CN113329982A - 涂覆制品及其制造方法 - Google Patents

涂覆制品及其制造方法 Download PDF

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Publication number
CN113329982A
CN113329982A CN202080010151.9A CN202080010151A CN113329982A CN 113329982 A CN113329982 A CN 113329982A CN 202080010151 A CN202080010151 A CN 202080010151A CN 113329982 A CN113329982 A CN 113329982A
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layer
dielectric layer
transparent substrate
enamel coating
thin film
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韩镇宇
张银学
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Saint Gobain Glass France SAS
Compagnie de Saint Gobain SA
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Saint Gobain Glass France SAS
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    • C03C17/00Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/34Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
    • C03C17/36Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
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    • C03C3/04Glass compositions containing silica
    • C03C3/062Glass compositions containing silica with less than 40% silica by weight
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    • C03C17/34Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
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Abstract

根据本发明的一个示例性实施方案的涂覆制品,其包含透明基材、设置在透明基材上的多层薄膜涂层和图案化区域,其中图案化区域在透明基材的至少一部分上具有以预定图案形成的搪瓷涂层,其中多层薄膜涂层包含在远离透明基材的方向上依次设置的第一介电层、具有红外线反射功能的金属功能层和第二介电层,并且图案化区域包含从多层薄膜涂层中除去第二介电层和金属功能层后留在基材上的第一介电层以及形成于第一介电层上的搪瓷涂层。

Description

涂覆制品及其制造方法
技术领域
本发明涉及一种涂覆制品及其制造方法。具体来说,涉及一种包含多层薄膜涂层和搪瓷涂层的涂覆制品及其制造方法。
背景技术
