CN113130722A - 利用通过焊接附着的磷光体元件的高光功率的光转换装置 - Google Patents
利用通过焊接附着的磷光体元件的高光功率的光转换装置 Download PDFInfo
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- CN113130722A CN113130722A CN202110414042.XA CN202110414042A CN113130722A CN 113130722 A CN113130722 A CN 113130722A CN 202110414042 A CN202110414042 A CN 202110414042A CN 113130722 A CN113130722 A CN 113130722A
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Abstract
提供了利用通过焊接附着的磷光体元件的高光功率的光转换装置。光转换装置包括磷光体轮,所述磷光体轮包括:光电陶瓷磷光体元件,其包括嵌入陶瓷基质中的一种或多种磷光体;可焊接金属堆叠,其包括沉积在所述光电陶瓷磷光体元件的背面的一个或多个金属层;以及金属散热器,所述金属散热器是可绕中心轴旋转的金属盘,并且,所述金属散热器通过其外缘上的焊接结合部附着到所述可焊接金属堆叠。响应于光源所施加的光束能量达到有效地将光电陶瓷磷光体元件加热到磷光体猝灭点的光束,光电陶瓷磷光体元件不发生开裂。
Description
本申请是申请号为201680067495.7的中国专利申请的分案申请。申请号为201680067495.7的中国专利申请是国际申请PCT/US2016/053367的中国国家阶段申请,该国际申请PCT/US2016/053367要求于2015年12月9日提交的标题为“HIGH OPTICAL POWERLIGHT CONVERSION DEVICE USING A PHOSPHOR ELEMENT WITH GLASS HOST(利用玻璃基质焊接的磷光体元件的高光功率的光转换装置)”的美国临时申请No.62/265,117的权益。2015年12月9日提交的美国临时申请No.62/265,117的全部内容通过引用并入本文。
该国际申请PCT/US2016/053367还要求于2015年9月25日提交的标题为“HIGHOPTICAL POWER LIGHT CONVERSION DEVICE USING AN OPTOCERAMIC PHOSPHOR ELEMENTWITH SOLDER ATTACHMENT(利用通过焊接附着的光电陶瓷磷光体元件的高光功率的光转换装置)”的美国临时申请No.62/232,702的权益。2015年9月25日提交的美国临时申请No.62/232,702的全部内容通过引用并入本文。
技术领域
以下涉及光学技术、磷光体技术、波长转换技术和相关技术,并且涉及使用这些技术的光电子、光子以及类似应用,例如(但不限于)投影显示器(例如数字光处理)、汽车照明等等。
背景技术
已知用于转换光波长的磷光体装置,其通常从较短波长向一个或多个较长波长下转换。在通常的方法中,磷光体材料分散在透明或半透明的结合剂材料(如环氧树脂、硅树脂等)中。磷光体由激光或其他泵浦光源激励或“泵浦”以发射磷光。磷光体装置可以是静态的,或者可以被配置为磷光体轮,在所述磷光体轮中,磷光体被布置在旋转轮的外边缘附近。磷光体轮设计为可以通过在不同的磷光体弧段中使用不同的磷光体来有利地提供不同的颜色(或更一般地说不同的光谱)的时间序列。也可以通过在磷光体弧段之间留下弧形间隙来提供零发射周期。例如,这种轮可用于为数字光处理(digital light processing,DLP)投影仪或其他DLP显示装置提供顺序的红色、绿色和蓝色光。
高光功率应用的问题在于,通常用于磷光体中的结合剂材料容易受到由于高功率泵浦激光的加热而导致的热损害。例如,在蓝色或紫外激光被转换为白光(或与蓝色泵浦激光混合形成白光的黄色光)的典型的下转换任务中,激光功率可以为25瓦量级或更高,从而导致显著的加热。
解决这个问题的方案是用陶瓷材料来代替结合剂材料,即,使用光电陶瓷磷光体。典型的陶瓷材料是通过在高温下并可选地在高压下烧结粉末状基材、结合剂和稳定剂的混合物来制造。其他制造工艺诸如化学气相沉积(chemical vapor deposition,CVD)或化学反应可以结合到陶瓷制造工艺中。对于光电陶瓷磷光体,选择基材以包含所需的磷光体组分,并且设计混合物和烧结以产生在工作光谱(包括泵浦光和磷光二者)上可光学透射的基质材料。陶瓷材料比诸如环氧树脂或硅树脂的常规磷光体结合剂材料更加致密,并且光电陶瓷磷光体一般耐热至少达到通常至少几百摄氏度的烧结温度,并且基于烧结工艺可以高达1000℃或更高。因此,当用高功率激光泵浦时,光电陶瓷磷光体预期是热稳定的。
