CN218274551U - Chip position correction mechanism and semiconductor chip packaging machine - Google Patents
Chip position correction mechanism and semiconductor chip packaging machine Download PDFInfo
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- CN218274551U CN218274551U CN202222298576.3U CN202222298576U CN218274551U CN 218274551 U CN218274551 U CN 218274551U CN 202222298576 U CN202222298576 U CN 202222298576U CN 218274551 U CN218274551 U CN 218274551U
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Abstract
The utility model discloses a chip position correcting mechanism and a semiconductor chip packaging machine, wherein the chip position correcting mechanism comprises a base, a mounting table, a rotating shaft, a driving component, an adsorption component, a vision component and a moving component; the mounting table is mounted on the base and provided with a first mounting hole; the rotating shaft penetrates through the first mounting hole, and an adsorption hole penetrating through the rotating shaft is formed in the end part of the rotating shaft; the driving assembly comprises a driving motor, and the driving motor is arranged on the base and is in driving connection with the rotating shaft; the adsorption component comprises a gas receiving pipe and vacuum equipment, the gas receiving pipe sleeve is communicated with the adsorption hole, and the other end of the gas receiving pipe is connected with the vacuum equipment; the visual assembly is arranged above the mounting table, the axis of the visual assembly is overlapped with the axis of the rotating shaft, and the visual assembly is used for detecting the angle of the chip positioned on the rotating shaft; the base is installed in the removal subassembly, removes the subassembly and is used for controlling the removal of base in the horizontal direction. The utility model discloses technical scheme can increase the subsides dress precision of chip.
Description
Technical Field
The utility model relates to a semiconductor chip pastes dress technical field, in particular to chip position correction mechanism and semiconductor paster packaging machine.
Background
Nowadays, due to the development and progress of science and technology, the assembly of the laser diode can be carried out by automatic equipment, the semiconductor chip needs to be mounted on the corresponding tube seat when the laser diode is assembled, and the shape of the semiconductor chip needs to correspond to the frame of the tube seat, so that the angle of the chip needs to be adjusted before the chip is mounted, so as to facilitate the subsequent mounting operation. Most of automatic equipment on the market at present adjusts the position of a suction nozzle on a welding head assembly, carries out vacuum adsorption on a chip through the suction nozzle, and finally transfers the chip to a tube seat for release, wherein deviation may occur when the position of the suction nozzle is adjusted, so that when the chip is placed on the tube seat, the chip cannot just fall into a frame of the tube seat, and the mounting precision of the chip is poor.
SUMMERY OF THE UTILITY MODEL
The main objective of the present invention is to provide a chip position correction mechanism, which aims to increase the mounting precision of the chip.
In order to achieve the above object, the utility model provides a chip position correction mechanism, include:
a base;
the mounting table is mounted on the base and provided with a first mounting hole;
the rotating shaft is rotatably arranged in the first mounting hole in a penetrating mode, an adsorption hole is formed in the end portion of the rotating shaft, and the adsorption hole penetrates through the rotating shaft;
the driving assembly comprises a driving motor, the driving motor is arranged on the base, and the driving motor is in driving connection with the rotating shaft;
the adsorption assembly comprises an air receiving pipe and vacuum equipment, the vacuum equipment is installed on the base, one end of the air receiving pipe is sleeved at the lower end of the rotating shaft and is communicated with the adsorption hole, and the other end of the air receiving pipe is connected with the vacuum equipment;
the visual assembly is arranged above the mounting table, the axis of the visual assembly is overlapped with the axis of the rotating shaft, and the visual assembly is used for detecting the angle of a chip positioned on the rotating shaft; and
the base is installed on the moving assembly, and the moving assembly is used for controlling the base to move in the horizontal direction.
Optionally, the driving assembly further comprises a first synchronizing wheel, a second synchronizing wheel and a synchronous belt, the first synchronizing wheel is sleeved on the rotating shaft of the driving motor, the second synchronizing wheel is sleeved on the rotating shaft, the first synchronizing wheel is connected with the second synchronizing wheel through the synchronous belt, and the driving motor drives the first synchronizing wheel to drive the rotating shaft to rotate.
Optionally, the driving assembly further includes a tension wheel, and the tension wheel is rotatably mounted on the base and is configured to abut against an inner surface of the timing belt.
Optionally, the driving assembly further comprises a first bevel gear and a second bevel gear, the first bevel gear is sleeved on a rotating shaft of the driving motor, the second bevel gear is sleeved on the rotating shaft, the first bevel gear is meshed with the second bevel gear, and the driving motor drives the first bevel gear to rotate so as to drive the rotating shaft to rotate.
