CN108304097B - 曲面触控模组结构及其贴合方法 - Google Patents

曲面触控模组结构及其贴合方法 Download PDF

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CN108304097B
CN108304097B CN201810331837.2A CN201810331837A CN108304097B CN 108304097 B CN108304097 B CN 108304097B CN 201810331837 A CN201810331837 A CN 201810331837A CN 108304097 B CN108304097 B CN 108304097B
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curved surface
touch
layer
touch module
bonding
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CN108304097A (zh
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林柏青
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Interface Optoelectronics Shenzhen Co Ltd
Interface Technology Chengdu Co Ltd
General Interface Solution Ltd
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Interface Optoelectronics Shenzhen Co Ltd
Interface Technology Chengdu Co Ltd
General Interface Solution Ltd
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Priority to TW107113760A priority patent/TWI662454B/zh
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Abstract

一种曲面触控模块结构及其贴合方法，乃针对曲面贴合制程中贴合材料容易于应力累积处造成皱折问题所采用的热塑贴合技术，将外观保护层的曲面内侧设计有一平面结构，此平面结构对应于触控元件层的接合区位置，可供触控元件层热塑贴合于外观保护层的曲面时，使其接合区位置的第一接合垫位于平面结构上；藉此，当进行后段热压接合制程，除需依产品形状曲率设计接合适用平台外，其余现有的热压元件皆不用修正，从而增加制程良率，并减少生产成本。

