CN113172180A - Coarse aluminum wire bonding machine - Google Patents
Coarse aluminum wire bonding machine Download PDFInfo
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- CN113172180A CN113172180A CN202110398769.3A CN202110398769A CN113172180A CN 113172180 A CN113172180 A CN 113172180A CN 202110398769 A CN202110398769 A CN 202110398769A CN 113172180 A CN113172180 A CN 113172180A
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 25
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 25
- 238000003466 welding Methods 0.000 claims abstract description 136
- 230000007246 mechanism Effects 0.000 claims abstract description 92
- 238000003384 imaging method Methods 0.000 claims abstract description 15
- 239000004065 semiconductor Substances 0.000 claims description 29
- 230000005540 biological transmission Effects 0.000 claims description 16
- 238000007599 discharging Methods 0.000 claims description 2
- 230000000007 visual effect Effects 0.000 abstract description 11
- 238000012544 monitoring process Methods 0.000 abstract description 6
- 238000013519 translation Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000011324 bead Substances 0.000 description 4
- 230000009471 action Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F15/00—Connecting wire to wire or other metallic material or objects; Connecting parts by means of wire
- B21F15/02—Connecting wire to wire or other metallic material or objects; Connecting parts by means of wire wire with wire
- B21F15/06—Connecting wire to wire or other metallic material or objects; Connecting parts by means of wire wire with wire with additional connecting elements or material
- B21F15/08—Connecting wire to wire or other metallic material or objects; Connecting parts by means of wire wire with wire with additional connecting elements or material making use of soldering or welding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/745—Apparatus for manufacturing wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/745—Apparatus for manufacturing wire connectors
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
The invention discloses a coarse aluminum wire bonding machine, which is characterized in that the traditional four-freedom structure is generally compounded into an integral lead welding machine head module for decoupling, and an X-axis driving mechanism and a Y-axis driving mechanism are decoupled through an X-axis guide rail and a Y-axis guide rail; the Z-axis driving mechanism and the rotary driving mechanism are decoupled through the spline shaft, so that the whole welding head module is lighter; the monitoring visual structure which is vertically arranged and combined with the welding head structure in the prior art is changed into a monitoring visual structure which is transversely arranged outside the welding head module, the propagation direction of a light path of light irradiated to a welding position after being reflected is changed through a prism, so that the reflected light can smoothly enter an imaging camera for imaging, and the quality and the volume of the welding head module can be reduced as much as possible by splitting the camera visual structure and the welding head module; make whole welding head module lightweight as far as possible, improve the translation rate of welding head module, effectively improve welding efficiency.
Description
Technical Field
The invention relates to a welding device for an inner lead of a semiconductor power device, in particular to a bonding machine for a coarse aluminum wire.
Background
A coarse aluminum wire bonding machine is mainly applied TO welding inner leads of semiconductor power devices such as TO-220 and TO-3P packaged large and medium power triodes, thyristors, field effect tubes, large-current fast recovery diodes, Schottky diodes and the like. In the existing coarse aluminum wire bonding machine, the size and the mass of a lead welding head module are generally large (for example, all structures for driving the lead welding head module to move in four degrees of freedom are compounded into a whole in the lead welding head module, and a visual structure for monitoring the welding process is compounded in the lead welding head module), so that the lead welding head module is slow in moving and cannot move in a light weight manner.
Accordingly, the prior art is yet to be improved and developed.
Disclosure of Invention
The invention aims to provide a coarse aluminum wire bonding machine, which solves one or more problems and enables a welding head module of the coarse aluminum wire bonding machine to realize motion lightweight.