印刷的玻璃基材有多种用途,例如,在工业、办公室或住宅建筑领域的装饰性和/或功能性目的,车辆的玻璃或烤箱门和冰箱门。为了控制热量,将低辐射玻璃应用于玻璃基材。例如,在应用于烤箱门的情况下,将低辐射涂层应用于玻璃基材的至少一侧,以提高烤箱的隔热性和防止用户接触烤箱门时被烫伤。
低辐射玻璃是其上沉积有低辐射层作为薄膜的玻璃,该低辐射层包含在红外区域具有高反射率的金属,如银(Ag)。印刷的玻璃基材可以通过对在上面沉积有低辐射层的玻璃应用暗色的搪瓷涂层来获得。
然而,在这种情况下,当搪瓷涂层在其上沉积有低辐射层的玻璃上形成时,搪瓷涂层和低辐射层之间的界面中的粘附会变差,因此会产生剥落。为了解决这个问题,在现有技术中,一种方法是在机械地去除要应用搪瓷涂层的部分的低辐射(Low-E)涂层(即边缘删除)后,形成搪瓷涂层,或采用随后专利文件1和2中公开的化学方法,即通过搪瓷涂层和Low-E涂层之间的反应,来去除全部Low-E涂层的方法。然而,当去除Low-E涂层,然后按上述方法应用搪瓷涂层时,碱金属离子会从玻璃传递到搪瓷涂层,使搪瓷涂层的质量变差,并由于碱金属的损失而破坏玻璃网络等等,这些问题经常发生。
现有技术文件
专利文件
1.美国专利注册7,323,088B
2.美国专利公布2015/0376935A
在本背景部分所公开的上述信息只是为了加强对发明背景的理解,因此它可能包含不构成本国中本领域普通技术人员已知的现有技术信息。
发明内容
本发明是为了提供一种当其具有红外线反射功能的多层薄膜时,仍包含具有优良的粘附和表面质量的搪瓷涂层的涂覆制品,以及其制造方法。
然而,本发明的示例性实施方案要解决的任务可能不限于上述任务,并可在本发明所包括的技术范围内以各种方式扩展。
本发明的一个示例性实施方案提供一种涂覆制品,其包含透明基材、设置在透明基材上的多层薄膜涂层和在透明基材的至少一部分上具有以预定图案形成的搪瓷涂层的图案化区域,其中多层薄膜涂层包含在远离透明基材的方向上依次设置的第一介电层、具有红外线反射功能的金属功能层和第二介电层,并且图案化区域包含从多层薄膜涂层中除去第二介电层和金属功能层后留在基材上的第一介电层和形成于第一介电层上的搪瓷涂层。
该多层薄膜涂层可以包含层压在金属功能层的上表面和下表面中至少一个上的阻断层,以防止金属功能层的氧化。
图案化区域所包含的第一介电层可以防止钠离子从透明基材中扩散。
第一介电层可以包含氮化硅。
搪瓷涂层的表面粗糙度可以为0.5μm以下。
搪瓷涂层可以包含至少一种选自Bi和Zn的金属。
搪瓷涂层可以包含黑色颜料。
本发明的另一个实施方案提供一种涂覆制品的制造方法,其包括:印刷用于形成搪瓷涂层的组合物,从而在上面形成有多层薄膜的透明基材的至少一部分上具有预定图案;和通过对在上面上形成有多层薄膜涂层和用于形成搪瓷涂层的组合物的透明基材进行热处理,形成包含搪瓷涂层的图案化区域;其中多层薄膜涂层在远离透明基材方向上包含第一介电层、具有红外线反射功能的金属功能层和第二介电层,将金属功能层和第二介电层从在上面通过热处理形成有图案化区域的部分中去除,而第一介电层留在搪瓷涂层和透明基材之间。
该多层薄膜涂层可以进一步包含层压在金属功能层的上表面和下表面中至少一个上的阻断层,以防止金属功能层的氧化。
热处理可在500℃至720℃的温度下进行。
用于形成搪瓷涂层的组合物可以包含对金属功能层具有蚀刻性能的金属氧化物。
金属氧化物可以是选自Bi2O3和ZnO的至少一种。
金属氧化物可以是Bi2O3,并且在用于形成搪瓷涂层的组合物中所包含的全部玻璃料中,Bi2O3的含量为55重量%至69重量%。
该制造方法可包括测量金属功能层的电阻的步骤,以确认在热处理过程中金属功能层的去除,并当金属功能层的电阻等于或大于100Ω/m2时停止热处理。
该制造方法可进一步包括在热处理前干燥和预热用于形成搪瓷涂层的组合物。
热处理可以是透明基材的回火过程。
本发明的另一个实施方案提供一种通过上述的制造方法制造的涂覆制品。
根据本发明的示例性实施方案,当设置具有红外线反射功能的多层薄膜涂层时,仍可以获得包含具有优良的粘附和表面质量的搪瓷涂层的涂覆制品。