一些市售的光电陶瓷磷光体包括嵌入陶瓷基质中的钇铝石榴石(YAG)、掺杂铈的YAG(YAG:Ce)、镥YAG(LuYAG)、硅酸盐基磷光体、硅-铝-氮氧化物(SiAlON)磷光体等等,陶瓷基质诸如为多晶氧化铝(Al2O3,PCA)、掺杂氧化镧的氧化钇(Y2O3-La2O3)、钇铝石榴石(Y3Al5O12)、铝酸镁尖晶石(MgAl2O4)、氧化镝(Dy2O3)、氧氮化铝(Al23O27N5)、氮化铝(AlN)等。例如参见Raukas等人的“Ceramic Phosphors for Light Conversion in LEDs(用于LED中的光转换的陶瓷磷光体)”,ECS Journal of Solid State Science and Technology,第2卷,第2期,第R3168-76页(2013)。
本文公开了一些改进。
发明内容
根据一些公开的实施例,一种光转换装置包括:包括嵌入陶瓷基质中的一种或多种磷光体的光电陶瓷磷光体元件;金属散热器;以及将光电陶瓷磷光体元件附着到金属散热器的焊接结合部。
根据一些公开的实施例,光转换装置包括:磷光体元件,该磷光体元件包括嵌入固体基质元件中的一种或多种磷光体;金属散热器;以及将磷光体元件附着到金属散热器的焊接结合部。在一些实施例中,磷光体元件包括嵌入固体玻璃基质元件中的一种或多种磷光体。
根据一些公开的方面,光发生器包括如前两段中的一段所阐述的光转换装置,以及布置成将光束施加到光转换元件的光源。响应于光源所施加的光束能量达到有效地将光电陶瓷磷光体元件加热到磷光体猝灭点的光束,光电陶瓷磷光体元件不发生开裂。
根据一些公开的实施例,一种制造光转换装置的方法包括:在包含嵌入陶瓷基质中的一种或多种磷光体的光电陶瓷磷光体元件的背面沉积可焊接金属堆叠;以及通过将可焊接金属堆叠焊接到散热器而将光电陶瓷磷光体元件附着到金属散热器。
根据一些公开的实施例,公开了制造光转换装置的方法。该方法包括在包括嵌入固体基质元件中的一种或多种磷光体的磷光体元件的背面沉积可焊接金属堆叠,并且通过将可焊接金属堆叠焊接到散热器上而将磷光体元件附着到金属散热器。
附图说明
图1示出了包括六个磷光体弧段的磷光体轮。图1的截面S-S示出了其中一个磷光体元件以及其与金属轮的焊接附着部的一部分的截面;
图2示出了图1的截面S-S的分解图(左侧)以及示意性示出主要制造操作的流程图(右侧);以及
图3示出了变型实施例,其中散热器(例如图1的金属轮)具有凹部,该凹部的形状和尺寸被设计为至少容纳焊接附着部并且可选地接纳磷光体元件的下部部分。
具体实施方式
如本文所使用的,并且如本领域中常见的,诸如“光谱”、“光学”、“波长”、“频率”、“光”、“光束”等术语不限于可见光谱,而是通过给定滤光器可以延伸到或者完全位于红外和/或紫外光谱区域中。
与预期的当利用高功率激光器泵浦时光电陶瓷磷光体将是热稳定的情况相反,发明人发现,实际上,随着高功率泵浦激光器的输出升高,光电陶瓷磷光体发生破坏性失效。具体而言,使用粘合剂或导热膏安装在散热器上的静态光电陶瓷磷光体元件在高功率泵浦激光器输出升高期间经历破坏性开裂。
如本文所公开的,发明人发现,通过采用光电陶瓷磷光体与散热器(例如Al或Cu)的焊接连接可以克服这种灾难性开裂失效模式。通过焊接附着,泵浦激光功率可以升高到足以产生磷光体猝灭而不会破坏光电陶瓷磷光体元件的高泵浦功率。不限于任何特定的操作理论,灾难性失效模式被认为是由于向光电陶瓷磷光体之外的热传导不足造成的,无论是就附着的热电阻而言,还是就附着的热电抗而言(即,在热传导升高之前的延迟),并且焊接附着通过充分附着改善了热传导,以克服灾难性开裂失效模式。鉴于此,设想除了焊接结合之外,还使用提供必要的热传导性能的其他附着结合。例如,设想利用通过在有机稀释剂中(以提供均匀分散)烧结银(Ag)纳米颗粒的粉末或膏剂形成的结合来代替焊接结合。烧结适于在银熔融温度以下的温度下进行,例如在约~250℃下,但在一些实施方案中,最佳工艺温度取决于诸如Ag纳米颗粒尺寸、密度和平均表面积之类的因素。当发生烧结时,可以可选地施加轻微的压力,和/或可选地可以在受控气氛中进行烧结。在烧结之后,银可工作于比烧结温度高得多的温度。不受限于任何特定的操作理论,该方法中的结合过程被相信可归因于原子扩散机制。
更一般地,如本文所公开的,使用焊接连接将固体磷光体元件附着到散热器(例如,Al或Cu)。焊接附着可以通过充分附着改善热传导,从而克服灾难性开裂或其他热失效模式。鉴于此,设想除了焊接结合之外,还采用提供必要的热传导性能的其他附着结合。
