CN1129826C - 尤其是用在一个集成模块中的半导体电路 - Google Patents

尤其是用在一个集成模块中的半导体电路 Download PDF

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Publication number
CN1129826C
CN1129826C CN97197407A CN97197407A CN1129826C CN 1129826 C CN1129826 C CN 1129826C CN 97197407 A CN97197407 A CN 97197407A CN 97197407 A CN97197407 A CN 97197407A CN 1129826 C CN1129826 C CN 1129826C
Authority
CN
China
Prior art keywords
semiconductor circuit
lead
initialization
assembly
electromotive force
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN97197407A
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English (en)
Chinese (zh)
Other versions
CN1228853A (zh
Inventor
A·策尔纳
A·雷施迈尔
W·波克兰德特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of CN1228853A publication Critical patent/CN1228853A/zh
Application granted granted Critical
Publication of CN1129826C publication Critical patent/CN1129826C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/57—Protection from inspection, reverse engineering or tampering
    • H01L23/576—Protection from inspection, reverse engineering or tampering using active circuits
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F21/70—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer
    • G06F21/86—Secure or tamper-resistant housings
    • G06F21/87—Secure or tamper-resistant housings by means of encapsulation, e.g. for integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2221/00—Indexing scheme relating to security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F2221/21—Indexing scheme relating to G06F21/00 and subgroups addressing additional information or applications relating to security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F2221/2143—Clearing memory, e.g. to prevent the data from being stolen
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Software Systems (AREA)
  • Computer Security & Cryptography (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Microcomputers (AREA)
  • Techniques For Improving Reliability Of Storages (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
CN97197407A 1996-08-23 1997-07-10 尤其是用在一个集成模块中的半导体电路 Expired - Lifetime CN1129826C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19634135A DE19634135C2 (de) 1996-08-23 1996-08-23 Halbleiterschaltung, insbesondere zur Verwendung in einem integrierten Baustein
DE19634135.3 1996-08-23

Publications (2)

Publication Number Publication Date
CN1228853A CN1228853A (zh) 1999-09-15
CN1129826C true CN1129826C (zh) 2003-12-03

Family

ID=7803529

Family Applications (1)

Application Number Title Priority Date Filing Date
CN97197407A Expired - Lifetime CN1129826C (zh) 1996-08-23 1997-07-10 尤其是用在一个集成模块中的半导体电路

Country Status (13)

Country Link
US (1) US6078537A (enExample)
EP (1) EP0920659B1 (enExample)
JP (1) JP3305330B2 (enExample)
KR (1) KR100311119B1 (enExample)
CN (1) CN1129826C (enExample)
AT (1) ATE219260T1 (enExample)
BR (1) BR9711641A (enExample)
DE (2) DE19634135C2 (enExample)
ES (1) ES2178783T3 (enExample)
IN (1) IN191987B (enExample)
RU (1) RU2189071C2 (enExample)
UA (1) UA56177C2 (enExample)
WO (1) WO1998008154A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8036788B2 (en) * 1995-06-07 2011-10-11 Automotive Technologies International, Inc. Vehicle diagnostic or prognostic message transmission systems and methods
US20080161989A1 (en) * 1995-06-07 2008-07-03 Automotive Technologies International, Inc. Vehicle Diagnostic or Prognostic Message Transmission Systems and Methods
EP1182702B1 (de) * 2000-08-21 2007-01-03 Infineon Technologies AG Vorrichtung zum Schutz einer integrierten Schaltung
JP6294530B2 (ja) * 2017-03-22 2018-03-14 ヒューレット パッカード エンタープライズ デベロップメント エル ピーＨｅｗｌｅｔｔ Ｐａｃｋａｒｄ Ｅｎｔｅｒｐｒｉｓｅ Ｄｅｖｅｌｏｐｍｅｎｔ ＬＰ 電子デバイス用シールド

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4131942A (en) * 1977-01-10 1978-12-26 Xerox Corporation Non-volatile storage module for a controller
FR2569054B1 (fr) * 1984-08-10 1986-11-28 Eurotechnique Sa Dispositif de neutralisation de l'acces a une zone a proteger d'un circuit integre
GB2182176B (en) * 1985-09-25 1989-09-20 Ncr Co Data security device for protecting stored data
GB2182467B (en) * 1985-10-30 1989-10-18 Ncr Co Security device for stored sensitive data
DE3706251A1 (de) * 1986-02-28 1987-09-03 Canon Kk Halbleitervorrichtung
GB2206431B (en) * 1987-06-30 1991-05-29 Motorola Inc Data card circuits
US4933898A (en) * 1989-01-12 1990-06-12 General Instrument Corporation Secure integrated circuit chip with conductive shield
RU2024110C1 (ru) * 1991-04-10 1994-11-30 Научно-исследовательский институт точной технологии Интегральная микросхема
US5369299A (en) * 1993-07-22 1994-11-29 National Semiconductor Corporation Tamper resistant integrated circuit structure
US5473112A (en) * 1993-09-13 1995-12-05 Vlsi Technology, Inc. Security circuitry with select line and data line shielding
US5721837A (en) * 1993-10-28 1998-02-24 Elonex I.P. Holdings, Ltd. Micro-personal digital assistant including a temperature managed CPU

Also Published As

Publication number Publication date
KR100311119B1 (ko) 2001-11-03
IN191987B (enExample) 2004-01-31
EP0920659A1 (de) 1999-06-09
CN1228853A (zh) 1999-09-15
EP0920659B1 (de) 2002-06-12
UA56177C2 (uk) 2003-05-15
JP2000502510A (ja) 2000-02-29
RU2189071C2 (ru) 2002-09-10
ES2178783T3 (es) 2003-01-01
ATE219260T1 (de) 2002-06-15
WO1998008154A1 (de) 1998-02-26
BR9711641A (pt) 1999-08-24
JP3305330B2 (ja) 2002-07-22
KR20000068112A (ko) 2000-11-25
US6078537A (en) 2000-06-20
DE19634135A1 (de) 1998-02-26
DE19634135C2 (de) 1998-07-02
DE59707516D1 (de) 2002-07-18

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