附图说明
图1显示根据本发明的一个示例性实施例的涂覆制品的横截面图。
图2显示根据本发明的另一个示例性实施例,制造涂覆制品的过程。
图3显示根据本发明的示例性实施例和比较例,在形成搪瓷涂层的阶段测量的电阻变化图。
图4显示根据本发明的示例性实施例和比较例的搪瓷涂层表面的照片。
图5显示根据本发明的示例性实施例和比较例,搪瓷涂层和透明基材之间空间的SEM照片。
具体实施方式
应当理解,尽管术语第一、第二、第三等在这里可以用来描述各种元素、部件、区域、层和/或部分,但它们并不限于此。这些术语仅用于区分一个元素、部件、区域、层或部分与另一个元素、部件、区域、层或部分。因此,下面讨论的第一元素、组件、区域、层或部分可以称为第二元素、组件、区域、层或部分,而不偏离本发明的教义。
本文使用的技术术语只是提到一个特定的示范性实施方案,并不意味着限制本发明。以单数使用的表达方式包含了复数的表达方式,除非它在上下文中有明显不同的含义。在说明书中,应理解诸如“包括”、“具有”等术语是为了表明说明书中披露的具体特征、区域、数字、阶段、操作、元素、组件或其组合的存在,而不是为了排除一个或多个其他具体特征、区域、数字、操作、元素、组件或其组合可能存在或可能添加的可能性。
当一个部分称为“在”另一个部分“上”时,它可以直接在另一个部分上或者也可以有中间部分的存在。相反,当一个元素称为“直接在”另一个元素“上”时,其间没有中间的元素。
除非另有定义,本文使用的所有术语,包括技术或科学术语,与本发明所属领域中具有普通知识的人普遍理解的含义相同。诸如在一般使用的字典中定义的术语应解释为具有与相关技术领域的上下文含义相同的含义,并且除非在本申请中明确定义,否则不得解释为具有理想化或过于正式的含义。
下面详细描述本发明的示例性实施方案,以便本发明所涉及的技术领域的技术人员可以很容易地实施这些示例性实施方案。
正如本领域的技术人员所应当理解,所描述的实施方案可以以各种不同的方式进行修改,而所有这些都不会偏离本发明的精神或范围。
图1显示根据本发明的一个示例性实施例的涂覆制品的横截面图。
参照图1,根据本发明的一个示例性实施例的涂覆制品包含透明基材10和在透明基材10上形成的多层薄膜涂层20,并进一步包含在透明基材10的至少一部分上作为预定图案形成的图案化区域(PA)。
透明基材10没有具体限制,但优选是由无机材料如玻璃或聚合物基质的有机材料制造。
多层薄膜涂层20包含设置在远离透明基材10方向上的第一介电层201、具有红外线反射功能的金属功能层210和第二介电层202。多层薄膜涂层20还包含堆叠在金属功能层210的上表面和下表面中至少一个上的阻断层221和222。
第一介电层201和第二介电层202可以包含金属氧化物、金属氮化物或金属氧氮化物。金属可包含钛(Ti)、铪(Hf)、锆(Zr)、铌(Nb)、锌(Zn)、铋(Bi)、铅(Pb)、铟(In)、锡(Sn)和硅(Si)中的至少一种。优选地,可以包含氮化硅(Si3N4)。
在本示例性实施方案中,将第一介电层201和第二介电层202举例说明为单层,它们不限于此。它们可以分别形成为具有两层以上的层压体。此外,还可以在第一介电层201和第二介电层202中额外掺杂Al等。通过掺杂Al,可以在制造过程中顺利地形成介电层。第一介电层201和第二介电层202可以包含掺杂剂,例如,氟、碳、氮、硼、磷和/或铝。即,溅射过程中使用的靶材被掺杂铝、硼或锆,从而改善涂层的光学性能,并提高通过溅射形成的介电层的形成速度。当第一介电层201和第二介电层202包含氮化硅时,可以掺杂锆,以摩尔比计,Zr(Si+Zr)可以是10到50%。当掺杂锆时,介电层的折射率可能会增加,且透光率可能会增加。具体来说,第一介电层201和第二介电层202可以是锆-掺杂的氮化硅,但不限于此。
介电层中最靠近透明基材10的第一介电层201,其形成以延伸至图案化区域(PA),并位于搪瓷涂层30和图案化区域(PA)中的透明基材10之间,以防止钠离子从透明基材10中扩散,详细内容会与后面描述的图案化区域(PA)一起描述。