本文公开的焊接结合方法可以为各种类型的高温磷光体元件(诸如单晶或多晶磷光体元件、玻璃磷光体元件等)提供益处,其中磷光体结合至水晶、玻璃或其他固体基质材料中。本文公开的焊接结合方法对于其他类型的高温磷光体元件(诸如在晶体生长过程期间,将磷光体结合至具有高热稳定性的晶体中的单晶或多晶磷光体元件等)可以提供类似的益处。
图1示意性地示出了磷光体轮10,磷光体轮10包括由铜、铜合金、铝合金等制成的金属盘或“轮”12。一个或多个光电陶瓷磷光体元件(例如弧段14)附着到轮12的外周,即,附着在轮12的外缘处或外缘附近。因此,金属盘或轮12既用作光电陶瓷磷光体弧段14的承载部件,又用作光电陶瓷磷光体弧段14的散热器。示意性光电陶瓷磷光体弧段14是几何上有利的设计,其使得光电陶瓷磷光体材料的量最小化,同时能够使磷光体覆盖整个轮周。示意性磷光体轮10包括六个相同尺寸的光电陶瓷磷光体弧段14;然而,可以使用更多或更少的磷光体弧段(包括少至形成完整的360°圆的单个光电陶瓷磷光体弧段)。尽管通常图示和标记出示意性六个光电陶瓷磷光体弧段14,但应该理解,不同的光电陶瓷磷光体弧段可以包括不同的磷光体(例如,以发射不同颜色的磷光),和/或在相邻的光电陶瓷磷光体弧段之间可以存在间隙。在操作中,例如通过将马达(未示出)的马达轴连接到中心轴线16并且操作马达以沿着所示出的顺时针方向CW旋转(也可以考虑逆时针旋转)磷光体轮10,而使金属轮12围绕中心轴线16旋转。在旋转的同时,将泵浦光施加到局部区域-这在图1中通过激光器18施加示意性泵浦激光束斑点L来示意性地示出。随着金属轮12旋转,其依次承载光电陶瓷磷光体弧段14并与激光束L接触以发射磷光。可以容易理解的是,通过适当选择各种电光陶瓷磷光体弧段14的磷光体,可以产生各种颜色的时间序列,例如可在DLP显示器应用中适用的红-绿-蓝-红-绿-蓝。
继续参考图1并进一步参考图2,截面S-S示意性地示出了一个光电陶瓷磷光体弧段14以及其与金属轮12的焊接附着的一部分的截面。图2示出了截面S-S的分解图(左侧)以及示意性地示出了主要制造操作的流程图(右侧)。应注意的是,层厚度在图1的示意截面S-S中以及其在图2中所示的分解图中未按比例绘制。光电陶瓷磷光体弧段14包括光电陶瓷磷光体元件20,光电陶瓷磷光体元件20(通过非限制性示例)可以包括嵌入陶瓷材料中的诸如钇铝石榴石(YAG)、掺杂铈的YAG(YAG:Ce)、镥YAG(LuYAG)之类的磷光体、硅酸盐基磷光体、硅-铝-氮氧化物(SiAlON)磷光体等等,陶瓷材料在可见光谱中可光学透射,并且诸如为多晶氧化铝(Al2O3,PCA)、掺杂氧化镧的氧化钇(Y2O3-La2O3)、钇铝石榴石(Y3Al5O12)、铝酸镁尖晶石(MgAl2O4)、氧化镝(Dy2O3)、氧氮化铝(Al23O27N5)、氮化铝(AlN)等。例如参见Raukas等人的“Ceramic Phosphors for Light Conversion in LEDs(用于LED中的光转换的陶瓷磷光体)”,ECS Journal of Solid State Science and Technology,第2卷,第2期,第R3168-76页(2013)。在其它实施例中,磷光体元件弧段14包括磷光体元件20,作为非限制性示例,磷光体元件20可以包括嵌入在可见光谱中可光学透射的晶体、玻璃或其他固体基质材料中的诸如钇铝石榴石(YAG)、掺杂铈的YAG(YAG:Ce)、镥YAG(LuYAG)的磷光体、硅酸盐基磷光体、硅-铝-氧氮化物(SiAlON)磷光体等。例如,基质材料可以是诸如B270、BK7、P-SF68、P-SK57Q1、P-SK58A、P-BK7等的玻璃。
磷光体或磷光体掺杂剂可以被适当地选择以发射期望的发射光,例如,绿色、黄色、红色或者浅色组合(例如白色磷光体混合物)。可以使用任何合适的工艺来制造光电陶瓷磷光体元件20,例如(通过非限制性示例)将粉末状基底材料、结合剂和稳定剂的混合物在高温度下烧结。在其他实施例中,例如使用玻璃基质材料,磷光体元件20可以使用诸如(通过非限制性示例)熔融、模制、烧结等的合适工艺来制造。