Description

曲面触控模组结构及其贴合方法
技术领域
本发明系有关一种触控面板结构，特别是指一种曲面触控模组结构及其贴合方法。
背景技术
随着触控应用技术的发展，触控介面已由平面造型，进展到多轴曲面造型。然而，在多轴曲面(Muti-Axis Curvy)触控面板的贴合制程中，因为多轴向外观件具有双轴曲率的因素，因此贴合材料于应力累积处容易造成贴合异常而产生皱折的现象，进而触控线路会因拉扯挠曲来导致微裂(micro crack)，局部的电阻值上升，使得触控功能发生异常。
在热压接合印刷电路板(FPC Bonding)制程时，若采用现行平面触控面板的接合方式，除须依产品形状曲率设置新的接合适用平台外，还需依据塑形的形状曲率设计不同的热压头，但是触控元件的电极图案经过热塑成型后，会造成X-Y-Z三个轴向的尺寸变异，若将接合的热压头设计为曲面，则有可能在过程中再造成三维的变异，造成在接合制程中的节距偏移(Pitch shift)，导致良率损失(Yield loss)。
发明内容
本发明的主要目的在于提供一种曲面触控模组的贴合结构及贴合方法，系于外观保护层的曲面内侧设有一对应触控元件层之接合垫的平面结构，在热塑贴合过程之后，不用更改进行热压贴合制程之热压头的外型，可有效减少制程变异，藉以提高生产良率、降低制造成本。
因此，为实现上述目的，本发明提供一种曲面触控模组结构，其包含有触控元件层以及外观保护层。触控元件层包括一显示区和一接合区，其中显示区具有复数导电线路，接合区具有与导电线路电性连接之复数第一接合垫，而外观保护层具有相隔的一外曲面与一内曲面，此内曲面包括一平面结构，可供触控元件层热塑贴合于内曲面并使第一接合垫位于平面结构上。其中，在触控元件层与外观保护层之间，可使用一黏着剂或因热塑行为使触控元件层与外观保护层之间来形成有一附着层，并使用一异方性导电胶接合触控元件层与一软性触控模组，使触控元件层的复数第一接合垫与软性触控模组对应的复数第二接合垫连接以电性导通。
另外，本发明提供一种曲面触控模组结构的贴合方法，其步骤是先形成一触控元件层，此触控元件层包括一显示区和一接合区，其中显示区具有复数导电线路，接合区具有与导电线路电性连接之复数第一接合垫。同时，提供一外观保护层，此外观保护层具有相隔的一外曲面与一内曲面，内曲面包括一平面结构。然后，将触控元件层热塑贴合于外观保护层的内曲面，并使第一接合垫位于平面结构上。接着，使用一异方性导电胶接合触控元件层与一软性触控模组，使触控元件层的复数第一接合垫与软性触控模组对应的复数第二接合垫连接以电性导通。
根据本发明之实施例，其中在所述触控元件层与所述外观保护层之间，可使用一黏着剂或因热塑行为使触控元件层与外观保护层之间形成一附着层。较佳地，附着层可为热敏感型胶材，外观保护层的材质可为玻璃或塑胶复合材料。
根据本发明之实施例，其中所述触控元件层与所述软性触控模组接合的步骤中，是藉由一热压头与对置于一热压治具的外观保护层、触控元件层、异方性导电胶与软性触控模组进行热压。
藉由本发明所提供的曲面触控模组结构及其贴合方法，使得触控元件层热塑贴合于外观保护层之后，后续使用异方性导电胶将软性触控模组和触控元件层热压接合在一起时，只要依产品形状曲率设计接合适用平台，无须将热压头修改为曲面，能够避免触控元件层的导电线路造成三维变异，使得接合过程中产生节距偏移的状况能够大幅改善，进而能够提升生产良率，降低制造成本，并提高竞争优势。
底下藉由具体实施例详加说明，当更容易了解本发明之目的、技术内容、特点及其所达成之功效。底下藉由具体实施例配合所附的图式详加说明，当更容易了解本发明之目的、技术内容、特点及其所达成之功效。
附图说明
图1A及图1B分别为本发明之实施例所提供的曲面触控模组结构之俯视图及侧视图。
图2为本发明之实施例所提供的曲面触控模组结构之剖面图。
图3为本发明之实施例所提供的曲面触控模组结构的贴合方法之流程图。
图4A-4D为本发明之实施例所提供的曲面触控模组结构的贴合方法中对应各步骤的结构剖面图。
图5为图4C中对应平面结构位置的局部结构之示意图。
图6为图4D中对应平面结构位置的局部结构之示意图。
附图标记：
1 曲面触控模组结构
20 触控元件层
21 基材
22 显示区
221 导电线路
23 接合区
231 第一接合垫
30 外观保护层
31 外曲面
32 内曲面
33 平面结构
40 附着层
50 软性触控模组
51 第二接合垫
60 异方性导电胶
70 热压头
80 热压治具
a 接合区的有效宽度
b 异方性导电胶的厚度
c 接合区的表面至平面结构的表面的距离
L1 热压头面向软性触控模组的底面
L2 平面结构的表面
L3 热压治具的底面
L4 接合区的表面
θ1 平面结构的表面与接合区的表面所夹角度
θ2 热压头面向软性触控模组的底面与平面结构的表面所夹角度
θ3 热压头面向软性触控模组的底面与热压治具的底面所夹角度
具体实施方式
请参阅图1A及图1B，其分别绘示本发明之实施例所提供的曲面触控模组结构1之俯视图及侧视图。本实施例中，此曲面触控模组结构1的外观具有多轴曲面。于一实施例中，曲面触控模组结构1可应用于显示装置、平板电脑、智能型手机、笔记本电脑、桌面电脑、电视、卫星导航、车上显示器、航空用显示器或可携式DVD放影机等各种电子装置。
请参阅图2，其绘示本发明一实施例，所提供的曲面触控模组结构之剖面图。于本实施例中，曲面触控模组结构主要包含有触控元件层20与外观保护层30。触控元件层20是可热塑拉伸的透明导电膜，并用以形成于透明基材21上，使基材21表面上形成电极图案，并可划分为显示区22和接合区(bonding area)23。显示区22具有多条导电线路221，接合区23具有与导电线路221电性连接之多个第一接合垫231。于一实施例中，透明导电膜之材质可为聚二氧乙基噻吩(PEDOT)、纳米银线(SNW)、纳米碳管(CNT)等，透明基材21之材质可为乙烯对苯二甲酸酯(PET)、聚碳酸酯(PC)等。外观保护层30，其具有相隔的一外曲面31和一内曲面32，并于内曲面32设有一平面结构33，以供触控元件层20热塑贴合于内曲面32，并使第一接合垫231位于平面结构33上，于一实施例中，外观保护层30可以是保护强化玻璃或塑胶复合材料。外观保护层30和触控元件层20之间，可藉由黏着剂或热塑行为使外观保护层30和触控元件层20之介面形成附着层40。于一实施例中，黏着剂可为热敏感型胶材。
请参照图3，说明本发明一实施例所提供之曲面触控模组结构的贴合方法的流程图。请依序参照图4A-4D，为本发明之实施例所提供之曲面触控模组结构的贴合方法中对应各步骤的结构剖面图。此贴合方法包括如下步骤：
步骤S101，如图4A所示，形成触控元件层20，触控元件层20包括一显示区22和一接合区23。显示区22具有多条导电线路221，接合区23具有与导电线路221电性连接之多个第一接合垫231。
步骤S102，如图4B所示，提供外观保护层30，外观保护层30具有相隔的外曲面31与内曲面32，并于内曲面32设有一平面结构33。
步骤S103，如图4C所示，将触控元件层20贴合于外观保护层30的内曲面32，且通过热塑方式而紧密结合在一起，并使第一接合垫231位于平面结构33上。此步骤中，可藉由黏着剂或热塑行为形成附着层40于触控元件层20与外观保护层30之间。
步骤S104，如图4D所示，使用异方性导电胶60(Anisotropic Conductive Film；ACF)接合触控元件层20与软性触控模组50，使触控元件层20的第一接合垫231与软性触控模组50对应的第二接合垫51连接以电性导通。此步骤中，藉由热压头70对设置于热压治具80上的外观保护层30、触控元件层20、异方性导电胶60与软性触控模组50进行热压。
于一实施例中，接合区23的表面L4和平面结构33的表面L2可以为平行。于一实施例中，接合区23的表面L4和平面结构33的表面L2可以为不平行。
如图5所示，其绘示对应图4C中对应平面结构33位置的局部结构示意图。请同时参照图5及图4C、4D，平面结构33的表面L2与接合区23的表面L4所夹角度θ1定义为：0<tanθ1<c/a，其中，a为接合区23的有效宽度，c为接合区23的表面L4至平面结构33的表面L2的距离。
如图6所示，其绘示对应图4D中对应平面结构33位置的局部结构示意图。请同时参照图4C、4D和图6，热压头70面向软性触控模组50的底面L1与平面结构33的表面L2所夹角度θ2定义为：0<tanθ2<b/a；热压头70面向软性触控模组50的底面L1与热压治具80的底面L3所夹角度θ3定义为：0<tanθ3<b/a，其中，a为接合区23的有效宽度，b为异方性导电胶60的厚度。
有关图5及图6中所绘角度θ1、θ2和θ3皆仅为示意，以清楚说明各元件的相对关系，并非为实际角度。
综上所述，根据本发明所提供的曲面触控模组结构的贴合结构及贴合方法，其系将外观保护层的曲面内侧设计有一平面结构，此平面结构对应于触控元件层的接合区位置，使得触控元件层的接合区可直接热塑贴合于平面结构上，继而，当进行后段的热压接合制程，除需依产品形状曲率设计适用的接合平台外，不用对于其余现有的热压元件的外型进行修正(例如将热压头修改为曲面)，藉以避免触控元件层的导电线路造成三维变异，并改善接合过程中产生节距偏移的状况。
虽然本揭露已以实施方式揭露如上，然其并非用以限定本揭露，任何熟习此技术者，在不脱离本揭露之精神与范围内，当可作各种更动与润饰，因此本揭露之保护范围当视后附之申请专利范围所界定者为准。