金属功能层210具有红外线(IR)反射特性。金属功能层210可以包含金(Au)、铜(Cu)、钯(Pd)、铝(Al)和银(Ag)中的至少一种。具体来说,它可以包含银或银合金。银合金可以包含银-金合金和银-钯合金。
这里金属功能层210可以包含单层(单一的Low-E涂层),或者可以包含至少两个金属功能层。即,可以包含两个或三个金属功能层,如果需要,可以包含四个金属功能层。例如,当包含两个金属功能层(双Low-E涂层)时,多层薄膜涂层包含在远离透明基材的方向设置的:第一介电层201、第一金属功能层210、第二介电层202、第二金属功能层(未显示)和第三介电层(未显示)。第三介电层的结构(configuration)可以等同于或不同于上述的第一介电层201和第二介电层202。在这种情况下,第一和第二金属功能层的厚度之和可以是27至33nm。当它们非常薄时,太阳得热系数(SHGC)可能会增加。当它们非常厚时,透射色的色坐标可能与蓝色相距甚远。
在本发明的一个示例性实施方案中,可进一步包含堆叠在金属功能层210的上表面和下表面中的至少一个上并防止金属功能层210的氧化的阻断层221和222。当有多个金属功能层210时,可进一步包含对应各金属功能层的阻断层。图1显示,阻断层221和222堆叠在金属功能层210的上表面和下表面上,但不限于此。它们可以形成在上表面和下表面中的一个上。阻隔层221和222可以包含钛、镍、铬和铌中的至少一种。进一步具体来说,它们可以包含镍-铬合金。在这种情况下,部分铬可能在溅射过程中改变为氮化物。阻断层221和222的厚度可以分别为0.5至2nm。
在多层薄膜涂层20的最外部分可以进一步包含包覆层(未显示)。即,在单Low-E涂层的情况下,包覆层可以形成在第二介电层202上,或者在双Low-E涂层的情况下,它可以形成在第三介电层上。每当包含一个额外的层时,包覆层可以形成在多层薄膜涂层20离透明基材10最远的一层上。包覆层可以是TiOx、TiOxNy、TiNx和Zr掺杂剂中的至少一种。进一步具体来说,包覆层可以包含TiZrxOyNz(此处,x为0.5至0.7,y为2.0至2.5,z为0.2至0.6)。通过包含包覆层,可以防止多层薄膜涂层20中所包含的层损坏。
在本发明的一个示例性实施例中,在透明基材10的至少一部分上以预定图案形成的图案化区域(PA)包含用于覆盖预定图案的搪瓷涂层30,并包含提供于搪瓷涂层30和透明基材10之间的第一介电层201。
搪瓷涂层30可以表现为暗色,并且可以根据其用途,带着各类图案形成。例如,它可以有一个沿涂覆制品100的边缘延伸的框或画框形状,它可以有一个特定的形状,以产生装饰效果,而且没有具体限制。
搪瓷涂层30可以包含黑色颜料,并且可以形成为对可见光不透明。搪瓷涂层30可以由通过熔化玻璃料所获得的有机组合剂制成。即,搪瓷涂层30可以通过应用组合物(或糊)并将其干燥、融化和冷却而形成,其中,该组合物包含玻璃料、有机载体(或粘合剂)和液体补充剂。在该例中,用于制造玻璃料的原料包含金属氧化物,该金属氧化物至少包含Bi2O3和ZnO中的一种。因此,由此形成的搪瓷涂层30包含金属氧化物,该金属氧化物包含Bi和Zn中至少一种。此外,搪瓷涂层30的厚度可以是5μm至30μm,但不限于此。
第一介电层201设置在搪瓷涂层30和透明基材10之间。第一介电层201防止钠离子从透明基材10扩散到搪瓷涂层30,从而提高搪瓷涂层30的粘附,并还在制造过程中抑制搪瓷涂层30内部气泡的产生,从而改善搪瓷涂层30的表面特性。