The technical scheme of the invention is as follows: this technical scheme provides a thick aluminum wire bonding machine, includes:
the feeding clamp module is used for conveying a semiconductor power device to be processed to a welding station, fixing the semiconductor power device during welding of the semiconductor power device, and conveying and discharging the semiconductor power device after the welding of the semiconductor power device is finished;
the welding head module is used for realizing lead welding on the semiconductor power device at a welding station;
the welding head motion driving mechanism is used for driving the welding head module to realize motion;
the paying-off module is used for providing bonding wires to the welding head module to realize lead welding;
the welding head motion driving mechanism comprises an X-axis driving mechanism, a Y-axis driving mechanism, a Z-axis driving mechanism, a rotation driving mechanism, an X-axis guide plate, a Y-axis guide plate, a mounting plate and a spline shaft;
the Y-axis guide plate is arranged on the X-axis guide plate and is connected with the X-axis driving mechanism, and the Y-axis guide plate is driven by the X-axis driving mechanism to move back and forth on the X-axis guide plate along the X-axis direction;
the mounting plate is arranged on the Y-axis guide plate and connected with the Y-axis driving mechanism, and the mounting plate is driven by the Y-axis driving mechanism to move back and forth on the Y-axis guide plate along the Y-axis direction;
the Z-axis driving mechanism and the rotary driving mechanism are both arranged on the mounting plate;
the welding head module is arranged at one end part of the spline shaft;
the Z-axis driving mechanism is connected with the spline shaft and drives the welding head module to lift up and down along the Z-axis direction;
and the rotary driving mechanism is connected with the spline shaft to drive the welding head module to rotate by taking the spline shaft as a rotating center.
Furthermore, the device also comprises a feeding module for bearing the semiconductor power device to be processed and a receiving module for bearing the processed semiconductor power device.
The spline shaft further comprises a shaft body and a rotating part, the shaft body penetrates through the rotating part to be installed in a matched mode, the shaft body rotates in the rotating part, and the welding head module is installed at one end part of the shaft body; the Z-axis driving mechanism is connected with the axis body and drives the axis body to lift up and down in the rotating piece along the Z-axis direction; the rotating part is connected with the rotary driving mechanism, and the rotary driving mechanism drives the rotating part and the shaft body to realize rotation.
Furthermore, an X-axis guide rail arranged along the X-axis direction is arranged on the X-axis guide plate, the bottom of the Y-axis guide plate is clamped on the X-axis guide rail through a sliding block, and the X-axis guide plate moves back and forth along the X-axis direction.
Furthermore, a Y-axis guide rail arranged along the Y-axis direction is arranged on the Y-axis guide plate, the bottom of the mounting plate is clamped on the Y-axis guide rail through a sliding block, and the mounting plate moves back and forth along the Y-axis direction on the Y-axis guide plate.
Furthermore, the X-axis driving mechanism comprises an X-axis driving motor, a screw rod which is connected with a motor shaft of the X-axis driving motor and rotates along with a motor shaft, and a sliding block which is arranged on the screw rod and rotates along with the screw rod to move back and forth, and the Y-axis guide plate is connected with the sliding block; the welding head module is driven to move back and forth along the X-axis direction by the X-axis driving motor.
Furthermore, the Y-axis driving mechanism comprises a Y-axis driving motor, a screw rod, a sliding block and a moving plate, wherein the screw rod is connected with a motor shaft of the Y-axis driving motor and rotates along with a motor shaft; and the welding head module is driven to move back and forth along the Y-axis direction by the Y-axis driving motor.
Furthermore, the Z-axis driving mechanism comprises a Z-axis driving motor arranged along the vertical direction, a screw rod connected with a motor shaft of the Z-axis driving motor and rotating along with a motor shaft, and a sliding block arranged on the screw rod and rotating along with the screw rod and moving back and forth, wherein the sliding block is connected with the shaft body; and the welding head module is driven to lift up and down along the Z-axis direction by the Z-axis driving motor.
Furthermore, the rotary driving mechanism comprises a rotary motor and a driving transmission wheel arranged on a motor shaft of the rotary motor, a driven transmission wheel is sleeved outside the rotary part, and the driving transmission wheel and the driven transmission wheel are in transmission connection through a belt; the welding head module is driven to rotate through the rotary driving mechanism.
Further, including setting up the camera vision structure on the X axle deflector, the welding head module is located the below of X axle deflector, camera vision structure is transversely to be set up on the X axle deflector, and the welding head module carries out the inner lead welding of semiconductor power device at the welding station, and the light reflection that shines welding position department upwards transmits behind 90 turns and gets into camera vision structure formation of image.
