CN113169215A - 柔性面板及柔性面板制作方法 - Google Patents
柔性面板及柔性面板制作方法 Download PDFInfo
- Publication number
- CN113169215A CN113169215A CN201880097628.4A CN201880097628A CN113169215A CN 113169215 A CN113169215 A CN 113169215A CN 201880097628 A CN201880097628 A CN 201880097628A CN 113169215 A CN113169215 A CN 113169215A
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- substrate
- flexible panel
- hard
- flexible
- base material
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- 230000009975 flexible effect Effects 0.000 title claims abstract description 184
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 97
- 239000000463 material Substances 0.000 claims description 55
- 239000007769 metal material Substances 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 20
- 238000005728 strengthening Methods 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims 1
- 230000002787 reinforcement Effects 0.000 abstract description 6
- 239000000853 adhesive Substances 0.000 description 20
- 230000001070 adhesive effect Effects 0.000 description 20
- 239000002184 metal Substances 0.000 description 20
- 229910052751 metal Inorganic materials 0.000 description 20
- 239000012778 molding material Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000005192 partition Methods 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- 239000010408 film Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000005266 casting Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229910052755 nonmetal Inorganic materials 0.000 description 3
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 2
- 244000043261 Hevea brasiliensis Species 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 229920005549 butyl rubber Polymers 0.000 description 2
- 238000003490 calendering Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000010329 laser etching Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229920003052 natural elastomer Polymers 0.000 description 2
- 229920001194 natural rubber Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 description 2
- 229920003051 synthetic elastomer Polymers 0.000 description 2
- 239000005061 synthetic rubber Substances 0.000 description 2
- 229920002725 thermoplastic elastomer Polymers 0.000 description 2
- 210000000707 wrist Anatomy 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- JWVAUCBYEDDGAD-UHFFFAOYSA-N bismuth tin Chemical compound [Sn].[Bi] JWVAUCBYEDDGAD-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K99/00—Subject matter not provided for in other groups of this subclass
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
本申请提供一种柔性面板及柔性面板制作方法，所述柔性面板(100)包括基材(10)和电子器件(20)，基材(10)包括用于和功能元件连接的绑定区(11)，所述基材(10)设有强化所述绑定区(11)的支撑强度的硬质部(12)，所述电子器件(20)固定于所述基材(10)，所述电子器件(20)与延伸至所述绑定区(11)的导线(30)连接。通过在基材(10)设有硬质部(12)，硬质部(12)对绑定区(11)提供应力补强，使得绑定区(11)不易产生变形，防止电子器件(20)与功能元件连接失效，提高了柔性面板(100)的功能稳定性。
Description
PCT国内申请，说明书已公开。
Claims (20)
- PCT国内申请，权利要求书已公开。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2018/121994 WO2020124415A1 (zh) | 2018-12-19 | 2018-12-19 | 柔性面板及柔性面板制作方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113169215A true CN113169215A (zh) | 2021-07-23 |
Family
ID=71100608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880097628.4A Pending CN113169215A (zh) | 2018-12-19 | 2018-12-19 | 柔性面板及柔性面板制作方法 |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN113169215A (zh) |
| WO (1) | WO2020124415A1 (zh) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080074830A1 (en) * | 2006-09-25 | 2008-03-27 | Epson Imaging Devices Corporation | Mounting structure, electro-optical device, and electronic apparatus |
| CN103094306A (zh) * | 2011-11-03 | 2013-05-08 | 三星显示有限公司 | 柔性显示装置 |
| CN108777113A (zh) * | 2018-06-14 | 2018-11-09 | 武汉华星光电半导体显示技术有限公司 | 柔性基板结构和显示装置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106410029B (zh) * | 2016-11-04 | 2019-10-08 | 上海天马微电子有限公司 | 一种柔性显示面板及其制作方法、柔性显示装置 |
| CN106847871B (zh) * | 2017-03-22 | 2020-06-16 | 武汉华星光电技术有限公司 | Oled显示面板及其显示装置 |
-
2018
- 2018-12-19 WO PCT/CN2018/121994 patent/WO2020124415A1/zh active Application Filing
- 2018-12-19 CN CN201880097628.4A patent/CN113169215A/zh active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080074830A1 (en) * | 2006-09-25 | 2008-03-27 | Epson Imaging Devices Corporation | Mounting structure, electro-optical device, and electronic apparatus |
| CN103094306A (zh) * | 2011-11-03 | 2013-05-08 | 三星显示有限公司 | 柔性显示装置 |
| CN108777113A (zh) * | 2018-06-14 | 2018-11-09 | 武汉华星光电半导体显示技术有限公司 | 柔性基板结构和显示装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020124415A1 (zh) | 2020-06-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20210723 |
|
| WD01 | Invention patent application deemed withdrawn after publication |