Optionally, the chip position correction mechanism further includes a rolling bearing, the rolling bearing is mounted in the first mounting hole, and the rotating shaft is rotatably inserted into the rolling bearing.
Optionally, the chip position correction mechanism further comprises a mounting plate, one end of the mounting plate is fixed to the base, a second mounting hole is formed in one side, away from the base, of the mounting plate, the driving motor is mounted on the mounting plate, and the rotating shaft of the driving motor is exposed through the second mounting hole.
Optionally, the moving assembly includes a first linear motor, a second linear motor, a first moving platform and a second moving platform, the first linear motor is installed on the first moving platform, the second moving platform is installed on the first linear motor, the second linear motor is installed on the second moving platform, the base is installed on the second linear motor, and the moving directions of the first linear motor and the second linear motor are different.
Optionally, the first moving platform is provided with two first guide rails and two first sliders, one of the first guide rails is in sliding fit with the first slider, the two first guide rails are respectively arranged on two sides of the first linear motor, the second moving platform is connected to the two first sliders, the second moving platform is provided with two second guide rails and two second sliders, one of the second sliders is in sliding connection with the second guide rails, and the base is connected to the two second sliders.
Optionally, two first buffer blocks are arranged on the first moving platform, and the two first buffer blocks are located at the front end portion and the rear end portion of the first linear motor and are arranged close to the end portion of the first moving platform; and two second buffer blocks are arranged on the second moving platform, are positioned at the front end part and the rear end part of the second linear motor and are close to the end parts of the second moving platform.
The utility model also provides a semiconductor paster packaging machine, include chip position correction mechanism.
The technical scheme of the utility model is that the position of the base is adjusted through the moving component, so that the upper end surface of the rotating shaft is arranged opposite to the vision component, the chip on the end surface of the rotating shaft is positioned and shot through the vision component, and the angle of the chip to be adjusted is obtained by comparing the shape of the frame of the tube seat and the shape of the chip; if the adjustment is needed, the driving motor is started to enable the rotating shaft to rotate, and when the chip rotates to a proper position, the next step of installation is carried out. The arrangement can ensure that the chip can be just placed into the frame of the tube seat when the next chip mounting work is carried out, so that the situation that the chip is not placed into the frame of the tube seat can be reduced, and the chip mounting precision is increased.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an embodiment of a chip position correction mechanism according to the present invention;
fig. 2 is an exploded view of the chip position correction mechanism of the present invention.
The reference numbers illustrate:
the objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that all the directional indicators (such as upper, lower, left, right, front, and rear … …) in the embodiments of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
In the present application, unless expressly stated or limited otherwise, the terms "connected" and "fixed" are to be construed broadly, e.g., "fixed" may be fixedly connected or detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In addition, the meaning of "and/or" appearing throughout includes three juxtapositions, exemplified by "A and/or B" including either A or B or both A and B. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The utility model provides a chip position correction mechanism.
In an embodiment of the present invention, as shown in fig. 1 and 2, the chip position correcting mechanism includes a base 10, a mounting table 11, a rotating shaft 12, a driving component, an adsorbing component, a vision component, and a moving component; the mounting table 11 is mounted on the base 10, and the mounting table 11 is provided with a first mounting hole 111; the rotating shaft 12 is rotatably inserted into the first mounting hole 111, an absorption hole 121 is formed at an end of the rotating shaft 12, and the absorption hole 121 is inserted into the rotating shaft 12; the driving component comprises a driving motor 20, the driving motor 20 is arranged on the base 10, and the driving motor 20 is in driving connection with the rotating shaft 12; the adsorption component comprises an air receiving pipe 30 and vacuum equipment, the vacuum equipment is arranged on the base 10, one end of the air receiving pipe 30 is sleeved at the lower end of the rotating shaft 12 and is communicated with the adsorption hole 121, and the other end of the air receiving pipe 30 is connected with the vacuum equipment; the visual assembly is arranged above the mounting table 11, the axis of the visual assembly is overlapped with the axis of the rotating shaft 12, and the visual assembly is used for detecting the angle of the chip positioned on the rotating shaft 12; the base 10 is mounted to a moving assembly for controlling movement of the base 10 in a horizontal direction.
The technical scheme of the utility model is that the position of the base 10 is adjusted by the moving component, so that the upper end surface of the rotating shaft 12 is arranged opposite to the vision component, and at the moment, the chip on the end surface of the rotating shaft 12 is positioned and shot by the vision component, and the angle of the chip to be adjusted is obtained by comparing the frame of the tube seat with the shape of the chip; if adjustment is required, the driving motor 20 is activated to rotate the rotating shaft 12, and the chip is rotated to a proper position for further mounting. The arrangement can ensure that the chip can be just placed in the frame of the tube seat when the next chip mounting work is carried out, so that the condition that the tube seat frame is not placed in the chip can be reduced, and the chip mounting precision is increased.