特别地,当把搪瓷涂层30应用到透明基材10上时,其中在该透明基材10上面形成有包含金属功能层210的多层薄膜涂层20,随着时间的推移,会产生金属沉积物,搪瓷涂层30很容易从金属功能层210上剥落,因此很难将搪瓷涂层30应用于透明基材10。为了解决这个问题,在现有技术中,提出了一种通过物理方法(边缘删除)或化学方法从应用有搪瓷涂层30的部分去除多层薄膜20的方法,并允许搪瓷涂层30直接接触透明基材10。然而,当搪瓷涂层30直接接触透明基材10时,有许多路径可供碱离子(如钠离子)通过搪瓷涂层30上形成的玻璃网络之间的间隙,因此,从玻璃制成的透明基材10路径中通过的钠离子的移动增加。正因为如此,透明基材10的玻璃因钠离子的分离而被腐蚀,当网络被破坏时,搪瓷涂层30的粘附变差,并且搪瓷涂层30变色和被腐蚀。
然而,根据本发明的一个示例性实施方案,特别去除金属功能层210,并且第一介电层201存在于搪瓷涂层30和透明基材10之间,因此,由于没有由金属功能层210产生的沉积物,粘附不会变差,并且碱离子(或钠离子)的移动被第一介电层201阻断,从而防止腐蚀、变色以及搪瓷涂层30和透明基材10之间粘附变差。此外,根据本发明的一个示例性实施方案,第一介电层201可能很容易形成,而不需要额外的过程,在形成过程中可以减少气泡的产生,并且搪瓷涂层30的表面质量可以得到改善。即,根据本发明的一个示例性实施方案的搪瓷涂层30的表面粗糙度在0.5μm以下。
现参照图2,根据本发明的一个示例性实施方案描述一种制造涂覆制品的方法。
图2显示根据本发明的另一个示例性实施例,制造涂覆制品的过程。
首先,多层薄膜涂层20形成在透明基材10上,其中该多层薄膜涂层20带有依次堆叠的第一介电层201、第一阻断层221、金属功能层210、第二阻断层222和第二介电层202的结构。
多层薄膜涂层20的各层可以通过物理气相沉积(PVD)方法(如溅射)形成。
用于形成搪瓷涂层的组合物301印刷在多层薄膜涂层20的至少一部分上,以便有预定图案。
用于形成搪瓷涂层的包含玻璃料、黑色颜料和有机载体的组合物301可以是糊的形式。即,用于形成糊-型搪瓷涂层的组合物301以优选的形式通过如丝网印刷的方法印刷在多层薄膜涂层20上。
这里玻璃料可以包含用于形成一般搪瓷涂层的玻璃料的组分,例如,它可以由包含SiO2、B2O3、Bi2O3、Al2O3、ZnO、Na2O2、K2O3、Li2O2、BaO和MgO在内的原料制造。特别地,为了便于熔化多层薄膜涂层20中包含的层,至少有一种选自Bi2O3和ZnO的金属氧化物作为必要组分被包含在内。在这种情况下,金属氧化物可以是Bi2O3,Bi2O3的含量可以是玻璃料的55重量%至69重量%。
此外,黑色颜料代表用于分配所需颜色到搪瓷涂层30的组分,例如,可以使用铬-铜氧化物或尖晶石-型黑色颜料,但没有具体限制,可以适当地选择和使用普遍使用的陶瓷颜料。另一种方法,可以通过玻璃料中包含的组分而不是额外的颜料来实现黑色。
玻璃料和黑色颜料均匀地分散在有机载体中。这里有机载体可由挥发性材料形成,因此在印刷用于形成搪瓷涂层的组合物301后,可通过预热或干燥过程去除有机载体。本例中的过程温度等于或低于玻璃料的软化点,该温度是仅有机载体可以汽化的温度,可以根据有机载体的类型来选择。例如,该过程可在70℃至170℃的温度下进行。
包含搪瓷涂层30的图案化区域(PA)是通过对层压体进行热处理而形成的,该层压体在由用于形成搪瓷涂层的组合物301形成的图案上去除有机载体后形成。
热处理可在500℃至720℃的温度下进行。在相应温度下进行热处理时,用于形成搪瓷涂层的组合物301中所包含的玻璃料熔化,通过这种方式,在设置于图案化区域(PA)的对应部分上的多层薄膜涂层20中的第二电介质材料202、金属功能层210和阻断层221和222溶解在熔化的玻璃料中,如图2的箭头D所示。
特别地,在这种情况下,热处理一直进行到第一介电层201留在图案化区域(PA)中,而第二电介质材料202,金属功能层210、以及阻断层221和222溶解和被去除。