在示意性示例中,采用光电陶瓷磷光体元件进行说明。可选地,可以将一种或多种光学涂层施加到光电陶瓷磷光体元件20的一个或多个表面上。为了示意的目的,光电陶瓷磷光体弧段14包括前面抗反射(anti reflection,AR)涂层22和背面电介质或金属或混合的电介质/金属镜面涂层24。在此使用的术语“前面”表示光泵浦激光器18或其它泵浦光束照射的光电陶瓷磷光体元件20的一侧;而在此使用的术语“背面”表示附着到散热器12(其中,在示意性示例中,磷光体轮10的金属轮12用作光电陶瓷磷光体元件20的散热器)的光电陶瓷磷光体元件20的一侧。AR涂层22被设计成使得照射在光电陶瓷磷光体元件20上的泵浦激光的反射最小化,同时不妨碍磷光的发射。电介质镜面涂层24被设计成反射磷光,并且可选地还被设计成反射泵浦激光。如图2所示,这些涂层可以通过溅射沉积S1来施加,但是可以使用适用于沉积构成这些涂层22、24的材料的任何其他沉积技术来执行沉积S1。还应理解,可以省略光学涂层22、24中的任一个或两个,和/或可以提供其他光学涂层,例如波长选择性滤光涂层、光散射涂层、沉积的菲涅耳透镜等等。
继续参考图1和2,光电陶瓷磷光体元件20和电介质或金属镜面涂层24(如果存在的话)通常不是非常适合于焊接结合的材料。为了便于通过焊接将光电陶瓷磷光体弧段14附着到金属轮12,光电陶瓷磷光体弧段14进一步包括可焊接金属堆叠30,可焊接金属堆叠沉积在光电陶瓷磷光体元件20的背面(或者更具体地,在示意性示例中沉积在电介质镜面涂层24的背面)。可焊接金属堆叠30可以包括少至为单个金属层;在示意性实施例中,可焊接金属堆叠30包括:与(作为非限制性示意性示例)铬或钛或钛-钨(TiW)合金的元件20相邻的粘合层32;(作为非限制性示意性示例)镍的扩散阻挡层34;和(作为非限制性示意性示例)金的可焊接金属层36。这仅仅是一个示意性的示例,并且可以使用本领域已知的用于促进非金属元件与金属元件的焊接的大量可焊接焊接堆叠。通过一些另外的非限制性示意性示例:可焊接金属层36可以是银、铂或另一种与焊接相容的金属或金属子堆叠,而不是金;镍扩散阻挡层可以包括百分之几(例如5%)的钒以降低其磁性特性,从而有助于通过磁控溅射进行沉积;可以完全省略扩散阻挡层34和/或可以完全省略粘合层32;等等。如图2所示,在金属沉积操作S2中,可焊接金属堆叠30例如可以通过溅射、电镀、真空金属蒸发(例如使用电子束蒸发、热蒸发)等而沉积在光电陶瓷磷光体元件20的背面(或者更具体地在示意性示例中,沉积在电介质镜面涂层24的背面),但也可以使用适于沉积构成这些可焊接金属堆叠30的材料的任何其它沉积技术来执行沉积S1。
继续参考图1和2,通过形成焊接结合部40的焊接操作S3,将包括光电陶瓷磷光体元件20、可选光学涂层22、24以及可焊接金属堆叠30的光电陶瓷磷光体弧段14附着到金属基板12(在图1的示意性示例中为金属轮12)。在图2中示意性示出的一种合适方法中,焊接操作S3需要通过涂覆有焊剂402的焊料预制件401将光电陶瓷磷光体弧段14放置在金属散热器12上,焊料预制件401介于光电陶瓷磷光体弧段14和金属散热器12之间。在另一个预期实施例中,焊剂被混合到焊料预制件中而不是被涂覆在焊料预制件上。可以使用各种焊料合金作为焊料预制件401,例如作为非限制性示例,可以使用铅/铟/银焊料合金、金/锡焊料合金、金-硅(AuSi)合金等等。然后将该组件加热到焊接温度,该焊接温度有效地使焊料401、402在可焊接金属堆叠30和金属散热器12之间形成焊接结合部40。可以设想其他方法用于执行焊接操作S3,例如使用焊枪将预先混合的焊接材料和焊剂布置在待焊接在一起的一个或两个表面上,然后将它们压在一起。为了商业制造,焊接操作S3应该是高产量的自动化工艺。
简要参考图3,在变型实施例中,待形成焊接附着的散热器基板12包括凹部44,凹部44的形状和深度足以接纳涂覆有焊剂402的焊料预制件401,如此以便于焊接操作S3。然后,所得到的装置将具有设置在凹部44中的焊接结合部40。可选地,凹部44可以足够深以完全接纳光电陶瓷磷光体弧段14的下部部分,使得所得到的装置将焊接结合部40以及光电陶瓷磷光体元件20的下部部分设置在凹部44中。
示意性实施例涉及图1的磷光体轮10。然而,应该理解,所公开的用于将光电陶瓷磷光体元件20焊接附着到金属散热器12的方法同样适用于将静态磷光体元件附着到散热器。例如,在一个应用中,光电陶瓷磷光体元件20包含一种或多种产生黄色或淡黄色磷光的磷光体,并且泵浦激光束是蓝色激光束。通过适当地调节光电陶瓷磷光体元件20中的磷光体浓度和蓝色泵浦光束功率,以产生蓝色泵浦光和黄色或淡黄色磷光的混合物来近似白光。光电陶瓷磷光体元件可以用于任何期望的光学系统中。作为一个非限制性示例,如本文所公开的焊接到散热器的静态光电陶瓷磷光体元件可以与光隧道结合使用,其中光隧道中的高光功率通过经由如本文公开的焊接结合从电陶瓷磷光体元件向散热器的有效传热来适配。