In an embodiment, the driving assembly further includes a first synchronous wheel 21, a second synchronous wheel 22 and a synchronous belt, the first synchronous wheel 21 is sleeved on the rotating shaft of the driving motor 20, the second synchronous wheel 22 is sleeved on the rotating shaft 12, the first synchronous wheel 21 is connected with the second synchronous wheel 22 through the synchronous belt, and the driving motor 20 drives the first synchronous wheel 21 to drive the rotating shaft 12 to rotate.
Specifically, the rotation of the rotating shaft 12 is controlled by a transmission mode of a synchronous wheel and a synchronous belt. Set up like this, because the transmission in-process vibration of synchronizing wheel and hold-in range is lower, so can increase the rotation stationarity of rotation axis 12, and control pivoted angle that can be more accurate. In other embodiments, the driving assembly further comprises a speed reducer, the driving motor 20 is connected to an input end of the speed reducer, and an output end of the speed reducer is connected to the rotating shaft 12 through a coupling.
In one embodiment, the driving assembly further comprises a tension wheel rotatably mounted on the base 10 and configured to abut against an inner surface of the timing belt.
Specifically, the tension wheel is fixed on the base 10 and located between the first synchronizing wheel 21 and the second synchronizing wheel 22, and the center of the tension wheel is deviated from the line connecting the center of the first synchronizing wheel 21 and the center of the second synchronizing wheel 22, so that the tension wheel can push out the synchronous belt towards the outside of the synchronous belt when abutting against the synchronous belt. The synchronous belt can be tightened by the aid of the arrangement, and the slipping condition of the synchronous belt is reduced. In other embodiments, the tension wheel is movably mounted on the base 10, and the tension wheel can move along a direction perpendicular to a connection line between the center of the first synchronous wheel 21 and the center of the second synchronous wheel.
In an embodiment, the driving assembly further includes a first bevel gear and a second bevel gear, the first bevel gear is sleeved on the rotating shaft of the driving motor 20, the second bevel gear is sleeved on the rotating shaft 12, the first bevel gear is engaged with the second bevel gear, and the driving motor 20 drives the first bevel gear to rotate so as to drive the rotating shaft 12 to rotate.
Particularly, the rotating shaft of the driving motor 20 is connected with the first bevel gear, so that the driving motor 20 can drive the first bevel gear to rotate, and the second bevel gear is meshed with the first bevel gear, therefore, when the first bevel gear rotates, the second bevel gear also rotates, so that the rotating shaft 12 is driven to rotate, and the purpose of adjusting the angle of the chip on the rotating shaft 12 is achieved. In other embodiments, the structure of the driving motor 20 driving the rotating shaft 12 is not limited thereto, and may be other structures as long as the driving motor can drive the rotating shaft 12 to rotate.
In an embodiment, the chip position correction mechanism further includes a rolling bearing 14, the rolling bearing 14 is mounted in the first mounting hole 111, and the rotating shaft 12 is rotatably inserted into the rolling bearing 14.
Specifically, the arrangement can reduce the friction force applied to the rotating shaft 12 in the rotating process, so that the rotating shaft 12 is not easy to be jammed in the process of adjusting the angle of the chip, and is smoother. In some other embodiments, the chip position correction mechanism further includes a needle bearing.
In an embodiment, the chip position correction mechanism further includes a mounting plate 13, one end of the mounting plate 13 is fixed to the base 10, a second mounting hole 131 is formed on a side of the mounting plate 13 away from the base 10, the driving motor 20 is mounted on the mounting plate 13, and a rotating shaft of the driving motor 20 is exposed from the second mounting hole 131.
Specifically, the driving motor 20 is mounted on the base 10 through a mounting plate 13, the mounting plate 13 is strip-shaped, a part of the mounting plate is mounted above the base 10, and the other part of the mounting plate extends out of the base 10 for mounting the driving motor 20. With the arrangement, compared with the driving motor 20 vertically installed above the base 10, the height of the whole mechanism can be reduced and the possibility of collision can be reduced when the synchronous pulley structure is used for driving the rotating shaft 12. In other embodiments, the driving motor 20 is mounted at the lower end of the base 10, and the rotating shaft of the driving motor 20 passes through the base 10 and extends upward.