The invention has the beneficial effects that: the invention provides a coarse aluminum wire bonding machine, wherein the traditional four-freedom structure is generally compounded into an integral lead welding machine head module for decoupling, and an X-axis driving mechanism and a Y-axis driving mechanism are decoupled through an X-axis guide rail and a Y-axis guide rail; the Z-axis driving mechanism and the rotary driving mechanism are decoupled through the spline shaft, so that the whole welding head module is lighter; the monitoring visual structure which is vertically arranged and combined with the welding head structure in the prior art is changed into a monitoring visual structure which is transversely arranged outside the welding head module, the propagation direction of a light path of light irradiated to a welding position after being reflected is changed through a prism, so that the reflected light can smoothly enter an imaging camera for imaging, and the quality and the volume of the welding head module can be reduced as much as possible by splitting the camera visual structure and the welding head module; make whole welding head module lightweight as far as possible, improve the translation rate of welding head module, effectively improve welding efficiency.
Drawings
Fig. 1 and 2 are schematic structural views of a coarse aluminum wire bonding machine according to the present invention.
Fig. 3 and 4 are schematic structural views of a welding head motion driving mechanism and a welding head module in the invention.
FIG. 5 is a schematic view of the spline shaft structure in the present invention.
Fig. 6 and 7 are schematic structural views of the visual structure of the camera in the invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or uses of other materials.
As shown in fig. 1 to 4, a crude aluminum wire bonding machine includes:
the feeding module 1 is used for bearing a semiconductor power device to be processed;
the material receiving module 2 is used for bearing the processed semiconductor power device;
the feeding clamp module 3 is used for conveying the semiconductor power device from the feeding module 1 to a welding station, fixing the semiconductor power device during welding of the semiconductor power device, and conveying the semiconductor power device into the receiving module 2 after the welding of the semiconductor power device is finished;
the welding head module 4 is used for realizing lead welding on the semiconductor power device at a welding station;
the welding head motion driving mechanism is used for driving the welding head module 4 to move;
the paying-off module is used for providing bonding wires (namely aluminum wires) to the welding head module 4 to realize lead welding;
the welding head motion driving mechanism comprises an X-axis driving mechanism, a Y-axis driving mechanism, a Z-axis driving mechanism, a rotation driving mechanism, an X-axis guide plate 421, a Y-axis guide plate 431, a mounting plate 441 and a spline shaft 46;
the Y-axis guide plate 431 is arranged on the X-axis guide plate 421, the Y-axis guide plate 431 is connected with the X-axis driving mechanism, and the Y-axis guide plate 431 is driven by the X-axis driving mechanism to move back and forth on the X-axis guide plate 421 along the X-axis direction;
the mounting plate 441 is arranged on the Y-axis guide plate 431, the mounting plate 441 is connected with a Y-axis driving mechanism, and the mounting plate 441 is driven by the Y-axis driving mechanism to move on the Y-axis guide plate 431 back and forth along the Y-axis direction;
the Z-axis driving mechanism and the rotary driving mechanism are both arranged on the mounting plate 441;
the welding head module 4 is arranged at one end part of the spline shaft 46;
the Z-axis driving mechanism is connected with the spline shaft 46 and drives the welding head module 4 to lift up and down along the Z-axis direction;
the rotation driving mechanism is connected with the spline shaft 46 to drive the welding head module 4 to rotate by taking the spline shaft 46 as a rotation center.
In some embodiments, as shown in fig. 5, the spline shaft 46 includes a shaft body 461 and a rotating member 462, the shaft body 461 is fittingly installed through the rotating member 462, the shaft body 461 rotates in the rotating member 462, and the welding head module 4 is installed at one end of the shaft body 461; the Z-axis driving mechanism is connected to the shaft body 461 to drive the shaft body 461 to move up and down in the rotating member 462 along the Z-axis direction; the rotating element 462 is connected with a rotation driving mechanism, and the rotation driving mechanism drives the rotating element 462 and the shaft body 461 to rotate.
In some embodiments, a mounting bracket 4411 is disposed on the mounting plate 441, a mounting bearing is disposed on the mounting bracket 4411, and the rotating member 462 is mounted in the mounting bearing, and the rotating member 462 rotates in the mounting bearing. According to actual use requirements, the spline shaft 46 can be used in cooperation with the mounting bearing, or the spline shaft 46 with the mounting bearing can be directly used for direct mounting.
