CN113056827A - 显示基板及其制备方法、显示装置 - Google Patents
显示基板及其制备方法、显示装置 Download PDFInfo
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- CN113056827A CN113056827A CN201980002170.4A CN201980002170A CN113056827A CN 113056827 A CN113056827 A CN 113056827A CN 201980002170 A CN201980002170 A CN 201980002170A CN 113056827 A CN113056827 A CN 113056827A
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- 239000000758 substrate Substances 0.000 title claims abstract description 444
- 238000002360 preparation method Methods 0.000 title abstract description 12
- 230000002093 peripheral effect Effects 0.000 claims abstract description 89
- 238000009413 insulation Methods 0.000 claims abstract description 54
- 230000007704 transition Effects 0.000 claims abstract description 52
- 239000010410 layer Substances 0.000 claims description 1326
- 229910052751 metal Inorganic materials 0.000 claims description 162
- 239000002184 metal Substances 0.000 claims description 162
- 238000000034 method Methods 0.000 claims description 101
- 230000008569 process Effects 0.000 claims description 93
- 239000011810 insulating material Substances 0.000 claims description 84
- 238000004519 manufacturing process Methods 0.000 claims description 67
- 238000000059 patterning Methods 0.000 claims description 59
- 239000003990 capacitor Substances 0.000 claims description 57
- 239000011229 interlayer Substances 0.000 claims description 49
- 238000005538 encapsulation Methods 0.000 claims description 48
- 238000003860 storage Methods 0.000 claims description 41
- 238000012546 transfer Methods 0.000 claims description 33
- 239000010409 thin film Substances 0.000 claims description 26
- 238000003475 lamination Methods 0.000 claims description 20
- 238000000151 deposition Methods 0.000 claims description 9
- 238000004806 packaging method and process Methods 0.000 claims description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
- 239000011241 protective layer Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 description 108
- 239000010408 film Substances 0.000 description 34
- 229920002120 photoresistant polymer Polymers 0.000 description 33
- 239000010936 titanium Substances 0.000 description 30
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 25
- 229910052719 titanium Inorganic materials 0.000 description 25
- 239000007769 metal material Substances 0.000 description 24
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 24
- 229910052581 Si3N4 Inorganic materials 0.000 description 23
- 229910052782 aluminium Inorganic materials 0.000 description 23
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 23
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 23
- 229910052814 silicon oxide Inorganic materials 0.000 description 22
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 17
- 229910052710 silicon Inorganic materials 0.000 description 17
- 239000010703 silicon Substances 0.000 description 17
- 239000002356 single layer Substances 0.000 description 17
- 239000000956 alloy Substances 0.000 description 16
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 15
- 229910052750 molybdenum Inorganic materials 0.000 description 15
- 239000011733 molybdenum Substances 0.000 description 15
- 239000002861 polymer material Substances 0.000 description 14
- 239000004642 Polyimide Substances 0.000 description 12
- 239000011368 organic material Substances 0.000 description 12
- 238000002161 passivation Methods 0.000 description 12
- 229920001721 polyimide Polymers 0.000 description 12
- 230000006870 function Effects 0.000 description 11
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 229920000178 Acrylic resin Polymers 0.000 description 9
- 239000004925 Acrylic resin Substances 0.000 description 9
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 9
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 9
- 239000002274 desiccant Substances 0.000 description 9
- 239000005011 phenolic resin Substances 0.000 description 9
- 239000002952 polymeric resin Substances 0.000 description 9
- 229920003002 synthetic resin Polymers 0.000 description 9