In an embodiment, the moving assembly includes a first linear motor 40, a second linear motor 41, a first moving platform 42 and a second moving platform 43, the first linear motor 40 is mounted on the first moving platform 42, the second moving platform 43 is mounted on the first linear motor 40, the second linear motor 41 is mounted on the second moving platform 43, the base 10 is mounted on the second linear motor 41, and the moving directions of the first linear motor 40 and the second linear motor 41 are different.
Specifically, the motion track of the first linear motor 40 is perpendicular to the motion track of the second linear motor 41, the first linear motor 40 is used for controlling the second moving platform 43 to move in the transverse direction, and the second linear motor 41 is used for controlling the base 10 to move in the longitudinal direction. With this arrangement, it is more efficient to adjust the base 10 than to manually adjust the position of the base 10. In other embodiments, the moving assembly includes a first screw, a second screw, a first adjusting bracket, a second adjusting bracket, a first moving platform 42 and a second moving platform 43, the first adjusting bracket is installed on the first moving platform 42, the first screw is screwed to the first adjusting bracket, and the end portion of the first screw is rotatably connected to the second moving platform 43, the position of the second moving platform 43 in the horizontal direction is adjusted by rotating the first screw, the second adjusting bracket is installed on the second moving platform 43, the second screw is screwed to the second adjusting bracket, and the end portion of the second screw is rotatably connected to the base 10, the position of the base 10 in the horizontal direction is adjusted by rotating the first screw, and the axis of the first screw is perpendicular to the axis of the second screw.
In an embodiment, the first moving platform 42 is provided with two first guide rails 44 and two first sliding blocks 45, the first guide rails 44 are slidably engaged with the first sliding blocks 45, the two first guide rails 44 are respectively disposed on two sides of the first linear motor 40, the second moving platform 43 is connected to the two first sliding blocks 45, the second moving platform 43 is provided with two second guide rails 46 and two second sliding blocks 47, the second sliding block 47 is slidably connected to the second guide rails 46, and the base 10 is connected to the two second sliding blocks 47.
Specifically, the first guide rail 44 and the first slider 45 can support the second moving platform 43, the first sliders 45 on both sides can share the load, the second guide rail 46 and the second slider 47 can support the base 10, and the second sliders 47 can share the load. This arrangement can reduce the load on the first linear motor 40 and the second linear motor 41, increase the supporting capability for the second movable platform 43 and the base 10, and reduce the friction force applied to the second movable platform 43 and the base 10 during the moving process.
In one embodiment, two first buffer blocks 48 are disposed on the first moving platform 42, and the two first buffer blocks 48 are disposed at the front and rear end portions of the first linear motor 40 and near the end portion of the first moving platform 42; two second buffer blocks 49 are arranged on the second moving platform 43, and the two second buffer blocks 49 are located at the front and rear end portions of the second linear motor 41 and are arranged near the end portion of the second moving platform 43.
Specifically, the first buffer block 48 and the second buffer block 49 are made of an elastic material, the first buffer block 48 is arranged at the foremost end and the rearmost end of the stroke of the first linear motor 40, the second buffer block 49 is arranged at the foremost end and the rearmost end of the stroke of the second linear motor 41, and when the first linear motor 40 or the second linear motor 41 runs to the tail section of the stroke, the first buffer block 48 and the second buffer block 49 are respectively in contact with the first linear motor 40 and the second linear motor 41. The arrangement can avoid damage of the linear motor due to overlarge rigid impact, so that the service life of the first linear motor 40 and the second linear motor 41 can be prolonged.
The utility model also provides a semiconductor chip packaging machine, this semiconductor chip packaging machine include chip position correction mechanism, and this chip position correction mechanism's concrete structure refers to above-mentioned embodiment, because this semiconductor chip packaging machine has adopted the whole technical scheme of above-mentioned all embodiments, consequently has all beneficial effects that the technical scheme of above-mentioned embodiment brought at least, and the repeated description is no longer given here. Wherein, semiconductor chip packaging machine has still included tool feed mechanism, point gum machine constructs, move and carry the mechanism, welding mechanism, chip feed mechanism and chip position correction mechanism, the tool is used for depositing a plurality of tube sockets, the tool flows and moves on moving and carrying the mechanism, carry out some glue in the tube socket through point gum machine earlier constructs, move welding mechanism department again and wait for chip feed to chip position correction mechanism after with chip feed mechanism, welding mechanism takes off the chip and pastes the dress in the tool, the tool flows out again and moves and carry the mechanism and carry out unified the collection.