In this embodiment, the spline shaft 46 is a hollow spline shaft, wherein a welding wire (i.e., an aluminum wire) passes through the hollow spline shaft to reach the welding head module 4 to realize welding; wherein, part of electric wires in the welding head motion driving mechanism (namely electric wires in the Z-axis driving mechanism and the rotary driving mechanism) pass through the spline shaft of the hollow structure to realize wiring; like this, can further make welding head module 4 and welding head motion actuating mechanism's overall structure compacter, succinct, realize welding head module 4's motion lightweight.
In some embodiments, an X-axis guide rail 4211 is disposed on the X-axis guide plate 421, and the bottom of the Y-axis guide plate 431 is engaged with the X-axis guide rail 4211 through a slider to move back and forth on the X-axis guide plate 421 along the X-axis direction. Specifically, the X-axis guide rail 4211 may be replaced with another guide structure such as a guide screw slider.
In some embodiments, a Y-axis guide rail 4311 is disposed on the Y-axis guide plate 431 along the Y-axis direction, and the bottom of the mounting plate 441 is engaged with the Y-axis guide rail 4311 through a slider to move back and forth along the Y-axis direction on the Y-axis guide plate 431. Specifically, the Y-axis guide rail 4311 may be replaced with another guide structure such as a guide screw slider.
In some embodiments, the X-axis driving mechanism includes an X-axis driving motor 422, a lead screw connected to a motor shaft of the X-axis driving motor 422 and rotating along with a motor shaft, and a slider disposed on the lead screw and moving back and forth along the lead screw as the lead screw rotates, and the Y-axis guide plate 431 is connected to the slider; the welding head module 4 is driven by the X-axis driving motor 422 to move back and forth along the X-axis direction.
In some embodiments, the Y-axis driving mechanism includes a Y-axis driving motor 432, a lead screw connected to a motor shaft of the Y-axis driving motor 432 and rotating with a motor shaft, a slider disposed on the lead screw and moving back and forth along the lead screw as the lead screw rotates, and a moving plate disposed on the slider, wherein the mounting plate 441 is connected to the moving plate; the welding head module 4 is driven by the Y-axis driving motor 432 to move back and forth along the Y-axis direction.
In order to ensure that the moving plate is more stable in the moving process, the Y-axis driving mechanism further comprises a Y-axis guide rail, and the bottom of the moving plate is clamped on the Y-axis guide rail through a sliding block.
In some embodiments, the Z-axis driving mechanism includes a Z-axis driving motor 442 disposed along a vertical direction, a lead screw connected to a motor shaft of the Z-axis driving motor 442 and rotating along with the motor shaft, and a slider disposed on the lead screw and moving back and forth along the lead screw as the lead screw rotates, the slider being connected to the shaft body 461; the welding head module 4 is driven by the Z-axis driving motor 442 to move up and down along the Z-axis direction.
In some embodiments, the rotation driving mechanism includes a rotation motor 451, a driving transmission wheel disposed on a motor shaft of the rotation motor 451, a driven transmission wheel sleeved outside the rotation element 462, and the driving transmission wheel and the driven transmission wheel are in transmission connection through a belt; the welding head module 4 is driven to rotate by the rotary driving mechanism.
The head of the welding head module 4 may be an existing structure, and is not described herein again.
In some embodiments, as shown in fig. 6 and 7, the coarse aluminum wire bonding machine further includes a camera vision structure 7 disposed on the X-axis guide plate 421, the bonding head module 4 is located below the X-axis guide plate 421, the camera vision structure 7 is disposed on the X-axis guide plate 421 in a transverse direction, the bonding head module 4 performs inner lead bonding of the semiconductor power device at the bonding station, and light rays irradiated to the bonding station are reflected and then transmitted upwards to pass through a 90 ° turn and enter the camera vision structure 7 for imaging.
In some embodiments, the camera vision structure 7 includes a prism and an imaging camera, the prism is located above the welding station, the imaging camera is disposed on the X-axis guide plate 421, the optical path between the prism and the imaging camera is transversely disposed parallel to the X-axis guide plate 421, and light irradiated to the welding station is reflected and then enters the imaging camera for imaging through a turning action of the prism of 90 °.