Claims (9)

1.一种曲面触控模组结构，其特征在于，包含有：
一触控元件层，包括一显示区和一接合区，该显示区具有复数导电线路，该接合区具有与该些导电线路电性连接之复数第一接合垫；
一外观保护层，具有相隔的一外曲面与一内曲面，该内曲面包括一平面结构，该触控元件层热塑贴合于该内曲面并使该些第一接合垫位于该平面结构上，该外曲面为一连续的曲面，且该平面结构和对应于该显示区的该内曲面之间存在一断差；及
一附着层，设于该触控元件层和该外观保护层之间。
2.如权利要求1所述之曲面触控模组结构，更包含一软性触控模组，该软性触控模组面向该触控元件层，且该软性触控模组对应于该些第一接合垫的表面设有复数第二接合垫。
3.如权利要求2所述之曲面触控模组结构，更包含一异方性导电胶，该异方性导电胶设于该些第一接合垫与该些第二接合垫之间，使得该些第一接合垫和该些第二接合垫电性导通。
4.如权利要求1所述之曲面触控模组结构，其中该接合区的表面和该平面结构的表面为平行。
5.如权利要求1所述之曲面触控模组结构，其中该接合区的表面和该平面结构的表面为不平行。
6.一种曲面触控模组结构的贴合方法，其特征在于，包含下列步骤：
形成一触控元件层，该触控元件层包括一显示区和一接合区，该显示区具有复数导电线路，该接合区具有与该些导电线路电性连接之复数第一接合垫；
提供一外观保护层，该外观保护层具有相隔的一外曲面与一内曲面，该内曲面包括一平面结构，该外曲面为一连续的曲面；及
将该触控元件层热塑贴合于该外观保护层的该内曲面，并使该些第一接合垫位于该平面结构上，其中该平面结构和对应于该显示区的该内曲面之间存在一断差。
7.如权利要求6所述之曲面触控模组结构的贴合方法，其中该触控元件层与该外观保护层贴合的步骤中，系使用一黏着剂或因热塑行为使该触控元件层与该外观保护层之间形成一附着层。
8.如权利要求6所述之曲面触控模组的贴合方法，更包含使用一异方性导电胶接合该触控元件层与一软性触控模组，使该触控元件层的该些第一接合垫与该软性触控模组对应的复数第二接合垫连接以电性导通。
9.如权利要求8所述之曲面触控模组结构的贴合方法，其中该触控元件层与该软性触控模组接合的步骤中，系藉由一热压头与对置于一热压治具的该外观保护层、该触控元件层、该异方性导电胶与该软性触控模组进行热压。
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