- 239000002096 quantum dot Substances 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- 239000004954 Polyphthalamide Substances 0.000 description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 7
- 230000000903 blocking effect Effects 0.000 description 7
- 238000005530 etching Methods 0.000 description 7
- 239000002346 layers by function Substances 0.000 description 7
- 229910052760 oxygen Inorganic materials 0.000 description 7
- 239000001301 oxygen Substances 0.000 description 7
- 229920006375 polyphtalamide Polymers 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 238000011161 development Methods 0.000 description 6
- 239000003989 dielectric material Substances 0.000 description 6
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 239000011777 magnesium Substances 0.000 description 6
- -1 polyethylene terephthalate Polymers 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- 230000008021 deposition Effects 0.000 description 5
- 238000001514 detection method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 230000005284 excitation Effects 0.000 description 5
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 5
- 239000012212 insulator Substances 0.000 description 5
- 239000012044 organic layer Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical class C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 3
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical class [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 3
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 3
- 239000004695 Polyether sulfone Substances 0.000 description 3
- 239000004697 Polyetherimide Substances 0.000 description 3
- FRLJSGOEGLARCA-UHFFFAOYSA-N cadmium sulfide Chemical class [S-2].[Cd+2] FRLJSGOEGLARCA-UHFFFAOYSA-N 0.000 description 3
- UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical class [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 229910052733 gallium Inorganic materials 0.000 description 3
- 150000002290 germanium Chemical class 0.000 description 3
- 230000005525 hole transport Effects 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical class [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 3
- XCAUINMIESBTBL-UHFFFAOYSA-N lead(ii) sulfide Chemical compound [Pb]=S XCAUINMIESBTBL-UHFFFAOYSA-N 0.000 description 3
- 229910052744 lithium Inorganic materials 0.000 description 3
- 229910052749 magnesium Inorganic materials 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 3
- 229920000058 polyacrylate Polymers 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- 229920006393 polyether sulfone Polymers 0.000 description 3
- 229920001601 polyetherimide Polymers 0.000 description 3
- 239000011112 polyethylene naphthalate Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 229920005591 polysilicon Polymers 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000002310 reflectometry Methods 0.000 description 3
- GGYFMLJDMAMTAB-UHFFFAOYSA-N selanylidenelead Chemical class [Pb]=[Se] GGYFMLJDMAMTAB-UHFFFAOYSA-N 0.000 description 3
- 150000003376 silicon Chemical class 0.000 description 3
- 150000003384 small molecules Chemical class 0.000 description 3
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 3
- 239000011787 zinc oxide Substances 0.000 description 3
- GTLQJUQHDTWYJC-UHFFFAOYSA-N zinc;selenium(2-) Chemical class [Zn+2].[Se-2] GTLQJUQHDTWYJC-UHFFFAOYSA-N 0.000 description 3
- 239000011358 absorbing material Substances 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 230000009545 invasion Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/351—Thickness
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
一种显示基板及其制备方法、显示装置。该显示基板(100)包括衬底基板(1000)、引线(1210)、多个接触垫(1310)、第一绝缘层叠层(1320)及第二绝缘层叠层(1330)。衬底基板(1000)包括显示区(1100)与至少部分围绕显示区的围堰区(1102),围堰区(1102)远离显示区一侧的过渡区(1103),过渡区(1103)远离围堰区(1102)一侧的第一邦定区(1300)以及邦定周边区(1500);多个接触垫(1310)位于第一邦定区(1300),被配置为与引线(1210)电连接;第一绝缘层叠层(1320)位于第一邦定区(1300);第二绝缘层叠层(1330)位于邦定周边区(1500),第二绝缘层叠层(330)的至少两个绝缘层延伸到第一邦定区(1300)中以得到第一绝缘层叠层(1320),第一绝缘层叠层(1320)的在垂直于衬底基板方向上的厚度小于第二绝缘层叠层(1330)在垂直于衬底基板方向上的厚度。
Description
PCT国内申请,说明书已公开。
Claims (32)
- PCT国内申请,权利要求书已公开。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/CN2019/114061 WO2021081765A1 (zh) | 2019-10-29 | 2019-10-29 | 显示基板及其制备方法、显示装置 |