这里,为了确认第二介电材料202、金属功能层210、阻断层221和222被去除,而第一介电层201仍留在图案化区域(PA),进一步包括测量金属功能层210的电阻的步骤。即,当金属功能层210存在于图案化区域(PA)时,由于导电的金属功能层210,测量的电阻非常低。而当进行热处理且金属功能层210被去除时,导电层消失,测量的电阻值急剧增加。例如,通过当测量的电阻等于或大于100Ω/m2时停止热处理,第一介电层201仍留在图案化区域(PA),而第二介电材料202、金属功能层210以及阻断层221和222被去除。特别地,当电阻等于或大于100Ω/m2时,一些金属功能层210可能以岛形状残留,但大部分已经去除,因此如上所述产生了高电阻,其中金属功能层210被去除并且保留第一介电层201的这样的结构没有额外的确认过程。
此外,在通过热处理来溶解多层薄膜涂层20中所包含的层的过程中,玻璃料中包含的氧化物与多层薄膜涂层20中所包含的层发生反应。而作为反应结果所产生的气体可能留在搪瓷涂层30中,并可能使搪瓷涂层30的质量变差。即,气泡未能离开搪瓷涂层30,搪瓷涂层30的表面变得粗糙。然而,在本发明的一个示例性实施方案中,最后,第一介电层201作为与玻璃料反应而产生残留气泡的原因,并没有反应而是保留下来,从而防止了残留气泡。因此,可以得到表面粗糙度较小的搪瓷涂层30。
此外,强化透明基材10的过程,即回火的过程,也可以通过热处理一起进行。即,用于形成搪瓷涂层30的热处理过程在足够高的温度下进行,因此可以得到充分强化的透明基材10,而无需额外的回火过程。
根据本发明的一个示例性实施方案的制造方法,涂覆制品100可以通过使搪瓷涂层30和透明基材10之间的由氮化硅制成的第一介电层201保留在图案化区域(PA)中而获得,不需要额外的加工,因此,在透明基材10(其包含多层薄膜涂层20)上形成的搪瓷涂层30可以提供良好的粘附,抑制内部气泡的产生,并提供优良的表面质量。此外,抑制碱离子在透明基材10和搪瓷涂层30之间的移动,从而防止玻璃制成的透明基材10和搪瓷涂层30被腐蚀和变色。
现在参照实验例对本发明进行更详细的说明。然而,该实验例是对本发明的示范,本发明并不限于此。
实施例
Planitherm Dura Plus(品牌名称,应用了单Low-E涂层的玻璃基材)是韩国玻璃工业有限公司(Glass Industry Co.,Ltd.Korea)制备的一种低辐射玻璃,其作为包含多层薄膜涂层的透明基材。
这里,用于形成搪瓷涂层的组合物包含:通过混合具有表1中表示的组合物的玻璃料得到的有机载体、陶氏化学(Dow Chemical)的ETHOCELTM STD.45、ETHOCELTM STD.14(即,乙基纤维素)以及乙酸丁酯,有机载体、乙基纤维素和乙酸丁酯的比例为1.3:1.7:19,该组合物印在包含多层薄膜涂层的透明基材上,在60℃的温度下干燥20分钟,在90℃的温度下进一步干燥20分钟,并在670℃的温度下进行热处理,得到其中在透明基材上(其包含多层薄膜涂层)形成有搪瓷涂层的涂覆制品。
表1
Figure BDA0003172473980000101
在这种情况下,在示例性实施例1和2中,当测量电阻并且电阻等于或大于100Ω/m2时,立即停止热处理(即,当时间变成约230秒时停止热处理,如图3中所示),而在对比例1和2中,当测量电阻并且电阻变得等于或大于100Ω/m2时,进一步进行热处理约80秒。也就是说,如图3所示,在对比例1和2的情况下,电阻在大约150秒处急剧增加,热处理继续进行而不停止,因此,热处理的时间为230秒,与示例性实施例1和2一致。
示例性实施例和对比例获得的搪瓷涂层30的层结构、表面粗糙度和表面拍照结果见表2、图4和图5。图5的SEM图像可以确认搪瓷涂层和透明基材之间保留有Si3N4层。
表2
Figure BDA0003172473980000111
如表2、图4和图5所示,可以发现,在示例性实施例1和2的情况下,其中当多层薄膜涂层的电阻等于或大于100Ω/m2时,立即停止热处理,保留Si3N4(第一介电层)(在搪瓷涂层和透明基材之间第一介电层的厚度约为37.3nm,38.1nm厚度被保留),且搪瓷涂层的表面粗糙度小于0.5μm,显示出优良的表面质量。相反,在对比例1和2中证实,如图5所示,多层薄膜涂层被去除,而没有保留第一介电层,在这种情况下得到的搪瓷涂层的表面粗糙度非常高。也就是说,根据本发明的示例性实施例,Si3N4(第一介电层)留在搪瓷涂层和透明基材之间,搪瓷涂层的表面粗糙度得到改善。
