamura Corporation Lead-free solder alloy, electronic circuit board, and electronic control device
TWI764632B (zh) * 2015-05-05 2022-05-11 美商銦業公司 用於嚴苛環境之電子應用的高可靠度無鉛焊料合金
KR102685941B1 (ko) 2015-05-05 2024-07-17 인듐 코포레이션 전자장치 적용을 위한 무연 땜납 합금
JP6230674B2 (ja) * 2016-09-20 2017-11-15 株式会社タムラ製作所 鉛フリーはんだ合金、電子回路基板および電子制御装置
JP6745453B2 (ja) * 2016-05-18 2020-08-26 パナソニックＩｐマネジメント株式会社 はんだ合金およびそれを用いた実装構造体

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012169653A (ja) 2010-08-23 2012-09-06 Toshiba Corp 発光装置の製造方法
JP2014057974A (ja) 2012-09-14 2014-04-03 Senju Metal Ind Co Ltd はんだ合金
WO2015152387A1 (ja) 2014-04-02 2015-10-08 千住金属工業株式会社 Ｌｅｄ用はんだ合金およびｌｅｄモジュール
JP2015225938A (ja) 2014-05-27 2015-12-14 株式会社タムラ製作所 はんだ接合構造体の製造方法、はんだ接合構造体およびはんだ接合方法
JP2016179498A (ja) 2015-03-24 2016-10-13 株式会社タムラ製作所 鉛フリーはんだ合金、電子回路基板および電子制御装置
JP2018056397A (ja) 2016-09-29 2018-04-05 日亜化学工業株式会社 メタルベース基板の製造方法、半導体装置の製造方法、メタルベース基板、及び、半導体装置

Also Published As

Publication number Publication date
WO2020176583A1 (en) 2020-09-03
KR20210138614A (ko) 2021-11-19
US11752579B2 (en) 2023-09-12
US20200269360A1 (en) 2020-08-27
EP3931364A1 (en) 2022-01-05
JP2022523203A (ja) 2022-04-21
KR102873457B1 (ko) 2025-10-17
CN113474474A (zh) 2021-10-01

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