In some embodiments, the prism is a right angle prism.
In some embodiments, in order to adapt to ensure the shooting quality, the camera vision structure 7 further comprises a vision light source 74, and the vision light source 74 emits light to irradiate the welding position.
In some embodiments, a fixed mounting plate is disposed at one end of the shaft 461, and the welding head module 4 is mounted on the lower surface of the fixed mounting plate; the visual light source 74 comprises a light source module arranged on the lower surface of the fixed mounting plate, a through hole is formed in the middle of the light source module, and a circle of lamp beads is arranged on the light source module around the through hole; the lamp beads emit light rays to irradiate the welding station, the light rays enter the prism through the through holes after being reflected, and the light rays are incident into the imaging camera for imaging through the turning action of the prism at 90 degrees.
In some embodiments, to save power, the lamp beads are LED lamp beads.
In the technical scheme, the traditional four-degree-of-freedom structures are generally compounded into a whole to be decoupled by a lead welding head module, an X-axis driving mechanism and a Y-axis driving mechanism are decoupled through an X-axis guide rail 4211 and a Y-axis guide rail 4311, when the welding head module 4 moves in the X-axis direction, the Y-axis driving mechanism cannot move along with the X-axis driving mechanism, and when the welding head module 4 moves in the Y-axis direction, the X-axis driving mechanism cannot move along with the Y-axis driving mechanism; the Z-axis driving mechanism and the rotary driving mechanism are decoupled through the spline shaft 46, the rotary driving mechanism cannot lift along with the Z-axis driving mechanism when the welding head module 4 lifts along the Z-axis direction, and the Z-axis driving mechanism cannot rotate along with the Z-axis driving mechanism when the welding head module 4 rotates; the whole welding head module 4 is lighter, the moving speed of the welding head module 4 is increased, and the welding efficiency is effectively improved; the weight of the traditional four-degree-of-freedom structure compounded into a whole lead welding head module is about 15KG, while the mass of the welding head module 4 subjected to decoupling in the technical scheme is about 2KG, and the weight reduction reaches 650%; while the welding speed of the traditional lead welding head module before decoupling is about 2.1K/hour (2100 welding wires are welded per hour), the welding speed of the welding head module 4 after decoupling is about 3K/hour (3000 welding wires are welded per hour), the welding speed is increased by 42.86%, and the welding efficiency is greatly improved. The technical scheme also changes the traditional vertically arranged monitoring visual structure which is combined with the welding head structure into a structure which is transversely arranged outside the welding head module 4, and changes the light path transmission direction after the light irradiated to the welding position is reflected through the prism so as to ensure that the reflected light can smoothly enter the imaging camera for imaging; through separating camera visual structure 7 and welding head module 4, reduced welding head module 4's vertical erection dimension and installation volume for welding head module 4's quality and volume can reduce as far as possible, make welding head module 4 realize the lightweight of motion and become possible, effectively improve equipment's process velocity.
In the description herein, references to the description of the terms "one embodiment," "certain embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
It is to be understood that the invention is not limited to the examples described above, but that modifications and variations may be effected thereto by those of ordinary skill in the art in light of the foregoing description, and that all such modifications and variations are intended to be within the scope of the invention as defined by the appended claims.