本发明不限于示例性实施例,可以以各种形式生产,本发明相关领域的技术人员会理解,本发明的示例性实施例可以以其他具体形式实施,而不修改本发明的技术精神或基本特征。因此,应该理解的是,上述的示例性实施例在所有方面都是说明性的,而非限制性的。
附图标记
10:透明基材
20:多层薄膜涂层
30:搪瓷涂层
PA:图案化区域
201:第一介电层
202:第二介电层
210:金属功能层
221,222:阻断层
100:涂覆制品

Claims (17)

1.一种涂覆制品,其包含
透明基材、设置在所述透明基材上的多层薄膜涂层和图案化区域,所述图案化区域在所述透明基材的至少一部分上具有以预定图案形成的搪瓷涂层,
其中所述多层薄膜涂层包含在远离所述透明基材的方向上依次设置的第一介电层、具有红外线反射功能的金属功能层和第二介电层,并且
所述图案化区域包含从所述多层薄膜涂层中除去所述第二介电层和金属功能层后留在所述基材上的第一介电层以及形成于所述第一介电层上的搪瓷涂层。
2.如权利要求1所述的涂覆制品,其中
所述多层薄膜涂层包含层压在所述金属功能层的上表面和下表面中的至少一个上的阻断层,以防止所述金属功能层的氧化。
3.如权利要求1所述的涂覆制品,其中
所述图案化区域所包含的第一介电层防止钠离子从所述透明基材中扩散。
4.如权利要求1所述的涂覆制品,其中
所述第一介电层包含氮化硅。
5.如权利要求1所述的涂覆制品,其中
所述搪瓷涂层的表面粗糙度为0.5μm以下。
6.如权利要求1所述的涂覆制品,其中
所述搪瓷涂层包含至少一种选自Bi和Zn的金属。
7.如权利要求1所述的涂覆制品,其中
所述搪瓷涂层包含黑色颜料。
8.一种涂覆制品的制造方法,其包括:
印刷用于形成搪瓷涂层的组合物,从而使在上面形成有多层薄膜涂层的透明基材的至少一部分上具有预定图案;和
通过对在上面形成有多层薄膜涂层和用于形成搪瓷涂层的组合物的透明基材进行热处理,形成包含搪瓷涂层的图案化区域,
其中
所述多层薄膜涂层在远离所述透明基材方向上包含第一介电层、具有红外线反射功能的金属功能层和第二介电层,
将所述金属功能层和所述第二介电层从在上面通过所述热处理形成有图案化区域的部分中去除,并且所述第一介电层留在所述搪瓷涂层和所述透明基材之间。
9.如权利要求8所述的制造方法,其中
所述多层薄膜涂层还包含层压在所述金属功能层的上表面和下表面中至少一个上的阻断层,以防止所述金属功能层的氧化。
10.如权利要求8所述的制造方法,其中
所述热处理在500℃至720℃的温度下进行。
11.如权利要求8所述的制造方法,其中
所述用于形成搪瓷涂层的组合物包含对所述金属功能层具有蚀刻性能的金属氧化物。
12.如权利要求8所述的制造方法,其中
所述金属氧化物为选自Bi2O3和ZnO中的至少一种。
13.如权利要求12所述的制造方法,其中
所述金属氧化物为Bi2O3,并且在用于形成搪瓷涂层的组合物所包含的全部玻璃料中,所述Bi2O3的含量为55重量%至69重量%。
14.如权利要求8所述的制造方法,其包括
测量所述金属功能层的电阻以确认在所述热处理过程中金属功能层的去除,并且
当所述金属功能层的电阻等于或大于100Ω/m2时停止所述热处理。
15.如权利要求8所述的制造方法,进一步包括
在所述热处理之前干燥和预热所述用于形成搪瓷涂层的组合物。
16.如权利要求8所述的制造方法,其中
所述热处理为所述透明基材的回火过程。
17.一种涂覆制品,其通过权利要求9至16中任一项所述的方法制造。
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Application publication date: 20210831