CN112969939B - 偏光性光学功能膜层叠体的激光切割加工方法 - Google Patents

偏光性光学功能膜层叠体的激光切割加工方法 Download PDF

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Publication number
CN112969939B
CN112969939B CN201980071904.4A CN201980071904A CN112969939B CN 112969939 B CN112969939 B CN 112969939B CN 201980071904 A CN201980071904 A CN 201980071904A CN 112969939 B CN112969939 B CN 112969939B
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laser
film
polarizing
sheet
optical function
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CN112969939A (zh
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松尾直之
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Nitto Denko Corp
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Nitto Denko Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/30—Polarising elements
CN201980071904.4A 2018-11-02 2019-11-01 偏光性光学功能膜层叠体的激光切割加工方法 Active CN112969939B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018207452 2018-11-02
JP2018-207452 2018-11-02
PCT/JP2019/043124 WO2020091065A1 (ja) 2018-11-02 2019-11-01 偏光性光学機能フィルム積層体のレーザー切断加工方法

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CN112969939A CN112969939A (zh) 2021-06-15
CN112969939B true CN112969939B (zh) 2022-09-30

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JP (1) JP7316297B2 (ja)
KR (1) KR102433467B1 (ja)
CN (1) CN112969939B (ja)
TW (1) TWI824051B (ja)
WO (1) WO2020091065A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220149510A (ko) * 2020-03-16 2022-11-08 수미토모 케미칼 컴퍼니 리미티드 적층 시트 및 그 제조 방법
KR20210125127A (ko) * 2020-04-07 2021-10-18 삼성디스플레이 주식회사 전자 장치 제조 방법 및 전자 장치
JP7221256B2 (ja) * 2020-09-14 2023-02-13 日東電工株式会社 偏光板、位相差層付偏光板、ならびに、該偏光板または該位相差層付偏光板を含む画像表示装置

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JP2006128577A (ja) * 2004-11-01 2006-05-18 Furukawa Electric Co Ltd:The 半導体チップの製造方法及びそれに使用されるダイボンドダイシングテープ
JP2011022202A (ja) * 2009-07-13 2011-02-03 Sumitomo Chemical Co Ltd 偏光板およびそれを用いた画像表示装置
JP2013043292A (ja) * 2011-08-22 2013-03-04 Kao Corp 積層体の製造方法
CN103212855A (zh) * 2012-01-19 2013-07-24 昆山思拓机器有限公司 含同轴水射流结构的激光切割机
JP2015009250A (ja) * 2013-06-27 2015-01-19 昭和電工株式会社 レーザー加工方法
EP3205464A1 (en) * 2016-02-12 2017-08-16 Kondex Corporation Laser clad cutting blade for agricultural cutting components

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JP2921345B2 (ja) 1993-07-20 1999-07-19 株式会社大林組 橋桁のダンパー装置
JPH08146219A (ja) 1994-11-25 1996-06-07 Sekisui Chem Co Ltd 反射偏光板
JPH10206633A (ja) * 1997-01-22 1998-08-07 Casio Comput Co Ltd 偏光板およびその製造方法
GB2402230B (en) * 2003-05-30 2006-05-03 Xsil Technology Ltd Focusing an optical beam to two foci
JP2008073742A (ja) * 2006-09-22 2008-04-03 Nitto Denko Corp 光学フィルムの切断方法及び光学フィルム
JP2009006350A (ja) * 2007-06-27 2009-01-15 Sony Corp レーザ加工装置とその加工方法、デブリ回収機構とその回収方法、並びに表示パネルの製造方法
JP5558026B2 (ja) * 2008-05-07 2014-07-23 日東電工株式会社 偏光板、およびその製造方法
WO2011016572A1 (ja) * 2009-08-06 2011-02-10 住友化学株式会社 偏光板の製造方法
KR101817388B1 (ko) * 2014-09-30 2018-01-10 주식회사 엘지화학 편광판의 절단 방법 및 이를 이용하여 절단된 편광판
KR20170098569A (ko) * 2016-02-22 2017-08-30 주식회사 엘지화학 편광필름 및 그 제조방법
JP6887759B2 (ja) 2016-05-17 2021-06-16 日東電工株式会社 光学積層体、ならびに該光学積層体を用いた光学フィルム片の製造方法
JP6899721B2 (ja) 2016-07-22 2021-07-07 日東電工株式会社 偏光板の製造方法およびその製造装置
JP6772369B2 (ja) * 2017-04-13 2020-10-21 日東電工株式会社 画像表示装置の製造方法および画像表示装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006128577A (ja) * 2004-11-01 2006-05-18 Furukawa Electric Co Ltd:The 半導体チップの製造方法及びそれに使用されるダイボンドダイシングテープ
JP2011022202A (ja) * 2009-07-13 2011-02-03 Sumitomo Chemical Co Ltd 偏光板およびそれを用いた画像表示装置
JP2013043292A (ja) * 2011-08-22 2013-03-04 Kao Corp 積層体の製造方法
CN103212855A (zh) * 2012-01-19 2013-07-24 昆山思拓机器有限公司 含同轴水射流结构的激光切割机
JP2015009250A (ja) * 2013-06-27 2015-01-19 昭和電工株式会社 レーザー加工方法
EP3205464A1 (en) * 2016-02-12 2017-08-16 Kondex Corporation Laser clad cutting blade for agricultural cutting components

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Publication number Publication date
TWI824051B (zh) 2023-12-01
CN112969939A (zh) 2021-06-15
WO2020091065A1 (ja) 2020-05-07
KR20210066909A (ko) 2021-06-07
KR102433467B1 (ko) 2022-08-18
JPWO2020091065A1 (ja) 2021-10-07
JP7316297B2 (ja) 2023-07-27
TW202106426A (zh) 2021-02-16

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