在实验测试中,已经测试了焊接到铜散热器的光电陶瓷磷光体元件,同时与通过导热膏附着到铜散热器的光电陶瓷磷光体元件进行比较。一些测试的光电陶瓷磷光体元件包括前面AR涂层22和后面电介质镜面涂层24,后者被设计用作背面空气界面。在测试中,观察到对于有效地加热光电陶瓷磷光体元件直至并超过磷光体猝灭点的光束能量,通过焊接固定到散热器的光电陶瓷磷光体元件没有开裂。相比之下,通过导热膏固定到散热器上的光电陶瓷磷光体元件随着泵浦激光功率的增加而表现出灾难性的开裂,并且在到达磷光体猝灭点之前就发生了这种开裂,从而限制了装置的热范围。与使用所公开的焊接结合安装的光电陶瓷磷光体元件相比,在使用导热膏安装的光电陶瓷磷光体元件中还观察到AR涂层22的损坏,导致激光诱导损伤(laser induced damage,LITD)阈值的减少。还令人惊讶地观察到,尽管背面界面是针对焊接结合部40,而不是针对设计基准空气(折射率n=1)的,但是设计用于背面空气界面的背面电介质镜面涂层24仍提供了显著的光输出改善。不限于任何特定的操作理论,相信这可能是由于多个堆叠层提供了显著的反射,使得到达背面镜面/焊接界面的光的比例低。
这些结果证明,所公开的焊接附着方法能够构建包括光电陶瓷磷光体元件20、金属散热器12和焊接结合部40的无源光转换装置,该光电陶瓷磷光体元件20包括嵌入陶瓷基质中的一种或多种磷光体,该焊接结合部40将光电陶瓷磷光体元件20附着到金属散热器12,该金属散热器12可以以达到磷光体猝灭点的任何值的泵浦光束能量工作,而不使光电陶瓷磷光体元件20发生开裂。相比之下,传统的导热膏附着会导致在远低于磷光体猝灭点时就会灾难性开裂,从而限制装置性能。应该注意,所公开的焊接结合部为无源光学元件提供了改进的装置性能,其在许多实施例中不包括电气或电子部件。
应该理解,上面公开的各种特征和功能和其他的特征和功能或其替代方式可以被期望地组合成许多其他不同的系统或应用。将进一步理解的是,本领域技术人员随后可以做出各种目前未预见或未预料到的替代方案、修改、变型或改进,其也旨在由所附的权利要求涵盖。
以下各项目对应本申请母案的原始递交权利要求。
项目1.一种光转换装置,包括:
磷光体轮,其包括;
光电陶瓷磷光体元件,包括嵌入陶瓷基质中的一种或多种磷光体;
金属散热器;和
焊接结合部,所述焊接结合部将所述光电陶瓷磷光体元件附着到所述金属散热器。
项目2.根据项目1所述的光转换装置,其中所述光转换装置是静态光转换装置或磷光体轮。
项目3.根据项目1至2中任一项所述的光转换装置,还包括:
镜面涂层,设置在所述光电陶瓷磷光体元件和所述焊接结合部之间的所述光电陶瓷磷光体元件的背面。
项目4.根据项目3所述的光转换装置,其中所述镜面是经设计以与背面空气界面一起操作的电介质镜面。
项目5.根据项目3至4中任一项所述的光转换装置,还包括:
可焊接金属堆叠,包括设置在所述镜面涂层与所述焊接结合部之间的所述镜面涂层上的一个或多个金属层;
其中所述焊接结合部附着到所述可焊接金属堆叠。
项目6.根据项目1至2中任一项所述的光转换装置,还包括:
可焊接金属堆叠,包括设置在所述光电陶瓷磷光体元件和所述焊接结合部之间的所述光电陶瓷磷光体元件的背面的一个或多个金属层;
其中所述焊接结合部附着到所述可焊接金属堆叠。
项目7.根据项目5至6中任一项所述的光转换装置,其中所述可焊接金属堆叠包括以下堆叠之一:
铬/镍/金层堆叠,其中所述焊接结合部附着到金层;
钛/镍/金层堆叠,其中所述焊接结合部附着在金层;
铬/镍/银层堆叠,其中所述焊接结合部附着到银层;和
钛/镍/银层堆叠,其中所述焊接结合部附着到银层。
项目8.根据项目7所述的光转换装置,其中所述可焊接金属堆叠的所述镍层包含钒。
项目9.根据项目1至8中任一项所述的光转换装置,其中所述金属散热器包括凹部,所述焊接结合部设置在所述凹部内。
项目10.根据项目9所述的光转换装置,其中所述光电陶瓷磷光体元件的下部部分也设置在所述散热器的所述凹部内。
项目11.根据项目1至10中任一项所述的光转换装置,其中所述光电陶瓷磷光体元件响应于所施加的光束能量达到有效地将所述光电陶瓷磷光体元件加热到所述磷光体猝灭点的所述光束而不发生开裂。
项目12.一种光发生器,包括:
根据项目1至11中任一项所述的光转换装置;和
光源,所述光源被布置成将光束施加到所述光转换元件;
其中所述光电陶瓷磷光体元件响应于所述光源施加的光束能量达到有效地将所述光电陶瓷磷光体元件加热至所述磷光体猝灭点的所述光束而不发生开裂。
项目13.一种光转换装置,包括:
磷光体元件,所述磷光体元件包括嵌入固体基质元件中的一种或多种磷光体;
金属散热器;和
焊接结合部,将所述磷光体元件附着到所述金属散热器焊接。
项目14.根据项目13所述的光转换装置,其中所述光转换装置是静态光转换装置或磷光体轮。
项目15.根据项目13至14中任一项所述的光转换装置,还包括:
镜面涂层,设置在所述磷光体元件和所述焊接结合部之间的所述磷光体元件的背面。
项目16.根据项目15所述的光转换装置,其中所述镜面是经设计以与背面空气界面一起操作的电介质镜面。