Claims (10)
1. A crude aluminum wire bonding machine, comprising:
the feeding clamp module is used for conveying a semiconductor power device to be processed to a welding station, fixing the semiconductor power device during welding of the semiconductor power device, and conveying and discharging the semiconductor power device after the welding of the semiconductor power device is finished;
the welding head module is used for realizing lead welding on the semiconductor power device at a welding station;
the welding head motion driving mechanism is used for driving the welding head module to realize motion;
the paying-off module is used for providing bonding wires to the welding head module to realize lead welding;
the welding head motion driving mechanism comprises an X-axis driving mechanism, a Y-axis driving mechanism, a Z-axis driving mechanism, a rotation driving mechanism, an X-axis guide plate, a Y-axis guide plate, a mounting plate and a spline shaft;
the Y-axis guide plate is arranged on the X-axis guide plate and is connected with the X-axis driving mechanism, and the Y-axis guide plate is driven by the X-axis driving mechanism to move back and forth on the X-axis guide plate along the X-axis direction;
the mounting plate is arranged on the Y-axis guide plate and connected with the Y-axis driving mechanism, and the mounting plate is driven by the Y-axis driving mechanism to move back and forth on the Y-axis guide plate along the Y-axis direction;
the Z-axis driving mechanism and the rotary driving mechanism are both arranged on the mounting plate;
the welding head module is arranged at one end part of the spline shaft;
the Z-axis driving mechanism is connected with the spline shaft and drives the welding head module to lift up and down along the Z-axis direction;
and the rotary driving mechanism is connected with the spline shaft to drive the welding head module to rotate by taking the spline shaft as a rotating center.
2. The coarse aluminum wire bonding machine according to claim 1, further comprising a feeding module for carrying semiconductor power devices to be processed and a receiving module for carrying processed semiconductor power devices.
3. The coarse aluminum wire bonding machine according to claim 1, wherein the spline shaft comprises a shaft body and a rotating member, the shaft body is installed in a matched mode through the rotating member, the shaft body rotates in the rotating member, and the welding head module is installed at one end portion of the shaft body; the Z-axis driving mechanism is connected with the axis body and drives the axis body to lift up and down in the rotating piece along the Z-axis direction; the rotating part is connected with the rotary driving mechanism, and the rotary driving mechanism drives the rotating part and the shaft body to realize rotation.
4. The coarse aluminum wire bonding machine according to claim 1, wherein an X-axis guide rail is provided on the X-axis guide plate along the X-axis direction, and the bottom of the Y-axis guide plate is engaged with the X-axis guide rail via a slider to move back and forth along the X-axis direction on the X-axis guide plate.
5. The coarse aluminum wire bonding machine according to claim 1, wherein a Y-axis guide rail is provided on the Y-axis guide plate in the Y-axis direction, and the bottom of the mounting plate is engaged with the Y-axis guide rail by a slider to move back and forth in the Y-axis direction on the Y-axis guide plate.
6. The coarse aluminum wire bonding machine according to claim 1, wherein the X-axis driving mechanism comprises an X-axis driving motor, a screw rod connected with a motor shaft of the X-axis driving motor and rotating along with a motor shaft, and a slide block arranged on the screw rod and rotating along with the screw rod and moving back and forth along the screw rod, and the Y-axis guide plate is connected with the slide block; the welding head module is driven to move back and forth along the X-axis direction by the X-axis driving motor.
7. The coarse aluminum wire bonding machine according to claim 1, wherein the Y-axis driving mechanism comprises a Y-axis driving motor, a screw rod connected with a motor shaft of the Y-axis driving motor and rotating along with a motor shaft, a slide block arranged on the screw rod and rotating along with the screw rod and moving back and forth along the screw rod, and a moving plate arranged on the slide block, wherein the mounting plate is connected with the moving plate; and the welding head module is driven to move back and forth along the Y-axis direction by the Y-axis driving motor.
8. The coarse aluminum wire bonding machine according to claim 3, wherein the Z-axis driving mechanism comprises a Z-axis driving motor arranged along a vertical direction, a screw rod connected with a motor shaft of the Z-axis driving motor and rotating along with a motor shaft, and a slider arranged on the screw rod and moving back and forth along the screw rod along with the rotation of the screw rod, wherein the slider is connected with the shaft body; and the welding head module is driven to lift up and down along the Z-axis direction by the Z-axis driving motor.
9. The coarse aluminum wire bonding machine according to claim 3, wherein the rotary driving mechanism comprises a rotary motor, a driving transmission wheel arranged on a motor shaft of the rotary motor, a driven transmission wheel sleeved outside the rotary member, and the driving transmission wheel and the driven transmission wheel are in transmission connection through a belt; the welding head module is driven to rotate through the rotary driving mechanism.
