KR102873457B1 - 가혹한 서비스 조건을 위한 고 신뢰성의 무연 땜납 합금 - Google Patents

가혹한 서비스 조건을 위한 고 신뢰성의 무연 땜납 합금

Info

Publication number
KR102873457B1
KR102873457B1 KR1020217030585A KR20217030585A KR102873457B1 KR 102873457 B1 KR102873457 B1 KR 102873457B1 KR 1020217030585 A KR1020217030585 A KR 1020217030585A KR 20217030585 A KR20217030585 A KR 20217030585A KR 102873457 B1 KR102873457 B1 KR 102873457B1
Authority
KR
South Korea
Prior art keywords
solder alloy
remainder
solder
alloy
exceeding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020217030585A
Other languages
English (en)
Korean (ko)
Other versions
KR20210138614A (ko
Inventor
지에 겅
홍웬 장
닝청 리
Original Assignee
인듐 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 인듐 코포레이션 filed Critical 인듐 코포레이션
Publication of KR20210138614A publication Critical patent/KR20210138614A/ko
Application granted granted Critical
Publication of KR102873457B1 publication Critical patent/KR102873457B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR1020217030585A 2019-02-26 2020-02-26 가혹한 서비스 조건을 위한 고 신뢰성의 무연 땜납 합금 Active KR102873457B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962810619P 2019-02-26 2019-02-26
US62/810,619 2019-02-26
PCT/US2020/019831 WO2020176583A1 (en) 2019-02-26 2020-02-26 High reliability leadfree solder alloys for harsh service conditions

Publications (2)

Publication Number Publication Date
KR20210138614A KR20210138614A (ko) 2021-11-19
KR102873457B1 true KR102873457B1 (ko) 2025-10-17

Family

ID=70190079

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217030585A Active KR102873457B1 (ko) 2019-02-26 2020-02-26 가혹한 서비스 조건을 위한 고 신뢰성의 무연 땜납 합금

Country Status (6)

Country Link
US (1) US11752579B2 (enExample)
EP (1) EP3931364A1 (enExample)
JP (1) JP7630436B2 (enExample)
KR (1) KR102873457B1 (enExample)
CN (1) CN113474474A (enExample)
WO (1) WO2020176583A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI814081B (zh) * 2019-09-02 2023-09-01 美商阿爾發金屬化工公司 高溫超高可靠性合金、其製造方法及其應用
KR20240019350A (ko) * 2021-06-11 2024-02-14 인듐 코포레이션 혼합 땜납 합금 분말을 갖는 고 신뢰성 무연 땜납 페이스트
CN117798544B (zh) * 2023-11-10 2024-09-20 苏州优诺电子材料科技有限公司 一种高强抗热疲劳无铅焊料合金及其制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160279741A1 (en) * 2015-03-24 2016-09-29 Tamura Corporation Lead-free solder alloy, electronic circuit board, and electronic control device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9260768B2 (en) * 2005-12-13 2016-02-16 Indium Corporation Lead-free solder alloys and solder joints thereof with improved drop impact resistance
US20120043569A1 (en) 2010-08-23 2012-02-23 Kabushiki Kaisha Toshiba Light emitting device and manufacturing method thereof
JP2014057974A (ja) 2012-09-14 2014-04-03 Senju Metal Ind Co Ltd はんだ合金
JP2015077601A (ja) 2013-04-02 2015-04-23 千住金属工業株式会社 鉛フリーはんだ合金
CN106163732B (zh) * 2014-04-02 2019-03-05 千住金属工业株式会社 Led用软钎料合金及led组件
JP6370110B2 (ja) 2014-05-27 2018-08-08 株式会社タムラ製作所 はんだ接合構造体の製造方法、はんだ接合構造体およびはんだ接合方法
JP6200534B2 (ja) 2015-03-24 2017-09-20 株式会社タムラ製作所 鉛フリーはんだ合金、電子回路基板および電子制御装置
TWI764632B (zh) * 2015-05-05 2022-05-11 美商銦業公司 用於嚴苛環境之電子應用的高可靠度無鉛焊料合金
KR102685941B1 (ko) 2015-05-05 2024-07-17 인듐 코포레이션 전자장치 적용을 위한 무연 땜납 합금
JP6230674B2 (ja) * 2016-09-20 2017-11-15 株式会社タムラ製作所 鉛フリーはんだ合金、電子回路基板および電子制御装置
JP6745453B2 (ja) * 2016-05-18 2020-08-26 パナソニックＩｐマネジメント株式会社 はんだ合金およびそれを用いた実装構造体
JP2018056397A (ja) 2016-09-29 2018-04-05 日亜化学工業株式会社 メタルベース基板の製造方法、半導体装置の製造方法、メタルベース基板、及び、半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160279741A1 (en) * 2015-03-24 2016-09-29 Tamura Corporation Lead-free solder alloy, electronic circuit board, and electronic control device

Also Published As

Publication number Publication date
WO2020176583A1 (en) 2020-09-03
KR20210138614A (ko) 2021-11-19
US11752579B2 (en) 2023-09-12
US20200269360A1 (en) 2020-08-27
EP3931364A1 (en) 2022-01-05
JP2022523203A (ja) 2022-04-21
CN113474474A (zh) 2021-10-01
JP7630436B2 (ja) 2025-02-17

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