项目17.根据项目15至16中任一项所述的光转换装置,还包括:
可焊接金属堆叠,包括在所述镜面涂层与所述焊接结合部之间的所述镜面涂层上的一个或多个金属层;
其中所述焊接结合部附着到所述可焊接金属堆叠。
项目18.根据项目13至14中任一项所述的光转换装置,还包括:
可焊接金属堆叠,包括在所述磷光体元件和所述焊接结合部之间的在所述磷光体元件的背面的所述一个或多个金属层;
其中所述焊接结合部附着到所述可焊接金属堆叠。
项目19.根据项目17至18中任一项所述的光转换装置,其中所述可焊接金属堆叠包括以下堆叠之一:
铬/镍/金层堆叠,其中所述焊接结合部附着到金层;
钛/镍/金层堆叠,其中所述焊接结合部附着到金层;
铬/镍/银层堆叠,其中所述焊接结合部附着到银层;和
钛/镍/银层堆叠,其中所述焊接结合部附着到银层。
项目20.根据项目19所述的光转换装置,其中所述可焊性金属堆叠的所述镍层包含钒。
项目21.根据项目13至20中任一项所述的光转换装置,其中所述金属散热器包括凹部,所述焊接结合部设置在所述凹部内。
项目22.根据项目21所述的光转换装置,其中所述磷光体元件的下部部分也设置在所述散热器的所述凹部内。
项目23.根据项目13至22中任一项所述的光转换装置,其中所述磷光体元件包括嵌入固体玻璃基质元件中的一种或多种磷光体。
项目24.根据项目23所述的光转换装置,其中所述固体玻璃基质元件包括B270、BK7、P-SF68、P-SK57Q1、P-SK58A或P-BK7。
项目25.一种光发生器,包括:
根据项目13至24中任一项所述的光转换装置;和
光源,所述光源被布置成将光束施加到所述光转换元件;
其中所述光电陶瓷磷光体元件响应于所述光源施加的光束能量达到有效地将所述光电陶瓷磷光体元件加热至所述磷光体猝灭点的所述光束而不发生开裂。
项目26.一种制造光转换装置的方法,包括:
在包括嵌入陶瓷基质中的一种或多种磷光体的光电陶瓷磷光体元件的背面沉积可焊接金属堆叠;和
通过将所述可焊接金属堆叠焊接到所述散热器上,而将所述光电陶瓷磷光体元件附着到所述金属散热器。
项目27.根据项目26所述的方法,还包括:
在将所述可焊金属堆叠沉积在所述光电陶瓷磷光体元件的背面之前,在所述电光陶瓷磷光体元件的背面沉积电介质镜面涂层,由此将所述可焊金属堆叠沉积在所述电介质镜面涂层上。
项目28.根据项目26至27中任一项所述的方法,其中所述将可焊接金属堆叠沉积在所述光电陶瓷磷光体元件的背面包括:
将铬层或钛层沉积到所述光电陶瓷磷光体元件的背面或沉积到设置在所述光电陶瓷磷光体元件的背面的电介质镜面涂层上;
在所述铬层或钛层上沉积镍层;和
在所述镍层上沉积银层、铂层或金层。
项目29.根据项目28所述的方法,其中所述镍层包含钒。
项目30.根据项目26至27中任一项所述的方法,其中所述可焊接金属堆叠沉积在所述光电陶瓷磷光体元件的背面包括:
在所述镍层上沉积可焊接的银层、铂层或金层;
其中所述焊接包括将所述可焊接的银层、铂层或金层焊接至所述散热器。
项目31.根据项目26至28中任一项所述的方法,其中所述附着包括:
将所述光电陶瓷磷光体元件设置在所述金属散热器上,其中在所述光电陶瓷磷光体元件和所述金属散热器之间夹设有焊料预制件以形成组件;和
将所述组件加热到焊接温度,所述焊接温度有效地使所述焊料预制件在所述可焊接金属堆叠和所述金属散热器之间形成焊接结合部。
项目32.根据项目31所述的方法,其中所述焊料预制件包括涂覆在所述焊料预制件上或混合到所述焊料预制件中的焊剂。
项目33.根据项目31至32中任一项所述的方法,其中所述焊料预制件包括铅/铟/银焊料合金或金/锡焊料合金。
项目34.一种制造光转换装置的方法,包括:
在包括嵌入固体基质元件中的一种或多种磷光体的磷光体元件的背面沉积可焊接金属堆叠;和
通过将所述可焊接金属堆叠焊接到所述散热器上,而将所述磷光体元件附着到所述金属散热器。
项目35.根据项目34所述的方法,还包括:
在将所述可焊性金属堆叠沉积在所述磷光体元件的背面之前,在所述磷光体元件的背面沉积电介质镜面涂层,由此将所述可焊性金属堆叠沉积在所述电介质镜面涂层上。
项目36.根据项目34至35中任一项所述的方法,其中所述可焊金属堆叠在所述磷光体元件的所述背面的沉积包括:
将铬层或钛层沉积在所述磷光体元件的背面或沉积在设置于所述磷光体元件的背面的电介质镜面涂层上;
在所述铬层或钛层上沉积镍层;和
在所述镍层上沉积银层、铂层或金层。
项目37.根据项目33至34中任一项所述的方法,其中,在所述磷光体元件的背面沉积所述可焊接金属堆叠包括:
在所述镍层上沉积可焊接的银层、铂层或金层;
其中所述焊接包括将所述可焊接的银层、铂层或金层焊接至所述散热器。