10. The coarse aluminum wire bonding machine according to claim 1, comprising a camera vision structure disposed on the X-axis guide plate, wherein the welding head module is disposed under the X-axis guide plate, the camera vision structure is transversely disposed on the X-axis guide plate, the welding head module performs inner lead welding of the semiconductor power device at the welding station, and light rays irradiated to the welding station are reflected and then transmitted upwards to pass through a 90-degree turn and enter the camera vision structure for imaging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110398769.3A CN113172180A (en) | 2021-04-14 | 2021-04-14 | Coarse aluminum wire bonding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110398769.3A CN113172180A (en) | 2021-04-14 | 2021-04-14 | Coarse aluminum wire bonding machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113172180A true CN113172180A (en) | 2021-07-27 |
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Citations (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4239144A (en) * | 1978-11-22 | 1980-12-16 | Kulicke & Soffa Industries, Inc. | Apparatus for wire bonding |
| JPH08111430A (en) * | 1994-10-06 | 1996-04-30 | Rohm Co Ltd | Method and apparatus for correcting bonding position of wire bonder |
| US6286749B1 (en) * | 1998-01-23 | 2001-09-11 | Hyundai Electronics Industries Co., Ltd. | Apparatus for moving a bonding head of a wire bonder in X, Y and Z axial directions |
| CN101055846A (en) * | 2006-04-12 | 2007-10-17 | 中南大学 | Thermal ultrasonic reverse chip key binder |
| CN101920395A (en) * | 2010-09-07 | 2010-12-22 | 中国科学院长春光学精密机械与物理研究所 | Machine head for ultrasonic aluminum wire press welder |
| CN102091851A (en) * | 2011-01-07 | 2011-06-15 | 广东中宝炊具制品有限公司 | Three-axis linkage numerical control welding machine |
| CN102655106A (en) * | 2012-03-11 | 2012-09-05 | 无锡派图半导体设备有限公司 | Device for picking and placing paraxial decoupling direct drive chip |
| CN102723296A (en) * | 2012-05-11 | 2012-10-10 | 哈尔滨工业大学 | XY motion platform driven by double-layer linear motor |
| CN203031121U (en) * | 2012-12-12 | 2013-07-03 | 桂林立德爱博半导体装备有限公司 | Slider bonding tool movement device of full-automatic ultrasonic coarse aluminum wire bonder |
| CN103204462A (en) * | 2013-03-27 | 2013-07-17 | 山东理工大学 | Low-temperature ultrasonic anodic bonding device for silicon wafers and glass pieces |
| CN203804439U (en) * | 2014-04-04 | 2014-09-03 | 深圳市骏腾发机器人自动化有限公司 | Tri-axial numerical control welding machine |
| CN205202164U (en) * | 2015-12-17 | 2016-05-04 | 东莞市长江超声波机有限公司 | Flexible ultrasonic welding machine's Z shaft drive |
| CN106078029A (en) * | 2016-06-29 | 2016-11-09 | 成都浩方机电有限责任公司 | A kind of welding manipulator operation platform and welding method |
| CN108044218A (en) * | 2017-12-14 | 2018-05-18 | 无锡昌至盛机械制造有限公司 | Tin soldering machine |
| CN207668702U (en) * | 2017-12-19 | 2018-07-31 | 深圳市巨匠激光器械有限公司 | A kind of optical fiber bonding machine |
| CN208051227U (en) * | 2018-03-20 | 2018-11-06 | 浙江永宏电气股份有限公司 | A kind of cylindrical battery Seal welding with novel clamping mechanism picks |
| CN209140887U (en) * | 2018-10-22 | 2019-07-23 | 广东工业大学 | A kind of two dimension decoupling macro/micromotion platform |
| CN209303890U (en) * | 2018-11-30 | 2019-08-27 | 东莞市必达信超声波设备有限公司 | A kind of ultrasonic welding institution that welding precision is high |
