KR100311119B1 - 집적 모듈내에서 사용되는 반도체 회로 - Google Patents

집적 모듈내에서 사용되는 반도체 회로 Download PDF

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Publication number
KR100311119B1
KR100311119B1 KR1019997001129A KR19997001129A KR100311119B1 KR 100311119 B1 KR100311119 B1 KR 100311119B1 KR 1019997001129 A KR1019997001129 A KR 1019997001129A KR 19997001129 A KR19997001129 A KR 19997001129A KR 100311119 B1 KR100311119 B1 KR 100311119B1
Authority
KR
South Korea
Prior art keywords
assembly
connection line
line
initialization
semiconductor circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019997001129A
Other languages
English (en)
Korean (ko)
Other versions
KR20000068112A (ko
Inventor
안겔라 첼너
안드레아스 라에슈마이어
볼프강 포크란트
Original Assignee
칼 하인쯔 호르닝어
지멘스 악티엔게젤샤프트
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 칼 하인쯔 호르닝어, 지멘스 악티엔게젤샤프트 filed Critical 칼 하인쯔 호르닝어
Publication of KR20000068112A publication Critical patent/KR20000068112A/ko
Application granted granted Critical
Publication of KR100311119B1 publication Critical patent/KR100311119B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/57Protection from inspection, reverse engineering or tampering
    • H01L23/576Protection from inspection, reverse engineering or tampering using active circuits
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F21/00Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F21/70Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer
    • G06F21/86Secure or tamper-resistant housings
    • G06F21/87Secure or tamper-resistant housings by means of encapsulation, e.g. for integrated circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/525Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/544Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/58Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/585Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2221/00Indexing scheme relating to security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F2221/21Indexing scheme relating to G06F21/00 and subgroups addressing additional information or applications relating to security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F2221/2143Clearing memory, e.g. to prevent the data from being stolen
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Software Systems (AREA)
  • Computer Security & Cryptography (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Microcomputers (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Techniques For Improving Reliability Of Storages (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
KR1019997001129A 1996-08-23 1999-02-11 집적 모듈내에서 사용되는 반도체 회로 Expired - Fee Related KR100311119B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19634135A DE19634135C2 (de) 1996-08-23 1996-08-23 Halbleiterschaltung, insbesondere zur Verwendung in einem integrierten Baustein
DE19634135.3 1996-08-23

Publications (2)

Publication Number Publication Date
KR20000068112A KR20000068112A (ko) 2000-11-25
KR100311119B1 true KR100311119B1 (ko) 2001-11-03

Family

ID=7803529

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019997001129A Expired - Fee Related KR100311119B1 (ko) 1996-08-23 1999-02-11 집적 모듈내에서 사용되는 반도체 회로

Country Status (13)

Country Link
US (1) US6078537A (enExample)
EP (1) EP0920659B1 (enExample)
JP (1) JP3305330B2 (enExample)
KR (1) KR100311119B1 (enExample)
CN (1) CN1129826C (enExample)
AT (1) ATE219260T1 (enExample)
BR (1) BR9711641A (enExample)
DE (2) DE19634135C2 (enExample)
ES (1) ES2178783T3 (enExample)
IN (1) IN191987B (enExample)
RU (1) RU2189071C2 (enExample)
UA (1) UA56177C2 (enExample)
WO (1) WO1998008154A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080161989A1 (en) * 1995-06-07 2008-07-03 Automotive Technologies International, Inc. Vehicle Diagnostic or Prognostic Message Transmission Systems and Methods
US8036788B2 (en) * 1995-06-07 2011-10-11 Automotive Technologies International, Inc. Vehicle diagnostic or prognostic message transmission systems and methods
DE50013937D1 (de) * 2000-08-21 2007-02-15 Infineon Technologies Ag Vorrichtung zum Schutz einer integrierten Schaltung
JP6294530B2 (ja) * 2017-03-22 2018-03-14 ヒューレット パッカード エンタープライズ デベロップメント エル ピーHewlett Packard Enterprise Development LP 電子デバイス用シールド

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4131942A (en) * 1977-01-10 1978-12-26 Xerox Corporation Non-volatile storage module for a controller
FR2569054B1 (fr) * 1984-08-10 1986-11-28 Eurotechnique Sa Dispositif de neutralisation de l'acces a une zone a proteger d'un circuit integre
GB2182176B (en) * 1985-09-25 1989-09-20 Ncr Co Data security device for protecting stored data
GB2182467B (en) * 1985-10-30 1989-10-18 Ncr Co Security device for stored sensitive data
DE3706251A1 (de) * 1986-02-28 1987-09-03 Canon Kk Halbleitervorrichtung
GB2206431B (en) * 1987-06-30 1991-05-29 Motorola Inc Data card circuits
US4933898A (en) * 1989-01-12 1990-06-12 General Instrument Corporation Secure integrated circuit chip with conductive shield
RU2024110C1 (ru) * 1991-04-10 1994-11-30 Научно-исследовательский институт точной технологии Интегральная микросхема
US5369299A (en) * 1993-07-22 1994-11-29 National Semiconductor Corporation Tamper resistant integrated circuit structure
US5473112A (en) 1993-09-13 1995-12-05 Vlsi Technology, Inc. Security circuitry with select line and data line shielding
US5721837A (en) * 1993-10-28 1998-02-24 Elonex I.P. Holdings, Ltd. Micro-personal digital assistant including a temperature managed CPU

Also Published As

Publication number Publication date
IN191987B (enExample) 2004-01-31
JP2000502510A (ja) 2000-02-29
EP0920659B1 (de) 2002-06-12
RU2189071C2 (ru) 2002-09-10
JP3305330B2 (ja) 2002-07-22
BR9711641A (pt) 1999-08-24
UA56177C2 (uk) 2003-05-15
DE59707516D1 (de) 2002-07-18
EP0920659A1 (de) 1999-06-09
DE19634135A1 (de) 1998-02-26
DE19634135C2 (de) 1998-07-02
ES2178783T3 (es) 2003-01-01
WO1998008154A1 (de) 1998-02-26
KR20000068112A (ko) 2000-11-25
US6078537A (en) 2000-06-20
CN1228853A (zh) 1999-09-15
CN1129826C (zh) 2003-12-03
ATE219260T1 (de) 2002-06-15

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Patent document republication publication date: 20020305

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