项目38.根据项目33至34中任一项所述的方法,其中所述附着包括:
将所述磷光体元件设置在所述金属散热器上,其中在所述磷光体元件和所述金属散热器之间夹设有焊料预制件以形成组件;和
将所述组件加热到焊接温度,所述焊接温度有效地使所述焊料预制件在所述可焊接金属堆叠和所述金属散热器之间形成焊接结合部。
项目39.根据项目38所述的方法,其中所述焊料预制件包括涂覆在所述焊料预预制件或混合到所述焊料预预制件中的焊剂。
Claims (36)
1.一种光转换装置,包括:
磷光体轮,所述磷光体轮包括:
光电陶瓷磷光体元件,其包括嵌入陶瓷基质中的一种或多种磷光体;
可焊接金属堆叠,其包括沉积在所述光电陶瓷磷光体元件的背面的一个或多个金属层;以及
金属散热器,所述金属散热器是可绕中心轴旋转的金属盘,并且,所述金属散热器通过其外缘上的焊接结合部附着到所述可焊接金属堆叠。
2.根据权利要求1所述的光转换装置,还包括:
镜面涂层,设置在所述光电陶瓷磷光体元件和所述可焊接金属堆叠之间的所述光电陶瓷磷光体元件的背面。
3.根据权利要求2所述的光转换装置,其中所述镜面涂层是经设计以与背面空气界面一起操作的电介质镜面。
4.根据权利要求1至3中任一项所述的光转换装置,其中所述可焊接金属堆叠包括以下堆叠之一:
铬/镍/金层堆叠,其中所述焊接结合部附着到金层;
钛/镍/金层堆叠,其中所述焊接结合部附着到金层;
铬/镍/银层堆叠,其中所述焊接结合部附着到银层;以及
钛/镍/银层堆叠,其中所述焊接结合部附着到银层。
5.根据权利要求4所述的光转换装置,其中所述可焊接金属堆叠的所述镍层包含钒。
6.根据权利要求1所述的光转换装置,其中所述可焊接金属堆叠的所述金属层之一包括粘合层或扩散阻挡层。
7.根据权利要求1所述的光转换装置,其中所述可焊接金属堆叠包括:
可焊接金属层;
粘合层,所述粘合层与所述磷光体元件相邻;以及
扩散阻挡层,所述扩散阻挡层设置在所述粘合层和所述可焊接金属层之间。
8.根据权利要求7所述的光转换装置,其中所述粘合层包含铬或钛,所述扩散阻挡层包含镍,所述可焊接金属层包含金或银。
9.根据权利要求8所述的光转换装置,其中所述可焊接金属堆叠的所述扩散阻挡层还包含钒。
10.根据权利要求1至3中任一项所述的光转换装置,其中所述金属散热器包括凹部,所述焊接结合部设置在所述凹部内。
11.根据权利要求10所述的光转换装置,其中所述光电陶瓷磷光体元件的下部部分也设置在所述金属散热器的所述凹部内。
12.根据权利要求1至3中任一项所述的光转换装置,其中所述光电陶瓷磷光体元件响应于所施加的光束能量达到有效地将所述光电陶瓷磷光体元件加热到所述磷光体猝灭点的光束而不发生开裂。
13.一种光发生器,包括:
根据权利要求1至12中任一项所述的光转换装置;以及
光源,所述光源被布置成将光束施加到所述光转换装置;
其中所述光电陶瓷磷光体元件响应于所述光源施加的光束能量达到有效地将所述光电陶瓷磷光体元件加热至所述磷光体猝灭点的所述光束而不发生开裂。
14.一种光转换装置,包括:
磷光体轮,所述磷光体轮包括:
磷光体元件,其包括嵌入固体基质元件中的一种或多种磷光体;
电介质镜面涂层,所述电介质镜面涂层设置在所述磷光体元件的背面;
可焊接金属堆叠,所述可焊接金属堆叠沉积在所述电介质镜面涂层的背面;金属散热器;以及
焊接结合部,所述焊接结合部将所述可焊接金属堆叠附着到所述金属散热器。
15.根据权利要求14所述的光转换装置,其中所述金属散热器是金属盘,并且其中所述磷光体元件通过所述焊接结合部附着到所述金属盘的外缘。
16.根据权利要求14至15中任一项所述的光转换装置,其中所述可焊接金属堆叠包括以下堆叠之一:
铬/镍/金层堆叠,其中所述焊接结合部附着到金层;
钛/镍/金层堆叠,其中所述焊接结合部附着到金层;
铬/镍/银层堆叠,其中所述焊接结合部附着到银层;以及
钛/镍/银层堆叠,其中所述焊接结合部附着到银层。
17.根据权利要求16所述的光转换装置,其中所述可焊接金属堆叠的所述镍层包含钒。
18.根据权利要求16所述的光转换装置,其中所述可焊接金属堆叠包括与所述磷光体元件相邻的粘合层、可焊接金属层和设置在所述粘合层和所述可焊接金属层之间的扩散阻挡层,其中所述粘合层包含铬或钛,所述扩散阻挡层包含镍,并且所述可焊接金属层包含金或银。
19.根据权利要求18所述的光转换装置,其中所述可焊接金属堆叠的所述扩散阻挡层还包含钒。
20.根据权利要求14至15中任一项所述的光转换装置,其中所述金属散热器包括凹部,所述焊接结合部设置在所述凹部内。
21.根据权利要求20所述的光转换装置,其中所述磷光体元件的下部部分也设置在所述金属散热器的所述凹部内。