| CN209303892U (en) * | 2018-11-30 | 2019-08-27 | 东莞市必达信超声波设备有限公司 | A kind of new type ultrasonic welding equipment |
| CN209363790U (en) * | 2018-10-30 | 2019-09-10 | 苏州晟成智能装备有限公司 | A kind of solar panel terminal box lead automatic welding device |
| CN212634662U (en) * | 2020-01-16 | 2021-03-02 | 佛山派阁汽车塑料技术有限公司 | Three-coordinate module ultrasonic flexible welding mechanism |
| CN212761701U (en) * | 2020-08-15 | 2021-03-23 | 深圳市微迅超声设备有限公司 | Welding head mounting base |
-
2021
- 2021-04-14 CN CN202110398769.3A patent/CN113172180A/en active Pending
Patent Citations (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4239144A (en) * | 1978-11-22 | 1980-12-16 | Kulicke & Soffa Industries, Inc. | Apparatus for wire bonding |
| JPH08111430A (en) * | 1994-10-06 | 1996-04-30 | Rohm Co Ltd | Method and apparatus for correcting bonding position of wire bonder |
| US6286749B1 (en) * | 1998-01-23 | 2001-09-11 | Hyundai Electronics Industries Co., Ltd. | Apparatus for moving a bonding head of a wire bonder in X, Y and Z axial directions |
| CN101055846A (en) * | 2006-04-12 | 2007-10-17 | 中南大学 | Thermal ultrasonic reverse chip key binder |
| CN101920395A (en) * | 2010-09-07 | 2010-12-22 | 中国科学院长春光学精密机械与物理研究所 | Machine head for ultrasonic aluminum wire press welder |
| CN102091851A (en) * | 2011-01-07 | 2011-06-15 | 广东中宝炊具制品有限公司 | Three-axis linkage numerical control welding machine |
| CN102655106A (en) * | 2012-03-11 | 2012-09-05 | 无锡派图半导体设备有限公司 | Device for picking and placing paraxial decoupling direct drive chip |
| CN102723296A (en) * | 2012-05-11 | 2012-10-10 | 哈尔滨工业大学 | XY motion platform driven by double-layer linear motor |
| CN203031121U (en) * | 2012-12-12 | 2013-07-03 | 桂林立德爱博半导体装备有限公司 | Slider bonding tool movement device of full-automatic ultrasonic coarse aluminum wire bonder |
| CN103204462A (en) * | 2013-03-27 | 2013-07-17 | 山东理工大学 | Low-temperature ultrasonic anodic bonding device for silicon wafers and glass pieces |
| CN203804439U (en) * | 2014-04-04 | 2014-09-03 | 深圳市骏腾发机器人自动化有限公司 | Tri-axial numerical control welding machine |
| CN205202164U (en) * | 2015-12-17 | 2016-05-04 | 东莞市长江超声波机有限公司 | Flexible ultrasonic welding machine's Z shaft drive |
| CN106078029A (en) * | 2016-06-29 | 2016-11-09 | 成都浩方机电有限责任公司 | A kind of welding manipulator operation platform and welding method |
| CN108044218A (en) * | 2017-12-14 | 2018-05-18 | 无锡昌至盛机械制造有限公司 | Tin soldering machine |
| CN207668702U (en) * | 2017-12-19 | 2018-07-31 | 深圳市巨匠激光器械有限公司 | A kind of optical fiber bonding machine |
| CN208051227U (en) * | 2018-03-20 | 2018-11-06 | 浙江永宏电气股份有限公司 | A kind of cylindrical battery Seal welding with novel clamping mechanism picks |
| CN209140887U (en) * | 2018-10-22 | 2019-07-23 | 广东工业大学 | A kind of two dimension decoupling macro/micromotion platform |
| CN209363790U (en) * | 2018-10-30 | 2019-09-10 | 苏州晟成智能装备有限公司 | A kind of solar panel terminal box lead automatic welding device |
| CN209303890U (en) * | 2018-11-30 | 2019-08-27 | 东莞市必达信超声波设备有限公司 | A kind of ultrasonic welding institution that welding precision is high |
| CN209303892U (en) * | 2018-11-30 | 2019-08-27 | 东莞市必达信超声波设备有限公司 | A kind of new type ultrasonic welding equipment |
| CN212634662U (en) * | 2020-01-16 | 2021-03-02 | 佛山派阁汽车塑料技术有限公司 | Three-coordinate module ultrasonic flexible welding mechanism |
| CN212761701U (en) * | 2020-08-15 | 2021-03-23 | 深圳市微迅超声设备有限公司 | Welding head mounting base |
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Application publication date: 20210727 |