CN113345825B - 一种晶圆双层输送机构 - Google Patents

一种晶圆双层输送机构 Download PDF

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CN113345825B
CN113345825B CN202110591897.XA CN202110591897A CN113345825B CN 113345825 B CN113345825 B CN 113345825B CN 202110591897 A CN202110591897 A CN 202110591897A CN 113345825 B CN113345825 B CN 113345825B
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CN113345825A (zh
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宣荣卫
陈娟
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Aihua Wuxi Semiconductor Technology Co ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706Mechanical details, e.g. roller, belt
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67733Overhead conveying
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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  • Condensed Matter Physics & Semiconductors (AREA)
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  • Microelectronics & Electronic Packaging (AREA)
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Abstract

本发明涉及半导体制造技术领域,具体为一种晶圆双层输送机构,其能够提高输送效率和设备产能,简化维护操作,其包括安装于底座的下层输送机构,其特征在于,下层输送机构上方设置有上层输送机构,上层输送机构和下层输送机构机构均包括并排布置的至少两个槽体,每个槽体上安装有辊筒轴承座和输送辊筒,下层输送机构的输送起始端第一个槽体为固定槽体,其余的槽体为活动槽体且底部通过滑块与底座上的导轨滑动连接,上层输送机构的输送起始端第一个槽体位于下层输送机构的的输送起始端第二个槽体上方,下层输送机构一侧为传动侧、另一侧为操作侧,下层输送机构的活动槽体可在操作侧向外拉出。

Description

一种晶圆双层输送机构
技术领域
本发明涉及半导体制造技术领域,具体为一种晶圆双层输送机构。
背景技术
在半导体行业中,在晶圆输送时,该道工序通常为单层输送机构,产能较低,为满足晶圆生产节拍的要求,该工序目前主要解决问题的方式是通过在原有输送机构旁继续增加新的设备解决产能低下的问题;但是,以上处理方式,需要占用较多车间的面积;并且输送机构在输送过程中,需要定期进行维护和碎片清理,传统的维护都需要操作人员直接在输送机构一侧进行清理操作,输送机构另一层是封闭的,清理操作比较麻烦,影响整体维护效率。
发明内容
为了解决现有输送效率低,设备产能低下,维护操作麻烦的问题,本发明提供了一种晶圆双层输送机构,其能够提高输送效率和设备产能,简化维护操作。
其技术方案是这样的:一种晶圆双层输送机构,其包括安装于底座的下层输送机构,其特征在于,所述下层输送机构上方设置有上层输送机构,所述上层输送机构和所述下层输送机构均包括并排布置的至少两个槽体,每个所述槽体上安装有辊筒轴承座和输送辊筒,所述下层输送机构的输送起始端第一个所述槽体为固定槽体,其余的所述槽体为活动槽体且底部通过滑块与所述底座上的导轨滑动连接,所述上层输送机构的输送起始端第一个所述槽体位于所述下层输送机构的的输送起始端第二个所述槽体上方,所述下层输送机构一侧为传动侧、另一侧为操作侧,所述下层输送机构的活动槽体可在所述操作侧向外拉出。
其进一步特征在于,所述活动槽体在操作侧安装有拉手;
所述底座旁设置有支撑小车,所述活动槽体拉出时底部由所述支撑小车支撑;
所述上层输送机构往所述传动侧方向平移一段距离布置。
采用本发明后,在下层输送机构上方设置有上层输送机构,在基本不增加占用面积的情况下,可以实现原有两倍输送效率,大大提高设备产能,并且将下层输送机构中除去第一个槽体外都设置为可向外拉开的活动槽体,大大简化了清理操作;进一步的,拉手和支撑小车的设置,可以更加方便于拉动,拉出后可以支撑,防止出现倾斜现象。
附图说明
图1为本发明结构主视图;
图2为本发明结构俯视图;
图3为本发明活动槽体拉开时侧视图。
具体实施方式
见图1至图3所示,一种晶圆双层输送机构,其包括安装于底座1的下层输送机构2,下层输送机构2上方设置有上层输送机构3,上层输送机构3和下层输送机构2均包括并排布置的至少两个槽体,本实施例中均为五个,每个槽体上安装有辊筒轴承座和输送辊筒4,下层输送机构2的输送起始端第一个槽体为固定槽体5,其余的槽体为活动槽体6且底部通过滑块7与底座1上的导轨8滑动连接,上层输送机构3的输送起始端第一个槽体位于下层输送机构2的的输送起始端第二个槽体上方,由于第一个槽体会产生水汽,水汽上升遇到槽体会液化形成冷凝水往下滴落,造成晶圆表面损坏,因此需要错开一个槽体布置,让水汽顺利排出,下层输送机构2一侧为传动侧9、另一侧为操作侧10,下层输送机构2的活动槽体6可在操作侧10向外拉出。为了方便拉出和推回,活动槽体6在操作侧10安装有拉手11。
底座1旁设置有支撑小车12,活动槽体6拉出时底部由支撑小车12支撑,如果没有支撑,则活动槽体6只能拉开较小的距离,否则活动槽体6底部没有支撑会发生倾斜掉落,支撑小车12的存在可以保证活动槽体拉开较多距离,使得清理操作更加方便。
上层输送机构3往传动侧9方向平移一段距离布置,同样是为了方便维护清理操作。
在传动侧9,安装有传动机构,活动槽体与传动机构之间是可以分离的,例如内齿圈和齿轮的配合,输送辊筒4端部安装有齿轮,传动机构连接内齿圈,齿轮插入内齿圈时,内齿圈转动带动输送辊筒转动,也可以是键与键槽的配合。

Claims (1)

1.一种晶圆双层输送机构,其包括安装于底座的下层输送机构,其特征在于,所述下层输送机构上方设置有上层输送机构,所述上层输送机构和所述下层输送机构均包括并排布置的至少两个槽体,每个所述槽体上安装有辊筒轴承座和输送辊筒,所述下层输送机构的输送起始端第一个所述槽体为固定槽体,其余的所述槽体为活动槽体且底部通过滑块与所述底座上的导轨滑动连接,所述上层输送机构的输送起始端第一个所述槽体位于所述下层输送机构的输送起始端第二个所述槽体上方,所述下层输送机构一侧为传动侧、另一侧为操作侧,所述下层输送机构的活动槽体可在所述操作侧向外拉出;所述活动槽体在操作侧安装有拉手;所述底座旁设置有支撑小车,所述活动槽体拉出时底部由所述支撑小车支撑;所述上层输送机构往所述传动侧方向平移一段距离布置。
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CN112340422A (zh) * 2020-10-22 2021-02-09 北京航星机器制造有限公司 一种双层辊道输送装置
CN212654386U (zh) * 2020-07-06 2021-03-05 江苏汇成光电有限公司 一种tray盘包装出货输送装置

Patent Citations (10)

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Publication number Priority date Publication date Assignee Title
CN205166905U (zh) * 2015-12-10 2016-04-20 中航商用航空发动机有限责任公司 存放货架以及用于航空发动机装配制造的装置
WO2018035968A1 (zh) * 2016-08-26 2018-03-01 江苏亚威机床股份有限公司 一种激光切割机用双层交换工作台
CN106144571A (zh) * 2016-08-29 2016-11-23 福建农林大学 具有自动逐步送料功能的流水线装置及其使用方法
CN207580679U (zh) * 2017-12-13 2018-07-06 上海矩子科技股份有限公司 一种双层上下料机构
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CN112340422A (zh) * 2020-10-22 2021-02-09 北京航星机器制造有限公司 一种双层辊道输送装置

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