Publications (2)
Publication Number | Publication Date |
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CN113056827A true CN113056827A (zh) | 2021-06-29 |
CN113056827B CN113056827B (zh) | 2024-07-05 |
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CN201980002170.4A Active CN113056827B (zh) | 2019-10-29 | 2019-10-29 | 显示基板及其制备方法、显示装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US12004387B2 (zh) |
EP (1) | EP4053901A4 (zh) |
CN (1) | CN113056827B (zh) |
WO (1) | WO2021081765A1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113517328A (zh) * | 2021-07-12 | 2021-10-19 | 京东方科技集团股份有限公司 | 一种显示面板以及显示装置 |
US20220413657A1 (en) * | 2021-06-23 | 2022-12-29 | Samsung Display Co., Ltd. | Input sensing panel, display device having the same, and method of manufacturing the display device |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20230020035A (ko) * | 2021-08-02 | 2023-02-10 | 삼성디스플레이 주식회사 | 증착용 마스크 |
CN113625483B (zh) * | 2021-08-31 | 2023-05-09 | 厦门天马微电子有限公司 | 一种显示面板及显示装置 |
WO2023070574A1 (zh) * | 2021-10-29 | 2023-05-04 | 京东方科技集团股份有限公司 | 显示基板及其制造方法和显示装置 |
KR20240094219A (ko) * | 2022-12-15 | 2024-06-25 | 삼성디스플레이 주식회사 | 표시 모듈 및 이를 포함하는 전자 장치 |
WO2024130695A1 (zh) * | 2022-12-23 | 2024-06-27 | 京东方科技集团股份有限公司 | 阵列基板及其制备方法、显示面板、显示装置 |
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US20160064691A1 (en) * | 2014-08-29 | 2016-03-03 | Samsung Display Co., Ltd. | Display apparatus and method of manufacturing the same |
CN107026177A (zh) * | 2017-03-31 | 2017-08-08 | 京东方科技集团股份有限公司 | 一种coa基板及其制备方法、显示装置 |
CN107329336A (zh) * | 2017-07-11 | 2017-11-07 | 厦门天马微电子有限公司 | 一种显示基板、显示面板及显示装置 |
CN107819014A (zh) * | 2017-10-25 | 2018-03-20 | 武汉华星光电技术有限公司 | 柔性显示面板及其制备方法 |
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CN109388287A (zh) * | 2018-09-29 | 2019-02-26 | 上海天马微电子有限公司 | 一种触控显示面板以及电子设备 |
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US10743425B2 (en) * | 2016-10-31 | 2020-08-11 | Lg Display Co., Ltd. | Display device and method for manufacturing the same |
US10673017B2 (en) | 2017-03-23 | 2020-06-02 | Sharp Kabushiki Kaisha | Organic EL display device |
KR102343794B1 (ko) | 2017-05-24 | 2021-12-28 | 삼성디스플레이 주식회사 | 표시 장치 |
US10923553B2 (en) * | 2017-09-26 | 2021-02-16 | Sharp Kabushiki Kaisha | Display device |
KR102652448B1 (ko) | 2018-03-13 | 2024-03-29 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
KR102553270B1 (ko) * | 2018-04-16 | 2023-07-07 | 삼성디스플레이 주식회사 | 표시 장치 |
-
2019
- 2019-10-29 CN CN201980002170.4A patent/CN113056827B/zh active Active
- 2019-10-29 WO PCT/CN2019/114061 patent/WO2021081765A1/zh unknown
- 2019-10-29 EP EP19945410.9A patent/EP4053901A4/en active Pending
- 2019-10-29 US US16/975,521 patent/US12004387B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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US20160064691A1 (en) * | 2014-08-29 | 2016-03-03 | Samsung Display Co., Ltd. | Display apparatus and method of manufacturing the same |
CN107026177A (zh) * | 2017-03-31 | 2017-08-08 | 京东方科技集团股份有限公司 | 一种coa基板及其制备方法、显示装置 |
CN107329336A (zh) * | 2017-07-11 | 2017-11-07 | 厦门天马微电子有限公司 | 一种显示基板、显示面板及显示装置 |
CN107819014A (zh) * | 2017-10-25 | 2018-03-20 | 武汉华星光电技术有限公司 | 柔性显示面板及其制备方法 |
CN108598135A (zh) * | 2018-06-06 | 2018-09-28 | 武汉华星光电半导体显示技术有限公司 | Oled显示面板及其制备方法 |
CN109388287A (zh) * | 2018-09-29 | 2019-02-26 | 上海天马微电子有限公司 | 一种触控显示面板以及电子设备 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20220413657A1 (en) * | 2021-06-23 | 2022-12-29 | Samsung Display Co., Ltd. | Input sensing panel, display device having the same, and method of manufacturing the display device |
US11747949B2 (en) * | 2021-06-23 | 2023-09-05 | Samsung Display Co., Ltd. | Input sensing panel, display device having the same, and method of manufacturing the display device |
CN113517328A (zh) * | 2021-07-12 | 2021-10-19 | 京东方科技集团股份有限公司 | 一种显示面板以及显示装置 |
Also Published As
Publication number | Publication date |
---|---|
US12004387B2 (en) | 2024-06-04 |
EP4053901A4 (en) | 2022-11-09 |
WO2021081765A1 (zh) | 2021-05-06 |
US20220384555A1 (en) | 2022-12-01 |
CN113056827B (zh) | 2024-07-05 |
EP4053901A1 (en) | 2022-09-07 |
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