The above is only the optional embodiment of the present invention, and not limiting the patent scope of the present invention, all under the inventive concept of the present invention, the equivalent structure transformation made by the contents of the specification and the attached drawings is utilized, or the direct/indirect application is included in other related technical fields in the patent protection scope of the present invention.
Claims (10)
1. A chip position correction mechanism, comprising:
a base;
the mounting table is mounted on the base and provided with a first mounting hole;
the rotating shaft is rotatably arranged in the first mounting hole in a penetrating mode, an adsorption hole is formed in the end portion of the rotating shaft, and the adsorption hole penetrates through the rotating shaft;
the driving assembly comprises a driving motor, the driving motor is arranged on the base, and the driving motor is in driving connection with the rotating shaft;
the adsorption assembly comprises a gas receiving pipe and vacuum equipment, the vacuum equipment is installed on the base, one end of the gas receiving pipe is sleeved at the lower end of the rotating shaft and is communicated with the adsorption hole, and the other end of the gas receiving pipe is connected with the vacuum equipment;
the visual assembly is arranged above the mounting table, the axis of the visual assembly is overlapped with the axis of the rotating shaft, and the visual assembly is used for detecting the angle of a chip positioned on the rotating shaft; and
and the base is arranged on the moving assembly, and the moving assembly is used for controlling the movement of the base in the horizontal direction.
2. The chip position correction mechanism according to claim 1, wherein the driving assembly further includes a first synchronizing wheel, a second synchronizing wheel and a synchronous belt, the first synchronizing wheel is disposed on a rotating shaft of the driving motor, the second synchronizing wheel is disposed on the rotating shaft, the first synchronizing wheel is connected to the second synchronizing wheel through the synchronous belt, and the driving motor drives the first synchronizing wheel to rotate the rotating shaft.
3. The chip position correction mechanism according to claim 2, wherein the driving unit further includes a tension pulley rotatably mounted on the base and adapted to abut against an inner surface of the timing belt.
4. The chip position correcting mechanism according to claim 1, wherein the driving assembly further comprises a first bevel gear and a second bevel gear, the first bevel gear is sleeved on a rotating shaft of a driving motor, the second bevel gear is sleeved on the rotating shaft, the first bevel gear is engaged with the second bevel gear, and the driving motor drives the first bevel gear to rotate so as to drive the rotating shaft to rotate.
5. The chip position correction mechanism according to claim 1, further comprising a rolling bearing mounted in the first mounting hole, wherein the rotary shaft is rotatably inserted into the rolling bearing.
6. The chip position correcting mechanism according to claim 1, further comprising a mounting plate, wherein one end of the mounting plate is fixed to the base, a second mounting hole is formed in a side of the mounting plate away from the base, the driving motor is mounted on the mounting plate, and a rotating shaft of the driving motor is exposed through the second mounting hole.
7. The chip position correction mechanism according to claim 1, wherein the moving assembly includes a first linear motor, a second linear motor, a first moving platform, and a second moving platform, the first linear motor is mounted on the first moving platform, the second moving platform is mounted on the first linear motor, the second linear motor is mounted on the second moving platform, the base is mounted on the second linear motor, and the first linear motor and the second linear motor move in different directions.
8. The chip position correcting mechanism according to claim 7, wherein the first moving platform is provided with two first guide rails and two first sliders, one of the first guide rails is slidably engaged with one of the first sliders, the two first guide rails are respectively disposed on two sides of the first linear motor, the second moving platform is connected to the two first sliders, the second moving platform is provided with two second guide rails and two second sliders, one of the second sliders is slidably connected to one of the second guide rails, and the base is connected to the two second sliders.
9. The chip position correcting mechanism according to claim 7, wherein the first moving platform is provided with two first buffer blocks, and the two first buffer blocks are located at the front and rear end portions of the first linear motor and are arranged near the end portion of the first moving platform; and two second buffer blocks are arranged on the second moving platform, are positioned at the front end part and the rear end part of the second linear motor and are close to the end parts of the second moving platform.
10. A semiconductor chip mounter characterized by comprising the chip position correction mechanism according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222298576.3U CN218274551U (en) | 2022-08-30 | 2022-08-30 | Chip position correction mechanism and semiconductor chip packaging machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222298576.3U CN218274551U (en) | 2022-08-30 | 2022-08-30 | Chip position correction mechanism and semiconductor chip packaging machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218274551U true CN218274551U (en) | 2023-01-10 |
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ID=84708981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222298576.3U Active CN218274551U (en) | 2022-08-30 | 2022-08-30 | Chip position correction mechanism and semiconductor chip packaging machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218274551U (en) |
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2022
- 2022-08-30 CN CN202222298576.3U patent/CN218274551U/en active Active
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