22.根据权利要求14至15中任一项所述的光转换装置,其中所述磷光体元件包括嵌入固体玻璃基质元件中的一种或多种磷光体。
23.根据权利要求22所述的光转换装置,其中所述固体玻璃基质元件包括B270、BK7、P-SF68、P-SK57Q1、P-SK58A或P-BK7。
24.一种光发生器,包括:
根据权利要求14至23中任一项所述的光转换装置;以及
光源,所述光源被布置成将光束施加到所述光转换装置;
其中所述磷光体元件响应于所述光源施加的光束能量达到有效地将所述磷光体元件加热至所述磷光体猝灭点的所述光束而不发生开裂。
25.一种制造光转换装置的方法,包括:
在磷光体轮的光电陶瓷磷光体元件的背面沉积可焊接金属堆叠,所述光电陶瓷磷光体元件包括嵌入陶瓷基质中的一种或多种磷光体;
提供金属散热器,所述金属散热器是可绕中心轴旋转的金属盘;以及
通过将所述可焊接金属堆叠焊接到所述金属盘的外缘,将所述光电陶瓷磷光体元件附着到所述金属盘的所述外缘。
26.根据权利要求25所述的方法,还包括:
在将所述可焊接金属堆叠沉积在所述光电陶瓷磷光体元件的所述背面之前,在所述光电陶瓷磷光体元件的所述背面沉积电介质镜面涂层,由此将所述可焊接金属堆叠沉积在所述电介质镜面涂层上。
27.根据权利要求25至26中任一项所述的方法,其中将所述可焊接金属堆叠沉积在所述光电陶瓷磷光体元件的所述背面包括:
将铬层或钛层沉积到所述光电陶瓷磷光体元件的所述背面,或将铬层或钛层沉积到设置在所述光电陶瓷磷光体元件的所述背面的电介质镜面涂层上;
在所述铬层或钛层上沉积镍层;以及
在所述镍层上沉积银层、铂层或金层。
28.根据权利要求27所述的方法,其中所述镍层包含钒。
29.根据权利要求25至26中任一项所述的方法,其中将所述可焊接金属堆叠沉积在所述光电陶瓷磷光体元件的所述背面包括:
在镍层上沉积可焊接的银层、铂层或金层;
其中所述焊接包括将所述可焊接的银层、铂层或金层焊接至所述金属散热器。
30.根据权利要求25至26中任一项所述的方法,其中所述附着包括:
将所述光电陶瓷磷光体元件设置在所述金属散热器上,其中在所述光电陶瓷磷光体元件和所述金属散热器之间夹设有焊料预制件以形成组件;以及
将所述组件加热到焊接温度,所述焊接温度有效地使所述焊料预制件在所述可焊接金属堆叠和所述金属散热器之间形成焊接结合部。
31.根据权利要求30所述的方法,其中所述焊料预制件包括涂覆在所述焊料预制件上或混合到所述焊料预制件中的焊剂。
32.根据权利要求30所述的方法,其中所述焊料预制件包括铅/铟/银焊料合金或金/锡焊料合金。
33.根据权利要求25所述的方法,其中所述沉积可焊接金属堆叠包括在所述磷光体元件的所述背面沉积粘合层,在所述粘合层上沉积扩散阻挡层,以及在所述扩散阻挡层上沉积可焊接金属层,其中所述粘合层包含铬或钛,所述扩散阻挡层包含镍,并且所述可焊接金属层包含金或银或铂。
34.根据权利要求33所述的方法,其中所述扩散阻挡层还包含钒。
35.根据权利要求25所述的方法,其中在所述光电陶瓷磷光体元件的所述背面沉积可焊接金属堆叠,包括:
沉积可焊接的银、铂或金层作为所述可焊接金属层;
其中,所述焊接包括将所述可焊接的银、铂或金层焊接到所述金属散热器。
36.根据权利要求26所述的方法,其中所述电介质镜面涂层是经设计以与背面空气界面一起操作的电介质镜面。
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JP2020046638A (ja) * | 2018-09-21 | 2020-03-26 | 日本特殊陶業株式会社 | 光波長変換装置 |
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US10833211B2 (en) | 2020-11-10 |
JP7170073B2 (ja) | 2022-11-11 |
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JP7113745B2 (ja) | 2022-08-05 |
TW201720777A (zh) | 2017-06-16 |
JP2021067957A (ja) | 2021-04-30 |
US20170092786A1 (en) | 2017-03-30 |
TWI629251B (zh) | 2018-07-11 |
CN108367968A (zh) | 2018-08-03 |
EP3353125A1 (en) | 2018-08-01 |
KR20180056762A (ko) | 2018-05-29 |
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